CN102123238A - Image capture module and lens module - Google Patents
Image capture module and lens module Download PDFInfo
- Publication number
- CN102123238A CN102123238A CN2010100032362A CN201010003236A CN102123238A CN 102123238 A CN102123238 A CN 102123238A CN 2010100032362 A CN2010100032362 A CN 2010100032362A CN 201010003236 A CN201010003236 A CN 201010003236A CN 102123238 A CN102123238 A CN 102123238A
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- module
- integrated circuit
- supporting construction
- lens
- composition surface
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Abstract
The invention discloses an image capture module, which comprises an integrated circuit module and a lens module. The integrated circuit module has a first joint surface. The lens module comprises a lens element and a supporting structure. The lens element has a second joint surface with an area larger than that of the first joint surface, wherein the first joint surface and the second joint surface are jointed with each other, so that the integrated circuit module is fixed on the lens element. The supporting structure is arranged on the second joint surface, and is positioned at the periphery of the sidewall of the integrated circuit module. In sum, the invention provides an image capture module and a lens module, which can be produced massively by a simple and economic method. The image capture module and the lens module have the characteristics of extremely high shock resistance and light tightness.
Description
[technical field]
The invention relates to a kind of Optical devices, particularly about a kind of camera lens module that has preferable shock resistance and can prevent the taken module of light leak and be applied to taken module.
[background technology]
The taken module that tradition is made up of image sensing wafer original paper and optical lens module often because the composition surface area between sensing wafer original paper and the optical lens is too little and camera lens module and integrated circuit module between height ratio difference too big, cause moment too big and cause the shock resistance of traditional taken module not good, in vibrations, separate easily and can't by concussion with drop test.
Please refer to Fig. 1, it is the structural representation of existing taken module 100.As shown in the figure, the composition surface A2 of camera lens module 110 and the composition surface A1 of integrated circuit module 120 have area identical (that is A1=A2), that is between camera lens module 110 and the integrated circuit module 120 composition surface with a homalographic link together (face of being illustrated as line segment P1-P1 ' that connects), in addition, camera lens module 110 has higher height with respect to integrated circuit module 120 (that is H2＞H1) makes taken module 100 unequal and cause camera lens module 110 to separate with integrated circuit module 120 in the suffered moment of composition surface A2 when being shaken as seen from the figure.Fig. 2 then is the structural representation of another existing taken module 200.As shown in the figure, the area of the composition surface A2 ' of camera lens module 110 is less than the area (that is A2 '＜A1 ') of the composition surface A1 ' of integrated circuit module 120, therefore, composition surface with a unequal-area between camera lens module 210 and the integrated circuit module 220 link together (face that connects shown in line segment P2-P2 '), similarly, camera lens module 210 also has higher height (that is H2 '＞H1 ') with respect to integrated circuit module 220, when being shaken, camera lens module 210 distributes uneven the separation because of moment similarly easily with integrated circuit module 220.In addition, there is the situation of side light leak in the encapsulation regular meeting of traditional integrated circuit module thereby causes final image quality not good.
Hereat, how using simple and easy and economic mode increases the shock resistance of taken module and avoids the light leak problem of integrated circuit module to be still a big problem in this field.
[summary of the invention]
The invention provides a kind of taken module and camera lens module, it can be produced in a large number via a kind of simple and easy and economic method, and can improve shock resistance and be difficult for light leak.
According to one embodiment of the invention, a kind of taken module is provided, it includes an integrated circuit module and a camera lens module.This integrated circuit module then has one first composition surface.This camera lens module includes a lens member and a supporting construction.This lens member has one second composition surface, its area is greater than the area on this first composition surface, wherein this first composition surface and this second composition surface are to be engaged with each other and this integrated circuit module is fixed on this lens member, in addition, this supporting construction then is arranged on this second composition surface, and is positioned at the periphery of the sidewall of this integrated circuit module.
According to another embodiment of the present invention, a kind of camera lens module is provided, it includes a lens member and a supporting construction.This lens member has a composition surface, and in order to engage with an integrated circuit module, this supporting construction then is arranged on this composition surface.
According to another embodiment of the present invention, a kind of manufacture method of wafer-level lens module is provided, it comprises: form a substrate, wherein a first surface of this substrate has several grooves; Form a camera lens layer at a suprabasil second surface; Cut this substrate and form several camera lens modules, wherein those camera lens modules are to correspond to those grooves respectively, make each groove form a supporting construction on every side.
The present invention also provides a kind of taken module, includes:
One integrated circuit module has one first composition surface; And
One camera lens module includes:
One lens member has one second composition surface, and wherein this first composition surface and this second composition surface are
Be engaged with each other and this integrated circuit module is fixed on this lens member; And
One supporting construction is arranged at the periphery of this lens member and the periphery of this integrated circuit module.
In sum, the invention provides a kind of taken module and camera lens module, it can be produced in a large number via a kind of simple and easy and economic method, and the characteristic that has extremely strong shock resistance and be difficult for light leak.
[description of drawings]
Fig. 1 is the structural representation of existing taken module.
Fig. 2 is the structural representation of another existing taken module.
Fig. 3 is the structural representation of an embodiment of taken module of the present invention.
Fig. 4 is according to the cross sectional plan view of one embodiment of the invention in this taken module of Fig. 3.
Fig. 5 is the three-dimensional structure diagram of this taken module shown in Figure 3.
Fig. 6 is according to the cross sectional plan view of another embodiment of the present invention in this taken module of Fig. 3.
Fig. 7 is the three-dimensional structure diagram according to this taken module of another embodiment of the present invention.
Fig. 8 is the three-dimensional structure diagram according to this taken module of another embodiment of the present invention.
Fig. 9 is the sketch that comes to realize an integrally formed camera lens module according to one embodiment of the invention with a silicon wafer process on a wafer.
Figure 10 is along a part of profile of a line segment A-A ' on wafer shown in Figure 6.
The production phase of the camera lens module that Figure 11 is shaped for being made into one according to one embodiment of the invention.
Figure 12 is the three-dimensional structure diagram according to a taken module of one embodiment of the invention.
100,200,300,300A taken module
110,210,310,310A camera lens module
120,220,320 integrated circuit modules
3101 lens member
3102 supporting constructions
[embodiment]
Please refer to Fig. 3, it is the structural representation according to the taken module 300 that one embodiment of the invention realized.Taken module 300 includes (but a being not limited to) camera lens module 310 and an integrated circuit module 320.310 of camera lens modules include a lens member 3101 and a supporting construction 3102.Integrated circuit module 320 has one first composition surface A_1 in order to engage with camera lens module 310.Lens member 3101 can be a wafer-level lens (wafer level lens), it has one second composition surface A_2, (that is A_2＞A_1), wherein the first composition surface A_1 and the second composition surface A_2 are engaged with each other and integrated circuit module 320 are fixed on the lens member 3101 its area greater than the area of the first composition surface A_1.In addition, supporting construction 3102 is arranged on the second composition surface A_2, and is positioned at the periphery of the sidewall of integrated circuit module 320, as shown in Figure 3.Via 3102 composition surfaces that additionally provide of supporting construction, camera lens module 310 can more closely engage (supporting construction 3102 and integrated circuit module 320 can be used a filler or binder increases both degree of engagement) to strengthen the overall construction intensity of taken module 300 with integrated circuit module 320.
Please refer to Fig. 4 and Fig. 5, Fig. 4 is the cross sectional plan view according to one embodiment of the invention taken module 300 in Fig. 3, and Fig. 5 is the three-dimensional structure diagram of taken module 300 shown in Figure 3.As shown in Figure 4, supporting construction 3102 can and provide extra composition surface to link (supporting construction 3102 and integrated circuit module 320 can be used a filler or binder increases both degree of engagement) with its sidewall around integrated circuit module 320, make it when being shaken and drop, be difficult for separating with camera lens module 310, wherein the outside of supporting construction 3102 has a length L 1 and the width W 1 corresponding to lens member 3101, and its inboard has corresponding to a length L 2 of integrated circuit module 320 and a width W 2 (L1＞L2, W1＞W2).As shown in Figure 5, supporting construction 3102 is fitted with lens member 3101 on one side, and on the other hand that integrated circuit module 320 is surrounded.Yet this example is one embodiment of the invention only, is not to be used for limiting category of the present invention.
Please refer to Fig. 6 and Fig. 7, Fig. 6 is the cross sectional plan view according to another embodiment of the present invention taken module 300 in Fig. 3, and Fig. 7 is the three-dimensional structure diagram according to the taken module 300 of another embodiment of the present invention.In Fig. 6, the loop configuration that supporting construction 3102 is separated for twice, the sidewall of itself and integrated circuit module 320 parts is connected and extra composition surface is provided, wherein the outside of supporting construction 3102 has a length L 1 and the width W 1 corresponding to lens member 3101, and its inboard has a length L 2 and a width W 2 (L1＞L2 corresponding to integrated circuit module 320, W1＞W2), as shown in Figure 7, supporting construction 3102 is fitted with lens member 3101 on one side, and on the other hand that integrated circuit module 320 parts are surrounded.Yet, in other embodiments, the outside of supporting construction 3102 also can be not corresponding with lens member 3101, for instance, please refer to Fig. 8, it is the three-dimensional structure diagram according to the taken module 300 of another embodiment of the present invention, wherein supporting construction 3102 inboards have two groups of length L 1, width W 1 and length L 2, width W 2 (L1＞L2 that correspond to lens member 3101 and integrated circuit module 320 respectively respectively, W1＞W2), and the length in the outside of supporting construction 3102 and width only must be respectively greater than L1 and W1.Yet, in other embodiments, the length L of integrated circuit module 320 2 and width W 2 also can be respectively greater than the length L 1 of lens member 3101 and width W 1 (L2＞L1, W2＞W1).Above-mentioned structure all can reach the purpose of the shock resistance that improves taken module 300, so the spirit also according to the invention of the variation in this design and dropping within the category of the present invention.
For fear of the sidewall of external light penetration integrated circuit module 320 and influence the running of taken module 300, present embodiment can adopt lighttight material to constitute supporting construction 3102 promoting whole usefulness, or plates light-proof material (320 employed fillers of supporting construction 3102 and integrated circuit module also can be light tight material) in supporting construction 3102.In addition, in the present embodiment, lens member 3101 is to realize with a wafer-level lens, and hereat it can also can realize an integrally formed camera lens module 310 by the wafer scale processing procedure with supporting construction 3102.For instance, please refer to Fig. 9, it is for realizing the sketch of an integrally formed camera lens module with same wafer scale processing procedure according to one embodiment of the invention.The part that Fig. 9 mid point is retouched is the light tight material in order to the formation supporting construction, and this silicon wafer process can etch respectively in order to hold the space of an integrated circuit module in this light tight material according to the position of each lens member.Please cooperate Fig. 9 with reference to Figure 10, it is along a part of profile of a line segment A-A ' on the wafer in Fig. 9.As seen from the figure, this silicon wafer process can etch in order to hold the space of an integrated circuit module according to the position of a lens member, position according to this lens member cuts out a camera lens module 310A again, thus, just can be low-cost come a large amount of production shock resistances strong and be difficult for the taken module of light leak.
In addition, camera lens module 310 provided by the present invention is except being applied to taken module 300, also can be used among other optical application, that is the camera lens module that lens member 3101 that any application the present invention is instructed and supporting construction 3102 are constituted all is under the jurisdiction of category of the present invention.For instance, so long as lens member 3101 has a composition surface (A_2 for example shown in Figure 3) to engage with an integrated circuit module, and supporting construction 3102 is arranged at the camera lens module on this composition surface, spirit all according to the invention, supporting construction 3102 is constituted by ring-type and by lighttight material, lens member 3101 is a wafer-level lens, and/or supporting construction 3102 is one-body molded with lens member 3101.
Referring again to Fig. 9, in the middle of aforesaid embodiment, in same silicon wafer process, a second surface forms a camera lens layer on the original substrate of a wafer, and etch several grooves that correspond to those camera lens modules at a first surface (this first surface constitutes with light tight material) and make this original substrate form a substrate, cut this substrate and form several wafer-level lens modules according to the position of those several grooves more afterwards, for example the camera lens module 310.And in another embodiment, wafer-level lens module 310 also can be used other modes and form, for instance, application has one first substrate of those several camera lens modules, and one second substrate (this second base version constitutes with light tight material) with several perforation is fitted mutually and is formed this substrate, those several perforation has just formed those several grooves of this substrate with this first substrate, cuts this substrate according to the position of those several grooves more afterwards and just can obtain those several wafer-level lens modules equally.Variation on these manufacture methods all belongs within the category of the present invention.
Please refer to the making flow process that Figure 11 and Figure 12 further understand a kind of embodiment of integrally formed camera lens module.Production phase S1～the S4 of the camera lens module that Figure 11 is shaped for being made into one according to one embodiment of the invention, and Figure 12 is the three-dimensional structure diagram according to a taken module 300A of one embodiment of the invention.During first stage S1, formed a substrate SB with light transmitting property, wherein substrate SB goes up available different technology and indicates predetermined the removal to be used as the part substrate (i.e. figure bend part) that holds the integrated circuit module.And in next stage S2, those part substrates on the substrate SB have generated several grooves after removing smoothly.In stage S3, on the position of corresponding those grooves, several camera lens modules have been generated.At last, in the stage of S4, form spacer, and close, just can obtain several and not cut and the integrally formed wafer-level lens module of camera lens and supporting construction as yet with other camera lens laminatings.As shown in figure 12, wafer-level lens module 310A has on one side in order to hold the groove of integrated circuit module 320A, it has length and width L2, the W2 that corresponds to integrated circuit module 320A, can coat light tight material to reduce light leak in this recess sidewall of wafer-level lens module 310A on real the work.
In sum, the invention provides a kind of taken module and camera lens module, it can be produced in a large number via a kind of simple and easy and economic method, and the characteristic that has extremely strong shock resistance and be difficult for light leak.
The above only is preferred embodiment of the present invention, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to covering scope of the present invention.
Claims (20)
1. taken module includes:
One integrated circuit module has one first composition surface; And
One camera lens module includes:
One lens member has one second composition surface, and its area is greater than the area on this first composition surface, and wherein this first composition surface and this second composition surface are to be engaged with each other and this integrated circuit module is fixed on this lens member; And
One supporting construction is arranged on this second composition surface, and is positioned at the periphery of this integrated circuit module.
2. taken module as claimed in claim 1 is characterized in that: this supporting construction is around the sidewall of this integrated circuit module.
3. taken module as claimed in claim 1 is characterized in that: the inwall of this supporting construction is engaged in the sidewall of this integrated circuit module in addition.
4. taken module as claimed in claim 1 is characterized in that: this supporting construction is constituted by a lighttight material.
5. taken module as claimed in claim 1 is characterized in that: this lens member is a wafer-level lens.
6. taken module as claimed in claim 5 is characterized in that: this supporting construction and this wafer-level lens are one-body molded.
7. camera lens module includes:
One lens member has a composition surface, in order to engage with an integrated circuit module; And
One supporting construction is arranged on this composition surface.
8. camera lens module as claimed in claim 7 is characterized in that: this supporting construction is a ring-type.
9. camera lens module as claimed in claim 7 is characterized in that: this supporting construction is constituted by a lighttight material.
10. camera lens module as claimed in claim 7 is characterized in that: this lens member is a wafer-level lens.
11. camera lens module as claimed in claim 10 is characterized in that: this supporting construction and this wafer-level lens are one-body molded.
12. the manufacture method of a wafer-level lens module comprises:
Form a substrate, wherein a first surface of this substrate has several grooves;
Form a camera lens layer at a suprabasil second surface;
Cut this substrate and form several camera lens modules, wherein those camera lens modules are to correspond to those grooves respectively, make each groove form a supporting construction on every side.
13. manufacture method as claimed in claim 12 is characterized in that: the step that forms this substrate comprises:
One original substrate is provided; And
This original substrate of etching is to form this several grooves.
14. manufacture method as claimed in claim 12 is characterized in that: the step that forms this substrate comprises:
One original substrate is provided, and it includes:
One first substrate, it has those several camera lens modules; And
One second substrate, it has several perforation;
Wherein this first substrate and this second baseplate-laminating to be forming this substrate, and those several perforation and this first substrate then form those several grooves of this substrate.
15. a taken module includes:
One integrated circuit module has one first composition surface; And
One camera lens module includes:
One lens member has one second composition surface, and wherein this first composition surface and this second composition surface are to be engaged with each other and this integrated circuit module is fixed on this lens member; And
One supporting construction is arranged at the periphery of this lens member and the periphery of this integrated circuit module.
16. taken module as claimed in claim 15 is characterized in that: this supporting construction is around the sidewall of this integrated circuit module and the sidewall of this lens member.
17. taken module as claimed in claim 15 is characterized in that: the inwall of this supporting construction is engaged in the sidewall of this integrated circuit module and the sidewall of this lens member in addition.
18. taken module as claimed in claim 15 is characterized in that: this supporting construction is constituted by a lighttight material.
19. taken module as claimed in claim 15 is characterized in that: this lens member is a wafer-level lens.
20. taken module as claimed in claim 19 is characterized in that: this supporting construction and this wafer-level lens are one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100032362A CN102123238A (en) | 2010-01-11 | 2010-01-11 | Image capture module and lens module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100032362A CN102123238A (en) | 2010-01-11 | 2010-01-11 | Image capture module and lens module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102123238A true CN102123238A (en) | 2011-07-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010100032362A Pending CN102123238A (en) | 2010-01-11 | 2010-01-11 | Image capture module and lens module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955215A (en) * | 2011-08-22 | 2013-03-06 | 原相科技股份有限公司 | Lens module and manufacturing method thereof |
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| CN2433792Y (en) * | 2000-07-05 | 2001-06-06 | 锐相科技股份有限公司 | Improved structure of changable image chip |
| CN2465330Y (en) * | 2001-01-23 | 2001-12-12 | 陈文钦 | CCD and CMOS image picking up modular |
| CN1450651A (en) * | 2003-05-15 | 2003-10-22 | 王鸿仁 | Image sensor package structure and image taking module using said sensor |
| CN101094316A (en) * | 2006-06-19 | 2007-12-26 | 大瀚光电股份有限公司 | Ultrathin type CCM packaging structure, and packaging method |
| CN201004462Y (en) * | 2007-01-11 | 2008-01-09 | 力相光学股份有限公司 | Micro lens module encapsulation structure |
-
2010
- 2010-01-11 CN CN2010100032362A patent/CN102123238A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2433792Y (en) * | 2000-07-05 | 2001-06-06 | 锐相科技股份有限公司 | Improved structure of changable image chip |
| CN2465330Y (en) * | 2001-01-23 | 2001-12-12 | 陈文钦 | CCD and CMOS image picking up modular |
| CN1450651A (en) * | 2003-05-15 | 2003-10-22 | 王鸿仁 | Image sensor package structure and image taking module using said sensor |
| CN101094316A (en) * | 2006-06-19 | 2007-12-26 | 大瀚光电股份有限公司 | Ultrathin type CCM packaging structure, and packaging method |
| CN201004462Y (en) * | 2007-01-11 | 2008-01-09 | 力相光学股份有限公司 | Micro lens module encapsulation structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955215A (en) * | 2011-08-22 | 2013-03-06 | 原相科技股份有限公司 | Lens module and manufacturing method thereof |
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Application publication date: 20110713 |