CN201022079Y - 一种白光led - Google Patents

一种白光led Download PDF

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Publication number
CN201022079Y
CN201022079Y CNU200620015522XU CN200620015522U CN201022079Y CN 201022079 Y CN201022079 Y CN 201022079Y CN U200620015522X U CNU200620015522X U CN U200620015522XU CN 200620015522 U CN200620015522 U CN 200620015522U CN 201022079 Y CN201022079 Y CN 201022079Y
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China
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light
cover body
emitting diode
white light
diode chip
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Expired - Fee Related
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CNU200620015522XU
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English (en)
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陈盛国
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Individual
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种可消除黄色光圈的白光LED结构，包括有罩体、LED芯片、支架，LED芯片放于支架上；罩体采用环氧树脂添加脲类化合物，再配以各种荧光粉制成网状结构；将具有网状结构的罩体封装盖覆在LED芯片上。脲类化合物与环氧树脂化学反应后形成的网状结构不会造成荧光粉的沉淀，使荧光粉均匀分布在罩体上。通过LED芯片激发均匀分布的荧光粉，所得的白光具有亮度高，光线均匀，无黄色光圈产生。

Description

一种白光LED
技术领域
本实用新型涉及一种白光LED结构，尤其指的是一种可消除黄色光圈的白光LED结构。
背景技术
传统的白炽灯已有上百年历史，但由于发光效率低已逐步被发光效率较高的荧光灯所代替，但荧光灯的灯管中含汞，加上灯具的玻璃材料易碎造成对人类生存环境的严重污染，欧盟等发达地区已明令在2007年禁用。LED发光二极管利用半导体特性发光，具有低电压低电流的省电发光特点，同时具有轻、薄、短、小、抗震耐摔等高可靠、长寿命的优点，成为近年来全世界最受重视的新型电光源。
白光LED的产生主要是用兰光芯片激发涂布在其上方的黄色荧光粉，用兰光和黄光合成白光。此种方式所产生的白光，由于荧光粉的沉淀，在白光的外圈有黄色光圈产生，从而影响白光的色泽。业界为了消除黄色光圈，通常采用的做法是在罩体内加入白色填充物，虽可以消除黄色光圈，但是光的强度会变弱。
发明内容
本实用新型要解决的技术问题是提供一种白光LED，它的罩体结构可防止荧光粉沉淀，从而消除黄色光圈，提高光的照射强度。
为了解决上述技术问题，本实用新型的白光LED包括有罩体、LED芯片、支架，LED芯片放于支架上；罩体采用环氧树脂添加脲类化合物，再配以各种荧光粉制成网状结构；将具有网状结构的罩体封装盖覆在LED芯片上。
采用了上述结构的白光LED，由于外罩体采用环氧树脂添加脲类化合物，脲类化合物与环氧树脂化学反应后形成的网状结构不会造成荧光粉的沉淀，使荧光粉均匀分布在罩体上。通过LED芯片激发均匀分布的荧光粉，所得的白光具有亮度高，光线均匀，无黄色光圈产生。
附图说明
下面结合附图及具体实施方式对本实用新型作进一步详细的说明。
图1为本实用新型的白光LED剖视图
具体实施方式
如图1所示，本实用新型的白光LED包括有罩体1、LED芯片2、支架3，LED芯片2放于支架3上方。LED芯片2可采用现有的兰光芯片，支架3与芯片2的电连接参考现有技术。本实用新型的罩体1应该具有一开口的腔室，罩体1为方形或圆形或其它适用形状，罩体1可透光。罩体1采用环氧树脂添加脲类化合物，再配以各种荧光粉制成网状结构，一般的现有产品罩体只采用环氧树脂添加荧光粉。附图1中的网状结构并没有清楚的显示出来，脲类化合物与环氧树脂化学反应后形成的网状结构不会造成荧光粉的沉淀，使荧光粉均匀分布在罩体上。荧光粉可采用YAG、TAG或氮化物荧光粉等等。最后，将具有网状结构的罩体1封装盖覆在LED芯片2上。
此外，本实用新型还可以适用其它的白光LED封装，如：大功率的LED，只要其采用了环氧树脂添加脲类化合物，再配以各种荧光粉制成网状结构的罩体，均属于本实用新型的保护范围。

Claims (1)

1.一种白光LED，包括有罩体、LED芯片、支架，LED芯片放于支架上，其特征在于：罩体制成网状结构；将具有网状结构的罩体封装盖覆在LED芯片上。
CNU200620015522XU 2006-10-30 2006-10-30 一种白光led Expired - Fee Related CN201022079Y (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010048766A1 (zh) * 2008-10-31 2010-05-06 杭州艾欧易迪光能科技有限公司 一种led照明灯
CN102593326A (zh) * 2012-03-12 2012-07-18 江门昊坤光电科技有限公司 基于荧光粉分散激发技术的led封装结构及其封装工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010048766A1 (zh) * 2008-10-31 2010-05-06 杭州艾欧易迪光能科技有限公司 一种led照明灯
CN102593326A (zh) * 2012-03-12 2012-07-18 江门昊坤光电科技有限公司 基于荧光粉分散激发技术的led封装结构及其封装工艺

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Granted publication date: 20080213

Termination date: 20131030