CN201017172Y - Light blockage supply piping installation - Google Patents

Light blockage supply piping installation Download PDF

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Publication number
CN201017172Y
CN201017172Y CNU2007200003132U CN200720000313U CN201017172Y CN 201017172 Y CN201017172 Y CN 201017172Y CN U2007200003132 U CNU2007200003132 U CN U2007200003132U CN 200720000313 U CN200720000313 U CN 200720000313U CN 201017172 Y CN201017172 Y CN 201017172Y
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CN
China
Prior art keywords
photoresistance
nozzle
photoresist
surge tank
pipeline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200003132U
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Chinese (zh)
Inventor
胡清强
陈晓琪
鲁旭光
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Hejian Technology Suzhou Co Ltd
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Hejian Technology Suzhou Co Ltd
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Filing date
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Priority to CNU2007200003132U priority Critical patent/CN201017172Y/en
Application granted granted Critical
Publication of CN201017172Y publication Critical patent/CN201017172Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a photoresist supply pipeline device, including a photoresist bottle, a filter and a nozzle, which are orderly connected. A buffer vessel is installed in the pipeline between the filter and the nozzle, and the position of the buffer vessel is higher than the position of the nozzle. An exhaust device is installed over the buffer vessel. The photoresist inside the filter flows into the buffer vessel through the pipeline. If the pipeline contains air bubbles, the air bubbles can automatically float out from the photoresist because of the gravity action and rest on the surface of the photoresist level inside the buffer vessel and finally is exhausted from the exhaust device. The photoresist, which do not contain the air bubbles, flows into the nozzle through the pipeline. The utility model has the advantages that the air bubbles in the photoresist can be removed to ensure an afflux condition and a coating condition of the photoresist; the spraying speed of the photoresist can be changed; the device is simple and easy to be realized; especially no air bubbles-exhausting treatment is necessary during the changing course of the filter, which saves the photoresist and the time of staff which are wasted during the course of exhausting the air bubbles and increases the excellent and good rate of products and reduces the manufacturing cost.

Description

A kind of photoresistance supply line device
Technical field
The utility model relates to the technical field of photoresistance supply equipment, particularly a kind of photoresistance supply line device.
Background technology
In wafer production processes, photoresistance is one of important material very.In general, the price of photoresistance all is the comparison costliness, therefore should avoid the waste of photoresistance aborning.Under current photoresistance pipeline design conditions, when changing photoresistance filtrator (filter) at every turn, photoresistance is in being full of the process of filtrator, the air of filtrator the inside will be blended in the photoresistance, so will carry out the exhaust bubble, in this process, often to consume a large amount of photoresistances and slip-stick artist's time, cause a lot of unnecessary cost allowances to semiconductor factory.Present known photoresistance supply line device sees also Fig. 1, and it comprises the photoresistance bottle (resist bottle) 101 that is linked in sequence, pump 102, and filtrator 103 and nozzle 104 are connected with nitrogen (N in the photoresistance bottle 101 2), to form malleation, pump 102 aspirates photoresistance from photoresistance bottle 101, send into filtrator 103 and filter, and then photoresistance is delivered to nozzle 104, if this moment photoresistance in alveolate words, bubble will directly be sprayed onto on the wafer via nozzle 104, and if bubble is arranged in the filtrator 103, just then photoresistance can carry these bubbles when the wave filter 103, pipeline through the back directly arrives nozzle 104 again, and these bubbles have very adverse influence for injection situation and coating condition.
Therefore, but be badly in need of the photoresistance supply line device that a kind of exhaust is steeped at present, particularly a kind of photoresistance supply line device that does not need to carry out the processing of exhaust bubble in filtrator replacing process is with acceptance rate and the minimizing manufacturing cost that increases product.
Summary of the invention
The purpose of this utility model is to propose a kind of improved photoresistance supply line device, and it has solved air bubble problem in the photoresistance supply line by increasing a spot of equipment and very low cost.
For reaching above-mentioned purpose, the utility model provides a kind of photoresistance supply line device, comprise the photoresistance bottle that is linked in sequence successively, filtrator and nozzle, wherein, one surge tank (buffer tank) is installed in the pipeline between filtrator and nozzle, its position is higher than the position of nozzle, exhaust apparatus is equipped with in the surge tank top, if contain bubble in the pipeline,, rest on the top of photoresistance liquid level in the surge tank owing to the automatic emersion photoresistance of action of gravity bubble meeting, and finally discharge by exhaust apparatus, the photoresistance that does not contain bubble can flow to nozzle by the road.
Surge tank is installed or is positioned over its outside mobile device, and surge tank moves with mobile device, changes the speed of photoresistance ejection by the difference in height that changes surge tank and nozzle.
Liquid level sensor is installed in the surge tank, if but photoresistance exceeds the variation range of predetermined volumes, and then the height of photoresistance liquid level can be too high or too low, and liquid level sensor can signal to board, just board can be alarmed.
An advantage of the present utility model is to add surge tank behind filtrator, can remove the bubble in the photoresistance, guarantees the injection situation and the coating condition of photoresistance.Its another advantage is to change the partition coefficient that photoresistance injects by the position that changes surge tank.Simultaneously, the utility model device is simple, is easy to realize, does not particularly need to carry out the exhaust bubble and handle in filtrator replacing process, photoresistance that the process because of the exhaust bubble of having saved consumes and staff's time, the acceptance rate that has increased product with reduce manufacturing cost.
State with other purposes, feature and advantage and can become apparent on the utility model for allowing, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is known photoresistance supply line schematic representation of apparatus.
Fig. 2 is the schematic diagram of photoresistance supply line device of the present utility model.
Fig. 3 is the photoresistance supply line schematic representation of apparatus of the utility model one preferred embodiment.
Embodiment
Because technical characterictic of the present utility model focuses on the improvement to the pipeline between photoresistance supply line device middle filtrator and the nozzle, therefore the following illustrated device of only being correlated with based on the filtrator in the photoresistance supply line device, surge tank, nozzle and periphery thereof, the device that all the other and surge tank have nothing to do is not given unnecessary details now.
The principle of photoresistance supply line device of the present utility model as shown in Figure 2, between filtrator 103 and nozzle 104, install a surge tank 20 additional, elder generation was through surge tank 20 after photoresistance came out from filtrator 103, if contain bubble in the pipeline, because the automatic emersion photoresistance of action of gravity bubble meeting, rest on the top of photoresistance liquid level in the surge tank 20, and finally discharge by exhaust apparatus, owing between surge tank 20 and the nozzle 104 height difference H is arranged, the photoresistance that does not finally contain bubble can flow to nozzle 104 by the road.Do not have bubble or bubble to be low to moderate insignificant quantity in the photoresistance of flow nozzle 104 at this moment, can not exert an influence injection situation and coating condition.
The photoresistance supply line device of a preferred embodiment of the present invention as shown in Figure 3, in photoresistance bottle 101, be connected with nitrogen, certainly, photoresistance bottle 101 can be any type of container that holds photoresistance, be not limited to the flask in the accompanying drawing, and the gas that wherein feeds can be nitrogen or any suitable gas.Photoresistance is sucked out from photoresistance bottle 101, through other equipment and pump 102 back inflow filters 103.Photoresistance is filtering back inflow surge tank 20 through filter 103, if contain bubble in the pipeline, because the automatic emersion photoresistance of action of gravity bubble meeting, rest on the top of photoresistance liquid level in the surge tank 20, and finally discharge by exhaust apparatus, bubble produces in processes such as replacing filtrator 103, and the gas in the bubble is the gas of introducing when changing operation such as filtrator 103 grades.Do not contain the pipeline flow nozzle 104 of the photoresistance of bubble in the final surge tank 20, carry out photoresistance injection and coating by its below.Like this, the bubble in the photoresistance just can not arrive the pipeline of back, and in this embodiment, exhaust apparatus is a breather valve 302, and certainly, exhaust apparatus can be any device of discharging gas, gas outlet for example, exhausr port etc.In surge tank 20, liquid level sensor 202 can also be housed, the photoresistance capacity surpasses predetermined volumes or is less than the variation range of allowing of predetermined volumes in surge tank 20, when just the excessive height of photoresistance liquid level or mistake are low, liquid level sensor can signal to board, board just can be alarmed, can guarantee that so just the photoresistance liquid level in the surge tank 20 fluctuates in a very little scope, the stability of spouting velocity (dispense rate) when guaranteeing to inject photoresistance.One mobile device 201 is arranged in the outside of surge tank 20, and surge tank 20 is installed or is placed thereon, moves with mobile device 201, changes the partition coefficient that photoresistance injects by the height difference H that changes surge tank 20 and nozzle 104.In this embodiment, mobile device 201 belows are the support of approximate " L " shape, surge tank 20 places the recess of support, certainly, carry out moving of all directions as long as can drive surge tank 20, mobile device 201 can be any suitable device, and it can be automaton or manual overvide.
The above only is preferred embodiment of the present utility model; be not so limit scope of patent protection of the present utility model; so the so-called equivalent structure of all utilizations instructions of the present utility model and diagramatic content changes, or directly or indirectly apply in the scope that other correlative technology fields all in like manner all are contained in the utility model and are contained.

Claims (3)

1. photoresistance supply line device, comprise the photoresistance bottle that is linked in sequence successively, filtrator and nozzle, it is characterized in that, in the pipeline between filtrator and nozzle surge tank is installed, its position is higher than the position of nozzle, exhaust apparatus is equipped with in the surge tank top, photoresistance in the filtrator flows into surge tank by the road, if contain bubble in the pipeline,, rest on the top of photoresistance liquid level in the surge tank owing to the automatic emersion photoresistance of action of gravity bubble meeting, and finally discharge by exhaust apparatus, the photoresistance that does not contain bubble can flow to nozzle by the road.
2. photoresistance supply line device according to claim 1 is characterized in that, above-mentioned surge tank is installed or is positioned over its outside mobile device, and surge tank moves with mobile device, changes the speed that photoresistance sprays by the difference in height that changes surge tank and nozzle.
3. photoresistance supply line device according to claim 1 and 2, it is characterized in that, in the above-mentioned surge tank liquid level sensor is installed, if but photoresistance exceeds the variation range of predetermined volumes, then the height of photoresistance liquid level can be too high or too low, liquid level sensor can signal to board, and board just can be alarmed.
CNU2007200003132U 2007-01-08 2007-01-08 Light blockage supply piping installation Expired - Fee Related CN201017172Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200003132U CN201017172Y (en) 2007-01-08 2007-01-08 Light blockage supply piping installation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200003132U CN201017172Y (en) 2007-01-08 2007-01-08 Light blockage supply piping installation

Publications (1)

Publication Number Publication Date
CN201017172Y true CN201017172Y (en) 2008-02-06

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Application Number Title Priority Date Filing Date
CNU2007200003132U Expired - Fee Related CN201017172Y (en) 2007-01-08 2007-01-08 Light blockage supply piping installation

Country Status (1)

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CN (1) CN201017172Y (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102540706A (en) * 2012-01-18 2012-07-04 上海华力微电子有限公司 Method for extending effective use time of photoresist
CN102736419A (en) * 2011-04-13 2012-10-17 颀中科技(苏州)有限公司 Defoaming device for photoresist
CN102955362A (en) * 2011-08-23 2013-03-06 和舰科技(苏州)有限公司 Novel photo-resistive buffer tank
CN103111400A (en) * 2013-02-27 2013-05-22 上海华力微电子有限公司 Photoetching chemicals circulating system and method thereof
CN105314250A (en) * 2014-05-30 2016-02-10 盛美半导体设备(上海)有限公司 Fixing and weighing device for photoresist bottle
CN105629667A (en) * 2014-11-26 2016-06-01 沈阳芯源微电子设备有限公司 Supply device for rubber coating machine coating material
CN110652751A (en) * 2018-06-29 2020-01-07 台湾积体电路制造股份有限公司 Photoresist dispensing system and method for recovering photoresist
CN111090219A (en) * 2018-10-23 2020-05-01 长鑫存储技术有限公司 Photoresist discharge system and photoresist discharge method
CN111451061A (en) * 2020-04-07 2020-07-28 芯米(厦门)半导体设备有限公司 Double-buffer type photoresist liquid spraying system
CN111451022A (en) * 2020-04-07 2020-07-28 芯米(厦门)半导体设备有限公司 Photoresist liquid spraying system capable of saving photoresist liquid

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102736419A (en) * 2011-04-13 2012-10-17 颀中科技(苏州)有限公司 Defoaming device for photoresist
CN102736419B (en) * 2011-04-13 2014-03-05 颀中科技(苏州)有限公司 Defoaming device for photoresist
CN102955362A (en) * 2011-08-23 2013-03-06 和舰科技(苏州)有限公司 Novel photo-resistive buffer tank
CN102540706A (en) * 2012-01-18 2012-07-04 上海华力微电子有限公司 Method for extending effective use time of photoresist
CN103111400A (en) * 2013-02-27 2013-05-22 上海华力微电子有限公司 Photoetching chemicals circulating system and method thereof
CN103111400B (en) * 2013-02-27 2015-09-02 上海华力微电子有限公司 The lithographic chemical product circulatory system and method thereof
CN105314250A (en) * 2014-05-30 2016-02-10 盛美半导体设备(上海)有限公司 Fixing and weighing device for photoresist bottle
CN105629667A (en) * 2014-11-26 2016-06-01 沈阳芯源微电子设备有限公司 Supply device for rubber coating machine coating material
CN110652751A (en) * 2018-06-29 2020-01-07 台湾积体电路制造股份有限公司 Photoresist dispensing system and method for recovering photoresist
CN111090219A (en) * 2018-10-23 2020-05-01 长鑫存储技术有限公司 Photoresist discharge system and photoresist discharge method
CN111451061A (en) * 2020-04-07 2020-07-28 芯米(厦门)半导体设备有限公司 Double-buffer type photoresist liquid spraying system
CN111451022A (en) * 2020-04-07 2020-07-28 芯米(厦门)半导体设备有限公司 Photoresist liquid spraying system capable of saving photoresist liquid
CN111451061B (en) * 2020-04-07 2021-12-31 芯米(厦门)半导体设备有限公司 Double-buffer type photoresist liquid spraying system

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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080206

Termination date: 20100208