CN1979079A - Heat-pipe radiator structure and mfg. method - Google Patents
Heat-pipe radiator structure and mfg. method Download PDFInfo
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- CN1979079A CN1979079A CN 200510134531 CN200510134531A CN1979079A CN 1979079 A CN1979079 A CN 1979079A CN 200510134531 CN200510134531 CN 200510134531 CN 200510134531 A CN200510134531 A CN 200510134531A CN 1979079 A CN1979079 A CN 1979079A
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- heat
- pipe
- loam cake
- radiator
- base
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Abstract
The invention relates to heat pipe radiator and the manufacture method. It includes heat guiding base, plural heat pipe and radiator. The base includes bottom and upper cover. Several flutings are set on base. And plural heat pipes have heat absorbing end and condensing end. Plural through holes are formed in pressing section. And the radiator connects with condensing end of heat pipe in series to from radiator structure.
Description
Technical field
The present invention relates to a kind of heat spreader structures and manufacture method thereof, relate in particular to a kind of in order to heat-pipe radiator structure and manufacture method thereof to the electronic building brick heat radiation.
Background technology
The operation of any electrical equipment all can be difficult to produce too much heat because of efficient or friction problem with avoiding.Particularly, more and more trend is accurate in scientific and technological now industrial products development, and as integrated circuit, personal electric product, except the volume miniaturization, the generation of its heat also is tending towards increasing more.Especially in computer, because the continuous lifting of its operation efficiency, make the whole caloric value of computer also increase thereupon, and, the main heating source of computer no longer is confined to CPU, puts such as the contour quick-mounting of chip module, GPU, Dram and hard disk and also produces appreciable heat simultaneously.Therefore, can in the operating temperature range of allowing, normally move, must reduce the harmful effect of heat by extra heat abstractor for the computer module operation for making computer.
Under the trend of pursuing volume miniaturization and slim and gracefulization, the most normal adopted heat abstractor is the radiator with heat pipe structure.This radiator is made by the material with high thermal conductivity coefficient, the set working fluid and the operation of capillary structure in via heat pipe, make this radiator have the characteristic of high hot conductance, and it structurally has lightweight advantage, can reduce the problem of noise, weight, cost and the system complexity of heat abstractor generation, can transmit heat in a large number and need not to consume electric power, make radiator become a kind of radiating subassembly that generally uses with heat pipe structure.Yet, the structure of known heat-pipe radiator of past all is that heat-conducting block is attached on the electronic building brick of heating, by heat-conducting block heat is conducted to heat pipe, working fluid in the heat pipe absorbs heat, rise and conduct to radiator again in the vaporization back, afterwards, working fluid converts to aqueous again, get back to contact jaw with heat by capillary structure, thereby finish conduction of heat.But because of must after an end absorbs heat, conduct to heat pipe again by heat-conducting block on the conduction of heat in advance, make conducting path long, cause heat-transfer rate to be affected, cause the heat pipe for thermal conductivity effect desirable not as expection.
Prior art discloses a kind of heat-pipe radiator and manufacture method, and this heat-pipe radiator structure mainly comprises radiator, heat pipe and heat-conducting block.Radiator is formed by the mutual stacked combination of a plurality of fin, offer perforation on each fin, heat pipe has heating end and condensation end, and the condensation end of heat pipe is serially connected with in the perforation of each fin, and offer a plurality of grooves on the heat-conducting block, be used for the heating end of ccontaining heat pipe.Before the heating end of heat pipe is positioned over groove, must go ahead of the rest to smear in inside grooves has low-melting metal material, and the heating end with heat pipe is positioned in the groove again, sends into the brazier hot melt of heating afterwards, heat pipe is fixedly arranged on the heat-conducting block, thereby forms heat-pipe radiator.But heat pipe is subjected to brazier to add heat affecting and makes its surface stain, thereby needs by the redox program heat pipe surface recovery to be arrived original color again.
In above-mentioned heat-pipe radiator structure, utilize heat pipe to be arranged at heat-conducting block inside, to shorten thermally conductive pathways, accelerate its heat-transfer rate.Yet in the manufacture method of above-mentioned existing heat-pipe radiator, low-melting metal material must be applied on the groove of heat-conducting block, impose the hot melt of heating again, heat pipe can be fixedly arranged on the heat-conducting block fully.Yet, such manufacture process but must increase the manufacturing and the material cost of heat-conducting medium coating and hot melt operation, and engaging process at heat pipe and heat-conducting block, must be via the hot melt operation of heating of brazier, cause the surface stain of heat pipe, thereby must by the redox program heat pipe surface recovery be arrived original color again.Therefore, manufacturing time and step all increase, thereby have significantly reduced economic benefit, make this manufacture method desirable not as expection.
Summary of the invention
At above-mentioned defective, main purpose of the present invention is, a kind of heat-pipe radiator structure and manufacture method thereof are provided, the mode of utilizing loam cake to press down is closely pressed from both sides heat pipe and is pulled on heat-conducting seat, make heat pipe can directly be attached at the bottom surface of heat-conducting seat, thereby produce conduction of heat with pyrotoxin apace, save thus heat pipe is engaged step via the hot melt of heating with heat-conducting seat, prevent to pass through its surperficial step of redox program recovery because of the hot melt manufacture process causes heat pipe surface stain, need.
Description of drawings
Fig. 1 is a three-dimensional exploded view of the present invention;
Fig. 2 is heat pipe of the present invention and base combination schematic diagram;
Fig. 3 is base of the present invention and loam cake combination schematic diagram;
Fig. 4 is radiator of the present invention and heat pipe combination schematic diagram;
Fig. 5 is that figure is finished in radiator of the present invention and heat pipe combination;
Fig. 6 is a three-dimensional combination schematic diagram of the present invention.
In the accompanying drawing, the list of parts of each label representative is as follows:
1-radiator 11-fin 111-perforation
112-bulge loop 2-heat pipe 21-heat absorbing end
22-condensation end 3-heat-conducting seat 31-base
The dull and stereotyped 312-groove of 311-313-rivet
32-loam cake 321-through hole 322-compression part
323-intermediate plate 324-hole
The specific embodiment
In order to make those skilled in the art further understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, accompanying drawing only provide with reference to and usefulness is described, be not to be used for limiting the present invention.
See also Fig. 1, it is a three-dimensional exploded view of the present invention.This heat pipe heat radiation structure mainly comprises radiator 1, one or more heat pipe 2 (originally being illustrated as three) and heat-conducting seat 3.Wherein, radiator 1 is piled up mutually by a plurality of fin 11 and forms, and a plurality of fin 11 are made by the high metal material of thermal diffusivity, and as copper, aluminium etc., and a plurality of fin 11 can be rectangle or arbitrary suitable shape.In addition, offer a plurality of perforation 111 on the same position of each fin 11, the periphery of perforation 111 has extended upward circular bulge loop 112, and the height of each circular bulge loop 112 equates.Like this, during each adjacent fin 11 mutual subsides end contact, can form equi-spaced apart heat radiation runner.Heat pipe 2 is the U-shaped body in the present embodiment, and its inside has capillary structure and working fluid, and its outside is formed with heat absorbing end 21 and condensation end 22.Heat-conducting seat 3 is made up of base 31 and corresponding with it loam cake 32, and base 31 is made by Heat Conduction Material, as aluminium.Base 31 has flat board 311, offers a plurality of grooves 312 on the flat board 311, and heat absorbing end 21 substantial equivalences of the shape of groove 312 size and heat pipe 2.On base 31 left and right sides and centre position, be provided with a plurality of rivets 313.Loam cake 32 is a tabular, and is corresponding with base 31, and its material is identical with base 31.Have a plurality of through holes 321 of offering and be formed at the compression part 322 of 321 of each through holes at loam cake 32, both sides, compression part 322 bottom are provided with a plurality of arc clips 323.In addition, on flat board, offer and be used for the hole 321 that combines with rivet 313.
Now, describe the manufacture method of this heat-pipe radiator structure in detail with reference to Fig. 2 to 6.See also Fig. 2, at first heat pipe 2 is positioned on the base 31, and the bottom of heat pipe 2 comprises that heat absorbing end 21 engages with groove 312 inner tight of base 31 fully, as shown in Figure 3.Afterwards, the condensation end 22 with heat pipe 2 penetrates in the through hole 321 of loam cake 32 again, connects with base 31 corresponding driving fits up to loam cake 32.Simultaneously, the compression part 322 of loam cake 32 pastes and is against on the heat absorbing end 21 of heat pipe 2, and the intermediate plate 323 of both sides, compression part 322 bottom is fixed in the both sides of heat absorbing end 21, and is located at the hole 324 that rivet 313 on the base 31 penetrates loam cake 32, thus being connected of firm banking 31 and loam cake 32.In addition, before heat pipe 2 is positioned over base 31, can be about to the condensation end 22 of heat pipe 2 earlier penetrate in advance in the through hole 321 of loam cake 31, the heat absorbing end 21 with heat pipe 2 is positioned in the groove 312 of base 31 again.In addition, the above-mentioned base 31 and the fixed form of loam cake 32, any mode that also can utilize screw assembly locking, welding or bind.
See also Fig. 5 then, after the base 31 of heat-conducting seat 3 and loam cake 32 are fixing with heat pipe 2, again each fin 11 mutual stacked combination is become radiator 1.Then, the perforation 111 of each fin 11 condensation end 22 sockets over against heat pipe 2 are engaged, be projected into the top of radiator 1 up to the condensation end 22 of heat pipe 2, as shown in Figure 6.In addition, radiator 1 also can utilize impact style that each fin 11 is arranged on the heat pipe 2 one by one with the socket of heat pipe 2, and each fin 11 mutual stacked combination becomes radiator 1.
See also Fig. 6, it is a three-dimensional combination schematic diagram of the present invention.When heat-conducting seat 3 attaches on the electronic building brick of heating, heat-conducting seat 3 and heat pipe 2 absorb also quick area simultaneously from heat, the high heat dissipation characteristics of each fin 11 by radiator 1 distributes heat again, thereby makes electronic building brick can continue running under the operating temperature that allows.
The above only is the preferred embodiments of the present invention, be not so promptly limit claim of the present invention, the equivalent structure transformation that every utilization specification of the present invention and accompanying drawing content are done, or directly or indirectly be used in other relevant technical field, all in like manner be included in the claim of the present invention.
Claims (10)
1. heat-pipe radiator structure comprises:
Radiator;
At least one heat pipe, it has heat absorbing end and condensation end, and described condensation end is established with described radiator string and is connected;
Heat-conducting seat, base and loam cake by correspondence are formed, offer at least one groove on the described base, described heat absorbing end in order to ccontaining described heat pipe, described loam cake is dull and stereotyped, covers on described to be provided with a plurality of through holes and to be formed at compression part between described through hole, when described loam cake during with the corresponding connection of described base, the described condensation end of described heat pipe passes the described through hole of described loam cake, and the described compression part subsides of described loam cake are butted on the described heat absorbing end of described heat pipe.
2. heat-pipe radiator structure as claimed in claim 1, wherein, described radiator is piled up mutually by a plurality of fin and forms.
3. heat-pipe radiator structure as claimed in claim 2, wherein, described fin is made with any material in aluminium and the copper.
4. heat-pipe radiator structure as claimed in claim 1, wherein, the described compression part both sides of described loam cake further are provided with a plurality of intermediate plates.
5. heat-pipe radiator structure as claimed in claim 1, wherein, described heat-conducting seat is made of aluminum.
6. the manufacture method of a heat-pipe radiator structure, described heat-pipe radiator comprises: radiator; At least one heat pipe, it has heat absorbing end and condensation end, and described condensation end is established with described radiator string and is connected; Heat-conducting seat, base and loam cake by correspondence are formed, offer at least one groove on the described base, in order to the described heat absorbing end of ccontaining described heat pipe, described loam cake is dull and stereotyped, covers on described to be provided with a plurality of through holes and to be formed at compression part between described through hole, when described loam cake during with the corresponding connection of described base, the described condensation end of described heat pipe passes the described through hole of described loam cake, and the described compression part subsides of described loam cake are butted on the described heat absorbing end of described heat pipe, and described method comprises:
A. the described heat absorbing end with described heat pipe is positioned in the described groove of described base;
B. the described condensation end of described heat pipe is penetrated the described through hole of described loam cake;
C. with the corresponding connection of described loam cake, make described compression part paste simultaneously and be butted on the described heat absorbing end of described heat pipe with described base;
D. described radiator string is located on the described condensation end of described heat pipe, is finished described heat-pipe radiator structure.
7. the manufacture method of heat-pipe radiator structure as claimed in claim 6, wherein, described step a and described step b can change mutually.
8. the manufacture method of heat-pipe radiator structure as claimed in claim 6, wherein, in described step c, the connected mode of described base and described loam cake is selected from any one in welding, riveted joint and the bonding mode.
9. the manufacture method of heat-pipe radiator structure as claimed in claim 7, wherein, in described step c, described base is connected by screw assembly with described loam cake.
10. the structure making process of heat-pipe radiator as claimed in claim 7, wherein, in described steps d, described heat pipe and described radiator are gone here and there by process for stamping and are established.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005101345310A CN100402965C (en) | 2005-12-08 | 2005-12-08 | Heat-pipe radiator structure and mfg. method |
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CNB2005101345310A CN100402965C (en) | 2005-12-08 | 2005-12-08 | Heat-pipe radiator structure and mfg. method |
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CN1979079A true CN1979079A (en) | 2007-06-13 |
CN100402965C CN100402965C (en) | 2008-07-16 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101646329B (en) * | 2008-08-07 | 2011-09-14 | 鈤新科技股份有限公司 | Method and structure for levelly combining evaporation ends of parallel heat pipes with fixing base |
CN102256470A (en) * | 2010-05-17 | 2011-11-23 | 奇鋐科技股份有限公司 | Heat radiation apparatus and manufacture method thereof |
CN114623709A (en) * | 2021-11-22 | 2022-06-14 | 祥博传热科技股份有限公司 | Heat pipe installation process of heat pipe radiator |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11351769A (en) * | 1998-06-12 | 1999-12-24 | Furukawa Electric Co Ltd:The | Heat sink |
US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
US20040035558A1 (en) * | 2002-06-14 | 2004-02-26 | Todd John J. | Heat dissipation tower for circuit devices |
CN2622650Y (en) * | 2003-05-08 | 2004-06-30 | 于秉恒 | Thermotube radiator |
TWM244561U (en) * | 2003-09-12 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | A heat pipe radiator |
US6779595B1 (en) * | 2003-09-16 | 2004-08-24 | Cpumate Inc. | Integrated heat dissipation apparatus |
-
2005
- 2005-12-08 CN CNB2005101345310A patent/CN100402965C/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101646329B (en) * | 2008-08-07 | 2011-09-14 | 鈤新科技股份有限公司 | Method and structure for levelly combining evaporation ends of parallel heat pipes with fixing base |
CN102256470A (en) * | 2010-05-17 | 2011-11-23 | 奇鋐科技股份有限公司 | Heat radiation apparatus and manufacture method thereof |
CN114623709A (en) * | 2021-11-22 | 2022-06-14 | 祥博传热科技股份有限公司 | Heat pipe installation process of heat pipe radiator |
CN114623709B (en) * | 2021-11-22 | 2023-12-01 | 祥博传热科技股份有限公司 | Heat pipe installation process of heat pipe radiator |
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CN100402965C (en) | 2008-07-16 |
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