CN111451061A - Double-buffer type photoresist liquid spraying system - Google Patents

Double-buffer type photoresist liquid spraying system Download PDF

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Publication number
CN111451061A
CN111451061A CN202010263934.XA CN202010263934A CN111451061A CN 111451061 A CN111451061 A CN 111451061A CN 202010263934 A CN202010263934 A CN 202010263934A CN 111451061 A CN111451061 A CN 111451061A
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China
Prior art keywords
buffer
filter
liquid
photoresist
pumping
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CN202010263934.XA
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CN111451061B (en
Inventor
尹安和
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Xinmi Xiamen Semiconductor Equipment Co ltd
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Xinmi Xiamen Semiconductor Equipment Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/40Filters located upstream of the spraying outlets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D35/00Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/12Devices for taking out of action one or more units of multi- unit filters, e.g. for regeneration
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/14Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0406Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material with several pumps

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

A double-buffer type photoresist spraying system is characterized by comprising: a first liquid storage tank, a first filter; a first buffer; the first filter is arranged between the first liquid storage tank and the first buffer; the first buffer is connected with a first back pumping pipe; the first back pumping pipe is provided with a first back pumping pump; a second liquid storage tank; a second filter; a second buffer; the second filter is arranged between the second liquid storage tank and the second buffer; the second buffer is connected with a second back-pumping pipe; the second back-pumping pipe is provided with a second back-pumping pump; also includes one of the following two structures: the first structure comprises a selection mechanism and a total photoresist liquid pump; the second structure comprises a selection mechanism, a first photoresist liquid pump and a second photoresist liquid pump. The double-buffer type photoresist liquid spraying system can better save photoresist liquid and ensure that the supply of the photoresist liquid is not stopped.

Description

Double-buffer type photoresist liquid spraying system
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a double-buffer type photoresist liquid spraying system.
Background
Photoresist Coating (Coating) plays a very important role in the field of semiconductor manufacturing. For example, in an etching process, the photoresist layer is used as a mask for the etched film to keep the desired pattern from being removed by the etching reaction. In the ion implantation process, the photoresist layer also has the function of a mask to dope only a predetermined region.
The photoresist liquid spraying system mainly comprises: the first liquid storage tank, the first buffer, the first photoresist pump, the filter, the control valve and the nozzle. The photoresist liquid supplied from the first liquid storage tank enters the first buffer, is pumped out by the first photoresist liquid pump, is filtered by the filter, and is controlled by the control valve to be sprayed out from the nozzle at a required flow rate. The photoresist liquid is sprayed from a nozzle onto a chip (wafer) placed on a Spin Coater (Spin Coater), so that the Spin Coater drives the chip to rotate, and the photoresist liquid can be uniformly coated on the surface of the chip by centrifugal force.
However, in the photoresist Coating process, the phenomenon of Poor chip Coating (or Poor chip Coating) and Poor flatness (or Poor wafer height) often occurs due to bubbles or impurities generated in the photoresist, which may result in a decrease in the etching yield or reliability of the chip, and even cause the chip to be rejected.
Therefore, the filter needs to be replaced periodically to ensure the filtering quality.
At present, the filter is replaced frequently at a fixed frequency of once every three months, and during the replacement of the filter, the pre-wetting procedure of passing the photoresist liquid flow is required to discharge 500m L to l000m L of photoresist liquid, so that the wetted filter can be normally used.
However, the filter may generate bubbles during pre-wetting due to the influence of speed, pressure or temperature. If the coating operation is performed directly, the coating effect is affected. If the pre-wetting is followed by the exhausting operation, it will take more time and increase the cost of the photoresist solution, so that replacing the filter becomes a time-consuming and cost-consuming process.
Disclosure of Invention
The invention provides a double-buffer type photoresist liquid spraying system, which is used for removing micro bubbles generated in the pre-wetting process in the system after a filter is pre-wetted, so that the photoresist liquid is prevented from being additionally consumed, and the operation time is saved.
In order to solve the above problems, the present invention provides a double buffer type photoresist spraying system, comprising: the first liquid storage tank is used for storing and supplying photoresist liquid; a first filter for filtering impurities of the photoresist; the first buffer is used for removing micro bubbles of the photoresist liquid and buffering and providing the photoresist liquid; the first filter is arranged between the first liquid storage tank and the first buffer; the first buffer is connected with a first back-pumping pipe, the first end of the first back-pumping pipe extends into the first buffer, and the second end of the first back-pumping pipe is connected to the front end of the first filter; the first back pumping pipe is provided with a first back pumping pump; the first back-pumping pipe and the first back-pumping pump are used for back-pumping the light resistance liquid in the first buffer to the front end of the first filter; the second liquid storage tank is used for storing and supplying the photoresist liquid; a second filter for filtering impurities of the photoresist; the second buffer is used for removing micro bubbles of the photoresist liquid and buffering and providing the photoresist liquid; the second filter is arranged between the second liquid storage tank and the second buffer; the second buffer is connected with a second back-pumping pipe, the second end of the second back-pumping pipe extends into the second buffer, and the second end of the second back-pumping pipe is connected to the front end of the second filter; the second back-pumping pipe is provided with a second back-pumping pump; the second back-pumping pipe and the second back-pumping pump are used for back-pumping the light resistance liquid in the second buffer to the front end of the second filter; also includes one of the following two structures: the first structure comprises a selection mechanism and a total photoresist liquid pump; the selection mechanism is used for selecting the photoresist liquid from the first buffer and the first buffer; the total photoresist liquid pump is used for conveying the selected photoresist liquid to a using end; the second structure comprises a selection mechanism, a first light resistance liquid pump and a second light resistance liquid pump; the selection mechanism is used for selecting the photoresist liquid from the first buffer and the second buffer; the first light resistance liquid pump is used for conveying the light resistance liquid in the first buffer to a using end, and the second light resistance liquid pump is used for conveying the light resistance liquid in the second buffer to the using end.
Optionally, the first withdrawal pipe is provided with at least one of a first liquid valve and a first withdrawal liquid sensor; the second withdrawal pipe is provided with at least one of a second liquid valve and a second withdrawal liquid sensor.
Optionally, the first buffer is connected to a first exhaust pipe, and the first exhaust pipe is provided with a first exhaust valve and a first gas sensor; the second buffer is connected with a second exhaust pipe, and the second exhaust pipe is provided with a second exhaust valve and a second gas sensor.
Optionally, the system further includes a third filter, and the third filter and the first filter are connected in parallel between the first liquid storage tank and the first buffer; the buffer device also comprises a fourth filter, and the fourth filter and the second filter are connected in parallel between the second liquid storage tank and the second buffer.
Optionally, the front ends of the first filter and the third filter are connected to the first liquid storage tank through a first three-way valve, and the rear ends of the first filter and the third filter are connected to the first buffer through a second three-way valve; the front ends of the second filter and the fourth filter are connected with the second liquid storage tank through a third three-way valve, and the rear ends of the second filter and the fourth filter are connected with the second buffer through a fourth three-way valve.
Optionally, a first one-way control valve is arranged between the front end of the first filter and the first liquid storage tank; the second end of the first pumping return pipe is connected between the first one-way control valve and the first buffer; a second one-way control valve is arranged between the front end of the second filter and the second liquid storage tank; the second end of the second pumping back pipe is connected between the second one-way control valve and the second buffer.
Optionally, a first filtered liquid sensor is arranged between the rear end of the first filter and the first buffer; a second filtered liquid sensor is disposed between the rear end of the second filter and the second bumper.
Optionally, the rear end of the selection mechanism is also provided with a use control valve.
Optionally, the rear end of the usage control valve is further provided with a nozzle mechanism.
Optionally, a first supply liquid sensor is further arranged between the first buffer and the nozzle mechanism; a second supply liquid sensor is also provided between the second buffer and the nozzle mechanism.
In one aspect of the technical scheme, the invention provides a novel photoresist liquid spraying system, which can achieve the purpose of saving photoresist liquid while preventing bubbles from remaining in the photoresist liquid, and can pre-wet a filter by two different modes, so that the system has higher flexibility and stronger service performance; meanwhile, the system is provided with two different liquid supply pipelines which can both provide the photoresist liquid, the two liquid supply pipelines are provided with corresponding buffers, the buffers can be used for ensuring that the supply of the photoresist liquid is not stopped, and the two liquid supply pipelines are switched through the selection mechanism, so that the supply of the photoresist liquid is better ensured not to be stopped.
Drawings
FIG. 1 is a schematic diagram of a double-buffer type photoresist spraying system according to an embodiment of the present invention;
fig. 2 is a schematic view of another double-buffer type photoresist liquid spraying system according to another embodiment of the present invention.
Detailed Description
In the photoresist coating process, poor coverage and poor flatness may occur, and one of the reasons for these phenomena is that bubbles remain in the photoresist during the pre-wetting process of the filter, so that the photoresist is not continuously coated on the surface of the chip (wafer). However, to avoid this, the photoresist liquid, which is an expensive material, is usually wasted.
Therefore, the invention provides a double-buffer type photoresist liquid spraying system to solve the defects. For a more clear presentation, the invention is described in detail below with reference to the accompanying drawings.
An embodiment of the present invention provides a double-buffer type photoresist spraying system, please refer to fig. 1, the system includes:
a first reservoir tank 100 for storing and supplying a photoresist liquid (the photoresist liquid is not shown in fig. 1);
a first filter 110 for filtering impurities of the photoresist;
a first buffer 120 for removing microbubbles of the photoresist liquid and for buffering and providing the photoresist liquid;
the first filter 110 is disposed between the first liquid storage tank 100 and the first buffer 120;
a first photoresist pump 130 for delivering the photoresist in the first liquid storage tank 100 to a user end;
the first buffer 120 is connected with a first back-pumping pipe 160, a first end of the first back-pumping pipe 160 extends into the first buffer 120, and a second end is connected to the front end of the first filter 110; the first suction pipe 160 is provided with a first suction pump 161; the first pumping-back pipe 160 and the first pumping-back pump 161 are used for pumping back the photoresist liquid in the first buffer 120 to the front end of the first filter 110;
a second liquid storage tank 200 for storing and supplying a photoresist liquid;
a second filter 210 for filtering impurities of the photoresist;
a second buffer 220 for removing microbubbles of the photoresist liquid and for buffering and providing the photoresist liquid;
the second filter 210 is disposed between the second reservoir 200 and the second buffer 220;
the second buffer 220 is connected with a second back-pumping pipe 260, a second end of the second back-pumping pipe 260 extends into the second buffer 220, and the second end is connected to the front end of the second filter 210; the second suction pipe 260 is provided with a second suction pump 261; the second pumping-back pipe 260 and the second pumping-back pump 261 are used for pumping back the photoresist liquid in the second buffer 220 to the front end of the second filter 210;
a selection mechanism, in this embodiment, the selection mechanism is embodied as the main three-way valve 180 in fig. 1, and the selection mechanism is used for selecting the photoresist liquid from the first buffer 120 and the second buffer 220; that is, the embodiment can switch two different photoresist liquid supply pipelines through the main three-way valve 180;
the master photoresist pump 130, the master photoresist pump 130 is used to deliver the photoresist selected by the master three-way valve 180 to the user end.
Wherein, the rear end of the first buffer 120 and the rear end of the second buffer 220 are both connected to the user terminal.
It can be seen from the above structure that the system provided by this embodiment has two different liquid supply pipelines, both of which can provide the photoresist liquid, and both of the two liquid supply pipelines have corresponding buffers, and the buffers can be used to ensure that the supply of the photoresist liquid does not stop. And the two liquid supply pipelines are switched by a selection mechanism (a total three-way valve 180), so that the supply of the photoresist liquid can be further ensured to be not stopped.
In this embodiment, the first reservoir 100 is a photoresist reservoir. The photoresist liquid in the first liquid storage tank 100 can be supplied by inputting (pressing) dry air or nitrogen gas into the first liquid storage tank 100, so that the photoresist liquid is output. The pipes that can be used for the input of dry air or nitrogen are shown as the left-most pipes in fig. 1 (this pipe is not labeled).
The second fluid reservoir 200 may function in reference to the first fluid reservoir 100.
In this embodiment, the photoresist filtered by the first filter 110 is generally the photoresist input from the first tank 100 to the first filter 110. Meanwhile, in some cases, the photoresist solution pre-wetted by the first filter 110 is pumped back again from the first buffer 120 through the first pumping-back pipe 160, please refer to the following.
The role of the second filter 210 may be referenced to the first filter 110.
In this embodiment, the microbubbles discharged from the first buffer 120 are mostly from the photoresist liquid input to the first buffer 120 during the pre-wetting process of the first filter 110. Of course, if the microbubbles are generated from the first filter 110 during the use, the microbubbles can be also excluded from the first buffer 120.
The second buffer 220 may serve as a reference for the first buffer 120.
As shown in fig. 1, the present embodiment provides a system in which a first liquid valve 162 is installed in a first evacuation pipe 160. The first liquid valve 162 is used to further control the pumping back operation, so that when the first liquid valve 162 is opened and the first pumping back pump 161 is operated, the pumping back of the photoresist liquid is performed, thereby ensuring safe and reliable operation.
In the system provided in the present embodiment, the second liquid valve 262 is installed on the second withdrawal pipe 260, and the corresponding contents of the first liquid valve 162 can be referred to.
As shown in fig. 1, the present embodiment provides a system in which a first exhaust pipe 170 is connected to the first buffer 120, the first exhaust pipe 170 is used for gas exhaust, and the first exhaust pipe 170 can be led out from above the first buffer 120. The gas has a low density and escapes upward, and a first exhaust pipe 170 is provided to be connected above the first buffer 120 to facilitate the gas exhaust.
The function of the second exhaust pipe 270 may be referred to the first exhaust pipe 170.
As shown in fig. 1, the first exhaust pipe 170 is mounted with a first exhaust valve 172 and a first gas sensor 171. The first exhaust valve 172 is used to control the opening and closing of the first exhaust pipe 170, and the first exhaust valve 172 may also have a gas flow rate monitoring function. The first gas sensor 171 is used to further confirm whether the corresponding system exhaust state is normal during the exhaust process of the first buffer 120.
The roles of the second exhaust valve 272 and the second gas sensor 271 may be referenced to the first exhaust valve 172 and the first gas sensor 171, respectively.
It should be noted that in other embodiments, the first exhaust pipe 170 may be equipped with a corresponding air-extracting device, such as an air-extracting pump, to achieve better exhaust effect. The second exhaust pipe 270 may be equipped with a corresponding air-extracting device, such as an air-extracting pump, to achieve a better exhaust effect.
As shown in fig. 1, in the present embodiment, a first check valve 111 is provided between the front end of the first filter 110 and the first tank 100. The first one-way control valve 111 is used to cooperate with the first reservoir 100 to supply the photoresist to the first filter 110. The first one-way control valve 111 is opened to allow the photoresist liquid to be injected (pressed) from the first reservoir 100 into the first filter 110, and when the first one-way control valve 111 is closed, such closed state may be used to allow replacement of the first filter 110 or replacement of the first reservoir 100 (e.g., after the photoresist liquid is used up).
Meanwhile, in the present embodiment, the second end of the first back suction pipe 160 is connected between the first check valve 111 and the first buffer 120. At this time, the first one-way control valve 111 may be used to prevent the pumped back photoresist solution conveyed by the first pumping back pipe 160 from flowing back to the first liquid storage tank 100, so as to ensure that the pumped back photoresist solution is all used to input into the first filter 110, so as to be all used to pre-wet the first filter 110, and meanwhile, to implement the re-filtration of the portion of the photoresist solution, please refer to the following contents of this embodiment.
As shown in fig. 1, in the present embodiment, a second one-way control valve 211 is disposed between the front end of the second filter 210 and the second tank 200, and reference is made to the related content of the first one-way control valve 111.
In this embodiment, a first filtered liquid sensor 112 is provided between the rear end of the first filter 110 and the first buffer 120. The first filtered liquid sensor 112 may be used to detect whether the filtered photoresist liquid from the first filter 110 is normally input to the first buffer 120.
Second filtered liquid sensor 212 is located between the rear end of second filter 210 and second buffer 220, and reference can be made to the corresponding contents of first filtered liquid sensor 112.
Referring to fig. 1, in the present embodiment, the rear end of the first buffer 120 further has a use control valve 140. The control valve 140 is used to further control the flow state of the resist liquid to the use end, and even when the first resist pump 130 stops the supply (pressure-feed) of the resist liquid, the resist liquid can be further prevented from flowing (e.g., leaking) to the use end by the closing operation of the control valve 140. Meanwhile, as can be seen from fig. 1, in the present embodiment, the use control valve 140 is located at the rear end of the selection mechanism, and therefore, the use control valve 140 is also located at the rear end of the selection mechanism.
As shown in fig. 1, the rear end of the usage control valve 140 is also provided with a nozzle mechanism 150. The nozzle mechanism 150 controls the ejection flow rate and ejection state of the final resist liquid for use in the manufacture of semiconductor products such as chips.
As can be seen from the system structure shown in fig. 1, when the first photoresist pump 130 and the second photoresist pump 130 deliver the photoresist to the using end, the photoresist buffered in the first buffer 120 is pumped to the nozzle mechanism 150 at the back end, that is, the nozzle mechanism 150 is a structure corresponding to the using end.
The system of this embodiment may utilize a first conduit to provide the photoresist fluid to the nozzle mechanism 150 during normal use. The photoresist in the first tank 100 can be pumped out (pressed out) by various methods, and then transferred to the first filter 110 through a transfer pipe (not shown). The impurities are filtered by the first filter 110. The filtered photoresist solution is then transferred to the first buffer 120 through a back-end transfer pipe (not shown). The first buffer 120 is to prevent the user end from continuously working without photoresist being sprayed out (i.e. idling) and causing damage when the photoresist in the first tank 100 is used up. The first buffer 120 can also remove air during operation, so that the micro-bubbles generated in the previous process can be removed by the first buffer 120 and then sent to the nozzle mechanism 150 through the main three-way valve 180 for ejection.
The system of this embodiment may also provide the second path of the photoresist liquid to the nozzle mechanism 150 during normal use. The photoresist in the second tank 200 can be pumped out (pressed out) in various ways and then transferred to the second filter 210 through a transfer pipe (not shown). The impurities are filtered by the second filter 210. The filtered photoresist solution is then transferred to the second buffer 220 through a back-end transfer pipe (not shown). The second buffer 220 is used to prevent the damage caused by the continuous operation of the user end without the photoresist being sprayed out (i.e. idling) after the photoresist in the second fluid reservoir 200 is used up. The second buffer 220 can also remove air during operation, so that the second buffer 220 can remove micro-bubbles generated in the previous process, and then the micro-bubbles are sent to the nozzle mechanism 150 through the main three-way valve 180 to be sprayed out.
The first filter 110 and the second filter 210 need to be replaced after filtering the photoresist solution for a certain period of time.
In the following, the frequency of replacing the first filter 110, the reason for replacing the first filter, and the process of replacing the first filter 110 will be described by taking the first filter 110 as an example.
The first filter 110 is replaced at a fixed frequency, about once every three months. In actual conditions, the situation (such as blockage situation) that each filter needs to be replaced is different due to factors such as the usage rate and viscosity of the photoresist liquid. In order to achieve a safe service life of the entire system, the filter change timing is usually controlled to be a minimum of three months. However, when an abnormal condition occurs, it is also often necessary to replace the filter in a shorter time.
The photoresist solution is mainly prepared by mixing resin, photosensitizer and solvent according to different proportions, so the viscosity of the photoresist solution is changed due to different mixing proportions of the resin, the photosensitizer and the solvent, therefore, the existing filter needs to pass through the photoresist solution after being replaced, 500m L to l000m L of photoresist solution is discharged, and the wetted filter can be normally used.
Photoresist solutions are expensive to manufacture for semiconductors. In the pre-wetting process of the filter, micro-bubbles may be naturally generated during the process of completely wetting the filter surface of the filter, or micro-bubbles may be generated due to the pre-wetting filtering speed, bending and turning of the delivery pipe when delivering the photoresist liquid, and other factors when supplying the photoresist liquid. If the filter is disposed after the first buffer according to the known system structure design, it takes time and photoresist solution to perform the pre-wetting operation after the filter replacement operation is performed, and it also takes time and extra photoresist solution to remove micro-bubbles generated during the pre-wetting operation, thereby causing waste of the photoresist solution and increasing the manufacturing cost.
In the system of the present embodiment, after the first filter 110 is replaced with a new one, when the pre-wetting operation of the first filter 110 by the photoresist solution is desired, two ways may be adopted.
In the first mode, the photoresist solution can be drawn from the first liquid storage tank 100, the photoresist solution is pre-wetted and impurities are removed in the first filter 110, and micro bubbles generated by the photoresist solution during the pre-wetting process are discharged from the first buffer 120 when the photoresist solution leaves the first filter 110 and reaches the first buffer 120 (without using additional photoresist solution to perform bubble removal operation after the pre-wetting process).
In the second way, the photoresist solution can be pumped back from the first buffer 120, and the part of the pumped photoresist solution flows back to the first filter 110 again, on one hand, pre-wetting is performed on the first filter 110, and on the other hand, the part of the photoresist solution is filtered again by impurities; the microbubbles generated by the photoresist liquid during the pre-wetting process are also discharged from the first buffer 120 when the photoresist liquid leaves the first filter 110 again and returns to the first buffer 120 (without using additional photoresist liquid to perform bubble removal after pre-wetting), so that the method also saves time, can also save the usage amount of the photoresist liquid (the photoresist liquid used in the pre-wetting process and the photoresist liquid used in the subsequent microbubble removal process), and achieves the purpose of saving cost.
According to the two pre-wetting operation modes, when the system provided by the embodiment performs the pre-wetting operation, when the first mode is adopted, the following processes are performed:
after the new first filter 110 is replaced to the delivery line of the photoresist liquid spraying system, pre-wetting operation is immediately carried out, firstly, the photoresist liquid in the first liquid storage tank 100 is led out and is delivered into the first filter 110 by the delivery line, and pre-wetting operation and impurity filtration are carried out by the first filter 110; then, the filtered photoresist liquid is transported to the first buffer 120 through the transport pipe; the first buffer 120 can remove air during operation, so that micro-bubbles generated during pre-wetting of the filter can be removed by the first buffer 120 and then sent to the nozzle mechanism 150 for spraying, so that the micro-bubbles generated by pre-wetting of the first filter 110 are blocked in the first buffer 120 and do not affect photoresist coating.
When the second mode is adopted, there is the following process:
after the new first filter 110 is replaced to the delivery line of the photoresist liquid spraying system, the pre-wetting operation is immediately performed, the first one-way control valve 111 is firstly closed, and the photoresist liquid is pumped from the first buffer 120 by the first back-pumping pipe 160 and the first back-pumping pump 161 to return to the front end of the first filter 110 and is delivered into the first filter 110 through the delivery line, and the pre-wetting operation and impurity filtering are performed by the first filter 110; then, the filtered photoresist liquid is transported to the first buffer 120 through the transport pipe; the first buffer 120 can remove air during operation, so that micro-bubbles generated during pre-wetting of the filter can be removed by the first buffer 120 and then sent to the nozzle mechanism 150 for spraying, so that the micro-bubbles generated by pre-wetting of the first filter 110 are blocked in the first buffer 120 and do not affect photoresist coating.
It should be noted that the embodiment intends to perform the pre-wetting operation on the first filter 110 in the second manner, provided that: the first buffer 120 has enough photoresist therein. It is sufficient to mean two aspects: on one hand, the photoresist liquid in the first buffer 120 is sufficient to be supplied to the user end; on the other hand, the photoresist liquid in the first buffer 120 is also sufficient to be simultaneously provided for the respective entire pre-wetting operation step. Both aspects typically need to be satisfied simultaneously.
In this embodiment, whether the photoresist in the first buffer 120 is sufficient to meet the requirements of the two aspects can be determined by providing a corresponding level sensor in the first buffer 120.
As can be seen from the second filter pre-wetting method, in the present embodiment, the first filter 110 can be pre-wetted by the photoresist solution in the first buffer 120, and the micro-bubbles generated during the pre-wetting process of the first filter 110 can be removed by the first buffer 120.
For the second filter pre-wetting mode described above, there is an advantage in that: at this time, the pre-wetting operation may not involve the first reservoir 100, and thus, the first reservoir 100 may be replaced at this operating time window at the same time.
There is another advantage to the second filter pre-wetting approach described above: at this time, the photoresist solution used for the pre-wetting operation is the photoresist solution filtered by the last stage of the old first filter 110, and the filtering quality of this photoresist solution is probably not ideal; therefore, the pumping back is used for the pre-wetting operation, and the part of the photoresist liquid can be filtered again at the same time, so that the impurities of the photoresist liquid can be effectively filtered.
In this embodiment, in another pipeline, the frequency, reason and process of replacing the second filter 210 can refer to the corresponding contents of the first filter 110.
In this embodiment, in two pipelines, corresponding filter all can in time be changed to the operation of prewetting after changing the filter all can save the light resistance liquid. Meanwhile, each pipeline is provided with a buffer to ensure the liquid supply state without stopping, and the three-way valve 180 is further arranged to switch two different liquid supply pipelines to provide the photoresist liquid, so that the supply of the photoresist liquid is better ensured without stopping.
Another embodiment of the present invention provides another double-buffer type photoresist spraying system, please refer to fig. 2, which includes:
a first reservoir 300 for storing and supplying a photoresist liquid (the photoresist liquid is not shown in fig. 2);
a first filter 310 for filtering impurities of the photoresist;
a first buffer 320 for removing microbubbles of the photoresist liquid and for buffering and providing the photoresist liquid;
the first filter 310 is disposed between the first reservoir 300 and the first buffer 320;
the first buffer 320 is connected with a first back-pumping pipe 360, a first end of the first back-pumping pipe 360 extends into the first buffer 320, and a second end is connected to the front end of the first filter 310; the first back-pumping pipe 360 is provided with a first back-pumping pump 361; the first pumping-back pipe 360 and the first pumping-back pump 361 are used for pumping back the photoresist liquid in the first buffer 320 to the front end of the first filter 310;
a second liquid storage tank 400 for storing and supplying a photoresist liquid;
a second filter 410 for filtering impurities of the photoresist;
a second buffer 420 for removing microbubbles of the photoresist liquid and for buffering and providing the photoresist liquid;
the second filter 410 is disposed between the second reservoir 400 and the second buffer 420;
the second buffer 420 is connected with a second back-suction pipe 460, a second end of the second back-suction pipe 460 extends into the second buffer 420, and the second end is connected to the front end of the second filter 410; the second suction pipe 460 is provided with a second suction pump 461; the second pumping-back pipe 460 and the second pumping-back pump 461 are used for pumping back the photoresist liquid in the second buffer 420 to the front end of the second filter 410;
the selection mechanism of the embodiment is used for selecting the photoresist liquid from the first buffer and the first buffer, and specifically, the selection mechanism comprises a first selection valve 340 and a second selection valve 440, wherein the first selection valve 340 and the second selection valve 440 are not opened at the same time, and only one of the first selection valve 340 and the second selection valve 440 is opened during normal operation, so that selection is realized;
the first photoresist pump 330 is used for delivering the photoresist in the first buffer 320 to the user end, and the second photoresist pump 430 is used for delivering the photoresist in the second buffer 420 to the user end.
In this embodiment, the outputs of the first photoresist pump 330 and the second photoresist pump 430 are connected to a common pipe segment.
As shown in fig. 2, in the system provided in the present embodiment, a first exhaust pipe 370 is connected to the first buffer 320, and a first exhaust valve 372 and a first gas sensor 371 are installed in the first exhaust pipe 370. A second exhaust pipe 470 is connected to the second buffer 420, and a second exhaust valve 472 and a second gas sensor 471 are installed in the second exhaust pipe 470.
As shown in fig. 2, in the present embodiment, a first check valve 311 is provided between the front end of the first filter 310 and the first reservoir 300. A second end of the first back suction pipe 360 is connected between the first check valve 311 and the first buffer 320. A second check valve 411 is provided between the front end of the second filter 410 and the second reservoir 400. A second end of the second back-suction pipe 460 is connected between the second check valve 411 and the second buffer 420.
In this embodiment, a first filtered liquid sensor 312 is provided between the rear end of the first filter 310 and the first buffer 320. A second filtered liquid sensor 412 is provided between the rear end of the second filter 410 and the second bumper 420.
Referring to fig. 2, in this embodiment, the common pipe section at the rear ends of the first photoresist pump 330 and the second photoresist pump 430 further has a usage control valve 510. The rear end of the second buffer 420 also has a usage control valve 510.
As shown in fig. 2, the rear end of the usage control valve 510 is also provided with a nozzle mechanism 520. The nozzle mechanism 520 controls the discharge flow rate and discharge state of the final resist liquid for use in the manufacture of semiconductor products such as chips.
As can be seen from the system structure shown in fig. 2, when the first photoresist pump 330 delivers the photoresist to the using end, the photoresist buffered in the first buffer 320 is pumped to the nozzle mechanism 520 at the rear end, that is, the nozzle mechanism 520 is a structure corresponding to the using end.
The structure of the system provided by this embodiment is substantially the same as the corresponding structure of the foregoing embodiment, and therefore, reference may be made to the corresponding contents of the foregoing embodiment for the nature, characteristics, advantages, operating conditions, operating principles, possible variations, and the like of the structure.
Unlike the previous embodiments, in the present embodiment, the first withdrawal pipe 360 is provided with a first withdrawal liquid sensor 363 in addition to the first liquid valve 362. The first pumping-back liquid sensor 363 can be used for monitoring whether the corresponding photoresist liquid is normally pumped back or not when the subsequently pumped back photoresist liquid is used for carrying out the filter pre-wetting operation, so that the safety and the reliability of the second filter pre-wetting mode are further ensured.
Unlike the previous embodiments, the present embodiment further includes a third filter 3100, and the third filter 3100 is connected in parallel with the first filter 310 between the first reservoir 300 and the first buffer 320. The embodiment further comprises a third filter and a fourth filter 4100, wherein the fourth filter 4100 and the second filter 410 are connected in parallel between the second liquid storage tank 400 and the second buffer 420.
Referring to fig. 2, a third filter 3100 is also located at the rear end of the first one-way control valve 311. The rear end of the third filter 3100 is likewise connected to the first filtered liquid sensor 312, i.e. the first filtered liquid sensor 312 is arranged at the rear end common to both the first filter 310 and the third filter 3100.
A fourth filter 4100 is also located at the rear end of the second check valve 411. The rear end of the fourth filter 4100 is also connected to a second filtered liquid sensor 412, i.e. the second filtered liquid sensor 412 is arranged at the rear end common to both the second filter 410 and the fourth filter 4100.
In order to accommodate the use of the third filter 3100, in this embodiment, the front ends of the first filter 310 and the third filter 3100 are connected to the first reservoir tank 300 by a first three-way valve 381, and the rear ends of the first filter 310 and the third filter 3100 are connected to the first buffer 320 by a second three-way valve 382.
By providing the third filter 3100, the first three-way valve 381, and the second three-way valve 382, the present embodiment can make the replacement of the filter more rapid and timely. Specifically, only the first three-way valve 381 and the second three-way valve 382 need to cooperate with the local delivery line inside the first line to switch over, so that the third filter 3100 in use can be quickly replaced with a new first filter 310, or the first filter 310 in use can be replaced with a new third filter 3100.
Also, by providing the fourth filter 4100, the third three-way valve 481, and the fourth three-way valve 482, the present embodiment can make the replacement of the filter more rapid and timely. Specifically, the third three-way valve 481 and the fourth three-way valve 482 are only required to cooperate with the local transfer line inside the second line, so that the fourth filter 4100 in use can be quickly replaced with a new second filter 410, or the second filter 410 in use can be replaced with a new fourth filter 4100.
It can also be seen from the above that in the present embodiment, the first filter 310 and the third filter 3100 are equal, and when they are used for the first time, if both filters are new, one of them can be selected to be used first. Similarly, the second filter 410 and the fourth filter 4100 are also equivalent.
Then, when one filter in the first pipeline is used and needs to be replaced, the corresponding conveying pipeline can be switched through the first three-way valve 381 and the second three-way valve 382; when one filter of the second pipeline is used and needs to be replaced, the corresponding conveying pipeline can be switched through the third three-way valve 481 and the fourth three-way valve 482. After switching, the standby new filter is put into use, and the filter needing to be replaced can be updated in time at the moment and is continuously standby. This way, the corresponding filter change can be made faster and more convenient.
Unlike the previous embodiments, in the present embodiment, a first supply liquid sensor 350 is further provided between the first buffer 320 and the nozzle mechanism 520. The first supply liquid sensor 350 may be used to further monitor the supply of the photoresist liquid from the first buffer 320 to the user side from time to time. In this embodiment, the first supply liquid sensor 350 is located between the first buffer 320 and the first selector valve 340. In other embodiments, the first supply liquid sensor may have more selective positions, and only needs to be located at the rear end of the first buffer and in the first pipeline. Similarly, a second supply liquid sensor 450 is provided between the second buffer 420 and the nozzle mechanism 520, and reference is made to the corresponding contents of the first supply liquid sensor 350.
It should be noted that each liquid sensor in each embodiment of the present invention may further be a sensor having a flow sensing monitoring function, that is, a liquid flow sensor; correspondingly, the first gas sensor in each embodiment of the present invention may also have a first gas sensor having a gas flow sensing and monitoring function; accordingly, each (control) valve of the embodiments of the present invention may further be a control valve having a gas or liquid flow control function.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A double-buffer type photoresist spraying system is characterized by comprising:
the first liquid storage tank is used for storing and supplying photoresist liquid;
a first filter for filtering impurities of the photoresist;
the first buffer is used for removing micro bubbles of the photoresist liquid and buffering and providing the photoresist liquid;
the first filter is arranged between the first liquid storage tank and the first buffer;
the first buffer is connected with a first back-pumping pipe, the first end of the first back-pumping pipe extends into the first buffer, and the second end of the first back-pumping pipe is connected to the front end of the first filter; the first back pumping pipe is provided with a first back pumping pump; the first back-pumping pipe and the first back-pumping pump are used for back-pumping the light resistance liquid in the first buffer to the front end of the first filter;
the second liquid storage tank is used for storing and supplying the photoresist liquid;
a second filter for filtering impurities of the photoresist;
the second buffer is used for removing micro bubbles of the photoresist liquid and buffering and providing the photoresist liquid;
the second filter is arranged between the second liquid storage tank and the second buffer;
the second buffer is connected with a second back-pumping pipe, the second end of the second back-pumping pipe extends into the second buffer, and the second end of the second back-pumping pipe is connected to the front end of the second filter; the second back-pumping pipe is provided with a second back-pumping pump; the second back-pumping pipe and the second back-pumping pump are used for back-pumping the light resistance liquid in the second buffer to the front end of the second filter;
also includes one of the following two structures:
the first structure comprises a selection mechanism and a total photoresist liquid pump; the selection mechanism is used for selecting the photoresist liquid from the first buffer and the first buffer; the total photoresist liquid pump is used for conveying the selected photoresist liquid to a using end;
the second structure comprises a selection mechanism, a first light resistance liquid pump and a second light resistance liquid pump; the selection mechanism is used for selecting the photoresist liquid from the first buffer and the second buffer; the first light resistance liquid pump is used for conveying the light resistance liquid in the first buffer to a using end, and the second light resistance liquid pump is used for conveying the light resistance liquid in the second buffer to the using end.
2. The photoresist formulation coating system of claim 1, wherein the first withdrawal line is fitted with at least one of a first liquid valve and a first withdrawal liquid sensor; the second withdrawal pipe is provided with at least one of a second liquid valve and a second withdrawal liquid sensor.
3. The photoresist solution coating system of claim 2, wherein a first exhaust pipe is connected to the first buffer, and the first exhaust pipe is provided with a first exhaust valve and a first gas sensor; the second buffer is connected with a second exhaust pipe, and the second exhaust pipe is provided with a second exhaust valve and a second gas sensor.
4. The photoresist coating system of claim 3, further comprising a third filter connected in parallel with the first filter between the first reservoir and the first buffer; the buffer device also comprises a fourth filter, and the fourth filter and the second filter are connected in parallel between the second liquid storage tank and the second buffer.
5. The photoresist coating system of claim 4, wherein the front ends of the first and third filters are connected to the first reservoir via a first three-way valve, and the rear ends of the first and third filters are connected to the first buffer via a second three-way valve; the front ends of the second filter and the fourth filter are connected with the second liquid storage tank through a third three-way valve, and the rear ends of the second filter and the fourth filter are connected with the second buffer through a fourth three-way valve.
6. The photoresist solution coating system of claim 5, wherein a first one-way control valve is provided between the front end of the first filter and the first reservoir; the second end of the first pumping return pipe is connected between the first one-way control valve and the first buffer; a second one-way control valve is arranged between the front end of the second filter and the second liquid storage tank; the second end of the second pumping back pipe is connected between the second one-way control valve and the second buffer.
7. The photoresist solution coating system according to claim 1 or 6, wherein a first filtered liquid sensor is provided between a rear end of the first filter and the first buffer; a second filtered liquid sensor is disposed between the rear end of the second filter and the second bumper.
8. The photoresist formulation coating system of claim 7, wherein the back end of the selection mechanism further has a use control valve.
9. The photoresist formulation coating system of claim 8, wherein the back end of the usage control valve further has a nozzle mechanism.
10. The photoresist solution coating system of claim 9, further comprising a first supply liquid sensor between the first buffer and the nozzle mechanism; a second supply liquid sensor is also provided between the second buffer and the nozzle mechanism.
CN202010263934.XA 2020-04-07 2020-04-07 Double-buffer type photoresist liquid spraying system Active CN111451061B (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050098410A (en) * 2004-04-07 2005-10-12 삼성전자주식회사 Apparatus and method for dispensing photosensitive solution in semiconductor device fabrication equipment
CN201017172Y (en) * 2007-01-08 2008-02-06 和舰科技(苏州)有限公司 Light blockage supply piping installation
CN101246311A (en) * 2007-02-12 2008-08-20 中芯国际集成电路制造(上海)有限公司 Photo resist air bubble eliminating system and method thereof
CN203630510U (en) * 2013-12-23 2014-06-04 徐州同鑫光电科技有限公司 Photoresist recycling system
CN105413247A (en) * 2012-02-27 2016-03-23 东京毅力科创株式会社 Solution Treatment Apparatus And Solution Treatment Method
CN207502908U (en) * 2017-11-22 2018-06-15 武汉新芯集成电路制造有限公司 A kind of photoresist supply system
CN212820700U (en) * 2020-04-07 2021-03-30 芯米(厦门)半导体设备有限公司 Double-buffer type photoresist liquid spraying system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050098410A (en) * 2004-04-07 2005-10-12 삼성전자주식회사 Apparatus and method for dispensing photosensitive solution in semiconductor device fabrication equipment
CN201017172Y (en) * 2007-01-08 2008-02-06 和舰科技(苏州)有限公司 Light blockage supply piping installation
CN101246311A (en) * 2007-02-12 2008-08-20 中芯国际集成电路制造(上海)有限公司 Photo resist air bubble eliminating system and method thereof
CN105413247A (en) * 2012-02-27 2016-03-23 东京毅力科创株式会社 Solution Treatment Apparatus And Solution Treatment Method
CN203630510U (en) * 2013-12-23 2014-06-04 徐州同鑫光电科技有限公司 Photoresist recycling system
CN207502908U (en) * 2017-11-22 2018-06-15 武汉新芯集成电路制造有限公司 A kind of photoresist supply system
CN212820700U (en) * 2020-04-07 2021-03-30 芯米(厦门)半导体设备有限公司 Double-buffer type photoresist liquid spraying system

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