CN1992149A - Chip adhesive apparatus and operation method thereof - Google Patents
Chip adhesive apparatus and operation method thereof Download PDFInfo
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- CN1992149A CN1992149A CNA2005100488425A CN200510048842A CN1992149A CN 1992149 A CN1992149 A CN 1992149A CN A2005100488425 A CNA2005100488425 A CN A2005100488425A CN 200510048842 A CN200510048842 A CN 200510048842A CN 1992149 A CN1992149 A CN 1992149A
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- chip
- adhesive tape
- glue
- release film
- mechanical arm
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Abstract
A chip bonding equipment, the equipment includes belt transmission device and bonding device. Among them, the belt transmission device includes tape-reel belt and the first roll tape, while tape-reel belt comprises multiple reel layers and the first separated film, and the two surfaces of the reel layers are all adhesive, and the first separated film covers one surface of these reel layers, and the first roll tape is used to wind the first separated film to drive the tape-reel belt rotating. In addition, the bonding device is installed in the front-end of the belt transmission device, and the bonding device includes at least one mechanical arm and one controller, in which the controller can control the mechanical arm arbitrary rotating and moving.
Description
Technical field
The present invention relates to a kind of semiconductor equipment and method of operation thereof, particularly relate to a kind of chip adhesive apparatus and method of operation thereof.
Background technology
In semiconductor industry, (Integrated Circuits, production IC) mainly are divided into three phases to integrated circuit: the encapsulation (Package) of the manufacturing of wafer (wafer), the making of integrated circuit and integrated circuit etc.Wherein, chip is made via wafer fabrication, circuit design, photomask and step such as cut crystal and finishing, and each cuts formed chip by wafer and need be pasted to glass substrate or other substrate usually, to carry out other follow-up technology.
Existing chip is pasted to the mode that technology on the glass substrate normally adopts a glue, on chip back point, after the colloid, again chip back is contacted with glass baseplate surface, and, make chip and glass substrate close adhesion via the program that is heating and curing.Yet, carrying out bonding program in a glue mode, regular meeting has the colloid crawling even or produce the problem of bubble, the phenomenon that it will cause follow-up chip to peel off easily, and can influence the reliability of technology.
Therefore, the someone proposes to replace traditional some glue mode with double faced adhesive tape, to solve the above problems.Figure 1A to 1D illustrate is the flow chart of existing a kind of chip adhesive.Please refer to Figure 1A, remove with the last release film 102 of manual mode earlier three layers of double faced adhesive tape 100 of monolithic.Then, please refer to Figure 1B, the last bonding plane and glass substrate 104 surfaces of double faced adhesive tape 100 are bonding.Then, please refer to Fig. 1 C, remove with the following release film 106 of manual mode again double faced adhesive tape 100.Subsequently, please refer to Fig. 1 D, with manual mode that chip 108 is bonding with the following bonding plane of double faced adhesive tape 100, so make to finish the bonding program of chip and glass substrate through heavy step.
From the above, existing chip adhesive technology is the step of a succession of very complicated, and so the practice is not only considerably consuming time, and more need spend great amount of manpower and can carry out.In addition, because required step is more, and comparatively expends time in, thereby make speed of production lower, productivity ratio can't promote.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of chip adhesive apparatus exactly, can carry out the chip adhesive technology of automation, with saving technology required time and manpower, and can improve speed of production and productive rate.
Another object of the present invention provides a kind of method of operation of chip adhesive apparatus, can avoid a colloid crawling that the glue mode is caused to spare or produce the problem of bubble, and the chip adhesive technology that can carry out automation, to save technology required time and manpower.
The present invention proposes a kind of chip adhesive apparatus, and this equipment comprises adhesive tape conveyer and bonder.Wherein, the adhesive tape conveyer comprises the roll type adhesive tape and first scroll bar, and the roll type adhesive tape is made up of a plurality of glue-lines and first release film, two surfaces of these glue-lines all have viscosity, and first release film coats a surface wherein of these glue-lines, first scroll bar is in order to first release film of reeling, to drive the rotation of roll type adhesive tape.In addition, bonder is to be disposed at adhesive tape conveyer front end, and bonder comprises an at least one mechanical arm and a controller, and its middle controller may command mechanical arm is rotation and mobile arbitrarily.
Described according to embodiments of the invention, above-mentioned adhesive tape conveyer also includes one first roller set, and it is with so that first release film advances to first scroll bar.
Described according to embodiments of the invention, above-mentioned roll type adhesive tape also includes one second release film, it coats another surface of glue-line, and the adhesive tape conveyer also includes one second scroll bar, it is disposed at first scroll bar top, and in order to second release film of reeling, to drive the rotation of roll type adhesive tape.In one embodiment, the adhesive tape conveyer more can include one second roller set, and it is with so that second release film advances to second scroll bar.
Described according to embodiments of the invention, above-mentioned roll type adhesive tape for example is a high temperature resistant roll type adhesive tape.
The present invention proposes a kind of method of operation of chip adhesive apparatus in addition, this method of operation is to rotate first scroll bar earlier, with first release film of reel spool formula adhesive tape, to drive the rotation of roll type adhesive tape, a plurality of glue-lines of roll type adhesive tape are transmitted on first release film toward the bonder direction.Then, at least one mechanical arm of mobile bonder is with the action of carrying out a plurality of chips and a plurality of substrate are transferred with the bonding circulation of these glue-lines.
Described according to embodiments of the invention, the above-mentioned action that a plurality of chips and a plurality of substrate are transferred with the bonding circulation of these glue-lines comprises that (a) utilizes mechanical arm to take out a chip, and makes chip and a glue-line bonding.(b) mechanically moving arm to substrate top, and will be stained with the chip and the base plate bonding of glue-line.(c) mechanical arm and chip are separated.(d) repeat step (a)～(c).
Described according to embodiments of the invention, the above-mentioned action that a plurality of chips and a plurality of substrate are transferred with the bonding circulation of these glue-lines, comprise that (a) utilizes first mechanical arm to take out a chip, and make chip and a glue-line bonding, and first mechanical arm and chip are separated.(b) utilize second mechanical arm to pick up chip.(c) move second mechanical arm to substrate top, and will be stained with the chip and the base plate bonding of glue-line.(d) second mechanical arm and chip are separated.(e) repeat step (a)～(d).
Described according to embodiments of the invention, on be set forth in and also comprise when rotating first scroll bar and rotate a roller set so that first release film advances to first scroll bar.
Described according to embodiments of the invention, the method for the mechanical arm of above-mentioned mobile bonder is to utilize the controller of bonder to control.
Described according to embodiments of the invention, on be set forth in and also comprise when rotating first scroll bar and rotate second scroll bar, with second release film of reel spool formula adhesive tape, and drive the rotation of roll type adhesive tape.In one embodiment, when rotating second scroll bar, also comprise and rotate second roller set, so that second release film advances to second scroll bar.
Described according to embodiments of the invention, above-mentioned roll type adhesive tape for example is a high temperature resistant roll type adhesive tape.
Chip adhesive apparatus of the present invention utilizes the adhesive tape conveyer to carry out the automatic dyestripping technology of adhesive tape, and utilize bonder to carry out the automatic adhesion technique of chip and substrate, to finish the entire chip adhesion technique, can reach the chip adhesive technology of automation thus, save required time and the manpower of technology.And, since the present invention be utilize the two-sided glue-line that all has viscosity with chip adhesive on substrate, the colloid crawling that therefore can avoid existing some glue mode to produce is even or produce the problem of bubble.
For above and other objects of the present invention, feature and advantage can be become apparent, following conjunction with figs. and preferred embodiment are to illustrate in greater detail the present invention.
Description of drawings
Figure 1A to 1D illustrate is the flow chart of existing a kind of chip adhesive.
Fig. 2 is the configuration schematic diagram according to the chip adhesive apparatus that the embodiment of the invention illustrated.
Fig. 3 is the schematic diagram according to the method for operation of the chip adhesive apparatus that one embodiment of the invention illustrated.
Fig. 4 is the schematic diagram according to the method for operation of the chip adhesive apparatus that another embodiment of the present invention illustrated.
The simple symbol explanation
100: double faced adhesive tape
102: go up release film
104: glass substrate
106: following release film
108: chip
200: chip adhesive apparatus
202: the adhesive tape conveyer
204: bonder
206: the roll type adhesive tape
208,226: scroll bar
210: glue-line
212,224: release film
214: arrow
216,217: mechanical arm
218: controller
220,228: roller set
222,230: roller
232: chip
234,236,238,244,246,248,250,252: label
240: substrate
242: workbench
Embodiment
Fig. 2 is the configuration schematic diagram according to the chip adhesive apparatus that the embodiment of the invention illustrated.Please refer to Fig. 2, chip adhesive apparatus 200 of the present invention mainly comprises adhesive tape conveyer 202 and bonder 204.
Wherein, adhesive tape conveyer 202 comprises roll type adhesive tape 206 and scroll bar 208.This roll type adhesive tape 206 for example is a high temperature resistant roll type adhesive tape, and it is high temperature resistant to be about 100 ℃.Roll type adhesive tape 206 is made up of with release film 212 a plurality of glue-lines 210, and two surfaces of these glue-lines 210 all have viscosity, and release film 212 coats one of them surface of these glue-lines 210, and release film 212 also can be considered the conveyer belt that transmits glue-line 210.Scroll bar 208 is to be used for reeling release film 212, and and then drive 206 rotations of roll type adhesive tape, it can make the glue-line 210 of roll type adhesive tape 206 transmit toward bonder 204 directions (as arrow 214 directions) on release film 212.
In addition, bonder 204 is to be disposed at adhesive tape conveyer 202 front ends, bonder 204 comprises at least one mechanical arm 216 and controller 218, its middle controller 218 may command mechanical arms 216 rotation and mobile arbitrarily, and the effect of mechanical arm 216 is in order to gripping or absorption chip (or substrate), so that it can carry out bonding with glue-line 210.In Fig. 2, bonder 204 only illustrates a mechanical arm 216, but it also can have two mechanical arms or the mechanical arm more than two, and the present invention does not do any qualification to the quantity of mechanical arm 216, and its visual actual conditions adjust.
In one embodiment, adhesive tape conveyer 202 of the present invention also can comprise a roller set 220, and it is with so that release film 212 advances to scroll bar 208.Among Fig. 2, roller set 220 illustrates four rolling 222 and does explanation, and the certain the present invention not quantity of the roller 222 of pair roller group 220 does any qualification, and its visual actual conditions adjust.
In another embodiment, roll type adhesive tape 206 also can comprise release film 224, and it coats another surface of glue-line 210.And adhesive tape conveyer 202 also can comprise scroll bar 226, and it is disposed at scroll bar 208 tops, and scroll bar 226 is in order to coiling release film 224, to help to drive 206 rotations of roll type adhesive tape.In another embodiment, also can comprise another roller set 228, it is with so that release film 224 advances to scroll bar 226.Among Fig. 2, roller set 228 illustrates two rollers 230 and does explanation, and the certain the present invention not quantity of the roller 222 of pair roller group 228 does any qualification, and its visual actual conditions adjust.
From the above, chip adhesive apparatus 200 of the present invention utilizes adhesive tape conveyer 202 to carry out the automatic dyestripping technology of adhesive tape, and utilizes bonder 204 to carry out the automatic adhesion technique of chip and substrate, to finish the entire chip adhesion technique.Therefore, can reach the chip adhesive technology of automation, to save required time and the manpower of technology.And, because the present invention utilize the two-sided glue-line that all has viscosity with chip adhesive on substrate, so the colloid crawling that can avoid existing some glue mode to produce is even or produce the problem of bubble.
Next, the method for operation of chip adhesive apparatus of the present invention is described, it describes how to carry out chip adhesive technology in detail with chip adhesive apparatus 200 of the present invention.
Please referring again to Fig. 2, the method for operation of chip adhesive apparatus of the present invention is, rotates scroll bar 208 earlier, and it for example is to be rotated clockwise.But rotate the release film 212 of scroll bar 208 reel spool formula adhesive tapes 206, be rotated to drive roll type adhesive tape 206, it for example is to be rotated with counterclockwise, and this release film 212 can have the function of similar conveyer belt, so that a plurality of glue-lines 210 of roll type adhesive tape 206 transmit toward bonder 204 directions on release film 212.
In one embodiment, when rotating scroll bar 208, also can utilize rotation roller group 220, so that release film 212 advances to scroll bar 208.Roller set 220 is except the release film 212 that can help reel spool formula adhesive tape 206, and it also can be according to quantity and arrangement position difference, to design the required transport path of actual conditions.
In another embodiment, roll type adhesive tape 206 includes another layer release film 224.The method of operation of chip adhesive apparatus of the present invention also can be utilized scroll bar 226, be rotated to help driving roll type adhesive tape 206, its method is when rotating scroll bar 208, rotate the release film 224 of scroll bar 226 with reel spool formula adhesive tape 206, to drive 206 rotations of roll type adhesive tape, scroll bar 226 for example is to be rotated clockwise.In addition, in another embodiment, also can be when rotating scroll bar 226, rotation roller group 228 is so that release film 224 advances to scroll bar 226.
Above-mentioned, the automatic dyestripping technology of the adhesive tape in the detailed description chip adhesive technology.In addition, the method of operation of chip adhesive apparatus of the present invention, when transmitting in a plurality of glue-lines 210 that make roll type adhesive tape 206 toward bonder 204 directions, also need the mechanical arm 216 of mobile bonder 204, carry out action that chip and substrate are transferred with glue-line 210 bonding circulations, to finish the automatic adhesion technique of chip and substrate, so just can reach the chip adhesive technology of automation.Above-mentioned, the method for the mechanical arm 216 of mobile bonder 204 utilizes the controller 218 of bonder 204 to control.
Please refer to Fig. 3, it is the schematic diagram according to the method for operation of the chip adhesive apparatus that one embodiment of the invention illustrated.Carry out the action that chip and substrate are transferred with the bonding circulation of glue-line for example be, utilize mechanical arm 216 earlier, in the mode of absorption or gripping, take out a chip 232 (as label 234).Then, control mechanical arm 216 moves down, and makes glue-line 210 stick to chip 232 surfaces (as label 236).Then, mechanically moving arm 216 is to substrate 240 tops (as label 238) again, and substrate 240 is positioned on the workbench 242.Afterwards, control mechanical arm 216 moves down, and chip 232 and glue-line 210 are adhered on the substrate 240, decontrols chip 232 (as label 244) subsequently.Above-mentioned be with chip and substrate with a bonding do action of glue-line, and its speed that can cooperate speed that adhesive tape advances and mechanical arm to transfer is with the chip adhesive technology that continues.
In addition, please refer to Fig. 4, it is the schematic diagram according to the method for operation of the chip adhesive apparatus that another embodiment of the present invention illustrated.Carry out the action that chip and substrate are transferred with the bonding circulation of glue-line for example be, utilize mechanical arm 216 earlier, in the mode of absorption or gripping, take out a chip 232 (as label 246).Then, control mechanical arm 216 moves down, and makes chip 232 stick to glue-line 210 surfaces, then, decontrols chip, and control mechanical arm 216 up moves, and carries out the action of adhesive die attachment on the glue-line surface continuing.Continue it, chip 232 is sticked to glue-line 210 surfaces after, control another mechanical arm 217 again and move down (as label 248), with absorption or gripping chip 232.Subsequently, mechanically moving arm 217 is to substrate 240 tops (as label 250) again, and substrate 240 is positioned on the workbench 242.Afterwards, control mechanical arm 217 moves down, and chip 232 and glue-line 210 are adhered on the substrate 240, decontrols chip 232 (as label 252) subsequently.Above-mentioned be with chip and substrate with a bonding do action of glue-line, and its speed and two speed that mechanical arm is transferred that can cooperate adhesive tape to advance are with the chip adhesive technology that continues.
Above-mentioned, has a mechanical arm with chip adhesive apparatus 200 of the present invention respectively and two mechanical arms illustrate, and chip adhesive apparatus 200 of the present invention has the operational circumstances of the mechanical arm more than two, then repeat no more, those skilled in the art can comply with for embodiment and can finish easily.
In sum, the present invention has following advantage at least:
1. the present invention carries out chip adhesive technology with the chip adhesive apparatus of automation, can save technology required time and manpower, and can improve speed of production and productive rate.
The present invention be utilize the two-sided glue-line that all has viscosity with chip adhesive on substrate, the colloid crawling that therefore can avoid existing some glue mode to produce is even or produce the problem of bubble.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.
Claims (13)
1, a kind of chip adhesive apparatus comprises:
The adhesive tape conveyer, this adhesive tape conveyer comprises:
The roll type adhesive tape, this roll type adhesive tape comprises a plurality of glue-lines and first release film, wherein two surfaces of those glue-lines all have viscosity, and this first release film coats the surface wherein of each those glue-line; And
First scroll bar in order to this first release film of reeling, and drives this roll type adhesive tape rotation; And
Bonder is disposed at this adhesive tape conveyer front end, and this bonder comprises at least one mechanical arm and controller, wherein this this mechanical arm of controller may command rotation and mobile arbitrarily.
2, chip adhesive apparatus as claimed in claim 1, wherein this adhesive tape conveyer also comprises first roller set, with so that this first release film advances to this first scroll bar.
3, chip adhesive apparatus as claimed in claim 1, wherein this roll type adhesive tape also comprises second release film, this second release film coats another surface of each those glue-line, and this adhesive tape conveyer also comprises second scroll bar, be disposed at this first scroll bar top, in order to this second release film of reeling, and drive this roll type adhesive tape rotation.
4, chip adhesive apparatus as claimed in claim 3, wherein this adhesive tape conveyer also comprises second roller set, with so that this second release film advances to this second scroll bar.
5, chip adhesive apparatus as claimed in claim 1, wherein this roll type adhesive tape comprises high temperature resistant roll type adhesive tape.
6, a kind of method of operation of chip adhesive apparatus comprises:
Rotate first scroll bar,, and drive this roll type adhesive tape rotation, a plurality of glue-lines of this roll type adhesive tape are transmitted toward a bonder direction on this first release film with first release film of reel spool formula adhesive tape; And
Move at least one mechanical arm of this bonder, to carry out with a plurality of chips and of the action of a plurality of substrate with the bonding circulation handover of each those glue-line.
7, the method for operation of chip adhesive apparatus as claimed in claim 6, the wherein action that those chips and those substrates are transferred with the bonding circulation of each those glue-line comprises:
(a) utilize mechanical arm to take out a slice chip, and make this chip and a glue-line bonding;
(b) move this mechanical arm to the substrate top, and will be stained with this chip and this base plate bonding of this glue-line;
(c) this mechanical arm and this chip are separated; And
(d) repeat step (a)～(c).
8, the method for operation of chip adhesive apparatus as claimed in claim 6, the wherein action that those chips and those substrates are transferred with the bonding circulation of each those glue-line comprises:
(a) utilize first mechanical arm to take out a slice chip, and make this chip and a glue-line bonding, and this first mechanical arm and this chip are separated;
(b) utilize second mechanical arm to pick up this chip;
(c) move this second mechanical arm to the substrate top, and will be stained with this chip and this base plate bonding of this glue-line;
(d) this second mechanical arm and this chip are separated; And
(e) repeat step (a)～(d).
9, the method for operation of chip adhesive apparatus as claimed in claim 6 wherein also comprises when rotating this first scroll bar and rotates first roller set, so that this first release film advances to this first scroll bar.
10, the method for operation of chip adhesive apparatus as claimed in claim 6, the method that wherein moves this mechanical arm of this bonder is to utilize a controller of this bonder to control.
11, the method for operation of chip adhesive apparatus as claimed in claim 6 wherein also comprises when rotating this first scroll bar and rotates second scroll bar, with second release film of this roll type adhesive tape of reeling, and drives this roll type adhesive tape rotation.
12, the method for operation of chip adhesive apparatus as claimed in claim 11 wherein also comprises when rotating this second scroll bar and rotates second roller set, so that this second release film advances to this second scroll bar.
13, the method for operation of chip adhesive apparatus as claimed in claim 6, wherein this roll type adhesive tape comprises high temperature resistant roll type adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100488425A CN1992149A (en) | 2005-12-31 | 2005-12-31 | Chip adhesive apparatus and operation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100488425A CN1992149A (en) | 2005-12-31 | 2005-12-31 | Chip adhesive apparatus and operation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1992149A true CN1992149A (en) | 2007-07-04 |
Family
ID=38214309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100488425A Pending CN1992149A (en) | 2005-12-31 | 2005-12-31 | Chip adhesive apparatus and operation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1992149A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107403755A (en) * | 2016-05-19 | 2017-11-28 | 胡川 | Chip manufacture method |
| TWI772834B (en) * | 2019-09-17 | 2022-08-01 | 日商鎧俠股份有限公司 | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
-
2005
- 2005-12-31 CN CNA2005100488425A patent/CN1992149A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107403755A (en) * | 2016-05-19 | 2017-11-28 | 胡川 | Chip manufacture method |
| TWI772834B (en) * | 2019-09-17 | 2022-08-01 | 日商鎧俠股份有限公司 | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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