CN201004462Y - Micro lens module encapsulation structure - Google Patents
Micro lens module encapsulation structure Download PDFInfo
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- CN201004462Y CN201004462Y CNU200720000238XU CN200720000238U CN201004462Y CN 201004462 Y CN201004462 Y CN 201004462Y CN U200720000238X U CNU200720000238X U CN U200720000238XU CN 200720000238 U CN200720000238 U CN 200720000238U CN 201004462 Y CN201004462 Y CN 201004462Y
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- module
- sensing chip
- eyeglass
- hollow cylinder
- cylinder base
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Abstract
The utility model discloses an encapsulation structure of micro lens module. A lens module can be arranged directly on the CCM module, which can avoid affecting the imaging effect of the chip module due to the height error produced when a tin ball and a base plate are combined. The CCM lens encapsulation structure comprises a base plate, a sensing chip module and a lens module, wherein, the sensing chip module can be covered by the lens module, and by using that a concave step arranged in the lens module is arranged closely around the illuminating surface of the sensing chip module, the chip module can keep synchronously the same level and height following the illuminating surface of the sensing chip so as to reduce the error produced during the processing and make the quality of the focusing imaging of the lens module and the sensing chip module more excellent.
Description
Technical field
The utility model relates to a kind of camera lens module encapsulating structure, refer to a kind of miniature lens module (Compact Camera Module, encapsulating structure CCM) of being useful in especially.
Background technology
Along with making rapid progress of science and technology epoch, carry-on information electronic product miscellaneous and equipment in response to and give birth to, and various product spare part all strides forward towards compact target.How to make product have more hommization, the notion of multimachine one, the volume-diminished Human Engineering that meets easy to carry more conforms with the demand that consumer's facility is followed the fashion, and is one of main problem of existing market.And with mobile phone in conjunction with digital camera functionality in addition with mobile computer and PDA(Personal Digital Assistant) all in conjunction with digital camera functionality, promptly be that wherein an important improvement breaks through.
Observe commercially available all mobile phones at present, can find all to go development towards microminiaturized route, the mobile phone that especially has the function of taking pictures, hot especially machine, more in conjunction with the function of 3G, utilization network video phone makes user both sides link up with image to mobile phone now.Therefore, the route of following mobile phone will be diversification and Full Featured outfit, even may replace existing digital camera, become in conjunction with take pictures, communication, online etc., have multi-functional integration machine.
See also shown in Figure 1ly, it is existing miniature lens module (Compact Camera Module is called for short CCM) encapsulating structure generalized section.Existing miniature lens module encapsulating structure 1 is to include: a substrate 10, a sensing chip module 11, a lens barrel 12, with a load bearing seat 13.Described sensing chip module 11 also includes: an image sensing chip 111, a transparent cover plate 112 and a chip support plate 113 are formed.
With described sensing chip module 11 with the tin chou be combined in described substrate 10 on, and with described load bearing seat 13 1 end ring of hollow around described sensing chip module 11 and be arranged on the described substrate 10.Screw thread 131 matched within described lens barrel 12 can rely on external screw thread 121 and the other end of described load bearing seat 13 is inner set, and be provided with a loophole 122 at described lens barrel 12 end faces, and described loophole 122 rears in described lens barrel 12 are provided with a lens set 123 and photic zone 124 in regular turn.
Yet, the error that is produced in the processing procedure and then influence the biggest factor of image quality, height (axially) error that height (axially) error that is produced when coming comfortable described sensing chip module 11 to rely on the tin ball to do electric connection with described substrate 10 and the described transparent cover plate 112 of described sensing chip module 11 are engaged with chip support plate 113.And two above-mentioned margins of error roughly are respectively ± 0.05mm and ± 0.02mm, so add up to the focal length influence imaging can reach ± the axial overall error amount of 0.07mm.Rely on described lens barrel that described load bearing seat 13 screwed togather 12 helical rotation in addition, can adjust the axial distance of described lens barrel 12 and described sensing chip module 11 focusings, and then reduce its margin of error, make it obtain preferable image space.But, prior art must spend more time and cost is to adjust error to permissible range, and carry out the assembling of lens barrel 12 and load bearing seat 13 after lens barrel 12 also must use two molds to produce respectively with load bearing seat 13 again, cause making improve relative with assembly cost.
Summary of the invention
First purpose of the present utility model, be to provide a kind of miniature lens module (Compact CameraModule, CCM) encapsulating structure, it is to utilize the set recessed rank closing of eyeglass module open end around the transparent surface of described sensing chip module, make described eyeglass module keep par angle and height synchronously with the transparent surface of described chip module, further get rid of described sensing chip module and rely on tin ball and the height error that substrate combines and produced, reach within the range of allowable error of standard.
Another purpose of the present utility model is to provide a kind of miniature lens module encapsulating structure, and existing load bearing seat and lens barrel are formed an eyeglass module in integrally formed mode, reaches only to use single mold production to reduce the purpose of manufacturing cost.
In order to achieve the above object, be to provide a kind of miniature lens module encapsulating structure, it is to mainly include: a substrate, a sensing chip module and an eyeglass module are formed.It is the printed circuit board (PCB) with one first real estate and one second real estate for described substrate.Described sensing chip module is to have a transparent surface and a composition surface, and relies on a tin ball and described first real estate to do electric connection with described composition surface.Described eyeglass module includes a hollow cylinder base, an openend inner edge is provided with recessed rank therein, and the other end with respect to described openend is provided with a loophole, is provided with an eyeglass and a photic zone in regular turn by described loophole rear in described accommodation chamber.
Described eyeglass module can utilize the interior recessed rank closing of described eyeglass module around the transparent surface of described sensing chip module, described sensing chip module frame can be enclosed and covers simultaneously, make described eyeglass module keep par angle and height synchronously, further get rid of the height error that relies on tin ball and substrate to combine and produced at the sensing chip module described in the processing procedure with the transparent surface of described sensing chip module.
Advantage of the present utility model is, guarantees that error drops within the permissible range of standard, can reduce production costs simultaneously.
Description of drawings
Fig. 1 is the generalized section of existing CCM encapsulating structure;
Fig. 2 is that generalized section is decomposed in CCM lens package module first preferred embodiment of the present utility model;
Fig. 3 is CCM lens package module first preferred embodiment combination generalized section of the present utility model;
Fig. 4 is CCM lens package module second preferred embodiment combination generalized section of the present utility model.
Description of reference numerals: 1～existing miniature lens module encapsulating structure; 10～substrate; 11～sensing chip module; 111～image sensing chip; 112～transparent cover plate; 113～chip support plate; 12～lens barrel; 121～external screw thread; 122～loophole; 123～lens set; 124～photic zone; 13～load bearing seat; 131～internal thread; 2～miniature lens module encapsulating structure; 21～substrate; 211～the first real estates; 212～the second real estates; 213～location hole; 22～sensing chip module; 221～transparent surface; 222～composition surface; 223～chip support plate; 2231～via; 224～image sensing chip; 2241～action face; 2242～non-action face; 225～plain conductor; 226～transparent cover plate; 23～eyeglass module; 230～hollow cylinder base; 231～accommodation chamber; 232～openend; 2321～end face; 2333～end face; 234～recessed rank; 235～location trip; 236～loophole; 237～mirror group; 2371～lens set; 2372～photic zone; 30～tin ball.
Embodiment
The miniature lens module encapsulating structure that is proposed in order more clearly to describe the utility model below will cooperate icon to describe in detail.
See also shown in Figure 2ly, it is miniature lens module of the present utility model (Compact Camera Module, CCM) the decomposition generalized section of encapsulating structure first preferred embodiment.Wherein, miniature lens module encapsulating structure 2 mainly by: a substrate 21, a sensing chip module 22 and 23 of eyeglass modules are formed jointly.
Described substrate 21 has one first real estate 211 and one second real estate 212, and in general, described substrate 21 is a printed circuit board (PCB), and is provided with some circuit on first real estate 211 and second real estate 212.
Described sensing chip module 22 has a transparent surface 221 and a composition surface 222, is to be used for capturing extraneous image.Described sensing chip module 22 also includes: a chip support plate 223, an image sensing chip 224, a plurality of plain conductor 225 and a transparent cover plate 226.Described image sensing chip 224 is charge coupled device (charge coupled device normally, CCD) or complementary metal oxide semiconductor (complementarymetal oxide semiconductor, CMOS), and described image sensing chip 224 has an action face 2241 and a non-action face 2242, and so-called action face 2241 is meant the side with the extraneous imaging function of acquisition.Described image sensing chip 224 glutinous crystalline substances are on described chip support plate 223, and rely on a plurality of plain conductors 225 that described image sensing chip 224 is done electric connection with described chip support plate 223, and the side that relies on set via 2231 to be electrically connected to disengaged 222.In addition, and with described transparent cover plate 226 cover described image sensing chip 224 on, and be combined on the described chip support plate 223, become a complete sensing chip module 22.
It also includes described eyeglass module 23: a hollow cylinder base 230, an accommodation chamber 231, an openend 232, an end face 233, one recessed rank 234, a loophole 236 and by a mirror group 237 that at least one eyeglass constituted.Described hollow cylinder base 230 is for to penetrate one-body molded made single component with plastics, and its inside is to form an accommodation chamber 231 that connects.Openend 232 inner edges at the hollow cylinder base 230 of described eyeglass module 23 are provided with described recessed rank 234, and are provided with a loophole 236 with respect to another end face 233 of described openend 232.One mirror group 237 is set in described accommodation chamber 231, and described mirror group 237 also includes a lens set 2371 and a photic zone 2372, and is arranged in regular turn in the described accommodation chamber 231 by described loophole 236 rears.Described photic zone 2372 can be an infrared ray filter glass.
See also shown in Figure 3ly, it is the combination generalized section of miniature lens module encapsulating structure first preferred embodiment of the present utility model.Wherein, described sensing chip module 22 with its composition surface 222 rely on a plurality of tin balls 30 be arranged on described substrate 21 described first real estate 211 on, and do electric connection with described substrate 21.Described eyeglass module 23 utilizes the mode closing of recessed rank set in the described eyeglass module 23 234 utilization vision localization around the transparent surface 221 of described sensing chip module 22, and the openend 232 with described eyeglass module 23 encloses its sensing chip module 22 covering frames simultaneously.At this moment, an end 2321 of described openend 232 does not directly abut on described first real estate 211 of substrate 21 usually, but leaves a little gap.
Make described eyeglass module 23 keep same axial level and level angle synchronously with the transparent surface 221 of described sensing chip module 22, it is online more to be positioned at same central shaft with the described loophole 236 of the described action face 2241 of seasonal described image sensing chip 224 and described eyeglass module 23 and described lens set 2371 and described photic zone 2372, the pick-up image of can focusing.
Rely on recessed rank 234 closings set in the described eyeglass module 23 around the transparent surface 221 of described sensing chip module 22, so more can make described eyeglass module 23 be positioned at sustained height and level angle with described sensing chip module 22.Not only can make described eyeglass module 23 and described sensing chip module 22 keep same central axis, more so the unlikely lens set 2371 in the described eyeglass module 23 of influence of the height error that caused of the described tin ball 30 that makes described sensing chip module 22 and described substrate 21 electrically connect to the distance of the described action face 2241 of described image sensing chip 224, and can obtain better imaging focal length.So, in the processing procedure of described miniature lens module encapsulating structure 2, described tin ball 30 causes and is roughly ± and the focus error amount of 0.05mm will be left out fully, therefore can significantly reduce the image error of focusing.In other words, in miniature lens module encapsulating structure 2 of the present utility model, how many axial errors no matter tin ball 30 is caused has, and all can not have influence on eyeglass module 23 and described sensing chip module 22 axial relative distance (just lens set 2371 is a definite value with transparent surface 221 axial height between the two of sensing chip module 22) between the two fully.
Therefore, the variable that influences described focusing imaging only remains in the processing procedure of producing described sensing chip module 22, be combined in to produce on the described chip support plate 223 at described transparent cover plate 226 and be roughly ± the focus error amount of 0.02mm, and this one ± 0.02mm is that belong to can be by the common receptible scope of industry with interior micro-error, and no longer need go to carry out the axial location trimming movement of chip module 22 at the axial error that tin ball 30 is caused.So, miniature lens module encapsulating structure 2 of the present utility model can be made into single component in integrated mode with the hollow cylinder base 230 of eyeglass module 23 especially, and does not need to provide the spiral fine adjustment function to be separated into lens barrel 12 and 13 liang of assemblies of load bearing seat for reining in as shown in Figure 1 the prior art.So, eyeglass module 23 one-body molded and single component only needs to manufacture and do not need the assembling processing procedure that screw thread screws togather with single mold, not only can save production cost and the suitableeer extremely suitably focal lengths of error of need not adjusting once more producing described eyeglass module 23 in batches such as mould and assembling.
See also shown in Figure 4ly, it is the combination generalized section of miniature lens module encapsulating structure second preferred embodiment of the present utility model.Because it is similar with first preferred embodiment shown in Figure 3 substantially for miniature lens module encapsulating structure second preferred embodiment of the present utility model of Fig. 4, so identical assembly and will repeating no more below the structure.The difference of its second preferred embodiment is that described substrate 21 is provided with at least one location hole 213, and the described end 2321 at the described openend 232 of described hollow cylinder base 230 is provided with at least one location trip 235, can make described location trip 235 insert within the described location hole 213.
Set described location trip 235 not only provides described eyeglass module 23 to be positioned function in the location hole 213 on the described substrate 21 on the described eyeglass module 23, because of there is no, described location trip 235 closely is fixed in the described location hole 213, more can utilize described location trip 235 surface and the frictional resistance of described location hole 213 inner edge contact-making surfaces to share the gravity that described eyeglass module 23 relies on described recessed rank 234 closings to be applied when described sensing chip module 22, the gravity of part eyeglass module 23 is married again on described substrate 21, its described sensing chip module 22 unlikely gravity by described eyeglass module 23 are destroyed.
At this moment, the described end 2321 of described eyeglass module 23 does not directly abut on described first real estate 211 of substrate 21 usually, and still leave a little gap, mainly make described eyeglass module 23 rely on described recessed rank 234 closings around the transparent surface 221 of described sensing chip module 22, and keep same axial level and level angle synchronously with the transparent surface 221 of described sensing chip module 22, it is online more to be positioned at same central shaft with the described loophole 236 of the described action face 2241 of seasonal described image sensing chip 224 and described eyeglass module 23 and described lens set 2371 and described photic zone 2372.
In sum, miniature lens module encapsulating structure of the present utility model, wherein, described eyeglass module 21 can enclose described sensing chip module 22 frames and cover, and use recessed rank 234 closings in the described eyeglass module 21 around the described transparent surface 221 of described sensing chip module 22, make described eyeglass module 21 keep par angle and height synchronously with the transparent surface 221 of described sensing chip module 22, further get rid of the height error that the sensing chip module 22 described in the processing procedure relies on tin ball 30 and described substrate 21 to combine and produced, fabrication errors is dropped in the permissible range of the general standard of industry, reach release adjustment focal length and make image quality better.
The above is to utilize preferred embodiment to describe the utility model in detail, and unrestricted scope of the present utility model.Generally knowing this type of skill personage can both understand, suitably does slightly change and adjustment, will not lose main idea of the present utility model place, does not also break away from spirit and scope of the present utility model.
Claims (10)
1. miniature lens module encapsulating structure, it is characterized in that: it includes:
One substrate, it has one first real estate and one second real estate and is provided with at least one circuit;
One sensing chip module, it is to have a transparent surface and a composition surface, described sensing chip module is to rely on a tin ball and described first real estate to do electric connection with described composition surface; And
One eyeglass module, it includes a hollow cylinder base, and forms an accommodation chamber that connects in described hollow cylinder base, and an openend inner edge is provided with recessed rank therein, and another end face with respect to described openend is provided with a loophole, is provided with at least one eyeglass in described accommodation chamber;
Recessed rank closing in the described eyeglass module is around the transparent surface of described sensing chip module, simultaneously described sensing chip module frame is enclosed and cover, make described eyeglass module keep par angle and height synchronously, and be positioned at same central axis simultaneously with the transparent surface of described sensing chip module.
2. encapsulating structure according to claim 1 is characterized in that: described sensing chip module also includes:
One chip support plate, it is the support body of a concavity, it includes a central disposal area and at least one via;
One image sensing chip, it is to have an action face and a non-action face, and with on the central disposal area of non-action face in conjunction with described chip support plate;
A plurality of plain conductors are that the via of described image sensing chip and described chip support plate is done electric connection; And
One transparent cover plate, cover described image sensing chip on, and be combined on the described chip support plate.
3. encapsulating structure according to claim 1 is characterized in that: described at least one eyeglass is also to include an eyeglass and a photic zone, and is arranged in described loophole rear in regular turn.
4. encapsulating structure according to claim 3 is characterized in that: described photic zone is an infrared ray filter glass.
5. encapsulating structure according to claim 1, it is characterized in that: described substrate is provided with at least one location hole, and the end at the described openend of described hollow cylinder base is provided with at least one location trip, makes described location trip insert within the described location hole; And described end does not directly abut on described first real estate of substrate.
6. encapsulating structure according to claim 1 is characterized in that: the described hollow cylinder base made single component that is formed in one, and the axial height between described eyeglass and the transparent surface is definite value and can't adjusts.
7. miniature lens module encapsulating structure is characterized in that: include:
One substrate, it is to have one first real estate;
One sensing chip module, it is to have a transparent surface and is to be combined on described first real estate; And
One eyeglass module, it includes a hollow cylinder base and is located at the interior at least one eyeglass of hollow cylinder base, openend inner edge at described hollow cylinder base is to be provided with recessed rank, and directly do not abut on first real estate in an end of described openend, described recessed rank are that closing is around described transparent surface simultaneously.
8. encapsulating structure according to claim 7, it is characterized in that: described substrate is provided with at least one location hole, and the end at the described openend of described hollow cylinder base is provided with at least one location trip, makes described location trip insert within the described location hole; And described end does not directly abut on described first real estate of substrate.
9. miniature lens module encapsulating structure is by comprising that a substrate, a sensing chip module and an eyeglass module are constituted, and it is characterized in that:
Described eyeglass module is to include a hollow cylinder base and be located at the interior at least one eyeglass of hollow cylinder base; The described hollow cylinder base made single component that is formed in one is to be provided with recessed rank at an openend inner edge of described hollow cylinder base; Wherein, the described openend of described hollow cylinder base does not directly abut on the substrate; Simultaneously, described recessed rank closing on described sensing chip module so that eyeglass module and sensing chip module location between the two to be provided.
10. encapsulating structure according to claim 9, it is characterized in that: described substrate is provided with at least one location hole, and the end at the described openend of described hollow cylinder base is provided with at least one location trip, makes described location trip insert within the described location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720000238XU CN201004462Y (en) | 2007-01-11 | 2007-01-11 | Micro lens module encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720000238XU CN201004462Y (en) | 2007-01-11 | 2007-01-11 | Micro lens module encapsulation structure |
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| Publication Number | Publication Date |
|---|---|
| CN201004462Y true CN201004462Y (en) | 2008-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200720000238XU Expired - Fee Related CN201004462Y (en) | 2007-01-11 | 2007-01-11 | Micro lens module encapsulation structure |
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| CN (1) | CN201004462Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123238A (en) * | 2010-01-11 | 2011-07-13 | 奇景光电股份有限公司 | Image capture module and lens module |
| CN109326620A (en) * | 2018-10-11 | 2019-02-12 | 北京工业大学 | A kind of embedded packaging structure and production method of image sensing chip |
| CN112770033A (en) * | 2020-12-31 | 2021-05-07 | 之江实验室 | Light collection system and optical lens |
-
2007
- 2007-01-11 CN CNU200720000238XU patent/CN201004462Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123238A (en) * | 2010-01-11 | 2011-07-13 | 奇景光电股份有限公司 | Image capture module and lens module |
| CN109326620A (en) * | 2018-10-11 | 2019-02-12 | 北京工业大学 | A kind of embedded packaging structure and production method of image sensing chip |
| WO2020073370A1 (en) * | 2018-10-11 | 2020-04-16 | 北京工业大学 | Embedded packaging structure and manufacturing method for image sensing chip |
| CN112770033A (en) * | 2020-12-31 | 2021-05-07 | 之江实验室 | Light collection system and optical lens |
| CN112770033B (en) * | 2020-12-31 | 2022-09-23 | 之江实验室 | Light collection system and optical lens |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080109 Termination date: 20100211 |