US20170099744A1 - Method for making multi-part frame - Google Patents
Method for making multi-part frame Download PDFInfo
- Publication number
- US20170099744A1 US20170099744A1 US15/379,720 US201615379720A US2017099744A1 US 20170099744 A1 US20170099744 A1 US 20170099744A1 US 201615379720 A US201615379720 A US 201615379720A US 2017099744 A1 US2017099744 A1 US 2017099744A1
- Authority
- US
- United States
- Prior art keywords
- conductive
- frame
- main body
- frames
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/18—Construction of rack or frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/20—Inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0007—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Definitions
- the subject matter herein generally relates to electrically insulated structures.
- a frame of an electronic device may be utilized by inner circuitry, such as for an antenna of the electronic device.
- inner circuitry such as for an antenna of the electronic device.
- the frame needs to made of segments. Some metal segments are coupled together, and plastic is injected between the metal segments to create the complete frame.
- FIG. 1 is a diagrammatic view of an embodiment of a multi-part frame.
- FIG. 2 is a side view of the frame of FIG. 1 .
- FIG. 3 is a cross-sectional view of the frame of FIG. 1 taken along a line
- FIG. 4 is a cross-sectional view of the frame of FIG. 1 taken along a line IV-IV.
- FIG. 5 is a cross-sectional view of another embodiment of a multi-part frame.
- FIG. 6 is a flow chart of a process for a method for making the multi-part frame.
- Coupled is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections.
- the connection can be such that the objects are permanently connected or releasably connected.
- inside indicates that at least a portion of a region is partially contained within a boundary formed by the object.
- substantially is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder.
- comprising when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
- FIG. 1 illustrates an embodiment of a frame 100 which is configured both to protect the internal electronic components and to function as part of an electronic device.
- the frame 100 can include a first conductive sheet 111 , a second conductive sheet 121 , and a support portion 131 .
- the first conductive sheet 111 and the second conductive sheet 121 can be electrically connected to different places of an inside surface of the frame 100 , and the support portion 131 can extend from the inside surface of the frame 100 .
- the first conductive sheet 111 and the second conductive sheet 121 can be conductive materials and can be coupled to the inside surface of the frame 100 by soldering. In another embodiment, the first conductive sheet 111 and the second conductive sheet 121 can be integrated with the inside surface of the frame 100 .
- the first conductive sheet 111 and the second conductive sheet 121 can be configured as an electrical connection between the frame 100 and inner circuitry of the electronic device.
- the support portion 131 can be configured to support internal electronic components.
- FIG. 2 illustrates that the frame 100 can include a first conductive frame 110 , a second conductive frame 120 , and an insulating frame 130 .
- the first conductive frame 110 and the second conductive frame 120 can be made of conductive materials and be annular structures.
- a predetermined gap can be formed between the first conductive frame 110 and the second conductive frame 120 .
- the insulating frame 130 can be made of insulating materials and be of annular structures.
- the insulating frame 130 can be sandwiched between the first conductive frame 110 and the second conductive frame 120 .
- the insulating frame 130 can be coupled to the first conductive frame 110 and the second conductive frame 120 throughout the entire annular surface to increase contact surface area and enhance the strength of the connection.
- FIG. 3 illustrates that the first conductive frame 110 can include a first main body 112 and a first extending portion 113 extending inward from the first main body 112 .
- the first main body 112 and the first extending portion 113 can form a substantially “L”-shaped semi-closed space to receive the insulating frame 130 .
- the first extending portion 113 can increase the contact area between the insulating frame 130 and the first conductive frame 110 to enhance the structural strength of the insulating frame 130 and the first conductive frame 110 .
- the second conductive frame 120 can include a second main body 122 and a second extending portion 123 extending inwardly from the second main body 122 .
- the second main body 122 and the second extending portion 123 can form a substantially “L”-shaped semi-closed space to receive the insulating frame 130 .
- the second extending portion 123 can increase the contact area between the insulating frame 130 and the second conductive frame 120 to enhance the structural strength of the insulating frame 130 and the second conductive frame 120 . That is, a part of the insulating frame 130 can be sandwiched between the first main body 112 of the first conductive frame 110 and the second main body 122 of the second conductive frame 120 .
- An extended part of the insulating frame 130 can be located between the first extending portion 113 of the first conductive frame 110 and the second extending portion 123 of the second conductive frame 120 .
- the insulating frame 130 can include a support portion 131 extending from an inner surface thereof and a through hole 132 defined on the support portion 131 .
- the support portion 131 can locate and support the internal electronic components, and the through hole 132 can be coupled to a fastener configured to tighten the internal electronic components.
- FIG. 4 illustrates that the first conductive sheet 111 and the second conductive sheet 121 can be substantially “L”-shaped.
- One end of the first conductive sheet 111 and one end of the second conductive sheet 121 can be respectively coupled to different locations of the first main body 112 and the second main body 122 , and the other end of the first conductive sheet 111 and of the second conductive sheet 121 can be extended inside the frame 100 .
- the first conductive sheet 111 and the second conductive sheet 121 can be substantially triangular, or rectangular, or other shapes.
- the insulating frame 130 can extend to partially cover the first conductive sheet 111 and the second conductive sheet 121 .
- the insulating frame 130 can avoid exposure of the first conductive sheet 111 and the second conductive sheet 121 inside the frame 100 and can enhance the structural and connecting strength of the first conductive frame 110 and the second conductive frame 120 .
- FIG. 5 illustrates another embodiment of a frame 200 .
- the frame 200 can include a first conductive frame 210 , a second conductive frame 220 , and a third conductive frame 230 .
- the insulating frame 240 can be arranged between the first conductive frame 210 , the second conductive frame 220 , and the third conductive frame 230 .
- a first conductive sheet 211 , a second conductive sheet 221 , and a third conductive sheet 231 can be electrically connected to different locations of the inside surface of the first conductive frame 210 , the second conductive frame 220 , and the third conductive frame 230 .
- the insulating frame 240 can extend to partially cover the first conductive sheet 211 , the second conductive sheet 221 , and the third conductive sheet 231 .
- the first conductive frame 210 can include a first main body 212 and a first extending portion 213 extended from the first main body 212 .
- the first extending portion 213 can increase the contact area between the insulating frame 240 and the first conductive frame 210 .
- the second conductive frame 220 can include a main body only. In another embodiment, there can be a different or any number of the second conductive frames 220 .
- the third conductive frame 230 can include a third main body 232 and a third extending portion 233 extended from the third main body 232 .
- the third extending portion 233 can increase the contact area between the insulating frame 240 and the third conductive frame 230 .
- the first extending portion 213 and the third extending portion 233 can be arranged to extend along a same direction.
- the insulating frame 240 can be arranged between the first extending portion 213 and the third extending portion 233 .
- the frame 200 can include four or more conductive frames, and an insulating frame can be arranged between any number of conductive frames.
- FIG. 6 illustrates a flowchart in accordance with an example embodiment.
- the example method is provided by way of example, as there are a variety of ways to carry out the method. The method described below can be carried out using the configurations illustrated in FIG. 1 , for example, and various elements of the figure are referenced in explaining the example method.
- Each block shown in FIG. 6 represents one or more processes, methods, or subroutines carried out in the example method. Additionally, the illustrated order of blocks is by example only and the order of the blocks can change.
- the example method can begin at block 101 .
- a plurality of conductive frames can be provided, and each conductive frame can be made with a predetermined shape.
- each conductive frame can include a main body and an extending portion extending from the main body, or just include a simple main body.
- a plurality of conductive sheets can be provided, and each conductive sheet can be coupled to an inside surface of one of the plurality of conductive frames.
- Each of the plurality of conductive sheets can be electrically connected to different conductive frames.
- Conductive sheets can be coupled to different places inside each conductive frame, thus the frame can electrically connected to the inside circuitry.
- each conductive frame can be placed in an injection mold and a predetermined gap can be kept between each two conductive frames.
- the gap between each two conductive frames can be filled with insulating material to form an insulating frame, and the insulating frame can partially cover the conductive sheets.
- the molten insulating material can be filled in the gap to form the insulating frame and the insulating frame can extend to partially cover the conductive sheets.
- the insulating frame can also extend to form a support portion in predetermined places.
- the support portion can be configured to support the internal electronic components.
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
- The present application is a divisional application of U.S. patent application Ser. No. 14/567,629, filed on Dec. 11, 2014, which claims priority to Chinese Application No. 201410565496.7 filed on Oct. 22, 2014, the contents of which are entirely incorporated by reference herein.
- The subject matter herein generally relates to electrically insulated structures.
- A frame of an electronic device may be utilized by inner circuitry, such as for an antenna of the electronic device. In order to make the frame meet different needs of the circuit, the frame needs to made of segments. Some metal segments are coupled together, and plastic is injected between the metal segments to create the complete frame.
- Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
-
FIG. 1 is a diagrammatic view of an embodiment of a multi-part frame. -
FIG. 2 is a side view of the frame ofFIG. 1 . -
FIG. 3 is a cross-sectional view of the frame ofFIG. 1 taken along a line -
FIG. 4 is a cross-sectional view of the frame ofFIG. 1 taken along a line IV-IV. -
FIG. 5 is a cross-sectional view of another embodiment of a multi-part frame. -
FIG. 6 is a flow chart of a process for a method for making the multi-part frame. - It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
- Several definitions that apply throughout this disclosure will now be presented.
- The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “inside” indicates that at least a portion of a region is partially contained within a boundary formed by the object. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
-
FIG. 1 illustrates an embodiment of aframe 100 which is configured both to protect the internal electronic components and to function as part of an electronic device. Theframe 100 can include a firstconductive sheet 111, a secondconductive sheet 121, and asupport portion 131. The firstconductive sheet 111 and the secondconductive sheet 121 can be electrically connected to different places of an inside surface of theframe 100, and thesupport portion 131 can extend from the inside surface of theframe 100. The firstconductive sheet 111 and the secondconductive sheet 121 can be conductive materials and can be coupled to the inside surface of theframe 100 by soldering. In another embodiment, the firstconductive sheet 111 and the secondconductive sheet 121 can be integrated with the inside surface of theframe 100. The firstconductive sheet 111 and the secondconductive sheet 121 can be configured as an electrical connection between theframe 100 and inner circuitry of the electronic device. Thesupport portion 131 can be configured to support internal electronic components. -
FIG. 2 illustrates that theframe 100 can include a firstconductive frame 110, a secondconductive frame 120, and aninsulating frame 130. The firstconductive frame 110 and the secondconductive frame 120 can be made of conductive materials and be annular structures. A predetermined gap can be formed between the firstconductive frame 110 and the secondconductive frame 120. The insulatingframe 130 can be made of insulating materials and be of annular structures. Theinsulating frame 130 can be sandwiched between the firstconductive frame 110 and the secondconductive frame 120. Theinsulating frame 130 can be coupled to the firstconductive frame 110 and the secondconductive frame 120 throughout the entire annular surface to increase contact surface area and enhance the strength of the connection. -
FIG. 3 illustrates that the firstconductive frame 110 can include a firstmain body 112 and a first extendingportion 113 extending inward from the firstmain body 112. The firstmain body 112 and the first extendingportion 113 can form a substantially “L”-shaped semi-closed space to receive theinsulating frame 130. The first extendingportion 113 can increase the contact area between theinsulating frame 130 and the firstconductive frame 110 to enhance the structural strength of theinsulating frame 130 and the firstconductive frame 110. The secondconductive frame 120 can include a secondmain body 122 and a second extendingportion 123 extending inwardly from the secondmain body 122. The secondmain body 122 and the second extendingportion 123 can form a substantially “L”-shaped semi-closed space to receive theinsulating frame 130. The second extendingportion 123 can increase the contact area between theinsulating frame 130 and the secondconductive frame 120 to enhance the structural strength of theinsulating frame 130 and the secondconductive frame 120. That is, a part of the insulatingframe 130 can be sandwiched between the firstmain body 112 of the firstconductive frame 110 and the secondmain body 122 of the secondconductive frame 120. An extended part of theinsulating frame 130 can be located between the first extendingportion 113 of the firstconductive frame 110 and the second extendingportion 123 of the secondconductive frame 120. Theinsulating frame 130 can include asupport portion 131 extending from an inner surface thereof and a throughhole 132 defined on thesupport portion 131. Thesupport portion 131 can locate and support the internal electronic components, and thethrough hole 132 can be coupled to a fastener configured to tighten the internal electronic components. -
FIG. 4 illustrates that the firstconductive sheet 111 and the secondconductive sheet 121 can be substantially “L”-shaped. One end of the firstconductive sheet 111 and one end of the secondconductive sheet 121 can be respectively coupled to different locations of the firstmain body 112 and the secondmain body 122, and the other end of the firstconductive sheet 111 and of the secondconductive sheet 121 can be extended inside theframe 100. In another embodiment, the firstconductive sheet 111 and the secondconductive sheet 121 can be substantially triangular, or rectangular, or other shapes. Theinsulating frame 130 can extend to partially cover the firstconductive sheet 111 and the secondconductive sheet 121. Theinsulating frame 130 can avoid exposure of the firstconductive sheet 111 and the secondconductive sheet 121 inside theframe 100 and can enhance the structural and connecting strength of the firstconductive frame 110 and the secondconductive frame 120. -
FIG. 5 illustrates another embodiment of aframe 200. Theframe 200 can include a firstconductive frame 210, a secondconductive frame 220, and a thirdconductive frame 230. Theinsulating frame 240 can be arranged between the firstconductive frame 210, the secondconductive frame 220, and the thirdconductive frame 230. A firstconductive sheet 211, a secondconductive sheet 221, and a thirdconductive sheet 231 can be electrically connected to different locations of the inside surface of the firstconductive frame 210, the secondconductive frame 220, and the thirdconductive frame 230. Theinsulating frame 240 can extend to partially cover the firstconductive sheet 211, the secondconductive sheet 221, and the thirdconductive sheet 231. The firstconductive frame 210 can include a firstmain body 212 and a first extendingportion 213 extended from the firstmain body 212. The first extendingportion 213 can increase the contact area between the insulatingframe 240 and the firstconductive frame 210. The secondconductive frame 220 can include a main body only. In another embodiment, there can be a different or any number of the second conductive frames 220. The thirdconductive frame 230 can include a thirdmain body 232 and a third extendingportion 233 extended from the thirdmain body 232. The third extendingportion 233 can increase the contact area between the insulatingframe 240 and the thirdconductive frame 230. The first extendingportion 213 and the third extendingportion 233 can be arranged to extend along a same direction. The insulatingframe 240 can be arranged between the first extendingportion 213 and the third extendingportion 233. In another embodiment, theframe 200 can include four or more conductive frames, and an insulating frame can be arranged between any number of conductive frames. -
FIG. 6 illustrates a flowchart in accordance with an example embodiment. The example method is provided by way of example, as there are a variety of ways to carry out the method. The method described below can be carried out using the configurations illustrated inFIG. 1 , for example, and various elements of the figure are referenced in explaining the example method. Each block shown inFIG. 6 represents one or more processes, methods, or subroutines carried out in the example method. Additionally, the illustrated order of blocks is by example only and the order of the blocks can change. The example method can begin atblock 101. - At
block 101, a plurality of conductive frames can be provided, and each conductive frame can be made with a predetermined shape. - The conductive frames can be made, and each conductive frame can include a main body and an extending portion extending from the main body, or just include a simple main body.
- At
block 102, a plurality of conductive sheets can be provided, and each conductive sheet can be coupled to an inside surface of one of the plurality of conductive frames. Each of the plurality of conductive sheets can be electrically connected to different conductive frames. - Conductive sheets can be coupled to different places inside each conductive frame, thus the frame can electrically connected to the inside circuitry.
- At
block 103, each conductive frame can be placed in an injection mold and a predetermined gap can be kept between each two conductive frames. - At
block 104, the gap between each two conductive frames can be filled with insulating material to form an insulating frame, and the insulating frame can partially cover the conductive sheets. - During the forming work, the molten insulating material can be filled in the gap to form the insulating frame and the insulating frame can extend to partially cover the conductive sheets. The insulating frame can also extend to form a support portion in predetermined places. The support portion can be configured to support the internal electronic components.
- The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a method of manufacturing multi-part frame. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the details, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US15/379,720 US20170099744A1 (en) | 2014-10-22 | 2016-12-15 | Method for making multi-part frame |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410565496.7 | 2014-10-22 | ||
CN201410565496.7A CN105592648A (en) | 2014-10-22 | 2014-10-22 | Coupled frame and manufacturing method thereof |
US14/567,629 US9578145B2 (en) | 2014-10-22 | 2014-12-11 | Coupling frame and methods for making the same |
US15/379,720 US20170099744A1 (en) | 2014-10-22 | 2016-12-15 | Method for making multi-part frame |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/567,629 Division US9578145B2 (en) | 2014-10-22 | 2014-12-11 | Coupling frame and methods for making the same |
Publications (1)
Publication Number | Publication Date |
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US20170099744A1 true US20170099744A1 (en) | 2017-04-06 |
Family
ID=55793149
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Application Number | Title | Priority Date | Filing Date |
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US14/567,629 Active 2035-02-11 US9578145B2 (en) | 2014-10-22 | 2014-12-11 | Coupling frame and methods for making the same |
US15/379,720 Abandoned US20170099744A1 (en) | 2014-10-22 | 2016-12-15 | Method for making multi-part frame |
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US14/567,629 Active 2035-02-11 US9578145B2 (en) | 2014-10-22 | 2014-12-11 | Coupling frame and methods for making the same |
Country Status (3)
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US (2) | US9578145B2 (en) |
CN (1) | CN105592648A (en) |
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CN108539371A (en) * | 2018-04-02 | 2018-09-14 | Oppo广东移动通信有限公司 | Processing method, antenna module and the electronic equipment of antenna module |
CN108539374A (en) * | 2018-04-02 | 2018-09-14 | Oppo广东移动通信有限公司 | Housing unit, antenna module, electronic equipment and processing method |
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US10372166B2 (en) * | 2016-07-15 | 2019-08-06 | Apple Inc. | Coupling structures for electronic device housings |
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WO2019158194A1 (en) * | 2018-02-14 | 2019-08-22 | Huawei Technologies Co., Ltd. | Housing structure comprising panel elements for an electronic device |
CN110534898B (en) * | 2019-08-19 | 2021-10-22 | Oppo(重庆)智能科技有限公司 | Shell assembly and electronic equipment |
CN111355829B (en) * | 2019-11-15 | 2021-08-27 | 深圳市裕展精密科技有限公司 | Composite middle frame, manufacturing method thereof and electronic device |
US11838432B2 (en) * | 2019-12-03 | 2023-12-05 | Apple Inc. | Handheld electronic device |
US11784673B2 (en) | 2020-09-16 | 2023-10-10 | Apple Inc. | Electronic device housing having a radio-frequency transmissive component |
US11769940B2 (en) | 2021-09-09 | 2023-09-26 | Apple Inc. | Electronic device housing with integrated antenna |
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- 2014-12-11 US US14/567,629 patent/US9578145B2/en active Active
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CN108539370A (en) * | 2018-04-02 | 2018-09-14 | Oppo广东移动通信有限公司 | Housing unit, antenna module, electronic equipment and processing method |
CN108539371A (en) * | 2018-04-02 | 2018-09-14 | Oppo广东移动通信有限公司 | Processing method, antenna module and the electronic equipment of antenna module |
CN108539374A (en) * | 2018-04-02 | 2018-09-14 | Oppo广东移动通信有限公司 | Housing unit, antenna module, electronic equipment and processing method |
Also Published As
Publication number | Publication date |
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US20160120057A1 (en) | 2016-04-28 |
TWI566662B (en) | 2017-01-11 |
CN105592648A (en) | 2016-05-18 |
US9578145B2 (en) | 2017-02-21 |
TW201616940A (en) | 2016-05-01 |
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