CN200986915Y - Transmission fixing device for substrate frame - Google Patents

Transmission fixing device for substrate frame Download PDF

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Publication number
CN200986915Y
CN200986915Y CNU2006201213468U CN200620121346U CN200986915Y CN 200986915 Y CN200986915 Y CN 200986915Y CN U2006201213468 U CNU2006201213468 U CN U2006201213468U CN 200620121346 U CN200620121346 U CN 200620121346U CN 200986915 Y CN200986915 Y CN 200986915Y
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CN
China
Prior art keywords
substrate holder
fixture
end plate
shell
transmission
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Expired - Fee Related
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CNU2006201213468U
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Chinese (zh)
Inventor
罗纳尔·维恩·肖尔
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Applied Materials Inc
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Applied Materials Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67369Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67386Closed carriers characterised by the construction of the closed carrier

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A transportation fixture for holding a substrate rack comprises top and bottom endplates that are attached by a plurality of posts. The posts are spaced apart a sufficient distance to confine a substrate rack between the posts. Each post has a longitudinal inside edge with a compliant bumper that cushions the substrate rack. A transportation shell at least a portion of which is light permeable, can enclose the fixture to allow viewing of the fixture and rack, without opening the shell. An exterior hard casing can enclose the shell for further protection.

Description

The transmission fixture of substrate holder
Technical field
Embodiments of the invention relate to transmission fixture and the encapsulation of transmitting substrate holder.
Background technology
During in order to formation display panel and semi-conductive substrate production, substrate holder can be used to keep a collection of substrate.For example, have the slit of a series of perpendicular positionings as the substrate holder of processing of wafers boat (boat) and so on, each this slit can both keep semiconductor wafer.Illustrate the illustrative substrate frame 10 that semiconductor wafer can be remained in the settling chamber among Fig. 1.This substrate holder 10 comprises several graphite plates 20, and this graphite plate 20 separately and by Metallic rod 40 is kept together by distance piece 30, and this Metallic rod 40 is connected on substrate 50 and the top board 60 by distance piece 30. Frame parts 20,30,40 and 50 can avoid being subjected to the depositional environment influence to protect them, and prevent to enter substrate processing chambers from the pollutant of substrate holder 10 with the ceramic coated as carborundum and so on.Substrate holder 10 can be placed in the settling chamber, as chemical vapor deposition (CVD) chamber, is used for the material as polysilicon, amorphous silicon or silicon dioxide and so on is deposited on substrate stack.In this was handled, silicon-containing gas imported in the CVD chamber, and produced plasma, and substrate holder 10 rotates and is heated simultaneously.When the illustrative substrate frame is used to illustrate this, should be understood that the substrate holder that uses also can use in as other substrate-treating apparatus of physical vapor deposition chamber (PVD), etching chamber and flood chamber and so on or method.
In use, after several cycle of treatment, frame 10 is cleaned or repairs, the processing deposit that gathers with removal.For example, in typical C VD handled, the CVD material that is deposited on the substrate also was deposited on the substrate holder 10.After several CVD cycle of treatment, the CVD material layer is deposited on the substrate holder 10.If deposit is peeled off from substrate holder, then sedimental this accumulation horizon may pollute CVD chamber and substrate.Therefore, periodically remove deposition materials,, be used for using in next cycle of treatment to repair and the Cleaning lining underframe from substrate holder 10.
Usually, substrate holder is packed and be transported to the device cleaning equipment of (off-site) outward, is used for cleaning or repairing rack 10.Yet, the transmission of frame 10 is had several problems.At first, the substrate holder of assembling is heavier, through being everlasting between about 50 to 100 pounds, and also frangible, this makes and is difficult to it is carried out not bad land transportation.Simultaneously, 10 pairs of surrounding environment of frame are very responsive, and can be subjected to etching or corrosion in being exposed to air the time.Simultaneously, the deposit that is formed on the frame 10 can be poisonous or harmful to the operator.So before being transported to the cleaning place, usually deposition comprises the thin sealant of the silicon that undopes on substrate holder 10, avoid being exposed to deposit on the frame with the protection operator.Then, substrate holder 10 is wrapping in " the bubble parcel " of air cushioning, and is placed into the wooden crate that is used for transporting.Because substrate holder 10 is very frangible, so must transmit a position, promptly its longitudinal axis is in vertical direction; Otherwise the fragile part of substrate holder can cracked or fracture.The solution of all these transmission problems has all increased the cost of cleaning and repairing rack 10.
In the process that is transferred to the cleaning place, the crate that comprises substrate holder 10 may be migrated or law enfrocement official's inspection.In order to check, the law enfrocement official opens crate usually and removes the bubble parcel, to confirm not comprise contraband in the crate.After checking, substrate holder 10 encapsulates and is transferred to the cleaning place again.At place, cleaning place, substrate holder is placed several hrs in the acid bath pond, to remove deposited material layer.Till now, substrate holder 10 is assembled, because deposited material layer is glued together with the parts of substrate holder, and substrate holder can't be dismantled under the situation of defective component not.After the acid bath first time, sedimentary deposit is removed and the parts of substrate holder become " coming unstuck ".Then,, clean once more, and dried about ten (10) individual hours down at about 400 ℃ with substrate holder 10 dismountings.In case after the drying, will dismantle the component packages of arrangement and transport the consumption place back, at place, consumption place, substrate holder 10 re-assemblies and prepares use.
During above-mentioned transmission and repair procedures, the substrate holder 10 of big ratio is subjected to the infringement that can not repair.For example, when substrate holder 10 encapsulation, promptly be wrapped in the bubble parcel and be placed in the crate, open encapsulation or when encapsulating again, for example consumption the place, during checking and the cleaning place, coat of silicon carbide on the parts of substrate holder 10 can be cracked at an easy rate or fracture, makes parts to use.If crate tilts during the transmission or falls, then frangible parts can break or be cracked.Re-assemblying aspect the substrate holder, when not having experience and unskilled experimental technique personnel to re-assembly substrate holder usually, substrate holder 10 may sustain damage in the consumption place.Except the damage substrate holder, when parts broke or be cracked, operator and/or inspection personnel may be exposed to the toxic material below the thin sealant.
So expectation can be transferred to cleaning or device external equipment with substrate holder 10 from dust free room effectively, cleans or repairs.Also be desirably in encapsulation, open the encapsulation and transmission course during the fracture of substrate holder 10 is minimized.Also be desirably under the situation of defective component not, clean frame 10 effectively.Also be desirably between processing and transmission period, the protection operator avoids being exposed to the deposit on the frame.
Summary of the invention
The purpose of this utility model is to provide a kind of transmission fixture that is used for substrate holder, and it cushions during the transmission, fixing and protection substrate holder, reduces the fracture of substrate holder thus and improves efficiency of transmission.
Be used to keep the transmission fixture of substrate holder to comprise top end plate and bottom end plate.Several pillars are connected to top end plate on the bottom end plate, and spaced apart enough distances, so that substrate holder is limited between them.Each pillar all has vertical internal edge.The adaptability buffer is coupled on each vertical internal edge of pillar.
In another embodiment, the transmission fixture comprises leg-of-mutton and has the top end plate and the bottom end plate on top.Three pillars are connected to the top of top end plate on the top of bottom end plate.The adaptability buffer is coupled on each pillar.
In such scheme, described substrate holder can described transmission fixture cushion, fix and protection, and has reduced damaged possibility thus.
Description of drawings
For the accompanying drawing of following description, claims and explanation example of the present invention, these features of the present invention, aspect and advantage will become easier to understand.Yet, should be understood that each feature all substantially can be in the present invention, and be not only to use, and the present invention includes the combination in any of these features in the content of special accompanying drawing, wherein:
Fig. 1 (prior art) is the perspective view of the embodiment of substrate holder;
Fig. 2 is the perspective view of embodiment of transmission fixture that is used for the substrate holder of Fig. 1;
Fig. 3 is the perspective view of the transmission fixture of Fig. 2, the substrate holder of its Closed Graph 1;
Fig. 4 is the decomposition diagram of the transmission fixture of Fig. 2;
Fig. 5 is the perspective view of the embodiment of the described transmission fixture of another version of the present invention;
Fig. 6 is the perspective view that seals the embodiment of the shell that transmits fixture, also shows in inside to have foam to hold the hard casing of shell;
Fig. 7 be shown in the perspective view of another embodiment of shell, its sealing transmission fixture, and show the details that is used in conjunction with the securing member of the pallet of shell;
Fig. 8 be shown in the perspective view of another embodiment of shell, its sealing transmission fixture;
Fig. 9 is the sectional side view that has exhaust port and clean the embodiment of the shell of using gas ports;
Figure 10 A is the sectional side view of exhaust port coupling device of the shell of Fig. 9; And
Figure 10 B is the sectional side view of another embodiment of exhaust port coupling device;
Figure 11 is the sectional side view that gas ports is used in the cleaning of the shell of Fig. 9; And
Figure 12 A and 12B are the perspective side elevation view that is suitable for transmitting the hard casing of shell.
Embodiment
Comprise that the transmission encapsulation of transmitting fixture can be used for that substrate holder 10 is transferred to another chamber from a chamber or from a device transmission to another equipment, as shown in fig. 1.For example, the transmission encapsulation can be used for the frame after the settling chamber uses 10 is transferred in the suitable device, is used for cleaning or repairing.This transmission be encapsulated in transport and processor between play the effect of the protectiveness container that is used to transmit fixture and other fixtures outside the fixture that also can be used for illustrating herein.During repair procedures, for example encapsulate and open encapsulation, in acid or other cleanings are bathed and in drying oven or stove, the transmission fixture also can be used to the frame 10 that keeps frangible.This transmission fixture can be used for substrate holder 10 is remained on the transmission encapsulation, or is used for frame 10 is transferred to another room of same building.Through under the situation of suitable modification well known to those skilled in the art, transmission encapsulation and fixture also may be used to transmit other except illustrate exemplary 10 herein.So scope of the present invention should not be confined to the illustrative embodiment of transmission encapsulation, fixture and frame described herein.
In Fig. 2, illustrate the exemplary transmission fixture 200 that is used to keep substrate holder 10.In a version, substrate holder 10 is by 200 sealings of transmission fixture and protection.This transmission fixture 200 can be reused and also can be used for entirely disassembled substrate holder 10 is returned to the user.Transmission fixture 200 comprises top end plate 210a and bottom end plate 210b, and they are connected to each other by several pillars 220. End plate 210a, 210b and pillar 220 form the casing that limits substrate holder 10, as shown in Figure 3. End plate 210a, 210b and pillar 220 can be with chemically inert nonmetallic materials and exotic material manufacturing, as polytetrafluoroethylene PTFE (the commercial Teflon that is called ), thereby transmission fixture 200 can stand cleaning or repair and handle, and also can be used to return substrate holder 10 through repairing and ressembling.
In a version, bottom end plate 210b comprises skid plate 230, and it prevents that substrate holder 10 is in slippage on the fixture 200 during the loading and unloading process.When frame 10 has outstanding end portion (not shown), end plate 210a, 210b also can have the buffer (also not shown) of the rising of shape such as floor, island, table top or bulge, this buffer is positioned on the surface 232 in the face of frame 10, to prevent the contact between substrate holder 10 and end plate 210a, the 210b.When loading and unloading substrate holder 10, the buffer of this rising also helps frame 10 is remained on upright position.The buffer of this rising can be coupled to or be integrally formed on the surface of end plate 210a, 210b.
Each end plate 210a, 210b can comprise reinforcement 240, as slide block, support or gusset, with the rigidity that strengthens end plate 210a, 210b and other functions are provided, as are used to mention and keeps to transmit the device of fixture 200.For example, reinforcement 240 can comprise hole 243, and this hole can be played and is used to connect handle or the finger hole of other carrying bands or the effect of device.Be similar to raised portion 230, reinforcement 240 can be coupled to or integral body is formed on end plate 210a, the 210b.And end plate 210a, 210b can provide opening 250, are beneficial to clean solution (that is acid) and flow on the parts of substrate holder 10.
The pillar 220a-c location of coupling end plate 210a, 210b makes that substrate holder 10 is firmly held between the pillar 220a-c, as shown in Figure 3.In a version, end plate 210a, 210b are triangle, and have sufficient size, with support substrate frame 10.Triangle needs less material, so that same support to be provided, and takies less space, thereby allows to transport in a container more multiterminal plate 210a, 210b.
With reference to Fig. 4, when end plate 210a, 210b were triangle, end plate 210a, 210b had top 212a-f, and pillar 220a-c can be incorporated on the top 212a-f of triangular end plates 210a, 210b, so that the maximization of the space between the pillar 220a-c.Gable top and bottom end plate 210a, 210b also can have slit 214a-f at their 212a-f place, top, to hold pillar 220a-c.Yet, be not that slit 214a-f can be positioned at turning and/or edge in the leg-of-mutton version at end plate 210a, 210b.
As shown in the figure, in this version, each pillar 220a, 220b, 220c are made by band 222a-b, 222c-d and the 222e-f of a pair of combination respectively.Each band 222a, 222c, 222e have and surface, inside 224b, the 224d of other bands 222b, 222d, 222f, surface, inside 224a, 224c, the 224e that 224f contacts.Each band 222a-f also has longitudinal fluting 226a-f along internal edge 228a-f respectively.When longitudinal fluting 226a-f was aligned with each other, they were in conjunction with forming internal groove, and bracing piece 232 can be positioned in this internal groove.In a version, 232 pairs of pillars 220 of bracing piece are strengthened, and can be stainless steels.Because bracing piece 232 to small part sealed by groove,, it avoids being subjected to the corrosive solution etching used during the repair procedures so being protected.In order to ensure this protection, band 222 can be by conventional inertia temperature resistant encapsulation agent combination, as pottery or epoxy sealent.
As shown in the figure, each band 222 all has inner longitudinal edge 228a-f, and this edge surface is to the inside of fixture 200, promptly towards substrate holder 10.This longitudinal edge 228 can be narrow (as shown in the figure) or wide (not shown).In a version, longitudinal edge 228a-f holds adaptability buffer 234a-c along the longitudinal edge 222b of combination.By making inner longitudinal edge 228 cup-shapeds, adaptability buffer 234 is firmly connected.In a version, buffer 234 can connect through the stainless steel screw with the sealing of high temperature silicone sealant.So, simplified the maintenance and the replacing of buffer 234.In another version, longitudinal edge 228 can be straight substantially, and adaptability buffer 234 is connected on the longitudinal edge 228 by chemically inert heat-resistant adhesive.In a version, adaptability buffer 234 can be a polymeric tube, as low-hardness tester rubber, elastomer strip that seals in open end or the band of being made by another adaptability nonabsorbable chemical inert material.In another version, buffer 234 can comprise bulge or other texture structures, with fixed disk 20.In another version, buffer 234 can be the pneumatic air bag that keeps and cushion substrate holder 10.Fixture 200 with pillar 220 and adaptability buffer 234 is fixed, is protected and buffering substrate holder 10, and especially graphite plate 20.In case substrate holder 10 is loaded in the transmission fixture 200 regularly, then the adaptability buffer 234a-c on the pillar 220a-c allows substrate holder 10 to place at an arbitrary position under the situation of not damaging its parts, for example flatly.
With reference to Fig. 2 and 4, top end plate 210a and bottom end plate 210b are connected to each other by pillar 220.One of them end plate 210a, 210b comprise around at least one slit 214 be provided with several to hinged block 242 (Fig. 2).Hinged block 242 can be coupled to or be integrally formed on end plate 210a, the 210b.A pair of hinged block 242 has the sidewall of facing, and this sidewall comprises the opening of aiming at the hole 221 in the pillar 220 241.When on time, sell 244 and inserted opening 241 and hole 221, so that pillar 220 is remained on the plate 210a, as shown in Figure 4 through hinged blocks 242.In a version, each pin 244 also can be coupled on the handle 246, and this handle 246 allows pin 244 to insert at an easy rate or removes, and also anti-irreversibly slippage of shotpin 244.And handle 246 can be fixed on the reinforcement 240 through nylon tape parcel (not shown), and this Nylon Bag parcel was for example inserted the hole in reinforcement 240 and the handle 246.Be similar to end plate 210a, 210b and pillar 220, pin 244 and handle 246 also can be with chemically inert heat proof material manufacturing, as PTFE (Teflon ).Preferably, pin 244 is used Teflon Make, it also provides the jointed shaft of low friction and low wearing and tearing, as following the explanation.
In a version, pin 244 plays hinged effect, if make and remove the pin 244 that an end of pillar 220 is connected to (for example bottom end plate 210b) on the end plate, then pillar 220 can be connected to pin 244 rotations on the top end plate 210a around the other end with pillar 220.This opens and allows to contact at an easy rate the inside of transmission fixture 200.One or two end of pillar 220 can be hinged by this way.In addition, one or more pillars 220 can be hinged, and other pillars are fixedly connected on end plate 210a, the 210b.
Because transmission fixture 200 is preferably made by nonmetal, chemical inertness and cleaning material, so substrate holder 10 can directly be placed on the transmission fixture 200 from the settling chamber.In order to help this, only drop on the bottom end plate 210b of transmission fixture 200 to allow substrate holder 10 by removing pin 244 and outside rotation post 220 that pillar 220 is connected on the top end plate 210a, can remove one of them end plate fully, for example top end plate 210a.Like this, pillar 220 can seal and reconnect on the top end plate 210a.
In another version of transmission fixture 200, end plate 210a, 210b are formed separately as the top-supported framework 710a at frame 10 tops and the undercarriage frame 710b of substrate holder 10 bottoms, as shown in Figure 5.Each scaffold 710a, 710b comprise flat center hub 712 and several flat arms 714 that radially extend from the center of this wheel hub 712.The angle that forms between two alternate arms 714 depends on the quantity of flat arm 714.In a version, three (3) individual flat arms 714 in horizontal plane each other with 120 ° of equidistant apart.Each arm 714 all comprises and is used to hold and the fixing slit 716 of rigid support 220.Although not shown among Fig. 5, each arm 714 also can comprise above-mentioned hinged block 242, so that pillar 220 is fixed on scaffold 710a, the 710b.
Transmission fixture 200 provides rigid support, thereby substrate holder 10 can not be subjected to twisting resistance or normal force, repairs facility and from repairing facility when transmission, this twisting resistance or normal force can cause its fracture when frame 10 is transferred to.And, because transmission fixture 200 is made by chemical inertness, nonmetal and heat-resisting material, so transmission fixture 200 can be placed on clean solution neutralization oven dry at high temperature with substrate holder 10, and do not damage oneself, substrate holder 10, acid bath pond or baking oven.Therefore, during repair procedures, transmission fixture 200 can be used to protect substrate holder 10, till substrate holder 10 is prepared dismounting.And the parts of substrate holder 10 had been cleaned drying fully and re-assemblied by those skilled in the art after, transmission fixture 200 can be reused for the substrate holder 10 that will repair fully and assemble and be transferred to the user.Because substrate holder 10 returns with assembled state, breaks substrate holder 10 possibilities into pieces so reduced laboratory worker when attempting to re-assembly parts.
In a version, transmission fixture 200 is placed in the shell 800, to form transmission encapsulation 802, further protection transmission fixture 200 and substrate holder 10 during this transmission is encapsulated in and transports.In one embodiment, as shown in Figure 6, shell 800a comprises columniform first and second pallets 850,860, when fitting together, they toward each other and face, between them, to form cavity.Shell 800a described herein is an exemplary embodiment of the present invention, should not be used to limit the scope of the invention.For example, pallet also can be shaped as the rectangular box shape, perhaps even be configured as the hemisphere vault.Pallet 850,860 usefulness are enough to bear the rigid material of external impact during the transmission and make.Pallet 850,860 also can comprise the reinforcement feature as floor and so on, with its structure of hardening.It is smooth, flexible and on-granulated is surperficial that pallet 850,860 preferably has, and when with the mantle friction of transmission fixture 200, this surface does not discharge single particle.Preferably, the surface of pallet 850,860 is continuous, continual and atresia, not the individual particle that can peel off when encapsulating and opening transmission fixture 200.In a version, for example, the smooth and elastic surface of pallet 850,860 can have the r.m.s. roughness less than 10 microinch.The surface of pallet 850,860 also should be capable of washing, thus shell 800a is imported to particle control environment in before pollutant can be eliminated.
The a pair of pallet 850,860 of assembling plays the effect of the self stand container of closure fastening device 200 and substrate holder 10, even can have built-in handle (not shown), fixture 200 directly be transferred in the repairing environment or be transferred in the clean room.This of assembling also can be stored a period of time in the clean room under sealing and stable environment pallet 850,860, and only when substrate holder 10 need use in process chamber at once, open, thereby further reduce any pollution of substrate holder 10 in pallet 850,860.
Pallet 850,860 can comprise continuous circumferential flange 852a, 852b, and this circumferential flange forms around the neighboring of pallet 850,860.The sealing gasket (not shown) can be placed between tray flange 852a, the 852b, and with the tight seal between the pallet 850,860 that assembling is provided, thereby protection substrate holder 10 and transmission fixture 200 avoid being subjected to contaminants. Circumferential flange 852a, 852b have reduced to seal the length of two pallet 850,860 needed gas-tight seals.Equally, when promoting from top pallet 850, with provide contact in shell 800a transmission fixture 200 and during frame 10, circumferential flange 852a, 852b allow the shell perpendicular positioning.When fixture 200 with frame 10 is placed in the shell or remove from shell when need remain on vertical orientation, this version is favourable.
Preferably, the part of shell 800a is made by rigid material at least, and this material also is a printing opacity, remains on inner substrate holder 10 to allow visual inspection.Such as used in this manual, printing opacity refers to the permission material of light by this material of some wavelength at least, as transparent, translucent, the muddy or opaque material of part.For example, suitable light transmissive material can have about at least 20% transmission of visible light.Shell 800a also can carry out surface finish, to strengthen the clarity of transmitted light and observation.Shell 800a also can be made by light transmissive material fully, and a perhaps only chlamydate part can be made with light transmissive material, as window.Under the situation of not opening sealing, the inspection personnel should visually check the interior contents in the bin.For example, in a version, have only one or more pallet 850,860 usefulness light transmissive materials to make, yet the integral body of two pallets 850,860 also can be made with light transmissive material.And shell 800a can comprise the mark of description properties and the potential hazard relevant with opening shell 800a.This mark can be arranged on the inner surface of light transmissive material of shell 800a.
Suitable printing opacity rigid material is the thermal finalization thermoplastic polymers, as high density polyethylene (HDPE), for example based on PETG (PET), glycol-modified-PETG (PETG), directed PETG (O-PET) or PEN (PEN) or its each other mixture or with the mixture of other resin.Preferably, the printing opacity rigid material is moldable thermoplastics, and it is softening when being heated, form mould and annotate shape, and as PETG-ethylene glycol (PETG), as by Palram, Ramat Yohanan, the PAL-G sheet that Israel makes.Pallet 850,860 can use conventional plastic mold injection technology to form single single piece with the single blank sheet mould of thermoplastic material.This blank sheet can utilize conventional thermal finalization technology and become thermosetting thin-walled pallet as the auxiliary mould of vacuum-assisted mould, air, the auxiliary mould of mechanical piston or to the equipment thermal finalization of matched moulds and so on.Single mode also can be used to make pallet, and the each several part that mould is annotated pallet can excise, and the pallet assembling of excision forms the shell with three or more different piece, as shown in Figure 9.
Advantageously, shell 800a allows do not opening shell or destroying its interior contents of visual inspection under the situation about sealing.If substrate holder 10 fracture or cracked then can not found this fracture under the intermediate conveyor point place as part distribution depot and so on does not open the situation of shell 800a at once.Be desirably in before transporting and do not opening and to pollute the state of checking the transmission encapsulation 802 of package shelf 10 under the situation of content of shell with sealing.In potential adverse environment in the situation of not destroying sealing, shell 800a allows also that the customs officer checks interior contents according to the strict more customs inspection that upgrades between by the international transmission period on border, may cause frame 10 discarded fully after finishing transportation under this environment.Shell 800a also allows frangible substrate holder 10 to be transferred to safely from the clean room to repair facility, and vice versa, keeps the good hermetic barrier with external environment condition simultaneously.
Transmission encapsulation 802 also can comprise hard casing 870, and this casing 870 is used for closure 800a (or any other shell version described herein), transports the example as shown in Fig. 6,12A and 12B.Casing 870 comprises the box 874 with internal foam piece 876, and this foam block 876 has in-profile or the cutting profile that mates with the external shape of shell 800a, as shown in Figure 6.Make for single of clean room's foam that the internal foam piece of processing through profile 876 can form required cutting profile with sticking together each other.Clean room's foam is the spongy polyethylene foam material of high compression, as from FP Technologies, and Ventura, the Zotefoam ' s of California " Plastazote LD-24 ".Clean room's foam has the open molecular structure of porous usually, for example has size and is approximately 10 to 100 microns hole.
Usually, casing 870 is at clean room's external opening, and fills the shell 800a of the transmission fixture 200 that sealing frame 10 is removed from casing 870, then cleans if desired, is written into the clean room then.Owing to the gas in the hole that is trapped in foam block 876 can be vented in clean room's environment; And being used to produce tack coat between the foam block of three-dimensional container also can exhaust or produce the polymerization contaminant particle, and therefore the clean room is not brought in the transmission encapsulation into.
Box 874 generally includes roof 877, sidewall 878 and the diapire made from rigid material (as plastics or sheet metal) 879.Suitable rigidity plastics comprises with mould annotates the casing that polypropylene is made, for example by Hardigg Indus., and South Deerfield, Massachusetts makes.The wall 878,879,881 of box 874 also can be strengthened with metal lipping 883, for example the aluminium fringing.Box 874 also can have handle 880 and wheel 882, is beneficial to package parts from transporting the clean room that vehicle is transferred to wafer manufacture equipment or repaiies equipment, as shown in Figure 12 A and 12B.
Other versions of shell 800 will be described now.In a version, shell 800b comprises flange 852a, 852b, and this flange has the groove that is parallel to the longitudinal axis shown in Fig. 7 and transverse axis extension.Lateral flange 852a, the 852b of pallet 850,860 can comprise several holes 855, and screw or other securing members 856 can be inserted this hole, so that pallet 850,860 is fixed to one another.Because the length of shell 800b and the combined distance of width are greater than circumferential distance, so lateral flange 852a, 852b have increased the contact area of flange seal.Equally, lateral flange 852a, 852b allow shell to remove in horizontal level, provide internal fixing device 200 to contact with the horizontal of frame 10.
With reference to Fig. 8, another embodiment that is used to be maintained fixed the shell 800c of device 200 and frame 10 comprises three interlocking pallets, and these three pallets comprise top pallet 910, central pallet 902 and the bottom tray 903 of closure fastening device 200.Each pallet 901-903 comprises the flange 910 that allows part 901-903 to be bonded to each other through the securing member (not shown).In this version, one of them circumferential flange 910 also plays the effect of the handle that is used to promote and move the shell 800c that has its content.Shell 800c is provided for allowing only opening the top over two, to allow the content of easier contact shell.Equally, the top can have the reinforcement band 907 of rising, and this band also plays the effect of the footing of supporting housing.
The another version of shell 800d also comprises three pallets 952,954 and 956 as shown in Fig. 9 to 11, but they combine by different way.With reference to Fig. 9, top pallet 952 comprises external flange 958, and this external flange 958 is flat, and cooperates with the inner flange 960 of second pallet 954, and this inner flange 960 slides in the external flange 958 and forms gas-tight seal.So the last binding site of shell 800d lacks outward extending flange.Second pallet 954 and the 3rd pallet 956 be by flange 962 and 964 combinations, and this flange from shell outwards and horizontal expansion and has crooked end portion 962a, 964a respectively, and this end portion is provided for keeping the handle with mobile shell.Outward extending flange 962,964 allows at least three people can promote shell simultaneously, as encapsulation weight surpass 75 pounds current OSHA rule needed.For example along six right-angled bend securing members 951 of 60 ° of positioned at intervals of flange, form sealing at the flat interior section 962b and the 964b place of flange 962,964 by use respectively.In addition, use two reinforced blade 953a, 953b making with shell 800d same material to locate, to provide extra intensity in these zones around top and the bottom section of shell 800d.In addition, pallet 952,954 and 956 can be made of equal dies, to save production cost, makes the sector of breakdown excision as flange, to form three difformities as shown in the figure.
In another version, shell also can have the cup (cup) 974 of depression, to hold exhaust port coupling device 966, as shown in Figure 10 B.In this version, the cup 974 of depression is sized to be installs exhaust port coupling device 966, thereby the top plan 975 of coupling device 966 flushes with the top surface 976 of roof 967.Between the transmission period of shell 200, the cup 974 protection coupling devices 966 of depression also prevent unexpected abate type damage.By in conventional moulding system, annotating the cup 974 that this glass made depression with shell while mould.In this version, the flange of clamping 969 engages first stiffener 972 on the basal surface 977 that is installed in roof 967 and is installed in second stiffener 973 on the top surface 976 of roof 967 of top pallet 952.
Exhaust port coupling device 966 is positioned on the roof 967 of top pallet 952.Exhaust port coupling device 966 is enough big, inserts to allow conventional Draeger gas sampler, and this sampling pipe can be used for screening the gas of shell, for example is used to survey toxic gas.Yet it should be too not big yet, otherwise will be outstanding too far away from roof 967.Figure 10 A shows the exemplary embodiment of exhaust port coupling device 966, and this coupling device comprises assembly: (i) adapter 968, as the NW-25 adapter; The O-ring packing 969 that (ii) has stainless steel ring; (iii) separate plate 970; (vi) be clipped in and compress shell 971 around the assembly top, all these can be from Nor-Calproducts, Eureka, and California obtains.On typical case " house " the exhaust washing system that flange is connected to wafer manufacture or trimming equipment, exhaust port coupling device 966 allows the air in the shell or other gas are pumped.Press flange 969 cooperates with one or more stiffeners 972,973, and this stiffener is installed in inside and is bonded on the roof 967 of top pallet 952.The plate of installing in inside 972,973 is thicker and firmer, strengthening combination, and can be that for example thickness is about 2 to 20 millimeters and the plectane shell same material (as PETG-ethylene glycol).By using the binding agent as McMaster Carr 517A2 PETG binding agent and so on, each parts of exhaust port coupling device 966 can bonded to one anotherly arrive together, and are bonded on the flange 969, to form gas-tight seal.
Cleaning is positioned on the sidewall 982 of bottom tray 956 with gas coupling device 980.Cleaning allows cleaning to enter shell with gas from outside cleaning gas source (not shown) with gas coupling device 980.Typical cleaning comprises non-active gas with gas, as nitrogen or argon gas, and plays and provides inertia or inert environment not to be exposed to effect in the external environment condition with fender bracket 10 in shell 200.Figure 11 shows the exemplary embodiment of cleaning with gas coupling device 980, and this coupling device comprises (i) anti-rotation support 981, and it can't move under standard is used easily, and connects by screw 983; (ii) conventional VCR type assembly parts 984; (iii) face seal plate and packing ring 986; And the nut 988 that (iv) assembly is kept together, all these can be from Swagelok, Solon, and Ohio obtains.Internal gas guide plate 992 shape is processed into the cleaning that will flow into gas downwards towards the bottom guiding of the inside of shell 800d, shown in arrow 994, with prevent cleaning with the gas direct collision on fixture 200 or frame 10.Cleaning is directly blown to the frangible coating that can remove particle on these parts and get loose with gas.The outside stiffener of installing 994 is provided for strengthening this assembly.Each parts can seal with foregoing binding agent.
The present invention is described with reference to its some preferred version; Yet other versions also are possible.For example, transmission encapsulation 802 and transmission fixture 200 can be used for the application of other type, as is known to the person skilled in the art, for example transmit other frangible processing unit.Other structures of transmission fixture 200 also can be used to adapt to the shape and size of processing unit.For example, the shape of end plate 210a, 210b can be processed into the shape except triangle or framework, for example square, hexagon or even circular slab or framework.Shell 800 also can be used other material, perhaps have by opaque material around the wicket of transparent material.Casing 870 also can have other shapes, and is for example cylindrical, and can make of steel or other metals.Therefore, the spirit and scope of claims should not be confined to the description of contained preferred version herein.

Claims (6)

1. be used for the transmission fixture of substrate holder, it is characterized in that, described transmission fixture comprises:
(a) top end plate and bottom end plate;
(b) described top end plate is connected to a plurality of pillars on the described bottom end plate, these pillar spacers are opened abundant distance, and so that described substrate holder is limited between them, each described pillar all has vertical internal edge; And
A plurality of adaptability buffers, each described buffer all is coupled on described vertical internal edge of described pillar.
2. fixture as claimed in claim 1 is characterized in that, described pillar is incorporated on the described end plate by the keying that forms hinge.
3. fixture as claimed in claim 1 is characterized in that, described top end plate and described bottom end plate are triangle, and have the top, and described pillar is attached on the described top.
4. fixture as claimed in claim 1 is characterized in that, described top end plate and described bottom end plate comprise reinforcement, and comprises the finger hole that is used to carry described fixture.
5. fixture as claimed in claim 1 is characterized in that, each described adaptability buffer all comprises polymeric tube.
6. fixture as claimed in claim 5 is characterized in that, each described polymeric tube all comprises grain surface.
CNU2006201213468U 2005-06-03 2006-06-05 Transmission fixing device for substrate frame Expired - Fee Related CN200986915Y (en)

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US11/144,870 US20060283770A1 (en) 2005-06-03 2005-06-03 Transportation fixture and package for substrate rack

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CNU2007201474744U Division CN201144053Y (en) 2005-06-03 2006-06-05 Transmission encapsulation member for transmitting substrate holders

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100995071B1 (en) * 2008-09-12 2010-11-18 삼성모바일디스플레이주식회사 Organic light emitting diode display
CN102142387B (en) * 2010-12-10 2013-01-23 北京七星华创电子股份有限公司 Vertical crystal boat for semiconductor equipment for heat treatment
TWI469872B (en) 2011-12-13 2015-01-21 Ind Tech Res Inst Polyester films with low thermal expansion and methods for manufacturing the same
CN103367531B (en) * 2012-04-09 2016-08-03 中电电气(上海)太阳能科技有限公司 A kind of experiment glass cleaning dries frame
JP6426096B2 (en) 2012-09-28 2018-11-21 インテグリス・インコーポレーテッド CMP brush packaging
CN103208448B (en) * 2013-03-18 2015-10-21 无锡华瑛微电子技术有限公司 Semiconductor wafer transmission device
CN103236409B (en) * 2013-04-07 2015-11-04 沈阳拓荆科技有限公司 The ceramic support plate of closed pin
TWI777308B (en) * 2019-11-21 2022-09-11 新加坡商保綠萊私人有限公司 Assembled plate storage box
CN114023676B (en) * 2021-10-13 2022-09-16 广东万维半导体技术有限公司 Movable wafer carrying disc bearing device

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US395234A (en) * 1888-12-25 Island
US344891A (en) * 1886-07-06 John b
US3469686A (en) * 1967-02-08 1969-09-30 Monsanto Co Retaining trays for semiconductor wafers and the like
US3487921A (en) * 1968-08-14 1970-01-06 Crawford Fitting Co Container
US3673758A (en) * 1970-12-21 1972-07-04 Joseph J Esty Method of packaging and preserving perishable products
US3715860A (en) * 1971-07-23 1973-02-13 J Esty Method of preserving perishable products
US4602715A (en) * 1983-11-08 1986-07-29 Aero Mayflower Transit Company, Inc. Shipping container for electronic components
US4588086A (en) * 1984-06-07 1986-05-13 Coe Thomas U Substrate and media carrier
US4674650A (en) * 1985-10-07 1987-06-23 E. I. Du Pont De Nemours And Company Container and cover fastening means
US4767002A (en) * 1986-01-14 1988-08-30 W. R. Grace & Co. Multiple circuit board carrier/shipper
US4840276A (en) * 1988-05-25 1989-06-20 George & Thomas Cone Company Cone package
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5232094A (en) * 1992-06-22 1993-08-03 Label Makers, Inc. Shipping container
US5575394A (en) * 1994-07-15 1996-11-19 Fluoroware, Inc. Wafer shipper and package
US5454478A (en) * 1995-01-26 1995-10-03 Everson; Thomas J. Compartmentalized transport container
US5853214A (en) * 1995-11-27 1998-12-29 Progressive System Technologies, Inc. Aligner for a substrate carrier
US6003674A (en) * 1996-05-13 1999-12-21 Brooks; Ray Gene Method and apparatus for packing contaminant-sensitive articles and resulting package
US5788304A (en) * 1996-05-17 1998-08-04 Micron Technology, Inc. Wafer carrier having both a rigid structure and resistance to corrosive environments
US5724748A (en) * 1996-07-24 1998-03-10 Brooks; Ray G. Apparatus for packaging contaminant-sensitive articles and resulting package
US6041938A (en) * 1996-08-29 2000-03-28 Scp Global Technologies Compliant process cassette
US5816425A (en) * 1996-09-19 1998-10-06 K-D Container L.L.C. Interlocking shipping container
US6056123A (en) * 1997-12-10 2000-05-02 Novus Corporation Semiconductor wafer carrier having the same composition as the wafers
US5947320A (en) * 1997-12-11 1999-09-07 Containers Accessories, Inc. Molded drum, lid and ring-clamp system with enhanced containment integrity
WO2000078638A1 (en) * 1999-06-17 2000-12-28 Troy James Merrell Article of manufacture and method for protecting information-storage devices
US6378538B1 (en) * 1999-12-13 2002-04-30 Advanced Micro Devices, Inc. Durable, multi-piece rotor for spray acid tools
US6811040B2 (en) * 2001-07-16 2004-11-02 Rohm And Haas Company Wafer holding apparatus
US7185760B2 (en) * 2003-06-11 2007-03-06 Applied Materials, Inc. Non-contact protective packaging for surface-sensitive articles
US20040262187A1 (en) * 2003-06-26 2004-12-30 Applied Materials, Inc. Clean room transportation package for process chamber kit

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JP3134448U (en) 2007-08-16
TWM319516U (en) 2007-09-21
JP3134131U (en) 2007-08-09
JP3134447U (en) 2007-08-16
CN201144053Y (en) 2008-11-05
CN201132651Y (en) 2008-10-15

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