CN200969350Y - Integrated power luminous diode package structure - Google Patents
Integrated power luminous diode package structure Download PDFInfo
- Publication number
- CN200969350Y CN200969350Y CNU2006200741546U CN200620074154U CN200969350Y CN 200969350 Y CN200969350 Y CN 200969350Y CN U2006200741546 U CNU2006200741546 U CN U2006200741546U CN 200620074154 U CN200620074154 U CN 200620074154U CN 200969350 Y CN200969350 Y CN 200969350Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light emitting
- main body
- reflection chamber
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
A luminescent diode encapsulating structure of integrated power type, includes a luminescent diode unit, a main body of PCB plate and a metal conducting layer, the metal conducting layer is arranged on the upper surface of the main body of PCB plate, the luminescent diode unit consists of a lens body, a metal leading wire, a chip, a concave reflection cavity body, a plurality of hole series corresponding to the concave reflection cavity body are opened at main body of PCB plate, the concave reflection cavity body is pushed and arranged in the hole series, the bottom of the concave reflection cavity body and the hole series are in the same plane, the chip is adhesive on the concave reflection cavity body, the chip is connected to the metal conducting layer through the metal leading wire, the lens is arranged on the concave reflection cavity body, and covers the metal leading wire and the chip. Only need to embed the concave reflection cavity body conveniently into each hole, and then connect the positive and negative metal conducting layer because the hole series opened at the main body of PCB plate are arranged and combined according to human will. This integrated encapsulating structure is convenient for intensifying heat dissipation, reducing heat resistance of system.
Description
Technical field:
The utility model relates to a kind of light fixture of being made up of light-emitting diode, relates in particular to the encapsulating structure that numerous light-emitting diodes connect into integrated light fixture.
Background technology:
Because the popularity that the advance of semiconductor light emitting technology and product use, be widely regarded as and had one of high-tech sector of development potentiality most, semiconductor not only has vast potential for future development, one of effective measure of national economy sustainable development especially aspect floor light.With light-emitting diode (hereinafter to be referred as LED) device is the semiconductor floor light technology of core, has advantages such as low in energy consumption, long-life, environmental protection, power saving.Be used widely in the market at traffic lights, highway signal lamp, Landscape Lighting.Follow improving constantly of led chip power, performance constantly improves, and nowadays more and more applies in the car light market and goes, and automobile-used LED is divided into decorative lamp and function lamp two big classes, and the present polygamy of decorative lamp closes control circuit and realizes prismy conversion; Aspects such as indicator light turn to, brake, move backward before and after the function lamp is used in.The full-color decorative lamp of indoor and outdoor market is another emerging market of LED, and by the control of electric current, LED can realize tens kinds even hundreds of change in color.Be particular about in the personalized epoch in present stage, the led color variation helps the development in LED decorative lamp market.LED has begun to make small decorating lamp, and decorative curtain wall is applied in hotel, the room.At aspects such as car light, display screen, decorative lamps then be a plurality of or up to a hundred LED form.Therefore, traditional LED encapsulating structure can not satisfy the more and more demand of the application market of expansion.That improves LED gets optical efficiency and heat dispersion, draws materials easily, cost is low, environmental protection and be fit to big industrial LED encapsulating structure, has become the emphasis of insider's research.
The utility model content:
The purpose of this utility model provides a kind of structure for packaging integration type power model light emitting diode, and it can carry out integrated splicing assembling to light-emitting diode according to people's actual demand, reaches predetermined illuminating effect.
Technical solution adopted in the utility model is:
Described structure for packaging integration type power model light emitting diode, comprise light emitting diode, main body pcb board and metal conducting layer, offer several installing holes at the main body pcb board, its shape is corresponding with the profile of matrix reflection chamber, metal conducting layer is arranged on the upper surface of main body pcb board, and be distributed in regularly by each installing hole, light emitting diode is by lenticular body, metal lead wire, chip, the matrix reflection chamber is formed, die bonding is at matrix reflection chamber lumen centers position, chip is connected with metal conducting layer by metal lead wire, lenticular body is installed on the matrix reflection chamber, and cover cap metal lead wire, chip, the matrix reflection chamber is fitted in the installing hole, closely cooperate between the two, and the bottom surface is in the same plane.
The material of described matrix reflection chamber is the high metal material of conductive coefficient, as aluminium, copper, iron and alloy thereof; Be provided with reflected coat layer at matrix reflection chamber surface of internal cavity, as silver-plated or chromium plating or other high-reflectivity metal coating.
The profile of described matrix reflection chamber is circle or polygon;
Described main body pcb board is that single or double covers copper PCB printed circuit board;
Described lenticular body is near hemisphere, and its material is acryl PMMA;
Invention effect of the present utility model is: because the installing hole of offering on main body pcb board system is to carry out permutation and combination according to people's wish, as long as the matrix reflection chamber is fitted in each installing hole.The integrated packaged type of this portable can make light emitting diode embed easily, and it embeds quantity and can determine arbitrarily.By this assembling mode, can make the bottom surface of the bottom surface of matrix reflection chamber and main body pcb board in the same plane, can directly link to each other with the secondary heat abstractor, enhance heat reduces the thermal resistance of system.
Description of drawings:
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1, Fig. 2 are a kind of embodiment schematic diagram of the present utility model;
Fig. 2 is the mounting structure schematic diagram of a light emitting diode among Fig. 1;
Embodiment:
Embodiment: as shown in Figure 1 and Figure 2, described structure for packaging integration type power model light emitting diode, comprise light emitting diode 1, main body pcb board 2 and metal conducting layer 3, light emitting diode 1 is made up of lenticular body 11, metal lead wire 12, chip 13, matrix reflection chamber 14, offer 12 circular mounting holes 21 at main body pcb board 2, the aperture of each installing hole 21 is corresponding with the cylindrical of matrix reflection chamber 14, matrix reflection chamber 14 is fitted in the installing hole 21, be matched in clearance closely between the two, and both bottom surfaces are in the same plane; Chip 13 is bonded in the centre of matrix reflection chamber 14 inner chambers, and chip 13 and metal conducting layer 3 are coupled together both by metal lead wire 12, the top that lenticular body 11 is installed matrix reflection chambers 14, and cover cap metal lead wire 12, chip 13.Described matrix reflection chamber 14 is the high metallic copper of conductive coefficient, aluminium, iron or its alloy, is copper in this example; In the electroplate or the chromium plating of matrix reflection chamber 14 inner chambers, be silver-plated in this example.The profile of matrix reflection chamber 14 is polygon or circle, is circular in this example; Described main body pcb board 2 covers copper PCB printed circuit board for single or double, is double-sided copper-clad PCB printed circuit board in this example; Described lenticular body 11 is near hemisphere, and its material is acryl PMMA.
Execution mode of the present utility model is a lot, does not enumerate at this, all belongs to protection category of the present utility model as long as adopt light emitting diode and main body pcb board to carry out splicing structure.
Claims (6)
1, a kind of structure for packaging integration type power model light emitting diode, it is characterized in that: comprise light emitting diode (1), main body pcb board (2) and metal conducting layer (3), offer several installing holes (21) at main body pcb board (2), its shape is corresponding with the profile of matrix reflection chamber (14), metal conducting layer (3) is arranged on the upper surface of main body pcb board (2), and it is other to be distributed in each installing hole (21) regularly, light emitting diode (1) is by lenticular body (11), metal lead wire (12), chip (13), matrix reflection chamber (14) is formed, chip (13) is bonded in the centre of matrix reflection chamber (14), chip (13) is connected with metal conducting layer (3) respectively by metal lead wire (12), lenticular body (11) is installed on the matrix reflection chamber (14), and cover cap metal lead wire (12), chip (13), matrix reflection chamber (14) is fitted in the installing hole (21), closely cooperate between the two, and the bottom surface is in the same plane.
2, according to claims 1 described structure for packaging integration type power model light emitting diode, it is characterized in that: the material of described matrix reflection chamber (14) is the high metal material of conductive coefficient, is provided with reflected coat layer at the surface of internal cavity of matrix reflection chamber (14).
3, according to claims 1 described structure for packaging integration type power model light emitting diode, it is characterized in that: the profile of described matrix reflection chamber (14) is circle or polygon.
4, according to claims 1 described structure for packaging integration type power model light emitting diode, it is characterized in that: described main body pcb board (2) covers copper circuit board for single or double.
5, according to claims 1 described structure for packaging integration type power model light emitting diode, it is characterized in that: described lenticular body (11) is that its material is acryl PMMA near hemisphere.
6, according to claims 1 described structure for packaging integration type power model light emitting diode, it is characterized in that: described main body pcb board (2) is the double-sided copper-clad circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200741546U CN200969350Y (en) | 2006-06-20 | 2006-06-20 | Integrated power luminous diode package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200741546U CN200969350Y (en) | 2006-06-20 | 2006-06-20 | Integrated power luminous diode package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200969350Y true CN200969350Y (en) | 2007-10-31 |
Family
ID=38968928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006200741546U Expired - Fee Related CN200969350Y (en) | 2006-06-20 | 2006-06-20 | Integrated power luminous diode package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200969350Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012040959A1 (en) * | 2010-09-30 | 2012-04-05 | 福建中科万邦光电股份有限公司 | Package structure of high-power led light source module |
| CN106683579A (en) * | 2016-12-01 | 2017-05-17 | 长沙信元电子科技有限公司 | Integrated LED display panel |
| CN111059480A (en) * | 2019-12-23 | 2020-04-24 | 深圳市丰颜光电有限公司 | Light emitting diode package component and light emitting diode bulb comprising same |
-
2006
- 2006-06-20 CN CNU2006200741546U patent/CN200969350Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012040959A1 (en) * | 2010-09-30 | 2012-04-05 | 福建中科万邦光电股份有限公司 | Package structure of high-power led light source module |
| CN106683579A (en) * | 2016-12-01 | 2017-05-17 | 长沙信元电子科技有限公司 | Integrated LED display panel |
| CN111059480A (en) * | 2019-12-23 | 2020-04-24 | 深圳市丰颜光电有限公司 | Light emitting diode package component and light emitting diode bulb comprising same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071031 Termination date: 20100620 |