CN201035488Y - Baffle and computer host with the baffle - Google Patents
Baffle and computer host with the baffle Download PDFInfo
- Publication number
- CN201035488Y CN201035488Y CNU2007200046443U CN200720004644U CN201035488Y CN 201035488 Y CN201035488 Y CN 201035488Y CN U2007200046443 U CNU2007200046443 U CN U2007200046443U CN 200720004644 U CN200720004644 U CN 200720004644U CN 201035488 Y CN201035488 Y CN 201035488Y
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- CN
- China
- Prior art keywords
- dividing plate
- host computer
- heat pipe
- contact site
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a host computer, which comprises a computer casing, a main board, and a radiator. The main board is installed in the computer casing, and at least a heating element is installed on the main board; the radiator comprises a contact part, a heat radiation part, and at least a heat pipe, the both ends of the heat pipe are respectively connected with the contact part and the heat radiation part, and the contact part is installed on the heating element, wherein, the host computer also comprises a baffle plate, the baffle plate comprises a main body part, a hollowed-out part is formed on the main body part. The baffle plate passes through the heat pipe through the hollowed-out part, and is installed between the contact part and the heat radiation part.
Description
Technical field
The utility model relates to a kind of host computer, particularly relates to a kind of host computer and this dividing plate that utilizes dividing plate to promote heat radiation function.
Background technology
Generally speaking, the host computer framework that can buy on the market at present is roughly as follows: be equiped with the wafer (as CPU, shows wafer etc.) of necessity on motherboard, the outside coats casing again to avoid motherboard and wafer because of attaching dust or water droplet is damaged.Wherein, too high and can't normal operation for fear of chip temperature, be example with CPU, be equiped with heating radiator on it and reduce the high temperature that wafer produces because of high-speed computation.Simultaneously, for reducing the temperature in the casing, also many simultaneously installing fans are taken away the hot-air of inside on the general casing.In addition, also often being drilled with hole on the casing increases the inside and outside gaseous exchange of casing, reduces temperature in the casing whereby, and keeps the normal operation of computer.
Be not difficult from aforesaid host framework to find that the heat that wafer produces is passed to earlier on the heating radiator, by the air of heat sink to the casing, in the lump the torrid zone walked when just extracting air out casing afterwards again by fan.Hence one can see that, and in this kind host framework, the heat that wafer produced must pre-exist a period of time in the interior air of casing, just by fan air is detached main frame then, and this kind cooling mechanism causes unavoidably the high temperature of hot-air that computer components is produced harmful effect.
Because the computer arithmetic capability doubles day by day, the user is also more and more higher for the requirement of heat dissipation, therefore, is necessary to propose a kind of computer main frame structure with high heat dissipation efficiency.
The utility model content
Fundamental purpose of the present utility model is to provide the host computer that can improve heat dispersion.
For achieving the above object, host computer of the present utility model comprises: casing; Motherboard is installed in the described casing, is equiped with a heater element on the described motherboard at least; Heating radiator, comprise contact site, radiating part and at least one heat pipe, the two ends of described heat pipe are connected with described contact site and described radiating part respectively, and described contact site is installed on the described heater element, wherein, described host computer also comprises dividing plate, comprises main part, be formed with openwork part on the described main part, described dividing plate pass described heat pipe by described openwork part and be installed in described contact site and described radiating part between.
For making aforesaid dividing plate can offer slit on the casing of host computer, dividing plate is separated by the radiating part and the motherboard of this slit with heating radiator, and then improve radiating efficiency by can the mode of substituting installing.Simultaneously, substitute more conveniently, can be provided with the handle that links with main part on the dividing plate, be user-friendly for pulling and pushing of dividing plate for making.In addition, owing to have flow passage structure design simultaneously on this dividing plate, the liquid that drops on the dividing plate can be led to outside the motherboard, and is flowed out by the draining hole of casing below, is unlikely to directly to drop on the motherboard and causes computer glitch.
Simultaneously, the utility model also provides a kind of dividing plate, be installed in the inner space of host computer, described host computer comprises heating radiator, and described heating radiator comprises contact site, radiating part and at least one heat pipe, and the two ends of described heat pipe are connected with described contact site and described radiating part respectively, wherein, described dividing plate comprises main part, is formed with openwork part on the described main part, described dividing plate pass described heat pipe by described openwork part and be installed in described contact site and described radiating part between.
Under the computer main frame structure that adopts the utility model dividing plate, wafer will be passed to the contact site of heating radiator earlier because of the heat that high-speed computation produced, and is passed to radiating part by heat pipe.Because the existence of dividing plate, the radiating part and the motherboard that have high temperature will be isolated in two different spaces.Because heat promptly is being brought on the radiating part after the generation, and radiating part is present in the different spaces with motherboard, and hot-air operates the harmful effect that is produced for computer and will be reduced to minimum.
Description of drawings
Fig. 1 is the exploded view of the utility model host computer.
Fig. 2 is the fragmentary cross-sectional view of the utility model host computer.
Fig. 3 is the synoptic diagram of the utility model host computer.
Fig. 4 is the synoptic diagram of the utility model dividing plate.
The main element label declaration is as follows:
Host computer 10 casings 11
Motherboard 13 heater elements 131
Heating radiator 15 contact sites 151
Radiating part 153 heat pipes 155
Dividing plate 17 main parts 171
Flow passage structure 175 handles 173
Fin 153f loam cake dividing plate 19
Hole 19h
Embodiment
For describing technology contents of the present utility model in detail, special is that example is described as follows with the preferred embodiment.
At first with reference to figure 1, Fig. 1 is the exploded view of the utility model host computer 10.Host computer 10 of the present utility model mainly comprises with the lower part: casing 11; Be installed in the motherboard 13 in this casing 11, motherboard 13 be provided with at least one heater element 131 (as CPU, shows wafer ... etc.); Heating radiator 15, it comprises contact site 151, radiating part 153 and at least one heat pipe 155, the two ends of heat pipe 155 are connected with contact site 151 and radiating part 153 respectively, and contact site 151 is in order to be installed on the heater element 131; And dividing plate 17, it comprises main part 171, is formed with openwork part 171h on the main part 171.
As shown in Figure 1, it is poor to have certain altitude between contact site 151 and the radiating part 153, therefore can see through the separation means isolates contact site 151 and radiating part 153, avoid the heat penetration of radiating part 153 to cross gaseous exchange or other means are passed to contact site 151 and other computer componentses on every side, and then make host computer 10 have advantages of higher stability.Wherein, have a plurality of fin 153f on the radiating part 153, in order to increasing the area that radiating part 153 contacts with air, and then the raising radiating efficiency.
And, can offer slit 11s on the casing 11 in order to improve the convenience of user when the dismounting dividing plate 17.The user improves the convenience on using greatly substituting or during dismounting dividing plate 17, can directly dividing plate 17 being inserted slit 11s, or directly dividing plate 17 be taken out by slit 11s, and need not casing 11 is taken apart.On the other hand, manufacturer also can not need to change again under the situation of single-piece frame mould, produces the product with the utility model effect, and then effectively saves manufacturing cost.Simultaneously, also can design jug 173 on the dividing plate 17, substituting or gripping during dismounting, improve the operability of dividing plate 17, and this handle 173 preferably be linked to main part 171 in one-body molded mode for the user.
It should be noted that although dividing plate 17 can the mode of substituting be installed, this dividing plate 17 can also fixed form be installed.For instance, this dividing plate 17 also can be built within the host computer 10, by screw or other fixing means it is locked.
Aspect material, dividing plate 17 is not limited to some certain material.For instance, general heat-resisting plastic cement, metal or alloy etc. all can be used as the material of dividing plate 17, and not as limit.By dividing plate 17 is installed, can reach effects such as heat insulation, waterproof and dustproof, anti-electromagnetic interference (EMI).
With reference to figure 2, Fig. 2 is the fragmentary cross-sectional view of the utility model host computer 10 again.After installing, this dividing plate 17 passes heat pipe 155 by openwork part 171h and is installed between contact site 151 and the radiating part 153.Because this design, the heat that sheds from radiating part 153 is because be subjected to the isolation of dividing plate 17, and is less to the influence that the computer components in space, contact site 151 place produces.Therefore, this design helps thermal isolation outside motherboard 13 and most of computer components, avoids motherboard 13 unstable because of being influenced by heat with the computer components on it.
It should be noted that although radiating part shown in Figure 2 153 and contact site 151 relation of presenting down, the utility model host computer 10 is not limited to this.For instance, the configuration of radiating part 153 and contact site 151 concerns about also can being.In addition, although have three heat pipes 155 among Fig. 2, the number of heat pipe 155 is not as limit.
Refer again to Fig. 3, Fig. 3 is the synoptic diagram of the utility model host computer 10.Although host computer 10 of the present utility model not necessarily will be coated on heating radiator 15, dividing plate 17, motherboard 13 in it fully, in order further to increase the effect of waterproof and dustproof and to improve security, also can add a slice loam cake dividing plate 19 again in the outside of radiating part 153.And, can be equipped with a plurality of hole 19h on the loam cake dividing plate 19 in order to allow loam cake dividing plate 19 be unlikely to most heat is coated in the host computer 10.Whereby, host computer 10 of the present utility model can see through casing 11 and the protection that loam cake dividing plate 19 is provided, and allows inner motherboard 13 and other computer componentses be unlikely to be subjected to outside influence as water droplet, dust etc.In addition, because casing 11 has waterproof and dustproof simultaneously with loam cake dividing plate 19 and completely cuts off the effect of electromagnetic interference (EMI), cooperate the design of heating radiator 15 and dividing plate 17, one can be with thermal isolation outside motherboard 13, on the other hand, this main frame 13 also can not need to change again under the situation of single-piece frame 11, effectively reaches the effect of dustproof, waterproof and isolated electromagnetic interference (EMI).
It should be noted that the mode of wearing of hole 19h is not limited to shown in the figure on the loam cake dividing plate 19, the user can select comparatively suitable loam cake dividing plate 19 according to its demand.Aspect material, loam cake dividing plate 19 also is not limited to some certain material.By loam cake dividing plate 19 is installed, can further promote effect heat insulation, that waterproof and dustproof reaches anti-electromagnetic interference (EMI).
Referring to Fig. 4, Fig. 4 is the synoptic diagram of the utility model dividing plate 17 at last.As shown in Figure 4, this dividing plate 17 mainly comprises main part 171, is to be formed with openwork part 171h on the main part 171, and also is connected with handle 173 on the main part 171.Dividing plate 17 of the present utility model mainly is installed in the inner space of host computer.Haply, this class host computer comprises heating radiator, and this heating radiator comprises contact site, radiating part and at least one heat pipe, and the two ends of heat pipe are connected with contact site and radiating part respectively.In when installing, dividing plate 17 can see through openwork part 171h pass the heat pipe of heating radiator and be arranged at contact site and radiating part between.
For the water droplet of avoiding dropping onto on the dividing plate 17 is dripped to motherboard by openwork part 171h landing, dividing plate 17 of the present utility model also can have the design of runner.As shown in Figure 4, be extended with flow passage structure 175 on the border of dividing plate 17, this flow passage structure 175 can make water droplet be dripped by both sides with dropping onto the both sides that water droplet on the dividing plate 17 guides to dividing plate 17, and then avoids water droplet to be dripped to motherboard by openwork part 171h landing.Under most situation, this flow passage structure 175 adopts integrated mode to make with this main part 171, yet not as limit.For instance, this flow passage structure 175 also can be to be installed in addition on the dividing plate 17.
In sum, the utility model is purpose, means and effect no matter, shows that all it is different from the feature of prior art.It should be noted that the foregoing description only is to give an example for convenience of explanation, protection domain of the present utility model is defined by the following claims, but not only limits to the foregoing description.
Claims (15)
1. host computer comprises:
Casing;
Motherboard is installed in the described casing, is equiped with a heater element on the described motherboard at least;
Heating radiator comprises contact site, radiating part and at least one heat pipe, and the two ends of described heat pipe are connected with described contact site and described radiating part respectively, and described contact site is installed on the described heater element,
It is characterized in that described host computer also comprises dividing plate, comprises main part, be formed with openwork part on the described main part, described dividing plate pass described heat pipe by described openwork part and be installed in described contact site and described radiating part between.
2. host computer as claimed in claim 1 is characterized in that, offer slit on the face of described casing, and described dividing plate is installed in the described casing by described slit.
3. host computer as claimed in claim 1 is characterized in that described dividing plate also comprises handle, and it is attached to described main part.
4. host computer as claimed in claim 3 is characterized in that, described handle and described main part are one-body molded.
5. host computer as claimed in claim 1 is characterized in that the border of described dividing plate is extended with flow passage structure.
6. host computer as claimed in claim 5 is characterized in that, described flow passage structure and described main part are one-body molded.
7. host computer as claimed in claim 1 is characterized in that, also comprises the loam cake dividing plate, and described loam cake dividing plate is installed in the outside of described radiating part.
8. host computer as claimed in claim 7 is characterized in that, described loam cake dividing plate is equipped with a plurality of holes.
9. host computer as claimed in claim 1 is characterized in that described radiating part comprises a plurality of fins.
10. host computer as claimed in claim 1 is characterized in that, the quantity of described heat pipe is three.
11. dividing plate, be installed in the inner space of host computer, described host computer comprises heating radiator, and described heating radiator comprises contact site, radiating part and at least one heat pipe, the two ends of described heat pipe are connected with described contact site and described radiating part respectively, it is characterized in that, described dividing plate comprises main part, be formed with openwork part on the described main part, described dividing plate pass described heat pipe by described openwork part and be installed in described contact site and described radiating part between.
12. dividing plate as claimed in claim 11 is characterized in that, also comprises the handle that is linked to described main part.
13. dividing plate as claimed in claim 12 is characterized in that, described handle and described main part are one-body molded.
14. dividing plate as claimed in claim 11 is characterized in that, the border of described dividing plate is extended with flow passage structure.
15. dividing plate as claimed in claim 14 is characterized in that, described flow passage structure and described main part are one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200046443U CN201035488Y (en) | 2007-04-19 | 2007-04-19 | Baffle and computer host with the baffle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200046443U CN201035488Y (en) | 2007-04-19 | 2007-04-19 | Baffle and computer host with the baffle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201035488Y true CN201035488Y (en) | 2008-03-12 |
Family
ID=39196380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200046443U Expired - Lifetime CN201035488Y (en) | 2007-04-19 | 2007-04-19 | Baffle and computer host with the baffle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201035488Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104866045A (en) * | 2014-02-25 | 2015-08-26 | 联想(北京)有限公司 | Electronic equipment |
| CN113380281A (en) * | 2021-06-23 | 2021-09-10 | 刘永志 | Information storage device for urban and rural planning |
-
2007
- 2007-04-19 CN CNU2007200046443U patent/CN201035488Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104866045A (en) * | 2014-02-25 | 2015-08-26 | 联想(北京)有限公司 | Electronic equipment |
| CN113380281A (en) * | 2021-06-23 | 2021-09-10 | 刘永志 | Information storage device for urban and rural planning |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080312 |