CN200970857Y - Tool for drilling silicon single-crystal rod from irregular silicon briquette - Google Patents
Tool for drilling silicon single-crystal rod from irregular silicon briquette Download PDFInfo
- Publication number
- CN200970857Y CN200970857Y CN 200620149156 CN200620149156U CN200970857Y CN 200970857 Y CN200970857 Y CN 200970857Y CN 200620149156 CN200620149156 CN 200620149156 CN 200620149156 U CN200620149156 U CN 200620149156U CN 200970857 Y CN200970857 Y CN 200970857Y
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- sleeve
- silicon
- sleeve body
- screw
- silicon single
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200620149156 CN200970857Y (en) | 2006-10-27 | 2006-10-27 | Tool for drilling silicon single-crystal rod from irregular silicon briquette |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200620149156 CN200970857Y (en) | 2006-10-27 | 2006-10-27 | Tool for drilling silicon single-crystal rod from irregular silicon briquette |
Publications (1)
Publication Number | Publication Date |
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CN200970857Y true CN200970857Y (en) | 2007-11-07 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200620149156 Expired - Lifetime CN200970857Y (en) | 2006-10-27 | 2006-10-27 | Tool for drilling silicon single-crystal rod from irregular silicon briquette |
Country Status (1)
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CN (1) | CN200970857Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101973078A (en) * | 2010-10-25 | 2011-02-16 | 镇江市港南电子有限公司 | Clamping device of silicon slice cutting device |
CN102806609A (en) * | 2012-08-15 | 2012-12-05 | 四川欣蓝光电科技有限公司 | Efficient and low-cost hollow-out method for sapphire wafer bar |
-
2006
- 2006-10-27 CN CN 200620149156 patent/CN200970857Y/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101973078A (en) * | 2010-10-25 | 2011-02-16 | 镇江市港南电子有限公司 | Clamping device of silicon slice cutting device |
CN102806609A (en) * | 2012-08-15 | 2012-12-05 | 四川欣蓝光电科技有限公司 | Efficient and low-cost hollow-out method for sapphire wafer bar |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: BEIJING GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS Effective date: 20120216 Free format text: FORMER OWNER: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Effective date: 20120216 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120216 Address after: 100088, 2, Xinjie street, Beijing Patentee after: GRINM Semiconductor Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Co-patentee before: GRINM Semiconductor Materials Co., Ltd. Patentee before: General Research Institute for Nonferrous Metals |
|
C56 | Change in the name or address of the patentee |
Owner name: GRINM ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: GRINM SEMICONDUCTOR MATERIALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 100088, 2, Xinjie street, Beijing Patentee after: YOUYAN NEW MATERIAL CO., LTD. Address before: 100088, 2, Xinjie street, Beijing Patentee before: GRINM Semiconductor Materials Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150611 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150611 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Patentee after: You Yan Semi Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Patentee before: YOUYAN NEW MATERIAL CO., LTD. |
|
CX01 | Expiry of patent term |
Granted publication date: 20071107 |
|
EXPY | Termination of patent right or utility model |