CN1994822A - Satellite acceptor shell and forming method - Google Patents

Satellite acceptor shell and forming method Download PDF

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Publication number
CN1994822A
CN1994822A CN 200510138183 CN200510138183A CN1994822A CN 1994822 A CN1994822 A CN 1994822A CN 200510138183 CN200510138183 CN 200510138183 CN 200510138183 A CN200510138183 A CN 200510138183A CN 1994822 A CN1994822 A CN 1994822A
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China
Prior art keywords
mould
housing
circuit board
molds
holding part
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Granted
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CN 200510138183
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Chinese (zh)
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CN100479335C (en
Inventor
陈勇钦
林宏源
郭三义
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Wistron Neweb Corp
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Wistron Neweb Corp
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Priority to CNB2005101381834A priority Critical patent/CN100479335C/en
Publication of CN1994822A publication Critical patent/CN1994822A/en
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Publication of CN100479335C publication Critical patent/CN100479335C/en
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Abstract

The invention relates to a high-frequency planet receiver, wherein the signal input part, the first circuit board container and the signal output part extend to the first side of main body of receiver, while they are integrated to form the high-frequency planet receiver, to avoid affecting the signal quality.

Description

The housing of satellite acceptor and the method for formation
[technical field]
The invention provides a kind of satellite acceptor, refer to a kind of integrated satellite acceptor especially.
[background technology]
The high frequency satellite receiver must be divided into the high frequency satellite receiver several parts and assemble owing to the restriction of external form.Because assembling the time can produce the gap, these assembly clearances not only can influence the receiving quality of satellite-signal, and allow rainwater penetrate into high frequency satellite receiver inside from the gap easily, cause inner impaired and shorten service life of product.
See also Fig. 1; Fig. 1 is the exploded view of satellite receiver 1 in the prior art.Satellite receiver 1 comprises a main body 10, three signal feed-in part 12, a circuit card holding part 14 and signal output portions 16, and wherein signal output portion 16 is locked on the main body 10 by screw 11.Because signal feed-in part 12 is one-body molded with main body 10 among Fig. 1, so during die sinking, the mould of signal feed-in part 12 (mold) can't be with directions X (above-below direction) die sinking, can only be with Y direction (fore-and-aft direction) die sinking, therefore cause the signal output portion 16 can't be one-body molded with main body 10, because signal output portion 16 can produce the problem of interfering with the mould of signal feed-in part 12 during die sinking, signal output portion 16 must be arranged on the main body 10 in the mode of locking, this has increased stack-mounted step and processing procedure time.
See also Fig. 2; Fig. 2 is the exploded view of satellite receiver 2 in the prior art.Satellite receiver 2 comprises a main body 20, a signal feed-in part 22, a circuit card holding part 24 and a signal output portion 26, and wherein signal feed-in part 22 is locked on the main body 20 by screw 21.Fig. 2 can't make with main body 20 signal feed-in part 22 in integrated mode be because be subject to the size and shape of circuit card holding part 24.Because the mould of circuit card holding part 24 must be with the directions X die sinking, and the image of opening member 25 vertical projections of signal feed-in part 22 upper ends and circuit card holding part 24 have overlapping part, therefore the mould of the circuit card holding part 24 that can cause during die sinking produces interference problems with the opening member 25 of signal feed-in part 22, so just signal feed-in part 22 is arranged on the main body 20 in the mode that locks.In addition, infiltrate through satellite receiver 2 via assembly clearance, between signal feed-in part 22 and main body 20, added O type ring 23 and come waterproof for fear of rainwater.
As mentioned above, owing to produce the problem of interfering when the external form of high frequency satellite receiver and die sinking, therefore the high frequency satellite receiver must be divided into several parts and assemble.Yet the high frequency satellite receiver belongs to the very high product of degree of precision, and assembly clearance can influence the receiving quality of satellite-signal.In addition, assembly clearance also allows rain penetration enter high frequency satellite receiver inside easily, shortens the service life of product, even use O type ring to come waterproof, but after the long-term use, O type ring can be out of shape just can't reach water-proof function.
[summary of the invention]
The present invention is the housing that discloses a kind of satellite acceptor, comprises a main body, a signal feed-in part, a first circuit board holding part and a signal output portion.This signal feed-in part is extended first side from this main body, this signal feed-in part comprises a plurality of signal receiving ends, this first circuit board holding part is arranged at first side of this main body, and this signal output portion extends from this main body, and this signal output portion comprises a plurality of signal output parts.
[description of drawings]
Fig. 1 is the exploded view of different high frequency satellite receivers in the prior art with Fig. 2.
Fig. 3 is the scheme drawing of satellite receiver of the present invention.
Fig. 4 to Fig. 6 is respectively lateral plan, birds-eye view and the backplan of satellite receiver among Fig. 3.
Fig. 7 and Fig. 8 are the scheme drawing of the required mould of satellite receiver among formation Fig. 3.
Fig. 9 and Figure 10 are respectively the scheme drawing of the submodule tool of first set of molds among Fig. 7.
[specific embodiment]
See also Fig. 3; Fig. 3 is the scheme drawing of satellite receiver 3 of the present invention.Satellite receiver 3 comprises a main body 30, a signal feed-in part 32, a first circuit board holding part 34 and a signal output portion 36.Signal feed-in part 32 comprises a cylinder 31, an opening member 33 and a plurality of signal receiving ends 321,322,323, is used for receiving satellite signal.First circuit board holding part 34 comprises one first groove 341, is used for holding a circuit card.Signal output portion 36 comprises a plurality of signal output parts 361.Therefore satellite receiver 3 of the present invention is formed in one, and no assembly clearance can be avoided assembly clearance influence the receiving quality of satellite-signal and avoids rain penetration.
See also Fig. 4 to Fig. 6; Fig. 4 to Fig. 6 is respectively lateral plan, birds-eye view and the backplan of satellite receiver 3, knows the structure of satellite receiver 3 with explanation.Among Fig. 4, signal output portion 36 35 is arranged on the main body 30 at angle with perpendicular line, this be since country variant for the form factors difference of high frequency satellite receiver, the angle that is provided with of signal output of the present invention portion 36 does not limit, and can decide according to each specification.
Fig. 5 can know the shape of a plurality of signal receiving ends 321,322,323 of seeing signal feed-in part 32, signal receiving end 321 and 323 is for having the circular signal receiving end of breach, signal receiving end 322 is a rectangular signal receiving end, and be connected in the indentation, there of signal receiving end 321 and 323, the junction interference of the mould of signal receiving end 322 and signal receiving end 321,323 when this design can be avoided die sinking.In addition, produce during for fear of the mould of the opening member 33 of signal feed-in part 32 and first circuit board holding part 34 in die sinking and interfere, therefore the edge-perpendicular of designed openings part 33 imagery coverage that is projected to main body 30 separates with first groove 341 of first circuit board holding part 34, avoids interference problem by the size or the shape of dwindling or change first circuit board holding part 34.The shape of the shape of the signal receiving end 321,322,323 of signal feed-in part 32, opening member 33 and first circuit board holding part 34 is not limited to the diagram of Fig. 5, and its shape can be complied with the antenna pattern of being installed and make change.
Fig. 6 is the bottom side of satellite receiver 3, and it comprises a second circuit holding part 38, and second circuit board holding part 38 also comprises one the two the second groove 381, is used for holding a circuit card.
The framework of satellite receiver 3 more than has been described, how the satellite receiver 3 of shop drawings 3 then has been described.See also Fig. 7 and Fig. 8; Fig. 7 and Fig. 8 are for forming the scheme drawing of the required mould of satellite receiver 3.First set of molds comprises the one first submodule tool 40 and the second submodule tool 42, see also Fig. 9 and Figure 10, be respectively the scheme drawing of the first submodule tool 40 and the second submodule tool 42, the submodel 401 of the first submodule tool 40 and the submodel 421 of the second submodule tool 42 are used for forming the housing (comprising cylinder 31 and opening member 33) of signal feed-in part 32; The submodel 402 of the first submodule tool 40 and the submodel 422 of the second submodule tool 42 are used for forming the housing of signal output portion 36; The submodel 403 of the first submodule tool 40 and the submodel 423 of the second submodule tool 42 are used for forming the housing of main body 30, first circuit board holding part 34 and the housing of second circuit board holding part 38.Second mould 44 is used for forming signal receiving end 321,322,323 and forms first groove 341 in the housing of first circuit board holding part 34 in the housing of signal feed-in part 32.The 3rd mould 46 is used for forming a plurality of signal output parts 361 in the housing of signal output portion 36.The 4th mould 18 is used in second groove 381 of the bottom side of main body 30 formation second circuit board holding part 38.
The order that makes up all moulds is, make up the first submodule tool 40 and the second submodule tool 42 in the Z direction, on directions X, second mould 44 and the 4th mould 48 are combined in the first submodule tool 40 and the second submodule tool 42 again, last and directions X 35 (as the angles among Fig. 4 35) at angle is combined in the 3rd mould 46 in the first submodule tool 40 and the second submodule tool 42, promptly finishes a module.Then, inject solidification liquid (coagulating liquid), as liquid aluminium, in the module that combination is finished, and the pressurization of heating is to form satellite acceptor 3.And the reversed in order of the order of die sinking and composite die is taken out earlier the 3rd mould 46 obliquely, extracts second mould 44 and the 4th mould 48 again on directions X out, extracts the first submodule tool 40 and the second submodule tool 42 out in the Z direction at last.
The integrated satellite acceptor of the present invention does not need to assemble any part again after processing procedure is finished, problem and the minimizing built-up time that therefore can avoid assembly clearance to produce.In addition, integrated satellite acceptor is not worried the problem of rain penetration yet, can improve the service life of product.
The above only is preferred embodiment of the present invention, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to covering scope of the present invention.

Claims (20)

1. the housing of a satellite acceptor comprises:
One main body;
One signal feed-in part is extended from one first side of this main body, and this signal feed-in part comprises a plurality of signal receiving ends;
One first circuit board holding part is arranged at first side of this main body; And
One signal output portion extends from this main body, and this signal output portion comprises a plurality of signal output parts.
2. the housing of satellite acceptor according to claim 1, it is characterized in that, these a plurality of signal receiving ends comprise two circular signal receiving end and the rectangular signal receiving ends with breach, and the outer rim of this rectangular signal receiving end and the breach of these circular signal receiving ends join.
3. the housing of satellite acceptor according to claim 1 is characterized in that, this first circuit board holding part comprises one first groove, is used for holding a first circuit board.
4. the housing of satellite acceptor according to claim 3 is characterized in that, this signal feed-in part comprises a cylinder and an opening member, and the area that the edge-perpendicular of this opening member is projected to this main body separates with first groove of this first circuit board holding part.
5. the housing of satellite acceptor according to claim 1 is characterized in that, more comprises a second circuit board holding part, is formed at one second side of this main body.
6. satellite acceptor housing according to claim 5 is characterized in that, this second circuit board holding part comprises one second groove, in order to hold a second circuit board.
7. satellite acceptor housing according to claim 1 is characterized in that, this main body, this signal feed-in part, this first circuit board holding part and this signal output portion are integrally formed.
8. a method that forms the housing of satellite acceptor according to claim 1 is characterized in that, comprises:
Make up one first set of molds, this first set of molds comprises one first submodule tool and one second submodule tool, in order to the main body that forms this satellite receiver housing, the housing of signal feed-in part, the housing of first circuit board holding part, the housing of signal output portion;
Make up one second mould in this first set of molds, in the housing of this signal feed-in part, to form a plurality of signal receiving ends and in the housing of this first circuit board holding part, to form one first groove;
Make up one the 3rd mould in this first set of molds, in the housing of this signal output portion, to form a plurality of signal output parts;
Make up one the 4th mould in this first set of molds, in the housing of the second circuit board holding part of second side of this main body, to form one second groove;
Inject solidification liquid in this module to form the housing of this satellite acceptor;
After the housing of this satellite acceptor forms, extract the 3rd mould out;
After extracting the 3rd mould out, extract this second mould and the 4th mould simultaneously out; And
After extracting this second mould and the 4th mould out, extract the first submodule tool and the second submodule tool of this first set of molds out.
9. method according to claim 8 is characterized in that, this first set of molds is in addition in order to the housing of the second circuit board holding part that forms this satellite receiver housing.
10. method according to claim 8, it is characterized in that, make up this first set of molds and comprise the first submodule tool and the second submodule tool that makes up this first set of molds with a first direction, and make up this second mould and the 4th mould and comprise with a second direction in this first set of molds and make up this second mould and the 4th mould in this first set of molds perpendicular to this first direction.
11. method according to claim 10 is characterized in that, makes up the 3rd mould and comprises to make up this first set of molds of the 3rd mould with this second direction direction in an acute angle in this first set of molds.
12. method according to claim 11 is characterized in that, extracts the 3rd mould out and comprises to become the direction of this acute angle to extract the 3rd mould out with this second direction.
13. method according to claim 12 is characterized in that, extracts this second mould and the 4th mould simultaneously out and is contained in this second direction and extracts this second mould and the 4th mould simultaneously out.
14. method according to claim 13 is characterized in that, the first submodule tool and the second submodule tool of extracting this first set of molds out are contained in the first submodule tool and the second submodule tool that this first direction is extracted this first set of molds out.
15. method according to claim 8 is characterized in that, injecting solidification liquid is to inject liquid aluminium in this module in this module.
16. the forming method of a satellite acceptor housing comprises:
First mould of the housing of the housing of housing, a signal output portion of the housing that forms a main body, a signal feed-in part, a first circuit board holding part and a second circuit board holding part is provided;
Second mould that is provided in to form a plurality of signal receiving ends in the housing of this signal feed-in part and in the housing of this first circuit board holding part, forms one first groove;
Be provided in to form in the housing of this signal output portion the 3rd mould of a plurality of signal output parts;
Be provided in to form in the housing of second circuit board holding part of bottom side of this main body the 4th mould of one second groove;
Make up this first mould, this second mould, the 3rd mould and the 4th mould to form a module; And
Inject solidification liquid in this module to form a high frequency satellite acceptor.
17. forming method according to claim 16 is characterized in that, providing first mould to comprise provides two-piece type first mould.
18. forming method according to claim 17, it is characterized in that, make up this first mould, this second mould, the 3rd mould and the 4th mould and comprise with a first direction and make up this first mould, and make up this second mould and the 4th mould with a second direction perpendicular to this first direction.
19. forming method according to claim 18 is characterized in that, makes up this first mould, this second mould, the 3rd mould and the 4th mould and comprises to make up the 3rd mould with this second direction direction in an acute angle.
20. forming method according to claim 16 is characterized in that, injecting solidification liquid is to inject liquid aluminium in this module in this module.
CNB2005101381834A 2005-12-31 2005-12-31 Satellite acceptor shell and forming method Active CN100479335C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2005101381834A CN100479335C (en) 2005-12-31 2005-12-31 Satellite acceptor shell and forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005101381834A CN100479335C (en) 2005-12-31 2005-12-31 Satellite acceptor shell and forming method

Publications (2)

Publication Number Publication Date
CN1994822A true CN1994822A (en) 2007-07-11
CN100479335C CN100479335C (en) 2009-04-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101850851A (en) * 2010-05-26 2010-10-06 中国科学院空间科学与应用研究中心 Distribution structure of SPORT (Solar Polar Orbit Radio Telescope) clock scanning satellite
CN104071354A (en) * 2014-05-28 2014-10-01 上海微小卫星工程中心 Satellite casing and satellite using same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101850851A (en) * 2010-05-26 2010-10-06 中国科学院空间科学与应用研究中心 Distribution structure of SPORT (Solar Polar Orbit Radio Telescope) clock scanning satellite
CN101850851B (en) * 2010-05-26 2015-02-04 中国科学院空间科学与应用研究中心 Distribution structure of SPORT (Solar Polar Orbit Radio Telescope) clock scanning satellite
CN104071354A (en) * 2014-05-28 2014-10-01 上海微小卫星工程中心 Satellite casing and satellite using same
CN104071354B (en) * 2014-05-28 2016-07-20 上海微小卫星工程中心 A kind of satellite shell and use the satellite of this housing

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