CN1985366A - 电子器件或功能器件的制造方法 - Google Patents

电子器件或功能器件的制造方法 Download PDF

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CN1985366A
CN1985366A CNA2005800221323A CN200580022132A CN1985366A CN 1985366 A CN1985366 A CN 1985366A CN A2005800221323 A CNA2005800221323 A CN A2005800221323A CN 200580022132 A CN200580022132 A CN 200580022132A CN 1985366 A CN1985366 A CN 1985366A
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保罗·雷蒙德·特鲁里
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Xaar Technology Ltd
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Abstract

本发明提供了一种电子器件或功能器件的制造方法。利用喷墨打印技术在挠性基板上形成塑料或其它电子器件。为了避免由于所述基板变形而引起配准困难，在其上施加有分离层的刚性基板上进行沉积。在施加作为永久、挠性基板的一类层后，从所述临时刚性基板分离所述结构。

Description

电子器件或功能器件的制造方法
技术领域
本发明涉及电子器件或功能器件的制造。
背景技术
通常的要求是将这样的器件形成在挠性基板上，这些基板有时呈在功能上类似于“传统”印制电路板的挠性印制电路板的形式，而有时呈其中支承电子器件为基板辅助功能的形式。这一形式基板的示例为塑料信用卡和“纸式的”单据、票证和其它文件。
已经提出在电子器件的形成中使用从喷墨打印领域借用的技术来沉积材料区域。该沉积的材料在性质上可以是金属的，并用于形成导体迹线。可沉积电介质材料。还已经提出利用例如聚合体导体和半导体从沉积材料形成整个器件。在这一布置中，沉积材料可以是电介质、半导体、搀杂物、导体或蚀刻剂或溶剂，从而在先前的材料沉积区域中形成一孔。在这方面，参照WO 2001/46987，其详细描述了用于在塑料或其它基板上形成塑料电子器件的类似于喷墨打印的技术。
在使用喷墨打印技术从而在挠性基板上形成电子器件中遇到的困难是沉积液体与基板的相互作用导致基板方位改变，这又导致难以与随后的沉积区域对准。在一个示例中，沉积流体可能使基板膨胀。然而，这仅仅是一个示例，由于多种热、湿、化学和机械效应而会引起难以与挠性基板对准。
这些困难会导致在维持随后制造过程的对准和配准时增加成本和难度，更不用说基板方位的变化了。可选或附加的是，这些困难会限制所能采用的基板材料的性质、基板的厚度或固有挠性以及可用的沉积处理。
发明内容
本发明的目的在于提供一种在挠性基板上制造电子器件的新方法，该新方法避免或改进了上述困难中的一些困难或所有困难。
因此，在一个方面中，本发明在于在挠性基板上具有多个电子器件或功能器件的电子设备或功能设备，包括以下步骤：提供具有沉积表面的刚性基板；在所述沉积表面上形成分离层；在所述分离层上沉积多个材料区域，以形成器件阵列；从所述沉积表面分离所述器件阵列；将挠性基板结合到所述阵列上，优选的是，其中所述多个材料区域中的至少一些材料区域沉积为液滴。
有利的是，在将挠性基板结合到所述阵列上的步骤之后进行从所述沉积表面分离所述电子器件阵列的步骤。
在另一方面中，本发明在于在塑料基板上具有多个电子器件或功能器件的电子设备或功能设备，包括以下步骤：提供具有沉积表面的刚性基板；沉积液滴以至少部分地形成器件阵列；将塑料基板结合到所述阵列上，和在将所述塑料基板结合到所述阵列上之后，从所述沉积表面分离所述阵列。
合适的是，所述器件基本由聚合材料形成。
有利的是，结合基板的所述步骤包括施加呈流体形式的基板材料并使所述流体固化从而形成基板的步骤。
优选的是，所述挠性或塑料基板被开孔，从而允许存取所述电子器件。
本发明的方面提供特别而不排他地用于通过喷墨进行材料沉积的处理顺序，该处理顺序使基板稳定性问题最小。
在本发明的一些形式中，选择可重复使用的稳定基板，所述基板可由玻璃、陶瓷或金属材料制成。在一侧上施加有分离层。该分离层可以是分离剂或者是可随后通过诸如蚀刻、加热、剥离(机械的)或其它材料去除工艺去除的材料。可通过湿镀、旋转(spinning)、喷墨沉积或其它工艺来施加所述分离层。因为所述分离层被施加到所述基板的整个沉积表面上，因此能采用而且应该采用低成本的工艺。然后在所述分离层的顶部上沉积形成塑料电子器件的液体材料区域。因为所述基板是刚性的，所以可容易地形成多个这样的层，而无需复杂的测量和对准系统。一旦完成，则可从所述基板分离所述沉积结构，以用于随后施加到挠性基板上。可选的是，并且尤其是在所述多个沉积层易损的情况下，可在从所述刚性基板分离所述结构之前，将挠性基板层附着到所述结构的与所述刚性基板相对的一侧上。
可以通过流体喷射、棒涂布(bar coating)、旋转或其它合适的技术来施加所述基板层。
另一实施例是这样的一个实施例，其中，作为第一步骤通过喷墨沉积、喷射或其它方法将所述挠性基板附着到所述刚性基板上，优选的是具有某一形式的分离层。有利的是，该挠性基板没有缺陷和污染(在其制造后由于处理和存储操作而易于产生缺陷和污染)。这容易产生效率较高的生产过程。然后在该“纯净”挠性基板的顶部上以多层方式沉积喷墨材料，以形成所述电子器件或功能器件。可选的是，可在分离之前将另一挠性层添加到所述结构上。
传统上认为用于电子器件或功能器件的基板为电介质，而这正好是一优选实施例。然而，某些器件要求外层是导电的(例如，可能是为了EMC的目的而形成屏蔽层，或者甚至是提供例如吸热设备的装置)，从而所述挠性基板可以是金属的并通过电镀方法或非电镀方法、真空方法、喷墨沉积或其它方法进行沉积。
附图说明
现在将参照附图以示例的方式更加详细地描述本发明，在附图中：
图1和图2为表示在根据本发明的方法中的步骤的剖视图。
图3为表示修改例的类似剖视图。
具体实施方式
参照附图，基板10采用刚性材料。该基板可由玻璃、陶瓷或金属材料形成，并且可设置成可重复使用。该基板是刚性且稳定的，并且在许多应用中都是扁平的。然而，可设想其中采用柱形基板从而能进行连续制造过程而不是成批模式的制造过程的布置。
分离层12施加到基板的沉积表面上。该分离层可采取通过各种技术(例如，湿镀、旋转或喷墨沉积)沉积的材料的形式，以形成保持基板10的稳定性，但是可在随后的蚀刻、加热或其它去除工艺中被去除的层。该分离层可采取公知的分离剂的形式。该分离层还可采取在所述基板上提供沉积表面的表面处理的形式，该沉积表面提供沉积材料的临时粘合，该临时粘合足以维持基板的稳定性，但仍然允许随后分离沉积结构。
如大致在附图标记14处所示，以多层形式沉积了多个材料区域，以形成电子器件。所述器件的确切性质以及这些材料区域形成的方式并非本发明的本质特征，本领域内技术人员将可利用对于其可用的各种布置和技术。例如参见WO 2001/46987。
现在转到图2，一旦完成多个层14，则沉积永久载体基板16。该载体基板16可采取结合到多层14的上表面上的固体基板层的形式。优选的是，通过沉积随后固化或凝聚以形成挠性基板的流体(其可以是气体、微粒或液体)来形成该永久载体基板。该载体基板可例如通过喷射、棒涂布或旋转技术形成。
现在转到图3，可以看到，可将诸如在附图标记18处示意性示出的另外部件结合到已经从临时基板分离的多层结构14的表面上。此外，可在永久基板中形成诸如附图标记20的孔隙，以允许诸如在附图标记22处示意性示出的部件连接到多层结构14的相对表面上。
应理解，已经通过示例的方式描述了本发明，并且在不脱离所附权利要求中所阐明的本发明范围的情况下可以进行多种修改。这样，已经采取可包括半导体器件或其它开关器件的电子器件、诸如显示元件或光传感器的光电器件、以及各种电子变换器作为所述示例。本发明更广泛地应用于形成并非一定是电子的功能器件，并包括能够由优选通过喷墨打印技术沉积多个材料区域而形成的磁、光学、化学和机械器件。

Claims (8)

1、在挠性基板上具有多个电子器件或功能器件的电子设备或功能设备的制造方法，该方法包括以下步骤：提供具有沉积表面的刚性基板；在所述沉积表面上形成分离层；在所述分离层上沉积多个材料区域，以形成器件阵列；从所述沉积表面分离所述器件阵列；和将挠性基板结合到所述阵列上。
2、根据权利要求1所述的方法，其中，所述多个材料区域中的至少一些材料区域沉积为液滴。
3、根据权利要求1或2所述的方法，其中，在将挠性基板结合到所述阵列上的所述步骤之后，进行从所述沉积表面分离所述器件阵列的所述步骤。
4、根据权利要求1或2所述的方法，其中，在所述沉积表面上形成分离层的所述步骤之后，立即进行结合挠性基板的所述步骤。
5、在塑料基板上具有多个电子器件或功能器件的电子设备或功能设备的制造方法，该方法包括以下步骤：提供具有沉积表面的刚性基板；沉积液滴以至少部分地形成器件阵列；将塑料基板结合到所述阵列上，和在将所述塑料基板结合到所述阵列上之后，从所述沉积表面分离所述阵列。
6、根据上述权利要求中任一项所述的方法，其中，所述器件基本上由聚合材料形成。
7、根据上述权利要求中任一项所述的方法，其中，结合基板的所述步骤包括施加呈流体形式的基板材料并使所述流体固化从而形成基板的步骤。
8、根据上述权利要求中任一项所述的方法，其中，所述挠性或塑料基板被开孔以允许存取所述器件。
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* Cited by examiner, † Cited by third party
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CN103531442A (zh) * 2013-10-25 2014-01-22 京东方科技集团股份有限公司 柔性基板制备方法
CN107672334A (zh) * 2013-12-12 2018-02-09 科迪华公司 制造电子设备的方法
US10784470B2 (en) 2012-12-27 2020-09-22 Kateeva, Inc. Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584039A (en) * 1984-12-26 1986-04-22 Hughes Aircraft Co. Fine line flexible cable fabrication process
US5108819A (en) * 1990-02-14 1992-04-28 Eli Lilly And Company Thin film electrical component
EP0801423B1 (en) * 1996-04-08 2008-09-17 Raytheon Company Hdmi decal and fine line flexible interconnect forming methods
US7427526B2 (en) * 1999-12-20 2008-09-23 The Penn State Research Foundation Deposited thin films and their use in separation and sacrificial layer applications
CN100375310C (zh) * 1999-12-21 2008-03-12 造型逻辑有限公司 喷墨制作的集成电路
DE10122324A1 (de) * 2001-05-08 2002-11-14 Philips Corp Intellectual Pty Flexible integrierte monolithische Schaltung
WO2003060986A2 (en) * 2002-01-11 2003-07-24 The Pennsylvania State University Method of forming a removable support with a sacrificial layers and of transferring devices

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US11489146B2 (en) 2012-12-27 2022-11-01 Kateeva, Inc. Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
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US10522425B2 (en) 2013-12-12 2019-12-31 Kateeva, Inc. Fabrication of thin-film encapsulation layer for light emitting device
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CN107672334A (zh) * 2013-12-12 2018-02-09 科迪华公司 制造电子设备的方法

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