CN1971905A - 具有接头元件的功率半导体模块 - Google Patents

具有接头元件的功率半导体模块 Download PDF

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CN1971905A
CN1971905A CNA2006101493571A CN200610149357A CN1971905A CN 1971905 A CN1971905 A CN 1971905A CN A2006101493571 A CNA2006101493571 A CN A2006101493571A CN 200610149357 A CN200610149357 A CN 200610149357A CN 1971905 A CN1971905 A CN 1971905A
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比约姆·陶舍尔
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Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
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Abstract

本发明涉及一种功率半导体模块，具有壳体；至少一个基板；至少一个电路接通地设置和连接的功率半导体部件；以及与功率半导体部件导电连接的且伸向外部的用于负载接头和辅助接头的接头元件，其中至少一个接头元件包括一弹性构成的第一导段、一刚性的第二导段以及一绝缘成型体，其中至少一个导段部分地与绝缘成型体连接，并且绝缘成型体具有至少一个用于壳体所配备的一支座的止挡面以及具有与壳体的卡锁连接的一部分。

Description

具有接头元件的功率半导体模块
技术领域
本发明涉及一种原则上由许多文献已知的功率半导体模块。这种功率半导体模块已知具有一绝缘的塑料壳体。在此塑料壳体内部有一个具有电路接通地(schaltungsgerecht)设置的功率半导体部件。此外这种功率半导体模块具有向外伸出的用于负载接头以及辅助接头的接头元件，以便电连接内部的电路结构。
背景技术
一个未公开的文献DE102004050588A1构成了本发明的出发点。该文献公开一种压力接触构成的功率半导体模块，具有一个底板和一个设置在其上的壳体。所述壳体包围两个电路接通连接的功率半导体部件，例如晶闸管。功率半导体模块具有多个负载接头和辅助接头用于功率半导体部件的外部电连接。这种辅助接头由绝缘成型体构成，该绝缘成型体包括具有设置在其内的弹簧元件、与之连接的插头以及与外部插接接触的连接导线。这种麻烦的构造优选用于功能特别大和持久的压力接触构造的功率半导体模块。
DE 19914741A1构成了本发明的另外一个出发点。其公开了例如不具有底板的功率半导体模块。在这种类型的功率半导体模块中，被壳体包围的基板直接设置在冷却构件上。在基板自身上在多个印制导线上设置功率半导体部件并且电路接通地彼此连接。伸向外部的负载接头和辅助接头构成为金属成型体，它们借助于金属丝粘结连接(Drahtbondverbindung)与基板连接。
在另外一个原则上类似的功率半导体模块的构造中已知在印制导线与接头元件之间的焊接连接。与压力接触的构造相比缺点在于较小的持久性或功能安全性。由DE 19630173A1已知其它的功率半导体模块，其具有设置在壳体内部的作为接头元件的弹簧元件。这允许简单的、使得自动化制造成为可能的构造。
发明内容
本发明的目的是，构造一种具有接头元件的功率半导体模块，其将电连接的高功能安全性与功率半导体模块的简单制造结合起来。
根据本发明上述目的通过权利要求1特征的措施达到。优选的实施方式在从属权利要求中描述。
本发明的构思从一功率半导体模块出发，其优选具有底板和至少一个设置在底板上的基板。所述基板与底板电绝缘地构成并且在其面向模块内部的第一主面上具有多个印制导线。至少一个功率半导体部件设置在其中一个印制导线上并且例如借助于金属丝粘结连接电路接通地连接。
本发明的功率半导体模块具有伸向外部的、用于负载接头和辅助接头的接头元件。接头元件在内部与基板的印制导线连接或者直接与功率半导体部件的接触面连接。
其中至少一个接头元件包括一弹性构成的第一导段、一刚性的第二导段和一绝缘成型体。第一导段与印制导线和功率半导体部件的接触面导电地连接，而第二导段将第一导段与外部的接头连接。此外接头元件具有一个绝缘成型体，该绝缘成型体与至少一个导段部分地形锁合或材料锁合连接。
绝缘成型体具有至少一个用于壳体所配备的支座的止挡面。这构成接头元件在壳体内的锁定的一部分。此外，绝缘成型体的一构件与壳体形成卡锁连接，此卡锁连接构成锁定的第二部分。由此优选的是，绝缘成型体具有可以运动释放的锁止凸耳并且壳体具有所配备的锁止边缘。
通过卡锁连接的锁止，通过绝缘成型体在壳体内的合适的设置将压力引导至接头元件的第一部分上。因此接头元件整体上在功率半导体模块内部构成为压力接触构造，其具有已知的优点。
特别优选的是，借助于本发明的接头元件的构造对功率半导体模块的辅助接头进行构造。
附图说明
借助于附图1至4中描述的实施例进一步阐述本发明的方案，其中：
图1示出了本发明的功率半导体模块的俯视图；
图2示出了本发明的功率半导体模块的侧向剖视图；
图3示出了本发明的功率半导体模块的接头元件的构造的三维视图；
图4示出了本发明的功率半导体模块的接头元件的一部分的三维视图。
具体实施方式
图1示出了本发明的功率半导体模块的俯视图。示出了一个具有两个晶闸管50的高功率的晶闸管模块，所述晶闸管设置在各自的基板的印制导线上。在此优选，仅按照本发明构成用于控制晶闸管50的辅助接头元件60。在晶闸管功率较小的时非常优选的是，按照本发明构成用于控制晶闸管50的负载接头元件16和/或辅助接头元件60。
示出了一个底板14、一个设置在其上的框架形地包围基板的壳体。基板分别构成为优选由工业陶瓷制成的绝缘体40，具有在朝向模块内部的一侧上设置的金属的印制导线42。功率半导体模块50设置在这些印制导线上并且借助于金属丝粘结连接54(见图3)电路接通地连接。本发明的接头元件60的第一导段在此构成为圆筒弹簧62，用于与功率半导体部件的接触面电接触以及用于与印制导线42电接触。
同样示出了接头元件60的第二导段64，其中此第二导段被所配备的绝缘成型体66部分包围并且与此绝缘成型体材料锁合(stoffbündig)连接。
图2以侧向剖视图示出了根据图1的本发明的功率半导体模块。在此可看到壳体10在底板上的结构以及被壳体10的框架形部分12包围的基板40，所述基板具有在所配备的印制导线42上设置的功率半导体部件50。
本发明的接头元件60的第一导段62设置在壳体10的一个用作引导部的成型部30内，其中第一导段自身构成为圆筒弹簧62。成型部30借助于合适的壳体部件32(也见图1)与壳体10的壁12连接，所述壳体部件32优选附加地用作壳体10的加强结构。
接头元件60此外具有一个第二导段64，其构成为金属成型体并且部分地与一绝缘成型体66连接。绝缘成型体66在其一端上具有一止挡面80，其设置壳体10的所配备的支座20上并且阻止绝缘成型体66远离功率半导体部件50运动。在绝缘成型体66的对置端部上具有可运动释放(freigestellten beweglichen)的部段82，其具有锁止凸耳84并且与壳体10的锁止边缘22一起构成绝缘成型体66与壳体10之间的、也就是接头元件60与壳体10之间的卡锁连接。
通过所示的绝缘成型体的构造，朝向底板14的压力被导入到第一导段即圆筒弹簧62上，并且因此构成圆筒弹簧62与所配备的接触面52(见图3)或与基板40的印制导线42(见图3)的可靠的电连接。
如附图所示，接头元件60的第二导段64的由壳体10中伸出的部分64a优选构成为按照现有技术的插接头并且用于与外部连接。
图3示出了本发明的功率半导体模块的接头元件60的构造的三维视图，其中为了看得清楚，省略了壳体。示出了具有两个基板40的底板14。两个底板14在同时电绝缘的情况下用作与底板14热耦合，或者在没有底板的功率半导体模块的情况下与冷却件热耦合。
在基板40上在朝向模块内部的一侧上设置根据现有技术的金属的印制导线42。在晶闸管模块的这个特殊的构造中在每个基板40上只设置一个晶闸管50，其中本发明不限于这种特殊情况。
所示出的接头元件用于每个晶闸管50具有一控制接头和一辅助阴极接头，其中控制接头直接与晶闸管50的所配备的接触面52连接并且辅助阴极接头与一所配备的基板40的印制导线42连接。所述连接构成为本发明的接头元件60的第一导段62，在此为圆筒弹簧。圆筒弹簧62不与接头元件60的第二导段64一体连接。第二导段64由一个金属成型体64构成，其与绝缘成型体66材料锁合地连接。金属成型体64在其第一端部上构成与圆筒弹簧62的接触面，在另外一端上构成一插头。
同样优选的是，当两个导段一体构成时，其中第一导段在此可以任意的方式按照现有技术弹性地构成。
绝缘成型体66优选由与壳体10相同的塑料制成并在第一端部具有一个空隙80，其构成为壳体10中的锚定部20的止挡面。绝缘成型体66的第二端部具有一个可运动释放的的部段82，其具有一个锁止凸耳84。
接头元件60的导段的两件式构造，作为一个圆筒弹簧62和一个刚性的金属成型体64，是特别优选的，因为在此经由第二导段64借助于绝缘成型体66和其在壳体10中的锚定将压力导入到圆筒弹簧62上。因此圆筒弹簧62一方面与功率半导体部件50的接触面52或基板40的印制导线42，且另一方面与第二导段64持久地导电连接。
这种构造在制造功率半导体模块时具有特别的优点，因为圆筒弹簧62首先可以装入壳体10的成型部30中并且在下一个步骤中设置接头元件的其它部分即第二导段64以及材料锁合地连接的绝缘成型体66，由此对圆筒弹簧62压力加载。
在导段的一件式的、在特殊的应用情况下两件式的构造中，也优选的是，与功率半导体的接触面或基板的印制导线不构成压力接触。在此其它已知的连接技术例如焊接连接或粘结连接是优选的。
图4示出了本发明的功率半导体模块的接头元件的一部分的三维视图。在此特别注意，两个接头元件的第二导段64具有一个共同的绝缘成型体66。这是特别优选的，因为在此进一步减少了所述的费用。
示出两个第二导段64，它们借助于冲压弯曲技术构成为刚性的金属成型体。因此可以在没有特别费用的情况下将圆筒弹簧62(见图3)在功率半导体模块中的任意位置与金属成型体64连接。
根据现有技术的塑料注塑方法已经证明为绝缘成型体66和第二导段64之间的特别合适的连接。特别有利的是，金属成型体64仅仅部分嵌入绝缘成型体66中，因为它由此尽可能紧凑地构成。

Claims (8)

1.一种功率半导体模块，具有壳体(10)；至少一个基板(40)；至少一个电路接通地设置和连接的功率半导体部件(50)；以及与功率半导体部件导电连接的且伸向外部的用于负载接头和辅助接头的接头元件(60)，其中至少一个接头元件(60)包括一弹性构成的第一导段(62)、一刚性的第二导段(64)以及一绝缘成型体(66)，其中至少一个导段(62，64)部分地与绝缘成型体(66)连接，并且绝缘成型体(66)具有至少一个用于壳体(10)所配备的一支座(20)的止挡面(80)以及具有与壳体(10)的卡锁连接(22，82，84)的一部分。
2.如权利要求1所述的功率半导体模块，其中接头元件(60)与功率半导体部件(50)的接触面(52)连接或与基板(40)的印制导线(42)连接。
3.如权利要求1所述的功率半导体模块，其中接头元件(60)的第一导段(62)与功率半导体部件(50)的接触面(52)或基板(40)的印制导线(42)以及与第二导段(64)压力接触地连接并且借助于绝缘成型体(66)实现力导入。
4.如权利要求1所述的功率半导体模块，其特征在于，接头元件(60)的至少一个导段(62，64)借助于塑料注塑法部分嵌入绝缘成型体(66)中。
5.如权利要求1所述的功率半导体模块，其特征在于，第一导段(62)构成为圆筒弹簧并且设置在一个壳体(10)所配置的用作引导部的成型部(30)中。
6.如权利要求1所述的功率半导体模块，其特征在于，绝缘成型体(66)具有一可以运动释放的具有锁止凸耳(84)的部段(82)，并且壳体(10)具有所配置的锁止边缘(22)。
7.如权利要求1所述的功率半导体模块，其特征在于，第二导段(64)构成为按冲压弯曲技术制造的金属成型体。
8.如权利要求1所述的功率半导体模块，其特征在于，壳体(10)设置在一底板(14)上、包围基板(40)并且具有在其内部的位于基板(40)之上的加强结构(32)，所述加强结构与成型部(30)连接。
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