CN1963603A - Liquid crystal display device and production method thereof, and projector - Google Patents

Abstract

A method of producing a microlens array includes a patterning step of forming a first optical resin layer having a first refractive index on a transparent substrate and forming a plurality of microlens planes arrayed in a two-dimensional pattern on the front surface of the first optical resin layer; a planarizing step of forming a planarized second optical resin layer; a joining step of providing a support layer on which a transparent protective film is previously formed; and a removing step of removing the support layer in such a manner that only the protective film remains on the second optical resin layer. The planarizing step is performed by filling irregularities of the microlens planes with a resin having a second refractive index and planarizing the front surface, opposed to the microlens planes, of the resin, to form the planarized second optical resin layer, and the joining step is performed by joining the support layer to the planarized second optical resin layer. With this method, a microlens array excellent in surface accuracy and flatness can be produced without the need of provision of a support layer made from glass.

Description

Liquid crystal display device and manufacture method and projector

The present invention is to be the dividing an application of No. 200510072722.9 patent of invention on May 13rd, 2003 applying date.

Technical field

The present invention relates to comprise the liquid crystal display device and the manufacture method thereof of microlens array and use the projector of this liquid crystal display device as bulb (light bulb).

Background technology

Use LCD (liquid crystal display device), DMD (digital mirror device) or LCOS (silica-based LC) to obtain development energetically as the projector of bulb.From the viewpoint of function and shape, projector is divided into is mainly used in PC and monitors the data presented projector, be mainly used in the front projector or the back projector of audio-visual equipment (AV) such as home theater and the back projector that is used for TV (TV).Simultaneously, from the viewpoint of bulb quantity, projector is divided into list-screen formula, two-screen formula and three-screen formula.Bulb is divided into transmission-type and reflection-type.

Following projector can need higher light characteristic.Satisfy this needs, main expectation is to the improvement of optical system.For example, expect to improve the brightness of the light source that uses, so that when using arc lamp, shorten arc length (to realize pointolite), optimization optical element, and the miniaturization that realizes optical element.

In order to satisfy above-mentioned requirements, secondly expectation increases aperture as the bulb of projector Primary Component than (aperture ratio).In this respect, need to realize the more fine structure of Pixel-level device and the aperture ratio of Geng Gao basically.But,, be the aperture ratio that can not improve pixel only by simple meticulous device architecture is provided if use liquid crystal as the electrical-optical medium.Reason is as follows: promptly, because liquid crystal is a non-individual body, one shielding black matrix" must be provided, and it will have enough big area to leak to prevent the light that light leaked and prevented to be used to drive the thin film transistor (TFT) of liquid crystal from back side angled section, therefore the aperture ratio of the corresponding sacrifice pixel of meeting.

In order to improve the utilization factor of source emissioning light, also in order to improve brightness, people begin to attempt installing microlens array (microlens arrays) on liquid crystal display device simultaneously.For example, in Jap.P. Te-Kai No.Hei 2000-206894, disclose a kind of flat panel display device that comprises microlens array.By using glass substrate, for example quartz base plate or new ceramic (neoceram) glass substrate (hereinafter, the glass substrate that is used for microlens array is called as " cover glass " sometimes), a kind of microlens array that is included in high precision liquid crystal display device (liquid crystal panel) that is used for the prior art liquid crystal projection apparatus has been produced.More particularly, a kind of by wet-etching or do-method that etching procedure or 2P (light-poly-effect) operation use cover glass (cover glass) to form microlens array dropped into practical application.In each case, the zone that form microlens array all is made up of transparent resin.The thickness that is used to support the cover glass of such transparent resin is reduced by polishing under the controlled way or grinding, and simultaneously, as needs, the transparent conductive film (for example, ITO film) that is used for display device is formed on the cover glass.

With reference to Figure 1A～1D, a kind of art methods of making microlens array by the wet etching operation will be introduced.

In the step shown in Figure 1A, after having cleaned quartz base plate, resist (resist) is added on the quartz base plate, and is patterned into and the corresponding pattern of the array pattern of pixel by exposure and development.In the step shown in Figure 1B, via resist isotropically the etching quartz base plate to form sphere lens face R.In addition, can use the good amorphous silicon membrane of metal, polysilicon or chemical corrosion stability to replace resist to be used as mask.Can finish etching based on the etching agent of HF or BHF base by using.

In step 1C, a bonding cover glass on the surface of quartz base plate is filled the transparent resin that refractive index is different from quartzy refractive index by vacuum injection, spin coating or the gap that is sprayed between the two.By UV (ultraviolet ray) irradiation or heating, with the resin full solidification in the sphere lens face of wet etching formation.Here employed examples of resins comprises epoxy, acrylic based resin, silicone and fluoro resin, and each all is cured by UV-irradiation or heating.Like this, just formed the lenticule of arranging with corresponding to the pattern of pel array pattern.At last, in step 1D, with the cover glass polishing, and form ito transparent electrode, to form the subtend substrate.Do not illustrate among the figure, the subtend substrate bonding and is injected into liquid crystal in therebetween the gap on the driving substrate that has been pre-formed pixel electrode and thin film transistor (TFT), has just obtained active-matrix liquid crystal display device.

Fig. 2 shows the structural representation of prior art projector optical system (mainly being lamp optical system).This projector comprises light source 1101, first microlens array 1102, second microlens array 1103, PS synthin 1104, collector lens 1105, field lens 1106, liquid crystal panel 1107 and projecting lens 1108, and they are arranged along optical axis 1100 in this order.Microlens array 1102 comprises a plurality of lenticules of arranging by two-dimensional pattern, and microlens array 1103 comprises a plurality of lenticules of arranging by two-dimensional pattern.PS synthin 1104 comprise a plurality of all be positioned at and two adjacent lenticules of second microlens array 1103 between half-Bo plate 1104A of corresponding position, space.

In this projector, from the illumination light of light source 1101 emission be divided into after by microlens array 1102 and 1103 a plurality of little-light beam.The light that comes out from microlens array 1102 and 1103 incides on the PS synthin 1104.Incide light L10 on the PS synthin 1104 and contain mutually orthogonal P-polarized component and S-polarized component in the plane vertical with optical axis 1100.The light L10 that PS synthin 1104 will incide on it is divided into two kinds of polarized light component L11 and L12 (P-polarized component and S-polarized component).In these polarized light components L11 and L12, polarized light component L11 (for example P-polarized component) outgoing and kept its original polarization direction (as the P-polarization) from PS synthin 1104, and polarized light component L12 (as the S-polarized component) is converted to another kind of polarized light component (for example P-polarized component) by half-Bo plate 1104A, and the light component L12 of conversion penetrates from PS synthin 1104.As a result, the polarized light component L11 and the L12 of two separation are oriented at certain orientation.

Pass collector lens 1105 and field lens 1106 from the light of PS synthin 1104 outgoing, and provide illumination for liquid crystal panel 1107.Be exaggerated by microlens array 1102 and 1103 little-light beams of cutting apart from light beam, and magnification is determined by the focal length " f " of the lenticule 1103M of the focal length " fc " of collector lens 1105 and second microlens array 1103, to illuminate the whole plane of incidence of liquid crystal panel 1107.Therefore, the light beam after a plurality of amplifications is added on the plane of incidence of liquid crystal panel 1107, to realize proportional illumination on the whole.Liquid crystal panel 1107 carries out solid adjustment according to picture intelligence to incident light, and by projecting lens 1108 light from liquid crystal panel 1107 outgoing is projected on the screen (not shown), forms image on screen.

Fig. 3 is the typical skeleton view of a routine liquid crystal panel.Liquid crystal panel shown in the figure (liquid crystal display device) has and comprises a pair of substrate 1201 and 1202 and the slab construction that places liquid crystal 1203 therebetween.Pixel array portion 1204 and driving circuit section are integrated on the infrabasal plate 1201.Driving circuit section is divided into vertical drive circuit 1205 and horizontal drive circuit 1206.External connection terminals 1207 is formed on the peripheral upper end of infrabasal plate 1201.Terminal 1,207 1208 is connected to vertical drive circuit 1205 and horizontal drive circuit 1206 through connecting up.On pixel array portion 1204, form gate lines G and signal wire S.Form pixel electrode 1209 and the thin film transistor (TFT) (TFT) 1210 that is used to drive pixel electrode 1209 at each intersection point place of gate lines G and signal wire S.Pixel P is made of the assembly of pixel electrode 1209 and thin film transistor (TFT) 1210.The gate electrode of thin film transistor (TFT) 1210 is connecting corresponding gate lines G, and its drain electrode resin is connecting corresponding pixel electrode 1209, and its source area is connecting corresponding signal lines S.Gate lines G is connecting vertical drive circuit 1205, and signal wire S is connecting horizontal drive circuit 1206.Vertical drive circuit 1205 is selected each pixel P successively through gate lines G.Horizontal drive circuit 1206 is written to picture intelligence the pixel P that chooses through signal wire S.The infrabasal plate 1201 of integrated pixel electrode and thin film transistor (TFT) (TFTs) is called as the TFT substrate.Counter electrode and colored filter are formed on the upper substrate 1202 but do not illustrate, so upper substrate 1202 is called as the subtend substrate.

Such microlens array must satisfy the requirement of degree of precision and higher brightness.For example, when the panel size of liquid crystal display device diminished, Pixel Dimensions will proportionally thereupon diminish, and correspondingly, cover glass must be done very thinly.Though cover glass has passed through polishing or ground attenuation, such polishing or grinding are restricted when precision attenuate cover glass as required, and this makes harmony and the planarization of guaranteeing designing requirement become difficult.If be used for the plane precision and the flatness deficiency of the cover glass of microlens array, when being assembled into microlens array in the liquid crystal display device, may produce the problem that mechanical stress occurs.Same, along with the more requirement of high definition of counter plate, cover glass is being thinned to 30 μ m or when thinner, can cause another problem, owing to solidify to form the differential contraction stress that different coefficient of thermal expansions causes between the optical resin of microlens array or optical resin and cover glass, cover glass may occur and rise and fall or warpage.

State in the use under the situation of active-matrix liquid crystal display device as the projector bulb, the more such liquid crystal display device of strong request has higher sharpness and high brightness.Consider this point, the switching device of the high temperature polysilicon thin film transistor (TFT) that can realize high definition as each pixel of driving.Comply with the needs of precision switch device more, just require microlens array to have more accurate structure.In order to satisfy these requirements, developed microlens array has been attached to technology on the substrate of active-matrix liquid crystal display device.For example, in the file of Jap.P. Te-Kai No.Hei 5-341283, Hei 10-161097 and 2000-147500, disclose a kind of manufacture method of the substrate in conjunction with microlens array.

A kind of double micro-lens array structure is counted as the ideal structure that can realize high-high brightness, the microlens array that wherein has the collector lens function is installed in the subtend substrate of light incident side, and the microlens array with field lens function is installed on the TFT substrate-side.This double micro-lens array can be brought up to maximum with the effective aperture ratio of pixel; Yet, owing to make double micro-lens array difficulty the most, a kind of its any actual manufacture method is not also disclosed at present.It is worth noting that a kind of LCD with double micro-lens array structure is commonly referred to MTMLCD, is the abbreviation of " Microlens Substrate-TFTSubstrate-Microlens Substrate LCD ".

Summary of the invention

First technical matters that the present invention will solve provides a kind of liquid crystal display device that comprises microlens array.

Second technical matters that the present invention will solve provides a kind of projector that uses above-mentioned liquid crystal display device.

The 3rd technical matters that the present invention will solve provides a kind of reasonable manufacture method with liquid crystal display device of double micro-lens array.

In order to solve first technical matters, according to a first aspect of the invention, provide a kind of liquid crystal display device of slab construction, it comprises the driving substrate that has formed pixel electrode on it at least and be used to drive the switching device of pixel electrode; At least formed the subtend substrate of counter electrode on it; And be inserted in liquid crystal layer between driving substrate and the subtend substrate, wherein two substrates engages and makes pixel electrode relative with counter electrode and leave certain interval between the two.In this device, be assemblied at least on the subtend substrate by the microlens array of forming with the lenticule of arranging corresponding to the X-Y scheme of pixel electrode array figure.Microlens array has the rear surface that engages with the subtend substrate and the front surface of leveling, and counter electrode is formed on the leveling front surface of this microlens array through diaphragm.

Preferably, will be pre-formed diaphragm bonding (bond) on supporting to the leveling front surface of microlens array after, should support removal exposing diaphragm, and on the diaphragm of exposure, form counter electrode.

Diaphragm is preferably by Al ₂O ₃, a-DLC, TiO ₂, TiN or Si make.

This microlens array preferably has dual structure, comprise be arranged on away from first lenticule liquid crystal layer one side, that have the collector lens function and be arranged near liquid crystal layer one side, be equivalent to second lenticule of field lens function substantially, and the distance value of each second lenticular principal point (principal point) and liquid crystal layer is arranged in 10 μ m or the littler scope.

It should be noted that, if the second lenticular focal length correspondence the distance between two first and second lenticules, then the second lenticular usefulness becomes 100%, and in fact, if the distance between the second lenticular focal length and two first and second lenticules differs greatly in 10%, then second lenticule possesses the function of field lens fully.

In order to solve second technical matters, according to second aspect present invention, a kind of projector is provided, comprises being used for luminous light source, having incident light is carried out the liquid crystal display device of optical modulation function and the projection projecting lens by the light of liquid crystal display device modulation.The liquid crystal display device of slab construction comprise the driving substrate that formed pixel electrode on it at least and be used to drive the switching device of pixel electrode, formed the subtend substrate of counter electrode on it at least and be inserted in driving substrate and the subtend substrate between liquid crystal layer, wherein two substrates engages and makes pixel electrode relative with counter electrode and leave certain interval between the two.In this device, be assemblied at least on the subtend substrate by the microlens array of forming with the lenticule of arranging corresponding to the X-Y scheme of pixel electrode array figure.Microlens array has the rear surface that engages with the subtend substrate and the front surface of leveling, and counter electrode is formed on the leveling front surface of this microlens array through diaphragm.

In order to solve the 3rd technical matters, according to a third aspect of the invention we, a kind of manufacture method of liquid crystal display device of slab construction is provided, this device comprise first substrate, second substrate and be inserted in first substrate and second substrate between liquid crystal layer, wherein two substrates engages and to make pixel electrode relative with counter electrode and leave certain interval between the two; On the front surface of first substrate, formed pixel electrode and the switching device that is used to drive pixel electrode at least, and the rear surface of first substrate is relative with its front surface; On the front surface of second substrate, formed counter electrode at least, and the rear surface of first substrate is relative with its front surface.By being used for combined one of them of first and second substrates of being formed into of first microlens array that the lenticule to the pixel electrode, two-dimensional arrangements of converging light respectively forms.Second microlens array that the light that converges to pixel electrode respectively passes by making, the lenticule of two-dimensional arrangements is formed is combined to be formed on another of first and second substrates.This method comprises bonding (bonding) step, a base plate is adhered on each the front surface of first and second substrates; Polishing (polishing) step when substrate is fixed on the described base plate, is polished this substrate rear surface, to reduce substrate thickness; Bonding (sticking) step, the transparent optical resin by having the refractive index that is higher or lower than described substrate is with on the corresponding surface of polished that bonds to substrate in first and second microlens arrays; Peel off (peeling) step, this substrate is peeled off and cleaned to described base plate from the substrate front surface, thus corresponding microlens array is attached on the rear surface of substrate.

If at least one in first and second substrates is the multi-chip module substrate that has corresponding to the zone of a plurality of panels, then this method can also comprise segmentation procedure, and multi-chip module is divided into single substrate corresponding to separate panels.Like this, when process bonding (bonding) step, polishing (polishing) step, bonding (sticking) step, with peel off (peeling) step, after will being combined in the multi-chip module substrate corresponding to the corresponding one of a plurality of first and second microlens arrays of a plurality of panels, this multi-chip module substrate can be divided into single substrate corresponding to separate panels a suitable stage.

In first and second substrates one has corresponding to the multi-chip module substrate in the zone of a plurality of panels and another is under the situation of list-chip module substrate, preferably will be formed on the multi-chip module substrate corresponding to the corresponding one of a plurality of first and second microlens arrays of a plurality of panels; In segmentation procedure, this multi-chip module substrate is divided into the single substrate corresponding to separate panels at once; Prepare each list that combines the corresponding one of first and second microlens arrays in advance-chip module substrate; And will be added on list-chip module substrate from the single substrate that the multi-chip module substrate splits and keep certain interval therebetween by man-to-man relation, so that be assembled in the separate panels.

In first and second substrates one has corresponding to the multi-chip module substrate in the zone of a plurality of panels and another is under the situation of list-chip module substrate, preferably will be formed on the multi-chip module substrate corresponding to the corresponding one of a plurality of first and second microlens arrays of a plurality of panels; Prepare each list that combines the corresponding one of first and second microlens arrays in advance-chip module substrate; List-chip module substrate is assembled on the multi-chip module substrate; And the multi-chip module substrate that list-chip module substrate is housed is divided into separate panels in segmentation procedure.

In first and second substrates one be combined be used for multi-chip module substrate a plurality of panels, the corresponding one of a plurality of first and second microlens arrays and another of first and second substrates also be combined be used for a plurality of panels, under corresponding another the situation of multi-chip module substrate of a plurality of first and second microlens arrays, preferably multi-chip module substrate mutual superposition is got up and keep certain interval betwixt, so that be assembled in the panel pedestal corresponding to a plurality of panels; And in segmentation procedure, the panel pedestal is divided into separate panels.

Segmentation procedure can comprise the first blockage cutting step and the second blockage cutting step, cut by first blockage, along the multi-chip module substrate being divided into the defined border of separate panels, the multi-chip module substrate is carried out the part cutting, have the groove of V-tee section with formation; By the cutting of second blockage, complete cut-in groove, thus form the single substrate that has the end face of cutting sth. askew.

This method can comprise orientation (alignment) step, after in strip step, peeling off base plate and cleaning base plate from the front surface of substrate, in the stable on heating temperature range of not damaging the microlens array that is attached on the substrate, on the exposure front surface of substrate, be formed for the both alignment layers of orientation liquid crystal layer.

This method can comprise the orientation step, is formed for the both alignment layers of orientation liquid crystal layer on the substrate front surface; Wherein by adhesion step, polishing step, bonding step and strip step, go forward to carry out described orientation step microlens array being attached to the substrate rear surface.

Polishing step can be played wiping (buffing) by what be fit to that optics is suitable for grade, particulate sandblast (particleblasting), and one or both of chemical-mechanical polishing and chemical etching or multiple combination are carried out.

In polishing step, preferably reduce the thickness of substrate by rear surface by following mode polishing substrate, promptly, when first and second substrate in batch are put into panel, make each lenticular focus of second microlens array that uses as field lens each lenticular principal point (principal point) corresponding to first microlens array that uses as collector lens.

Bonding step can comprise the step by the microlens array of processing, prepare the lenticule face composition of arranging with X-Y scheme to having than the optical glass material of low-refraction; And microlens array is navigated on the surface of polished of substrate, with microlens array with this place that is added to, specific gap, the transparent optical resin that is higher or lower than the refractive index of substrate with refractive index is filled described gap, and the step that this transparent optical resin is cured.

Bonding step can comprise with encapsulant and is fixed to the surface of polished of substrate on the microlens array and keeps certain clearance therebetween, the transparent optical resin that is higher or lower than the refractive index of substrate with refractive index is filled described gap, and seals the step in this gap.

Described lenticule face preferably is made into sphere shape, aspheric surface shape or Fresnel (Fresnel) shape.

This method can also comprise cleaning step, cleans in strip step the base plate under being stripped from as the product waste material, so that utilize this base plate again.

This method can also comprise preparation (preliminary) step, and corresponding one in first and second microlens arrays is attached on second substrate; And installation step, second substrate that combines microlens array is assembled on the front surface of first substrate.Like this, adhesion step can comprise base plate is adhered to step on the front surface side that is assemblied in second substrate on the first substrate front surface; Polishing step can be included under the situation that panel fixed by base plate, the step that the rear surface of first substrate is polished; And bonding step can comprise corresponding one in first and second microlens arrays is bonded to step on the surface of polished of first substrate.

Polishing step can be included in and be formed under the state on first substrate, that be used for the identical electromotive force of the outside a plurality of terminals maintenances that connect, polishes the step of the rear surface of first substrate.

Adhesion step can comprise that second substrate, one side with panel is installed to the step on the base plate that is fixed on the polishing platform that is used for polishing step.

According to the present invention,, thereby can no longer need to provide glass substrate (cover glass) because the surface of microlens array flattened by etching, plane punching press (flat stamping) or spin coating.This helps attenuate microlens array and the mechanical stress of removal when being assembled to microlens array on the liquid crystal display device.In addition, because by using for example etching, plane punching press or the such planarization technology of spin coating, two microlens arrays can be bonded with each other very accurately, therefore can stably produce so-called double micro-lens array.

According to the present invention, preparation comprises that the TFT substrate of microlens array comprises step: base plate is bonded on the front surface of TFT substrate with bonding agent; The single-sided polishing method that is suitable for grade by optics is polished the rear surface of TFT substrate, has the thin substrate of certain thickness TFT thereby form; And microlens array is bonded on the thin substrate of this TFT with a kind of adhesive transparent resin with high index of refraction.One comprises that the subtend substrate of microlens array also is produced by operation similar to the above.These substrates are superimposed with certain clearance each other, and liquid crystal is enclosed in this gap also sealed, to make a kind of liquid crystal display device with double micro-lens array.Such double micro lens type liquid crystal display device is suitable as for example bulb of projector.Since as the microlens array of liquid crystal layer collector lens and another as the microlens array of field lens can by tight each other-be provided with adjacently, so can obtain the lenticule of optimum usefulness, and therefore make the effective aperture ratio of pixel obtain to significantly improve.

Description of drawings

Be described in detail below in conjunction with accompanying drawing, will make these and other purposes, features and advantages of the present invention clearer, wherein:

Figure 1A～1D is the process chart of liquid crystal display device manufacture method in the prior art;

Fig. 2 is the canonical schema of an example of prior art projector;

Fig. 3 is the typical skeleton view that is contained in an example of the liquid crystal display device in the projector shown in Figure 39;

Fig. 4 A～4D is the process chart according to fabricating method of microlens array of the present invention;

Fig. 5 A～5C ' is the process chart according to another manufacture method of microlens array of the present invention;

Fig. 6 A～6D is the process chart according to the basic step of the another manufacture method of microlens array of the present invention;

Fig. 7 is the typical cut-open view of double micro-lens array reference example;

Fig. 8 is the optical indicatrix figure of microlens array shown in Figure 7;

Fig. 9 A～9E is the process chart that is used to illustrate according to liquid crystal display device of the present invention;

Figure 10 A～10E is the process chart that is used to illustrate according to another liquid crystal display device of the present invention;

Figure 11 A～11E is the process chart that is used to illustrate according to another liquid crystal display device of the present invention;

Figure 12 is the typical partial sectional view of general liquid crystal display device reference example;

Figure 13 A～13F is the process chart that is used to illustrate according to another liquid crystal display device of the present invention;

Figure 14 A and Figure 14 B are the zoomed-in views of liquid crystal display device shown in Figure 13 A～13F;

Figure 15 A～15F is the process chart that is used to illustrate according to another liquid crystal display device of the present invention;

Figure 16 is the exemplary view according to liquid crystal display device optical characteristics of the present invention;

Figure 17 is the skeleton view of the configured in one piece of liquid crystal display device according to the present invention;

Figure 18 is the exemplary view of the example of projector according to the present invention;

Figure 19 A～19E is the process chart according to liquid crystal display device manufacture method of the present invention;

Figure 20 is the process chart according to liquid crystal display device manufacture method embodiment of the present invention;

Figure 21 A and Figure 21 B are the exemplary view of the segmentation procedure of this manufacture method;

Figure 22 is the process chart according to another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 23 is the exemplary view of the installation step of this manufacture method;

Figure 24 A and Figure 24 B are the exemplary view of manufacture method that comprises the subtend substrate of microlens array;

Figure 25 is the process chart according to the another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 26 is the process chart according to the another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 27 is the process chart according to the another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 28 is the process chart according to the another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 29 is the process chart according to the another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 30 is the process chart according to the another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 31 is the exemplary view according to the another embodiment of liquid crystal display device manufacture method of the present invention;

Figure 32 is a kind of exemplary view of taking the panel of antistatic measure;

Figure 33 is the exemplary view that another kind is taked the panel of antistatic measure;

Figure 34 is the exemplary view of polishing step;

Figure 35 is the exemplary view of another polishing step;

Figure 36 is to use the sectional view of the bonding step of optical resin;

Figure 37 is the plan view that uses the bonding step of optical resin among Figure 36;

Figure 38 A～38C is the typical section figure of another polishing step;

Figure 39 is the sectional view of an example of liquid crystal display device constructed in accordance; And

Figure 40 is the exemplary view of an example of liquid crystal display device constructed in accordance.

Embodiment

Below, with reference to the accompanying drawings, to being described in this order, wherein show preferred embodiment according to the manufacture method of microlens array of the present invention, the liquid crystal display device that uses this microlens array, the projector of use liquid crystal display device and the manufacture method of liquid crystal display device.

1. the manufacture method of microlens array

With reference to accompanying drawing 4A～4D, will first embodiment according to the manufacture method of microlens array of the present invention be described.

In the pattern step shown in Fig. 4 A, on the substrate 1 that constitutes by clear glass etc., form first optical resin layer 2, and on the surface of first optical resin layer 2, form a plurality of lenticule faces of arranging by X-Y scheme with first refractive index.In the present embodiment, first optical resin layer 2 that is made of the UV-gel-type resin with low-refraction is pre-formed on glass substrate 1, Ni-electroforming prototype (electroformed original) punching press (stamped) that will have a plurality of lenticule faces is transferred to this lenticule face on the surface of first optical resin layer 2 on the surface of first optical resin layer 2.Solidify first optical resin layer 2 that constitutes by the UV-gel-type resin by the back side with ultraviolet ray irradiation first optical resin layer 2, fixedly to transfer to the lenticule face on first optical resin layer 2 from described glass substrate 1.

In the engagement step shown in Fig. 4 B,, join the supporting layer 4 that has been pre-formed transparent protective film 3 on it to glass substrate 1 side by encapsulant 5.This supporting layer 4 is made by cover glass.When subsequent step polished the supporting layer of being made by cover glass 4, a lip-deep diaphragm 3 that is pre-formed at supporting layer 4 used as throwing photoresist.Diaphragm 3 can be by for example SiO ₂, SiN, a-DLC (amorphous-type-diamond carbon) or Al ₂O ₃Insulating material constitute.Be used for supporting layer 4 and glass substrate 1 side engagement encapsulant 5 together are made of the resin that adds along the outer edge part of supporting layer 4, it comprises diameter glass fibre as sept in the scope of 2～3 μ m.The supporting layer 4 that outer edge part is scribbled sealant 5 is adhered to glass substrate 1 side, and between forms space in.

In the filling/screed step shown in Fig. 4 C; fill the interior space that surrounds by first optical resin layer 2 and diaphragm 3 with liquid resin with second light refractive index; and solidify this liquid resin, thereby between first optical resin layer 2 and diaphragm 3, form a microlens array.In the present embodiment, the resin that will have a high index of refraction is injected under vacuum condition in the interior space between first optical resin layer 2 and the diaphragm 3, and by this resin that is heating and curing.Alternatively, a kind of UV-gel-type resin can be expelled in this in space, and solidify by ultraviolet ray (UV) irradiation.Like this, the irregular place that is formed at the lip-deep lenticule face of first optical resin layer 2 is just had the liquid resin of second light refractive index fills, and meanwhile, the resin surface leveling relative with the lenticule face.Follow this resin solidification to form one second optical resin layer 6.Therefore by first optical resin layer 2 that has different refractivity each other and second optical resin layer 6 are piled up the formation microlens array.In the present embodiment, because the liquid resin that will be used to form second optical resin layer 6 is injected in the gap between glass substrate 1 and the supporting layer 4, therefore second optical resin layer, 6 surfaces with respect to the lenticule face have been flattened automatically.

In the removal step shown in Fig. 4 D, under the situation that diaphragm 3 uses as the resistance agent, will remove by the supporting layer 4 that cover glass is made by polishing or grinding, up on second optical resin layer 6, only staying diaphragm 3.

By this a series of step, can make the not microlens array of glass with cover.

According to present embodiment, engagement step was carried out before filling/screed step, to form the required gap of filling/screed step thereafter.More specifically, join to supporting layer 4 on first optical resin layer 2 and keep certain clearance betwixt, be injected into liquid resin in this gap and be cured.In this step, flattened simultaneously with respect to the resin surface of lenticule face.

Manufacture method according to microlens array of the present invention is not limited only to present embodiment, but can comprise that one is forming the pattern step have first optical resin layer of first refractive index and form a plurality of lenticule faces of arranging with X-Y scheme on the surface of first optical resin layer on the transparency carrier; The resin that one usefulness has second refractive index is filled irregular place on the lenticule face and the leveling resin surface with respect to the lenticule face, to form the filling/screed step of second optical resin layer; One joins the supporting layer that has been pre-formed transparent protective film on it engagement step of second optical resin layer of leveling to; And one remove this supporting layer and only keep the removal step of diaphragm on second optical resin layer.

With reference to Fig. 5 A～5C ', will second embodiment according to the manufacture method of microlens array of the present invention be described.In the present embodiment, by punching press (stamping) method, leveling is with respect to the resin surface of lenticule face.

In the pattern step shown in Fig. 5 A, surface at glass substrate 1 forms first optical resin layer 2 with first refractive index, and a Ni-electroforming prototype with a plurality of lenticule faces is stamped into the surface of first optical resin layer 2, this lenticule face is transferred on the surface of first optical resin layer 2.Similar with first embodiment, first optical resin layer is to be made of the UV-gel-type resin with low-refraction.From the rear side of glass substrate 1, be that the ultraviolet ray (wavelength is near 365nm) of 3000mJ is shone first optical resin layer 2 with energy, to solidify this UV-gel-type resin, fixedly transfer to the lenticule face on first optical resin layer 2 thus.

In the filling/screed step shown in Fig. 5 B, fill the irregular place of lenticule face with resin, and pass through the resin surface of pressing mold FS leveling in plane, to form second optical resin layer 6 with respect to the lenticule face with second refractive index.In the present embodiment, the UV-gel-type resin drop (drop) that will have high index of refraction is in the irregular place of lenticule face, and with the plane pressing mold FS leveling resin surface with respect to the lenticule face.In this case, by the ultraviolet ray irradiation second optical resin layer 6 is solidified, with second optical resin layer, 6 surfaces of fixing leveling.In addition, can replace drop method liquid resin to be offered the irregular place of lenticule face with spin-coating method.

In the film forming step shown in Fig. 5 C, form one by SiO by CVD (chemical vapor deposition) or second optical resin layer 6 surface that sputters at leveling ₂Or the diaphragm 3 of SiN formation, form the transparency electrode 7 that constitutes by ITO (indium tin oxide target) on the surface of diaphragm 3 then.

Can carry out the step shown in Fig. 5 C ' to replace the step shown in Fig. 5 C.In this step, a thin cover glass layer 4 is adhered on second optical resin layer 6 of leveling, and on cover glass layer 4, forms transparency electrode 7.Like this, in the step shown in Fig. 5 C ', cover glass layer 4 is used for replacing the diaphragm in the step 3 shown in Fig. 5 C.If desired, cover glass layer 4 can or grind by polishing and be thinned.

According to present embodiment, therefore can make a kind of substrate that comprises the LCD of the microlens array that combines transparency electrode.The advantage of this substrate is because the surface process of microlens array flattens, so when being assembled to this substrate in the liquid crystal display device, can not produce any unnecessary stress.Particularly, by adopting the step shown in Fig. 5 C, can make the microlens array that does not have cover glass.This helps reducing manufacturing expense.

With reference to Fig. 6 A～6D, will the 3rd embodiment of fabricating method of microlens array be described.In the present embodiment, by the resin surface of spin coating method leveling with respect to the lenticule face.

In the first spin coating step shown in Fig. 6 A, when on transparent glass substrate 1, forming first optical resin layer 2 with first refractive index, and form a plurality of lenticule faces of arranging (the about 7 μ m of the degree of depth) on the surface of first optical resin layer 2 and afterwards, carry out the spin coating first time with X-Y scheme.In this first spin coating process, under the rotational speed of 500～1000rpm, coating one viscosity is about the liquid resin of 100cps on the lenticule face.Like this, just formed one second optical resin layer 6 in the bottom of lenticule face.

In the second spin coating step shown in Fig. 6 B, under the rotational speed of 500～1000rpm, on recessed lenticule face again-coating viscosity is about the liquid resin of 100cps, carries out this second spin coating.

In the 3rd spin coating step shown in Fig. 6 C, under the centrifugal action that the rotational speed of 500～1000rpm produces, on recessed lenticule face again-coating viscosity is about the liquid resin of 100cps, carries out the 3rd spin coating.As the result of these three times repetition spin coatings, recessed lenticule face is filled by second optical resin layer 6 basically.

At last, in the 4th spin coating step shown in Fig. 6 D, carry out the 4th spin coating, so as with resin with lenticule face complete filling and leveling with respect to the resin surface of lenticule face.In this step, the rotational speed of spinner is set to the high value in 3000～5000rpm scope, is used for smoothly resin surface with respect to the lenticule face.

The method that can replace spin coating with the method for spraying.In this injection method, with solvent liquid resinous viscosity is arranged on tens cps, liquid resin sprays and is atomized into the particle that is of a size of tens μ m simultaneously, and then carries out drying.Spray, the liquid resin particle is flattened by its surface tension.Carry out such injection and drying repeatedly.If do not use solvent, also can use low viscous resin.

Except above-mentioned simple microlens array, developed the microlens array as collector lens has been added to as on the microlens array of field lens and the double micro-lens array that forms.Compare with single microlens array, double micro-lens array helps improving the utilization factor of light.

In common three-panel type liquid crystal projection apparatus, from light source send and incide microlens array the angle of divergence of light generally be made as about 10 °.Under the situation of using microlens array, owing to become big in the angle of divergence of liquid crystal panel outgoing one sidelight, although therefore the angle of divergence of incident angle is done very greatly, light is projected lens recoils (kick) and the corresponding utilization factor that reduces light.Equally, from the viewpoint that the increase that prevents with the angle of divergence that incides the liquid crystal panel glazing causes contrast to reduce, also will be within the specific limits with the incident angle restriction.

On the contrary, under the situation of double micro-lens array, because second lens (field lens) are set makes it leave the distance of first lens (collector lens), second focal length of lens on the incident light direction, by the angle of divergence control of the power of lens (power) of double micro-lens array decision the angle of divergence from (field lens arrange type) panel emergent light, reduce the degree that light is projected the lens recoil thus, thereby improve the utilization factor of light.

The double micro-lens array (DMLs) that is used for liquid crystal panel has two kinds of distributed architectures.Generally, one active array type liquid crystal panel has stacked structure, by will provide the driving substrate of the switching device of thin film transistor (TFT), pixel electrode etc. for example to join to the subtend of counter electrode substrate is provided and be fixed on driving substrate and the subtend substrate between liquid crystal form.The characteristics of first kind of DML distributed architecture are that DML is set at subtend substrate one side.The characteristics of second kind of DML distributed architecture are that the microlens array of DML is set at the subtend substrate-side, and another microlens array of DML is set at the driving substrate side, wherein liquid crystal is fixed between them.

Such DML must adapt to the development trend of pixel high-resolution.For reducing panel size, must reduce Pixel Dimensions pro rata with the panel size that reduces, correspondingly, the single lenticular spacing of arranging must reduce.So just need to shorten lenticular focal length and while attenuate cover glass.In these require, shorten the lenticule focal distance ratio and be easier to realize; But the attenuate cover glass is more many than difficulty under the single microlens array situation.

General by with the mutual bonding DML structure of making of two single microlens arrays (SMLs).Like this, in order to satisfy high-resolution needs, all stricter than the control among the common SML to the control of the cover glass of each SML and the thickness of optical resin layer etc.

With reference to Fig. 7, will describe the basic configuration of the liquid crystal display device (liquid crystal panel) that forms DML in the subtend substrate-side and the problem that will solve thereof.As shown in the figure, liquid crystal display device has with encapsulant 31 and joins driving substrate 10 to subtend substrate 20, and with sealing liquid crystal in substrate 10 and 20 s' gap and the overlaying structure that constitutes.Driving substrate 10 is formed by glass pedestal 11, and on its surface with the matrix figure in conjunction with the switching device of thin film transistor (TFT) for example with comprise the pixel 12 of pixel electrode.Pixel 12 is separated mutually by grid-shape black matrix" 13.

On subtend substrate 20, form double micro-lens array DML and counter electrode (not shown).DML is fixed between glass substrate 21 and the cover glass 22, and has by piling up the overlaying structure that low refractive index resin layer 23, high refractive index resins layer 24 and low refractive index resin layer 25 constitute mutually.Low refractive index resin layer 23 and 25 constitutes by fluoro-base resin, silicon-Ji resin or acrylic acid-Ji resin, and high refractive index resins layer 24 is made of acrylic acid-Ji resin, epoxy-Ji resin or thioxanthamide-Ji resin.The one ML (collector lens) is formed on the interphase between low refractive index resin layer 23 and the high refractive index resins layer 24, and the 2nd ML (field lens) then is formed on the interphase between high refractive index resins layer 24 and the low refractive index resin layer 25.

Along with development trend corresponding to pixel high-resolution, pel spacing narrows down, improve to the principal point of the 2nd ML to the distance on cover glass 22 surfaces 1., the distance of principal point to the two ML principal points of a ML 2. and control and the precision 3. of the orientation value between a ML and the 2nd ML become very important.1., 2. and 3. these parameters have determined the light collection rate (light collection ratio) of DML.In order to realize function, in these parameters, need 2. carry out strictness control to the distance of principal point to the two ML principal points of a ML to field pattern DML.

Fig. 8 is the 1. graph of relation of (principal point of the 2nd ML is to the distance on cover glass surface) of light collection rate and parameter.It should be noted that the light collection rate is to represent with the effective aperture ratio of pixel.Shown in curve map, in order to obtain very high light collection rate value, preferably 1. parameter is arranged on approximately≤scope of 5 μ m in, and, preferably 1. parameter is arranged in order to keep corresponding higher light collection rate value≤scope of 10 μ m in.Therefore, the thickness of the cover glass 22 of the 2nd ML need be become very thin.The curve map of Fig. 8 shows the curve of two different parameters.As based on any one of these two curves, clearly 1. parameter should be controlled at≤scope of 10 μ m in.It should be noted that at pel spacing to be set to 18 μ m * 18 μ m, and be set to from light emitted and the angle of divergence that incides the light of panel under 10 ° the condition, describe measurement data and obtain the curve of Fig. 8.

2. liquid crystal display device

With reference to Fig. 9 A～9E, will first embodiment according to liquid crystal display device of the present invention be described.

Fig. 9 A～9E is the typical process figure of the formation step of liquid crystal display device in the expression present embodiment.

Present embodiment is characterised in that double micro-lens array is formed on the subtend substrate-side.

Fig. 9 A represents to prepare the step of a ML substrate and the 2nd ML substrate.Formation one has the resin bed 23 of low-refraction on a ML substrate 21, has been pre-formed the lenticule face by process for stamping on the surface of resin bed 23.On the 2nd ML substrate 22, form one as the diaphragm 26 of throwing photoresist, and on diaphragm 26, form a resin bed 25 with low-refraction, be pre-formed the lenticule face on the surface of resin bed 25 by process for stamping.Diaphragm 26 is by Al ₂O ₃Or a-DLC constitutes.When in following step, the 2nd ML substrate 22 being polished, can guarantee the homogeneity of polishing as the diaphragm 26 of resistance agent.By Al ₂O ₃Or the diaphragm that a-DLC constitutes is transparent, and can have about 100nm or thicker thickness, to realize effectively hindering the agent function.Can form diaphragm 26 by sputtering technology or PECVD (plasma enhanced chemical vapor deposition) technology.Resistance agent film needs not to be transparent.For example, can wait by the a-Si that deposit thickness is approximately 1 μ m and form this resistance agent film.The lenticule mask that is formed on each low refractive index resin layer 23 and 25 has the aspheric surface shape (ellipse or hyperbola) of a radius-of-curvature and regulation aspheric constants, so that mate with pel spacing, proofreaies and correct efficient thereby obtain maximum light.

Fig. 9 B represents step that a ML substrate and the 2nd ML substrate are bonded with each other.Outer edge part at one of a ML substrate 21 and the 2nd ML substrate 22 applies the encapsulant of being made up of epoxy resin or acryl resin 27.After the mutual orientation of orientation mark quilt of a ML substrate 21 and the 2nd ML substrate 22, that a ML substrate 21 and the 2nd ML substrate 22 is stacked mutually.Be used for the epoxy resin of encapsulant 27 or acryl resin belongs to the UV-curing type or UV-curing/heat-curing is compound.Contain glass fibre or the plastic bead that quantity is 1～5wt% in advance as the resin of encapsulant 27, be used to make the principal point of a ML and the distance between the 2nd ML principal point focal length corresponding to the 2nd ML as spacer.For example, if pixel is arranged with the pel spacing of 18 μ m, the focal length of a ML (equivalence value in the air) is approximately 65 μ m, and the focal length of the 2nd ML (equivalence value in the air) is approximately 40 μ m; And each aspheric constants K of a ML and the 2nd ML is approximately-1.3.In addition, the refractive index of described low refractive index resin is arranged in 1.41～1.45 the scope, and the refractive index of the high refractive index resins of introducing after a while is arranged in 1.60～1.66 the scope.Like this, in order to satisfy, the distance (equivalence value in the air) of principal point and the 2nd ML principal point of a ML need be set to about 40 μ m to the field distribution condition.Therefore, in subsequent step, be that 1.60 high refractive index resins is filled under the situation in gap between the first and second ML substrates 21 and 22 with refractive index, thickness that can encapsulant 27 is set to guarantee that gap size is approximately the numerical value of 40/1.6=25 μ m.Particularly, can encapsulant 27 in the particle size of contained plastic bead be set to the value that calculates near by equation [25 μ m-(D1+D2)], shown in Fig. 9 B, wherein D1 is the thickness of low refractive index resin layer 23, D2 is the thickness of low refractive index resin layer 25.In fact, consider the resin settled when the punching press resin, must determine the thickness of encapsulant 27.

Fig. 9 C is illustrated in the step that forms double micro-lens array between the first and second ML substrates.A kind of high refractive index resins 24 vacuum are injected in the ML substrate 21 and the gap between the 2nd ML substrate 22 that is engaged with each other by encapsulant 27, to form double micro-lens array.At pel spacing is under the situation of 14 μ m, preferably with the orientation precision setting of 22 of a ML substrate 21 and the 2nd ML substrates in scope less than ± 1.0 μ m.The high refractive index resins 24 that is injected between a ML substrate 21 and the 2nd ML substrate 22 is heating and curing.If resin 24 is UV-gel-type resins, by ultraviolet ray (UV) irradiation cured resin 24.If desired, can make the resin 24 between the first ML substrate 21 and the 2nd ML substrate 22 keep liquid.

Fig. 9 D represents by polishing or grinds the step of removing the 2nd ML substrate.Remove the 2nd ML substrate 22 by polishing or grinding, remove degree of depth up to this and arrive as the diaphragm 26 that hinders agent.Particularly, can use for example Ce ₂O ₃CMP (chemical-mechanical polishing) technology the 2nd ML substrate 22 is polished.If diaphragm 26 is made of a-Si (amorphous silicon), when make by polishing a-Si film (diaphragm) 26 as the resistance agent be exposed to outer after, polishing that can be by using silica is with 26 removals of a-Si film.

By removing the 2nd ML substrate 22, can obtain on the subtend substrate-side, to have the structure of DML.In this step, because polishing is to carry out under with the condition of diaphragm as the resistance agent, thus can thoroughly remove the 2nd ML substrate (cover glass), and increase the homogeneity of polishing simultaneously, therefore can improve the utilization factor and the image quality of light.

Fig. 9 E represents to finish the step of liquid crystal display device.Counter electrode 28 is formed on the surface of the diaphragm 26 that exposes by polishing, to obtain combining the subtend substrate 20 of DML.With encapsulant 31 driving substrate 10 is joined on the subtend substrate 20, and liquid crystal 30 is sealed in the gap between them, thereby obtain liquid crystal display device.In addition, the switching device of for example thin film transistor (TFT) (TFTs) and pixel electrode are attached on the surface of driving substrate 10 in advance.

As mentioned above, liquid crystal display device according to present embodiment has panel construction, comprised the driving substrate 10 that formed pixel electrode on it at least and be used to drive the switching device of pixel electrode, formed the subtend substrate 20 of counter electrode 28 on it at least and be placed in liquid crystal layer 30 between two substrates 10 and 20 that wherein two substrates 10 and 20 engages and makes pixel electrode face counter electrode 28 and certain interval is set therebetween.To be assemblied at least on the subtend substrate 20 by the microlens array that constitutes with the lenticule of arranging corresponding to the X-Y scheme of the figure of arranging of pixel electrode.

As the characteristics according to the liquid crystal display device of present embodiment, microlens array has the rear surface that engages with a ML substrate 21 that constitutes subtend substrate 20 and the front surface of leveling.

On the leveling surface of microlens array, form counter electrode 28 by diaphragm 26.More properly; the diaphragm 26 that is pre-formed supporting on (the 2nd ML substrate 22) is adhered on the leveling surface of microlens array; by removing this support (the 2nd ML substrate 22) diaphragm 26 is come out, and on the diaphragm 26 that exposes, form counter electrode 28.As mentioned above, diaphragm 26 can be by Al ₂O ₃, a-DLC, TiO ₂, SiN or Si constitute.

According to present embodiment, microlens array is configured to the double micro-lens array of dual structure, and it has and is set at away from liquid crystal layer 30 1 sides and as first microlens array of collector lens and be set near liquid crystal layer 30 1 sides and as second microlens array of field lens roughly.Distance between lenticular principal point of each of second microlens array and the liquid crystal layer 30 is defined in≤scope of 10 μ m in.

Figure 10 A～10E is a process chart of representing the formation step of liquid crystal display device as a reference example.In these figure, for the ease of understanding, use identical Reference numeral with the corresponding parts of parts of liquid crystal display device among the embodiment shown in Fig. 9 A～9E.

The difference of embodiment shown in this reference example and Fig. 9 A～9E is not insert between the 2nd ML substrate (cover glass) and low refractive index resin layer any as the diaphragm of throwing photoresist.

In the step of Figure 10 A, a ML substrate 21 and the 2nd ML substrate 22 are oppositely arranged; In the step of Figure 10 B, with encapsulant 27 a ML substrate 21 is bonded with each other with the 2nd ML substrate 22 and is in the same place; And in the step of Figure 10 C, fill the ML substrate 21 that is bonded with each other and the gap between the 2nd ML substrate 22 with high refractive index resins 24.Formed a double micro-lens array thus.

In the step of Figure 10 D, remove the 2nd ML substrate (cover glass) 22 by polishing or grinding.In this step, as mentioned above,, principal point and the distance between the cover glass surface (equivalence value in the air) of the 2nd ML roughly can be arranged on by the thickness of cover glass being reduced to about 10 μ m≤scope of 5 μ m in.; do not use any resistance agent by the polishing thickness of cover glass is reduced under the situation of about 10 μ m; because the cover glass residual thickness becomes too thin; so shown in Figure 10 D '; cover glass can often be tilted polishing; perhaps in polishing step, cover glass may be cracked and be caused its damage.This can cause departing from of glass and resin boundary in the change of light collection rate or the image on projecting to it, and causes the serious decline of image quality thus.

In the step of Figure 10 E, on the polished surface of the 2nd ML substrate 22, form the counter electrode (not shown) of making by ITO etc., to form subtend substrate 20, and the subtend substrate is bonded with each other with driving substrate 10 is in the same place, then liquid crystal 30 is sealed in the gap between them, obtains a liquid crystal panel thus.Liquid crystal panel for such acquisition, if the polishing of the thickness of the 2nd ML substrate 22 is inhomogeneous, this liquid crystal panel can cause departing from of the border between the cover glass 22 and low refractive index resin layer 25 in the image on projecting to it, and causes the serious decline of image quality thus.

With reference to Figure 11 A～11E, with second embodiment of explanation according to liquid crystal display device of the present invention.

Figure 11 A～11E is the process chart that liquid crystal display device forms step in the present embodiment.

The characteristics of present embodiment are to form double micro-lens array in the subtend substrate-side, and the method that the formation method of the single microlens array (SML) shown in Fig. 4 A～4D is used to form double micro-lens array.

Figure 11 A represents the formation step of first microlens array and second microlens array.

Support formation optical resin layer 23a on 21 first, form the first lenticule face of arranging with X-Y scheme on the surface of this optical resin layer 23a.The optical resin 23 that uses refractive index to be different from the refractive index of optical resin layer 23a is filled the irregular place of the first lenticule face, and leveling forms first microlens array thus with respect to the surface of the optical resin 23 of lenticule face.In the present embodiment, the optical resin 23 that is used to fill the irregular place of lenticule face has for example about 1.4 low-refraction.Can use above-mentioned process for stamping, spin coating method or injection method to flatten the surface of optical resin 23.

Similarly, support the diaphragm 26 that forms on 22 as the throwing photoresist, and on diaphragm 26, form optical resin layer 25a, form the second lenticule face of arranging on the surface of optical resin layer 25a then with X-Y scheme second.The optical resin 25 that is different from the refractive index of optical resin layer 25a with refractive index is filled the irregular place of the second lenticule face, and leveling forms second microlens array thus with respect to the surface of the optical resin 25 of lenticule face.Optical resin 25 also has and is approximately 1.4 low-refraction.Can use above-mentioned process for stamping, spin coating method or injection method to flatten the surface of the optical resin 25 of filling the lenticule face.

Figure 11 B represents the step that first and second microlens arrays are stacked.Be coated in the outer edge part of one of support 21 and 22 with encapsulant 27.To support 21 and 22 mutual orientations and stack together based on the orientation mark.Encapsulant 27 contains for example spacer of high precision plastic optical fibre, the thickness of encapsulant 27 is remained on≤scope of 10 μ m in.

Figure 11 C represents step that first and second microlens arrays are together with each other.Under the state of the first lenticule face and the second lenticule face orientation,, thereby two microlens arrays are together with each other the leveling surface engagement of first microlens array leveling surface to second microlens array.As a result, between supporting 21 and 22, formed the gap suitable with the thickness of encapsulant 27.

Figure 11 D represents by inject the step that resin forms double micro-lens array in the gap.Refractive index is approximately 1.6 high index of refraction liquid resin 24 to be injected in the gap of being determined by the thickness of encapsulant 27.The resin 24 that is heating and curing then forms double micro-lens array.In order to make in the resin 24 not residual stress, preferably solidify the high refractive index resins 24 of filling the gap very slowly.Doing to throw under the situation of photoresist with diaphragm 26, removing by polishing and support 22, the surface of exposing diaphragm 26.On the surface that diaphragm 26 exposes, form the counter electrode that constitutes by ITO etc., to form subtend substrate 20.

Figure 11 E represents to finish the step of liquid crystal display device.Subtend substrate 20 is joined on the previously prepared driving substrate 10, and with sealing liquid crystal therein.Obtain liquid crystal panel thus.

According to present embodiment,, therefore can obtain a kind of high precision double micro-lens array structure that does not have stress because the single microlens array of leveling in advance is bonded with each other.

Figure 12 has the common configuration of liquid crystal display device of DML structure with reference to figure, wherein a microlens array is arranged on the subtend substrate-side and another microlens array is arranged on the driving substrate side.Liquid crystal display device shown in the figure has with encapsulant 31 with driving substrate 10 with subtend substrate 20 is bonded with each other and with sealing liquid crystal panel construction therein.Subtend substrate 20 is made of glass substrate 21 and cover glass 22.The one ML is inserted between glass substrate 21 and the cover glass 22, and a ML who wherein act as collector lens is positioned at incident one side.Pile up formation the one ML by the resin bed 23 and 24 that will have different refractivity.

Driving substrate 10 generally comprises the TFT substrate 11 that combines thin film transistor (TFT) and pixel electrode.TFT substrate 11 is thinned by polishing usually.Pixel 12 is attached on the surface of TFT substrate 11.Pixel 12 is separated mutually by grid-shape black matrix" 13.One the 2nd ML that act as field lens is inserted between a TFT substrate 11 and the rear side assisting base plate.Pile up by the resin bed 15 and 16 that will have different refractivity equally and form the 2nd ML.

In liquid crystal display device with such DML structure, the thickness of the TFT substrate 11 after the polishing 1., the distance between the principal point of the principal point of a ML and the 2nd ML 2. and the orientation precision between a ML and the 2nd ML 3. be the important function parameter.

In order to realize so-called field distribution, this parameter 2. (distance between the principal point of the principal point of a ML and the 2nd ML) need be corresponding to the focal length of the 2nd ML.In fact, if the deviation between the focal length of distance between two principal points and the 2nd ML at about 10% o'clock, the 2nd ML roughly uses as field lens.In order to realize this purpose, need parameter 1. (thickness of the TFT substrate 11 after the polishing) little of being approximately 10～50 μ m.

Yet, consider and form TFT substrate with minimal thickness like this, crackle or cracked problem may take place in the TFT substrate in polishing process with regard to having occurred, simultaneously also may be in forming the 2nd ML process because the contraction during resin solidification causes the problem of stress or fold.

As described below, use according to above-mentioned planarization technology of the present invention, can solve such problem.

In order to improve the brightness of liquid crystal projection apparatus, shown in Figure 9, the microlens array of DML is formed on driving substrate one side and another texture ratio that is formed on subtend substrate one side will be got well the structure that two microlens arrays of DML all are formed on subtend substrate one side.

Be formed in the situation of subtend substrate-side at microlens array DML, though realized effective collection to light by the microlens array of DML, but invalid resin can recoil the light of gathering such as the black matrix" that surrounds pixel in the driving substrate side, thereby reduces effective aperture ratio.On the contrary, be arranged on driving substrate one side and another is arranged in the structure of subtend substrate one side at a microlens array with DML, by shortening the focal length of a ML, can gather the light that sends from light source as much as possible, and make so many collection light by being positioned at the pixel aperture of TFT substrate-side.Simultaneously, so that the principal point of the 2nd ML leaves the mode that the distance of the principal point of a ML equals the 2nd ML focal length is provided with, make the 2nd ML relative with a ML and make the TFT substrate between them as field lens the 2nd ML simultaneously.

With reference to Figure 13 A～13F, with three embodiment of explanation according to liquid crystal display device of the present invention.

Figure 13 A～13F is the process chart that the liquid crystal display device of present embodiment forms step.

The characteristics of present embodiment are a microlens array in the DML structure is arranged on driving substrate one side, and another is arranged on subtend substrate one side.

Figure 13 A represents to prepare the step of TFT substrate.Preparation TFT substrate 11 is pre-formed TFTs and pixel electrode thereon.In the drawings, only illustrate and be used for, and TFTs and pixel electrode are not shown the separated black matrix" 13 of pixel.

Figure 13 B represents pedestal glass is bonded to step on the TFT substrate.Bonding agent 41 by for example wax bonds to pedestal glass 40 on the surface of TFT substrate 11.

Figure 13 C represents the step to the TFT substrate polishing.The rear surface of TFT substrate 11 is polished to 20 μ m or thinner thickness under the state of being fixed by pedestal glass 40.

Figure 13 D represents to prepare the step of the glass substrate with the 2nd ML.Preparation one has been pre-formed the glass substrate 14 of the 2nd ML on it.The resin bed 15 and 16 that the 2nd ML has by different refractivity is stacked each other on the structure that forms together.Use the surface evening of above-mentioned process for stamping or spin coating method handle with respect to second resin bed 16 of lenticule face.With thickness is on peripheral part of the encapsulant 18 of 2～3 μ m surface of polished that is coated in TFT substrate 11.

Figure 13 E represents by joining the TFT substrate to step that glass substrate forms driving substrate.Under the state of the pixel that is formed at TFT substrate 11 sides and the 2nd ML orientation that is formed on glass substrate 14 sides, TFT substrate 11 is stacked on the glass substrate 14.The gap of using bonding agent 19 to fill between the stacked substrate 14 and 11 is bonded with each other substrate 14 and 11 thus.Here since with the leveling surface engagement of the 2nd ML to the surface of polished of TFT substrate 11, therefore can solve the problem of relevant stress in the prior art.So just obtain finishing the driving substrate 10 of closing the 2nd ML., unnecessary pedestal glass 40 removed, and will remain in the 11 lip-deep bonding agents separation of TFT substrate such as wax thereafter.

Figure 13 F represents to finish the step of liquid crystal display device.Preparation combines the subtend substrate 20 of a ML in advance.This subtend substrate 20 comprises a glass substrate 21, a cover glass 22 and is fixed on a ML between them.The one ML has that resin bed 23 and 24 by different refractivity piles up mutually and the stacked structure that forms.The subtend substrate 20 that combines a ML is joined on the driving substrate 10 that combines the 2nd ML, and liquid crystal is sealing in the gap between them, thereby obtain liquid crystal display device.A ML who is included in the subtend substrate 20 act as collector lens, and the 2nd ML that is formed on the driving substrate 10 act as field lens.

As mentioned above, liquid crystal display device shown in Figure 13 A～13F has panel construction, comprise: formed pixel electrode on it at least and be used to drive the driving substrate 10 of the switching device of pixel electrode, at least formed the subtend substrate 20 of counter electrode on it, and be placed in liquid crystal layer between two substrates 10 and 20, wherein two substrates 10 and 20 engages and makes pixel electrode relative with counter electrode and keep certain interval therebetween.

To be included at least in the driving substrate 10 by the microlens array that constitutes with the lenticule of arranging corresponding to the X-Y scheme of the spacing of arranging of pixel electrode.This microlens array (the 2nd ML) has the stacked structure of first optical resin layer 15 and second optical resin layer 16, first optical resin layer 15 has first refractive index and has the lenticule face of arranging with X-Y scheme, and second optical resin layer 16 has second refractive index and fills the irregular place of this lenticule face and have the leveling surface.(the 2nd ML) joins TFT substrate 11 to this microlens array, and the leveling surface of second optical resin layer 16 is contacted with the rear surface of TFT substrate 11.By fill the lenticule face of first optical resin layer 15 with resin (being used to form second optical resin layer 16), and flatten the surface of second resin bed 16 relative with the lenticule face with this resin surface of pressing mold punching press with plane, to obtain this microlens array (the 2nd ML).Alternatively, can use above-mentioned polishing technology to replace uses the punching press of pressing mold to flatten operation.This polishing technology may further comprise the steps: a supporting layer that has been pre-formed on it as the protective seam of throwing photoresist is bonded on first optical resin layer, keeps certain interval therebetween; Fill this gap and resin is cured with liquid resin, to form second optical resin layer; And by polishing the removal supporting layer to expose protective seam.In present technique, the surface that protective seam is exposed is as the leveling surface of second optical resin layer.

According to present embodiment, microlens array (ML) is set in the subtend substrate 20 in the mode that is complementary with the microlens array (the 2nd ML) that is arranged in the driving substrate.This microlens array (ML) is as collector lens, and microlens array (the 2nd ML) is as field lens.TFT substrate 11 to driving substrate 10 polishes so that its attenuation from its back side.With the leveling surface engagement of second optical resin layer 16 of microlens array (the 2nd ML) to the surface of polished of TFT substrate 11.

Figure 14 A is the typical cut-open view of the completion status of liquid crystal display device shown in Figure 13 A～13F, and Figure 14 B is the partial enlarged view of Figure 14 A.

As mentioned above, by skim bonding agent 19 the 2nd ML is joined on the surface of polished of TFT substrate 11.Here, to the rear surface of the TFT substrate 11 that is thinned, be the surface engagement that flattens in advance of the 2nd ML particular importance.

For example, under the situation of TFT substrate 11 as 0.7 inch TFT substrate (pel spacing is 18 μ m) of SVGA (SVGA), if the focal length of a ML (equivalence value in the air) is approximately 35 μ m, and the focal length of the 2nd ML (equivalence value in the air) is approximately 42 μ m, the principal point of the one ML is approximately 20 μ m to the interfacial distance (equivalence value in the air) of liquid crystal layer 30, the thickness of liquid crystal layer 30 (equivalence value in the air) is 2 μ m, and the distance (equivalence value in the air) of the principal point of interphase to the two ML of liquid crystal layer 30 is approximately 20 μ m.In this case, be reduced to about 27 μ m (equivalence value in the air: actual (real) thickness about 18 μ m) by the thickness that polishes TFT substrate 11.Like this, TFT substrate 11 is just extremely thin, therefore, as in art methods, under high refractive index resins 16 and situation that TFT substrate 11 contacts, if solidify or be heating and curing high refractive index resins 16 is solidified, because the stress that produces in curing can make 11 distortion of TFT substrate by UV-.Such distortion meeting causes adverse influence to image quality.

In order to solve such problem, according to the present invention, the surface of leveling in advance of the 2nd ML is bonded on the rear surface of TFT substrate 11, suppress the appearance of stress thus.

As shown in Figure 14B, at position A, B, C place, the resin bed 16 of the 2nd ML has different thickness.If following the 2nd ML of the state that is not flattened on the surface of resin bed 16 joins on the TFT substrate 11, the locality difference of the amount of contraction of resin bed 16 can cause the distortion of TFT substrate 11 in the curing.

With reference to Figure 15 A～15F, with four embodiment of explanation according to liquid crystal display device of the present invention.

Figure 15 A～15F is the process chart of formation step of the liquid crystal display device of expression present embodiment.

The characteristics of present embodiment are a microlens array in the DML structure is arranged on the driving substrate side and another is arranged on the subtend substrate-side.

Figure 15 A represents to prepare the step of a complete liquid crystal panel.Prepare a complete liquid crystal panel 50, it has the stacked structure by subtend substrate 20 being stacked to TFT substrate 11 and enclosing liquid crystal 30 betwixt.The thickness of subtend substrate 20 for example is 1.1mm and comprises one the one ML.The thickness of TFT substrate 11 is 0.8～1.2mm, in its surface in conjunction with TFTs and pixel electrode.

Figure 15 B represents anchor clamps (jig) are stacked to step on the subtend substrate.The anchor clamps 40 that are made of blue sheet glass are bonded to subtend substrate 20 1 sides by wax.

Figure 15 C represents step that the TFT substrate is polished.Panel by anchor clamps 40 securing situations under, the rear surface of TFT substrate 11 is polished, become about 10～20 μ m up to the thickness of TFT substrate 11.

Figure 15 D represents to prepare the step of the glass substrate with the 2nd ML.At the periphery coating encapsulant 18 of the surface of polished of TFT substrate 11, meanwhile, preparation one has been pre-formed the glass substrate 14 of the 2nd ML on it.The optical resin layer 15 and 16 that the 2nd ML has by different refractivity piles up the stacked structure that forms.

Figure 15 E represents liquid crystal panel is joined to step on the glass substrate.Liquid crystal panel 50 with glass substrate 14 orientations, is engaged in this place through bonding agent (encapsulant) 18 then.At this moment, the glass substrate 14 that is combined with the 2nd ML is engaged on the surface of polished of TFT substrate 11, to form driving substrate 10.High refractive index resins 19 is injected in the gap between the leveling surface of TFT substrate 11 and the 2nd ML.

Figure 15 F represents to remove the step of de-chucking.Unwanted anchor clamps 40 finally are removed.

So just obtained a panel with following structure: the subtend substrate 20 that will be combined with a ML joins on the driving substrate 10 that comprises the 2nd ML, and liquid crystal 30 is enclosed therebetween.For this panel, because leveling is passed through on the surface of the 2nd ML, and compares with the thickness of liquid crystal layer 30, the thickness of resin bed 19 is extremely thin, so can prevent to be created in the differential contraction stress in the cured resin process.

To the 5th embodiment according to liquid crystal display device of the present invention be described with reference to Figure 16.

Figure 16 is the typical cut-open view of liquid crystal display device optical characteristics in the expression present embodiment, and it has and is arranged on the subtend substrate-side and another is arranged on the panel construction of driving substrate side with one in a pair of microlens array.More properly, the lens face that will have light-focusing function is arranged on subtend substrate one side, and the lens face that will have to field function (field function) is arranged on TFT substrate (driving substrate) side.This liquid crystal panel comprises a TFT substrate 50B and a subtend substrate 50A, and this subtend substrate 50A is arranged on light entrance face one side of TFT substrate 50B in mode relative with TFT substrate 50B and that accompany liquid crystal layer 45 therebetween.

Subtend substrate 50A comprises the subtend substrate 44A of a glass substrate 41, a resin bed 43A, one first microlens array 42A and an attenuation, they from light inlet side according to the said sequence setting.TFT substrate 50B comprises TFT substrate 44B, one second microlens array 42B, a resin bed 43B and a glass substrate 48 of pixel electrode 46, black matrix" 47, attenuation, they from light inlet side according to the said sequence setting.

The first microlens array 42A is made of a kind of optical resin, and has a plurality of according to the first lenticule 42M-1 that arranges corresponding to the X-Y scheme of the figure of arranging of pixel electrode 46.Each lenticule 42M-1 comprises the first lens face R1 that has positive amplification ratio and act as collector lens.In the present embodiment, the refractive index n 1 of resin bed 43A and the refractive index n of the first microlens array 42A 2 satisfy following relation: n2＞n1, and the first lens face R1 protrudes (light source one side) towards light inlet side.

Similar with the first microlens array 42A, the second microlens array 42B is made of a kind of optical resin, and has a plurality of according to the second lenticule 42M-2 that arranges corresponding to the X-Y scheme of the figure of arranging of pixel electrode 46.Each lenticule 42M-2 comprises the second lens face R2 that has positive amplification ratio and act as field lens.Therefore, the focus of the second lens face R2 of the second lenticule 42M-2 is roughly corresponding to the principal point (seeing by the optical path shown in the dotted portion among the figure) of the first lens face R1 of the first lenticule 42M-1.In the present embodiment, the refractive index n 4 of resin bed 43B and the refractive index n of the second microlens array 42B 3 satisfy following relation: n4＞n3, and the second lens face R2 protrudes towards light inlet side.

Double micro-lens array in the present embodiment has following structure: each pixel aperture between lenticule 42M-1 and 42M-2, more properly, between lens face R1 and R2.On optical axis 60, the position of the synthetic focus of lenticule 42M-1 and 42M-2 is near pixel aperture (seeing the optical path that solid line is represented among the figure).Can control the orientation of synthesizing focus and pixel aperture by the thickness of adjusting between each lenticule 42M-1 and 42M-2 and the pixel aperture.Such configuration is best for improving effective aperture ratio; But this is considered to the most difficult manufacturing.According to the present invention, can overcome the difficulty in these manufacturings, and realize double micro-lens array structure as shown in the figure.

With the 6th embodiment that is described with reference to Figure 17 according to liquid crystal indicator of the present invention.

Figure 17 is the integrally-built typical section figure of liquid crystal indicator that an expression has the panel construction of present embodiment.

Present embodiment is characterised in that the small size display panels of having realized having the high resolving power characteristics.

Display panels as shown in the figure is constructed to make subtend substrate 20 to be bonded on the driving substrate 10, leaves a specific gap therebetween, and liquid crystal 30 is enclosed in this gap.As mentioned above, the lenticule ML that is used as collector lens is formed in the subtend substrate 20, and the lenticule ML that is used as field lens is combined on the driving substrate 10.

The sweep trace 104 and the signal wire 105 that are perpendicular to one another are set on the inside surface of driving substrate 10.Pixel electrode 106 and each point of crossing that intersects each other with cells arranged in matrix online 104 and 105 as the thin film transistor (TFT) (TFT) of pixel switch.Yet unshowned is to be provided with an alignment film that handled by friction (rubbing) on the inside surface of driving substrate 10.Counter electrode 112 is formed on the inside surface of subtend substrate 20.Yet unshowned is also to be provided with an alignment film that has been rubbed and handled on the inside surface of counter electrode 112.

Polarizer 110 and 111 is arranged on the driving substrate 10 that is engaged with each other and two outsides of subtend substrate 20 assemblies, wherein Polarizer 110 is arranged on driving substrate 10 sides, leave certain interval therebetween, Polarizer 111 is arranged on subtend substrate 20 sides, leaves certain interval therebetween.The one scan pulse is applied on the sweep trace 104, so that select TFTs along sweep trace 104; And a signal is applied on the signal wire 105, so that be written on the pixel electrode 106 at place, the point of crossing between sweep trace 104 and the signal wire 105.One voltage is applied between pixel electrode 106 and the counter electrode 112, activates liquid crystal 30.Owing to the be activated transmission quantitative changeization of the incident white light that produces of liquid crystal layer 30 is extracted by a pair of Polarizer 110 and 111 that is arranged on cross Nicols (nicol) position, realize that the image of expecting shows.

The structure of projector is: by means of the enlarging projection optical system, this image demonstration is projected on the screen that is positioned at the liquid crystal panel front.If adopting, this projector has as the microlens array of collector lens with as the double micro-lens array structure of the assembly of the microlens array of field lens, can expect the utilization factor that improves the light of launching from light source so, thereby obtain to have the screen of high brightness.

Describe below and use projector of the present invention.

3. projector

One embodiment of projector of the present invention will be described with reference to Figure 18.Figure 18 is the canonical schema that expression one comprises the projector of display panels shown in Figure 17.Projector as shown in the figure is so-called three-screen type, wherein by using three transmissive type liquid crystal panel to realize COLOUR IMAGE VISUALIZATION OF HE, and each liquid crystal panel microlens array of comprising according to the present invention being constructed wherein.

The projector of present embodiment comprises a light source 211, a pair of more than first and second-lens arra colligator 212 and 213 and one complete-catoptron 214, this completely reflecting mirror 214 so that light path (optical axis 210) to more than second-lens arra colligator 213 sides rotate the mode that is similar to 90 ° be arranged on more than first and second-lens arra colligator 212 and 213 between.A plurality of lenticule 212M with X-Y scheme be arranged on more than first-lens arra colligator 212 in, similarly, a plurality of lenticule 213M with X-Y scheme be arranged on more than second-lens arra colligator 213 in.Many-lens arra colligator 212 and 213 all is used for balanced luminance brightness and distributes, and has the function that incident light is divided into a plurality of little luminous fluxes.

Light source 211 emissions comprise the white light of the required ruddiness component of COLOUR IMAGE VISUALIZATION OF HE, blue light component and green light components.Light source 211 is by the transmitter (not shown) of emission light and be used to reflect and gather from the light emitted concavees lens of transmitter and form.The example of transmitter (emitter) comprises Halogen lamp LED, metalized lamp and xenon lamp.Concavees lens preferably have the shape that can improve light collection efficient, for example shape of rotation-symmetry (as the ellipse of revolution face or the paraboloid of revolution).

Projector also comprises PS synthin 215, collector lens 216 and spectroscope 217, and they are set at more than second-the beam projecting side of lens arra colligator 213 sides by this order.Spectroscope 217 has the function of a separating incident light, for example is divided into ruddiness component LR and other colorama components.

PS synthin 215 is provided with a plurality of half-Bo plate 215A, and the position of each half-Bo plate 215A is corresponding to the gap between adjacent two lenticules of more than second-lens arra colligator 213.PS synthin 215 has the function that incident light L0 is divided into two kinds of polarized light components (P-polarized light component and S polarized light component) L1 and L2.PS synthin 215 also has the effect by half-wave plate 215A, makes polarized light component L2 (as P-polarized light component) keep its polarization direction simultaneously from 215 outgoing of PS synthin; And polarized light component L1 (as the S polarized light component) is converted to the function of another polarized light component (as P-polarized light component).

Projector also comprises a complete-catoptron 218, a field lens 224R and a liquid crystal panel 225R, and they are along going up series arrangement by the optical path (optical path) of spectroscope 217 isolated ruddiness component LR.Entirely-catoptron 218 reflexes to liquid crystal panel 225R with spectroscope 217 isolated ruddiness component LR.Based on picture intelligence, liquid crystal panel 225R has the function of the ruddiness component LR that incides on it being carried out three-dimensional modulation by field lens 224R.

Projector also comprises a spectroscope 219, along the optical path setting by 217 isolated other colorama components of spectroscope.Spectroscope 219 has and segregates into the function that is mapped to other colorama components on it, for example, isolates green light components LG and blue light component LB.

Projector also comprises a field lens 224G and a liquid crystal panel 225G, in this order along the optical path setting by spectroscope 219 isolated green light components LG.Based on picture intelligence, liquid crystal panel 225G has the function of the green light components LG that incides on it being carried out three-dimensional modulation by field lens 224G.

Projector also comprises a relay lens 220, one complete-catoptron 221, a relay lens 222, a complete-catoptron 223, a field lens 224B and a liquid crystal panel 225B, in this order along the optical path setting by spectroscope 219 isolated blue light component LB.Entirely-catoptron 221 will reflex to entirely-catoptron 223 by the blue light component LB that relay lens 220 incides on it.Entirely-catoptron 223 will by entirely-catoptron 221 reflection and the blue light component LB that incides on it through relay lens 222 reflex to liquid crystal panel 225B.Based on picture intelligence, liquid crystal panel 225B have to by entirely-catoptron 223 reflection and incide the function that the blue light component on it is carried out three-dimensional modulation through field lens 224B.

Projector also comprises the quadrature-prism (cross-prism) 226 with synthetic three kinds of colorama component LR, LG and LB function, and these cross prisms 226 are positioned at the optical path position intersected with each other of ruddiness component LR, green light components LG and blue light component LB.Projector also comprises the projecting lens 227 that is used on from the synthetic optical projection of quadrature-prism 226 outgoing to screen 228.Quadrature-prism 226 has three plane of incidence 226R, 226G and 226B, and an exit plane 226T.Incide on the plane of incidence 226R from the ruddiness component LR of liquid crystal panel 225R outgoing; Incide on the liquid crystal panel 226B from the green light components LG of liquid crystal panel 225G outgoing; Incide on the plane of incidence 226B from the blue light component LB of liquid crystal panel 225B outgoing.It is synthetic that quadrature-prism 226 will incide three kinds of colorama components of plane of incidence 226R, 226G and 226B, and make synthetic light go up outgoing from exit plane 226T.

4. the manufacturing of liquid crystal display device

Will be with reference to first embodiment of figure 19A～19E description according to the manufacture method of liquid crystal display device of the present invention.

Figure 19 A～19E is the process chart of expression according to the basic manufacturing step of the liquid crystal display device of present embodiment.

Figure 19 A represents the step of TFT base plate bonding to pedestal glass.The one base plate for example bonding agent 1003 of a pedestal glass 1002 by water soluble or organic solvent is adhered on the front surface 1001f of TFT substrate 1001.

The example of bonding agent 1003 comprises that wax is (as the solid state wax of heat molten type water-dissolubility, or the liquid wax of water-dissolubility), thermoplastic polymer adhesive's (trade name: Crystal Bond, crystal adhesise), cyanoacrylate (cyanoacrylate) based adhesive, and epoxy adhesive.

Fatty glyceride), " Aqua Wax553/531/442/SE " (principal ingredient: polyglycol the solid state wax of heat molten type water-dissolubility can be " Aqua Wax 20/50/80 " (principal ingredient: from the trade name such as Nikka Seiko company limited, the vinyl-pyrrolidinone multipolymer, glycerin polyether) and " PEG Wax 20 " (principal ingredient: obtain in product polyglycol).

Water-dissolubility liquid wax can be " Aqua Liquid WA-302 " (principal ingredient: polyglycol from the trade name such as Nikka Seiko company limited as the fluid binder based on synthetic resin, the polyvinylpyrrolidone derivant, methyl alcohol) and " WA-20511/QA-20566 " (principal ingredient: polyglycol, the polyvinylpyrrolidone derivant, IPA (isopropyl alcohol), water) obtain in the product.

Pedestal glass 1002 can be bonded on the TFT substrate 1001 by UV-curing adhesive double sticky tape or heat-curing adhesive double sticky tape.

If necessary, protect the surface of TFT substrate 1001 or prevent that halide ion from polluting the surface of TFT substrate 1001, the front surface 1001f of TFT substrate 1001 can apply last layer resist film (resist film).In addition, the pedestal glass material can be a clear glass, as borosilicate glass or backboard glass (blue plate glass).

Dissolve in thermoplastic polymer adhesive's (trade name: CrystalBond of organic solvent such as acetone in use, crystal adhesise) under the situation as bonding agent 1003, adhesion step realizes by following steps: the crystal adhesise that will be dissolved in the acetone is coated on the pedestal glass 1002; TFT substrate 1001 is overlapped with pedestal glass 1002 to be provided with; The TFT substrate 1001 and the pedestal glass 1002 that overlap each other of heating under the vacuum condition of 150-160 ℃/13.3322Pa (0.1Torr) removing the bubble that inserts therebetween, thereby makes TFT substrate 1001 closely contact with pedestal glass 1002; And the destruction vacuum state, the pressure that produces by means of returning atmospheric pressure promotes degasification, thus the thickness of balanced bonding agent 1003 arrives, as 1～3 μ m.

Water-the dissolubility solid state wax (for example using heat molten type, " the Aqua Wax80/553 " of Nikka Seiko company limited or " PEG Wax 20 ") under the situation as bonding agent 1003, adhesion step can realize by following steps: the wax of dissolving 30～40 percentage by weights (wt%) is in methyl alcohol, and filtration wax solution is to remove foreign matter; With spin-coating method wax solution is coated on the pedestal glass 1002; TFT substrate 1001 and pedestal glass 1002 are overlapped mutually; The TFT substrate 1001 and the pedestal glass 1002 that overlap each other of heating under the vacuum condition of 80-100 ℃/13.3322Pa (0.1Torr) removing the bubble that inserts therebetween, thereby makes TFT substrate 1001 closely contact with pedestal glass 1002; And the destruction vacuum state, the pressure that produces by means of returning atmospheric pressure promotes degasification, thus the thickness of balanced bonding agent 1003 arrives, as 1～3 μ m.

Water-the dissolubility liquid wax (for example making, " the Aqua LiquidWA-302 " of Nikka Seiko company limited) under the situation as bonding agent 1003, adhesion step can realize by following steps: the liquid wax that will have as 4-5cps viscosity with spin-coating method is coated on the pedestal glass 1002; TFT substrate 1001 and pedestal glass 1002 are overlapped mutually; The TFT substrate 1001 and the pedestal glass 1002 that overlap each other of heating under the vacuum condition of 70-80 ℃/13.3322Pa (0.1Torr) removing the bubble that inserts therebetween, thereby makes TFT substrate 1001 closely contact with pedestal glass 1002; And the destruction vacuum state, the pressure that produces by means of returning atmospheric pressure promotes degasification, thus the thickness of balanced bonding agent 1003 arrives, as 1～3 μ m.

100 ± 2 μ m) or use the two sides all to scribble the polyolefin tape (thickness: 100 ± 2 μ m) pedestal glass 1002 is adhered to TFT substrate 1001 of heat-curing adhesive using under the situation of double sticky tape as bonding agent 1003, adhesion step can realize by following steps: all scribble UV-curing adhesive (the thickness: (thickness: of polyolefin tape 10 ± 1 μ m) by using the two sides.In this step, can carry out vacuum stripping and handle, to prevent the generation of bubble therebetween.

Figure 19 B represents the polishing step of TFT substrate.In the state that TFT substrate 1001 is fixed by pedestal glass 1002, the back side 1001b of TFT substrate 1001 is polished and attenuation.For example, the back side 1001b of TFT substrate 1001 polishes by the single-sided polishing method that optics is suitable for level, and pedestal glass 1002 has the thin substrate 1001 of TFT of specific thicknesses (as 20 ± 3 μ m) as reference planes with preparation simultaneously.Because the dimensional accuracy of pedestal glass 1002, the depth of parallelism is set to 1～3 μ m and thickness is 2mm.

Optics is suitable for the single-sided polishing method of level can be by beating wiping and essence and beat wiping single face in proper order and play wiping and carry out according to slightly playing wipings (buffing), middle rank, wherein the particle size of abrasive such as aluminium oxide or cerium oxide can be beaten and wipes and smart order of playing wiping is reduced according to slightly playing wipings, middle rank, thereby little by little precision is polished in raising.

Playing wiping as the single face of the suitable level of optics single-sided polishing method can combine with single face sandblast (blasting).This single face sandblast comprises: prepare the laminar flow of a pressure-air, wherein be studded with as emery, boron carbide or adamantine abrasive particulate; And,, thereby the back side 1001b of TFT substrate 1001 is polished simultaneously at 1001b upper edge, the back side of TFT substrate 1001 reciprocating direction scan nozzle back and forth with the seam-shape opening ejection of the laminar flow of specific quantity from a spray nozzle front end.The sandblast following step is finishing polish, and promptly essence is played wiping, also removes the residual stress that produces owing to the particulate sandblast with further raising polishing precision.

Having single-sided polishing method that optics is suitable for level can pass through CMP (Chemical MechanicalPolishing, chemically mechanical polishing) and realize.Play wiping as single face, CMP also can carry out according to the order of rough polishing, middle rank polishing and finishing polish.

Playing wiping as the single face of the suitable level of optics single-sided polishing method can combine with the single face engraving method of the suitable level of glass.This process comprises: the engraving method that is suitable for level with glass is reduced to certain value with the thickness of TFT substrate 1001, and beats to wipe by the essence that is suitable for the level finishing method as optics and remove the surface undulation that engraving method produced that is suitable for level by glass.In this case, need to use the protectiveness bonding agent or the adhesive tape that can resist the corrosion of hydrofluorite base etchant.

The single face CMP that is suitable for level single-sided polishing method as optics can combine with the suitable level of an optics single face engraving method.This process comprises: the back side 1001b of the TFT substrate 1001 that will be made by quartz glass with hydrofluorite base etchant etches into certain value, and removes the surface undulation that is produced by glass etching by the CMP that is suitable for the finishing method of level as optics.Even in this case, also need to use the protectiveness bonding agent or the adhesive tape that can resist the corrosion of hydrofluorite base etchant.

Figure 19 C has represented microlens array is bonded to step on the TFT substrate.Microlens array bonds on the polished back face 1001b of TFT substrate 1001 by optical resin 1005.More specifically, this step comprises: the step of preparation lenticule base plate (ML substrate) 1004, and wherein pass through processing optical glass such as quartz glass or crystallized glass (Neo Ceram, new ceramic) lenticule plane 1004r is arranged to X-Y scheme; And make the polished back face 1001b orientation of ML substrate 1004 and TFT substrate 1001 and overlap, be higher than the gap of transparent optical resin 1005 fillings between the two of each substrate 1001 and 1004 refractive indexes and the step of solidifying this optical resin 1005 with a kind of refractive index.In this case, by ML substrate 1004 being adhered to the back side 1001b of TFT substrate 1001 with a kind of encapsulant 1006, between TFT substrate 1001 and ML substrate 1004, form the gap of sealing, and then fill this gap with the optical resin 1005 of transparent high index of refraction.

Filling/the curing schedule in back will be described below more fully.

Around ML substrate (lenticule base plate) 1004, formed that make and have a framework of filling mouthful by encapsulant 1006, and will be by the polishing attenuation TFT substrate 1001 overlap on the ML substrate 1004.In this state, the sealing material solidifies.If encapsulant 1006 is made of heat-curing adhesive, is cured by heating at a certain temperature, yet, then will shines and be cured by UV-with certain energy if encapsulant 1006 is to be made of the UV-curing adhesive.Alternatively, if encapsulant is made of heat-UV curing-curing mixed type bonding agent, then the mode that combines of the UV-irradiation by heating at a certain temperature and certain energy is cured.

The transparent optical resin 1005 of high index of refraction is injected into the gap from this filling mouth, and the filling mouth is sealed by the UV-curing adhesive.Optical resin 1005 carries out heat curing again.In the high refractive index transparent resin (viscosity: 20-100cps) under the situation as optical resin 1005 of using acrylic or propylene oxide acidic group, fill mouthful being assigned with property-coating (dispense-coated) resin or be immersed in the resin of vacuum state, be infused in the gap by filling mouth by being returned to atmospheric pressure then.At this moment, can add suitable pressure, so that resin is injected in the gap by filling mouth.Such high refractive index transparent resin solidified under 70～80 ℃ temperature 120 minutes subsequently, obtained to have refractive index and be 1.59～1.67 high refractive index transparent optical resin 1005.

Because high index of refraction optical resin 1005 is injected among the lens plane 1004r that is formed in the lenticule base plate 1004 with relative low-refraction and solidifies, thereby lenticule has just formed automatically.In addition, for with the pixel electrode of the lens plane 1004r of lenticule base plate 1004 sides and TFT substrate 1001 sides to concern orientation one to one, TFT substrate by being formed at mutual orientation and the orientation mark on the ML substrate, TFT substrate and ML substrate overlap each other, and are fixed by encapsulant 1006.

Figure 19 D has represented to peel off the step of pedestal glass.Useless pedestal glass 1002 is peeled off from the front surface 1001f of TFT substrate 1001, so that in conjunction with the rear surface 1001b of microlens array and TFT substrate 1001.Particularly, pedestal glass can be peeled off from TFT substrate 1001 by heating or ultraviolet ray irradiation.Using under thermoplastic polymer (crystal adhesise) or the situation of cyanoacrylate based adhesive as bonding agent 1003, after pedestal glass is peeled off by heating, with an organic solvent as acetone, acetone and alcohol mixture, methyl alcohol or IPA ultrasonic cleaning whole M L substrate.Using under the heat molten type water-situation of dissolubility wax (as " the Aqua Wax 80/553 " or " PEG Wax 20 " of Nikka Seiko company limited), using the pure water of pure water or 50～60 ℃ of heat to come ultrasonic cleaning whole M L substrate as bonding agent 1003.In addition, Fei high precision pedestal glass preferably after cleaning by again-utilize.

Figure 19 E represents to finish the step of liquid crystal display device.Overlap mutually with the lenticule subtend substrate (ML subtend substrate) 1017 that obtains by lenticule base plate is combined with the subtend substrate by the lenticule TFT substrate (MLTFT substrate) 1007 that obtains that combines with lenticule base plate 1004 of the TFT substrate 1001 with single-sided polishing, and keep certain interval betwixt, this gap fills that to go up liquid crystal 1009 backs sealed, to obtain active-matrix liquid crystal display device with double micro lens structure.

Lenticule subtend substrate 1017 can be by obtaining with acquisition lenticule TFT substrate 1007 same steps.More specifically, the front surface side of subtend substrate 1011 is polished, and lenticule base plate 1014 is bonded on the polished surface of subtend substrate 1011 by an encapsulant 1016.Lenticule plane 1014r is pre-formed on lenticule base plate 1014.In the subtend substrate 1011 of single-sided polishing and the gap between the lenticule base plate 1014, filled the transparent optical resin 1015 of high index of refraction and solidified, to obtain ML subtend substrate 1017.In addition, a subtend electrode is pre-formed on the front surface of the subtend substrate 1011 that will contact with liquid crystal 1009.

The liquid crystal display device that manufactures by the manufacture method according to present embodiment has a panel construction, and wherein liquid crystal 1009 is fixed on the pixel electrode that is formed at MLTFT substrate 1007 sides and is formed between the counter electrode of ML subtend substrate 1017 sides.Lenticule as each pixel electrode collector lens is arranged to X-Y scheme, and the microlens array of being made up of this lenticule is integrally formed in ML subtend substrate 1017 sides.Lenticule as each pixel electrode field lens is arranged to X-Y scheme, and the microlens array of being made up of this lenticule is integrally formed in MLTFT substrate 1007 sides.

In above-mentioned polishing step, TFT substrate 1001 and/or the subtend substrate 1011 polished thickness that reduce, make that under the state of finished product panel each the lenticular focus that is used as field lens almost is corresponding with the corresponding lenticular principal point (principal point) that is used as collector lens.For example, according to present embodiment, because TFT substrate 1001 is thinned to the thickness of about 20 μ m, above-mentioned needs just can be met.By microlens array all being set in TFT substrate 1001 sides and subtend substrate 1011 sides, make the focus of each field lens almost corresponding to the principal point of collector lens, just might expand the pixel effective aperture ratio to maximal value.

Along towards the direction of more segmenting pixel, each lenticular focus develops towards shorter direction, and correspondingly, need reduce the thickness of each substrate to a large extent.On this point, manufacture method of the present invention aspect rationality be favourable, make TFT substrate and the equal attenuation of subtend substrate effectively.

Lenticular lens plane 1004r and 1014r can form sphere, aspheric surface or Fresnel plane separately.Spherical lens be easy to make more favourable; Yet, because the radius-of-curvature of the lens that focal length becomes the shortest is limited by Pixel Dimensions, be difficult, unless can guarantee between the lens plane refractive index difference at the interface effectively focal length is shortened.Aspheric surface and Fresnel lens all are extraordinary in the complanation of the shortening of focal length and lens principal plane, and very effective for the angle of divergence of the light that suppresses to be come by light emitted.

Second embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 20.

Figure 20 is the process chart of the manufacturing step of expression present embodiment liquid crystal display device, wherein in S6, carry out multi-chip module technology at step S1, fill order in step S7 and S8-chip module technology has prepared ML subtend substrate (list-chip module substrate) between step S7 and S8.

In this embodiment, large tracts of land TFT substrate (TFT large-size substrate) is as the multi-chip module substrate, to promote the rationalization of manufacturing process.More specifically, large-area substrates (multi-chip module substrate) is used in step S1 in S6, and is split into the single substrate (list-chip module substrate) corresponding to separate panels in step S7.

At step S1, the preparation one TFT large-size substrate that has as 8 inch diameters.At step S2, the pedestal glass with 8 inch diameters bonds on the TFT large-size substrate.At step S3, be suitable for level single-sided polishing method by optics the thickness of TFT large-size substrate is reduced to 20 μ m.At step S4, the ML substrate (diameter: 8 inches) that wherein has been pre-formed the lenticule plane bonds on the polished surface of TFT large-size substrate by an encapsulant, and this lenticule plane fills with high refractive index resins, to form microlens array betwixt.At step S5, useless pedestal glass is stripped from, and cleans the TFT large-size substrate.

At step S6, the exposed surface of TFT large-size substrate is subjected to orientation and handles.For example, the polyimide alignment film is formed on the surface of TFT large-size substrate and is subjected to friction treatment.In this case, the high refractive index resins of relative low-heat resistance will inject and the formation microlens array owing to will have in abovementioned steps, preferably use special polyimide alignment film as the low-temperature curable type in the orientation of step S6 is handled.Yet, because multiple existing polyimide resin all is curable under low relatively temperature, thus polyimide film must be not specific be the low-temperature curable type.DLC (diamond like carbon, diamond-like-carbon) film can be used for substituting the polyimide alignment film, and wherein the DLC film can carry out the orientation processing by the ion exposure with certain party tropism.Alternatively, the SiOx alignment film that is formed by oblique gas phase-deposition SiOx can be used for replacing polyimide film, and wherein the orientation of SiOx obtains by oblique gas phase-deposition.

Under the situation of using the polyimide alignment film, polyimide film is by roller-be coated with method or spin-coating method forms, and breaks the wiping material and be subjected to friction treatment by using.Under the situation of using the DLC alignment film, the DLC film with about 5nm thickness is formed and is subjected to orientation by the ion exposure with certain party tropism to be handled.Under the situation of using the SiO alignment film, form the SiO film by oblique gas phase-deposition SiO.

At step S7, the TFT large-size substrate with 8 inch diameters is divided into independently single substrate, and each substrate has 0.9 square inch size, for example, and by blockage cutting (dicing) or CO ₂Cut.Each comprises that the single TFT substrate of microlens array has obtained like this.

Next, being chosen as single subtend substrate certified products, that respectively comprise microlens array has also prepared.

At step S8, each above-mentioned single subtend substrate overlaps mutually with one that is chosen as in single TFT substrate certified products, that include microlens array, and between them, keep certain interval, this gap is filled mouth by one and has been filled such as the liquid crystal to row (nematic) liquid crystal, next seals this filling mouth again.More specifically, form along the periphery of the TFT substrate that comprises microlens array or the periphery that comprises the subtend substrate of microlens array and have an encapsulant framework of filling mouthful.Comprise the TFT substrate of microlens array and comprise that the subtend substrate of microlens array overlaps mutually that be formed on the orientation mark orientation each other on each substrate simultaneously, encapsulant solidifies then.After liquid crystal is injected in the gap by the filling mouth, fills mouth and seal with the UV-curing adhesive.Liquid crystal is subjected to heating and cooling fast, adjusts the collimation of liquid crystal.

As previously mentioned, according to present embodiment, large-area substrates (will be split into the single substrate of a plurality of corresponding separate panels) stands adhesion step, polishing step, bonding step and strip step, come in conjunction with correspondence the large tracts of land microlens array of a plurality of single microlens arrays, and be divided into the single substrate of corresponding separate panels at appropriate step (step S7).Therefore, this might promote the rationalization of manufacturing process.In the present embodiment, the TFT large-size substrate, be formed with microlens array on it corresponding to a plurality of single microlens arrays, be split into single TFT substrate, each single TFT substrate all overlaps mutually with one of previously prepared single subtend substrate that is formed with single microlens array on it, leave certain interval therebetween, to obtain a panel (step S8).In addition, according to present embodiment, at strip step (step S5), pedestal glass is stripped from from the surface of TFT large-size substrate and after the TFT large-size substrate obtains cleaning, in the temperature range of the thermal resistance that can not destroy the microlens array that forms among the step S4, on the exposed surface of TFT large-size substrate, be formed for the both alignment layers (seeing step S6) of liquid crystal layer orientation.

Figure 21 A and 21B are the canonical schemas of the employed concrete dividing method of expression segmentation procedure shown in Figure 20 (step S7).By blockage cutting or CO ₂Cut is cut apart large-size substrate and is realized this dividing method, all has single TFT substrate certain size, that comprise microlens array with preparation.

As shown in the figure, this method comprised for two steps.In the first step shown in Figure 21 A (cutting of first blockage), by using V-arrangement-otch cutting blade 1021, along being defined the boundary member cutting large size substrate 1007 that is used for large-size substrate 1007 is divided into separate panels, on xsect, form the V-connected in star.In the step of second shown in Figure 21 B (cutting of second blockage), use general cutting blade 1022, fully cut the groove of large-size substrate 1007, large-size substrate is separated into each panel.By these steps, just can obtain to have the single substrate of tapered end face.

Cut large-size substrate by part in first step and form V-connected in star in the large-size substrate, and complete cutting large size substrate is separated into single substrate with large-size substrate, (chamfer) each the single substrate of just can cutting sth. askew in second step.When the TFT substrate was assembled in the panel, the single substrate of being cut sth. askew like this helped preventing that the thin base board end surface of TFT from breaking or the generation of breach.In addition, the preferred pair scribing machines that use carry out cutting of first blockage and the cutting of second blockage continuously.

The 3rd embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 22.

Figure 22 is the operation block diagram of the manufacturing step of liquid crystal display device in the expression present embodiment, wherein, in step S1～S7, carry out multi-chip module technology, fill order in step S8-chip module technology, preparation ML subtend substrate (list-chip module substrate) between step S6 and S7.The difference of present embodiment and previous embodiment shown in Figure 20 is that aforesaid step S7 and S8 are opposite each other.In the present embodiment, at step S7, qualified and single ML subtend substrate that handled by orientation overlaps on qualified and has been subjected on the TFT large-size substrate that comprises ML that orientation handles, and is assembled then, and liquid crystal is injected in therebetween the gap and sealed; At step S8, comprise that the TFT large-size substrate of ML is cut apart, to obtain separate panels.Compare with the previous embodiment shown in Figure 20, present embodiment is reasonably, because multi-chip module technology can be continuous before next-door neighbour's final step.As previously mentioned, according to present embodiment, when behind the microlens array that forms on the TFT large-size substrate corresponding to a plurality of single microlens arrays, each the single subtend substrate that has been pre-formed single microlens array on it is mounted to (step S7) on the TFT large-size substrate, and the TFT large-size substrate is cut apart, to form separate panels (step S8).

Figure 23 is illustrated in the concrete assembly method of using among the aforementioned installation step S7 shown in Figure 22.As shown in the figure, single substrate qualified, that comprise microlens array 1017 with comprise that the right rail of lenticular TFT large-size substrate 1007 overlaps mutually, has certain interval therebetween, and be fixed by an encapsulant 1008, liquid crystal 1009 is injected in the gap between two substrates 1007 and 1017 and is sealed then.

More specifically, after the encapsulant 1008 of the 10 coated UV-curing of MLTFT large-size substrate or heat-curing type, by using the orientation mark that is provided with on it, ML subtend substrate 1017 navigates to the appropriate section of MLTFT large-size substrate 1007 and overlaps each other, have certain interval therebetween, and be fixed by solidifying encapsulant 1008 with the method for UV irradiation or heating.Then liquid crystal is injected in the gap, and seals this filling mouth with the UV-curing adhesive by filling mouth.

After the assembly work of step S7 was finished, MLTFT large-size substrate 1007 was divided into single substrate by blockage cutting or cut.Shown in line, along the border cutting MLTFT large-size substrate 1007 of each panel, to obtain panel.At this moment, for the end face that prevents the thin substrate 1007 of TFT occurs breaking or breach, the blockage cutting is preferably as follows to be carried out: use V-arrangement-otch cutting blade along the thin substrate 1007 of boundary member cutting TFT, form the V-connected in star, use general cutting blade fully to cut the groove of the thin substrate 1007 of TFT then, the thin substrate of TFT is separated into each panel.

Figure 24 A and 24B are the process charts of an example of the manufacture method of expression ML subtend substrate 1017 shown in Figure 23.

Shown in Figure 24 A, center on the framework that the periphery that has been pre-formed the ML substrate 1014 of lenticule plane 1014r on it forms an encapsulant 1016.One cover glass substrate 1011 overlaps mutually with ML substrate 1014, has certain interval therebetween.Under such state, encapsulant 1016 is cured.

Shown in Figure 24 B, a high refractive index transparent optical resin 1015 is injected in the gap between cover glass substrate 1011 and the ML substrate 1014, and by being heating and curing, this gap is sealed by the UV-curing adhesive.The single-sided polishing method that is suitable for level by optics reduces the rear side thickness of cover glass substrate 1011, with preparation ML subtend substrate 1017.One nesa coating (as ITO) is formed on the polished back face of cover glass substrate 1011, to form counter electrode 1018.One polyimide alignment film 1019 is formed on the counter electrode 1018, and is subjected to handling such as the orientation of friction treatment.At this moment, according to the twin polishing method polishing ML substrate 1014 and the cover glass substrate 1011 of optical grade, the thickness of ML subtend substrate 1017 can be adjusted to certain value.For this situation, when by filling with the high refractive index transparent resin after lenticule plane 1014r forms ML substrate 1014, on with respect to the resin surface on lenticule plane, can form a transparent resin film, also form a SiO thereon by sputter or gas phase-deposition ₂Film.Form and such pile up tunic and can eliminate, thereby reduce manufacturing cost for the demand that cover glass substrate 1014 is provided.

As shown in figure 23, the single ML subtend substrate 1017 that forms like this is assembled on the multi-chip module type large scale MLTFT substrate 1007.

The 4th embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 25.

Figure 25 has represented the manufacturing step of liquid crystal display device in the present embodiment, wherein carry out multi-chip module technology at step S1～S6, in step S7 and S8 fill order-chip module technology, preparation ML subtend substrate (list-chip module substrate) between step S7 and S8.

Present embodiment is to revise from embodiment shown in Figure 20.

In the embodiment shown in Figure 20, at step S4, the microlens array of being made by high refractive index resins is formed between TFT large-size substrate and the ML large-size substrate; At step S6, the polyimide alignment film forms on the TFT large-size substrate, and is subjected to the orientation processing.In these steps, according to the thermal resistance of the high refractive index resins that is used for microlens array, the polyimide film that is used for the orientation processing must be selected low-temperature curable type polyimide film.

On the contrary, in this embodiment, the polyimide film that is used for the orientation processing at first forms at step S2, and the microlens array of being made by high refractive index resins forms in step S5 then.Be used for the polyimide film of orientation processing thereby just do not needed to select low-temperature curable type polyimide film, but can be chosen in the curable type polyimide film of high temperature all very excellent on performance and the stability.

Like this, according to present embodiment, carrying out series of steps, be adhesion step, polishing step, bonding step and strip step a microlens array is attached to before the back side of TFT large-size substrate, carry out orientation step (step 2) earlier, formation one is used for the both alignment layers of liquid crystal layer orientation on TFT large-size substrate surface.

Common polyimide resin is curable under about 180 ℃ of high temperature, yet common high refractive index transparent resin is curable under the low temperature of 60～120 ℃ of scopes.Therefore, do not wish to have installed in advance thereon on the TFT large-size substrate of the microlens array of making by common high refractive index resins and form the film of making by common polyimide.For this reason, in embodiment as shown in figure 20, a low-temperature curable polyimide film or DLC film are as alignment film.On the contrary, in this embodiment, because before making microlens array with high refractive index resins, the alignment film that is used for the orientation processing forms, and just can be used as alignment film by the film of making at the common polyimide resin of about 180 ℃ high temperature curable.

The 5th embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 26.

Figure 26 has represented the operation block diagram of the manufacturing step of liquid crystal display device in the present embodiment, wherein carry out multi-chip module technology at step S1～S6, in step S7 and S8 fill order-chip module technology, preparation ML subtend substrate (list-chip module substrate) between step S6 and S7.

Execute in the example at this, previous embodiments as shown in figure 22, single ML subtend substrate is assembled on the MLTFT large-size substrate, and the MLTFT large-size substrate is divided into the single substrate of corresponding separate panels then; Yet different with the previous embodiment shown in Figure 22 is in the orientation processing of step S2 execution use alignment film, to carry out the formation operation of the microlens array that uses the high refractive index transparent resin then at step S5.Therefore, similar embodiment shown in Figure 25, the film of being made by the curable polyimide type resin of high temperature can be used as alignment film.

The 6th embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 27.

Figure 27 is the operation block diagram of the manufacturing step of liquid crystal display device in the expression present embodiment, wherein carry out multi-chip module technology at step S1～S7, in step S8 fill order-chip module technology, the preparation relative large-size substrate of ML (multi-chip module substrate) between step S6 and S7.

According to present embodiment, at step S7, the relative large-size substrate of ML is assembled on the MLTFT large-size substrate; At step S8, the MLTFT large-size substrate is split into separate panels with the assembly of the relative large-size substrate of ML.Because two large-size substrates are to use before next-door neighbour's final step, this manufacturing process is just more reasonable.Yet, in the present embodiment, after the step, be the selection of acceptance or rejection in the end by checking that single product carries out for product.

As previously mentioned, according to present embodiment, relative large-size substrate of ML and MLTFT large-size substrate overlap mutually, has a specific gap therebetween, so that be assembled into large size panel part (step S7) corresponding to a plurality of panels, wherein the relative large-size substrate of this ML comprises the microlens array of corresponding a plurality of single microlens arrays, and this MLTFT large-size substrate also comprises the microlens array of corresponding a plurality of single microlens arrays; This assembly is split into separate panels (step S8) then.In addition, according to present embodiment, use the microlens array of high refractive index transparent optical resin to form at step S4, the low-temperature curable type polyimide film or the DLC film that are used for the orientation processing form at step S6.

The 7th embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 28.

Figure 28 is the operation block diagram of the manufacturing step of liquid crystal display device in the expression present embodiment, wherein carry out multi-chip module technology at step S1～S7, in step S8 fill order-chip module technology, the preparation relative large-size substrate of ML (multi-chip module substrate) between step S6 and S8.

In the present embodiment, previous embodiments as shown in figure 27, the relative large-size substrate of ML is assembled on the TFT large-size substrate, and this assembly is divided into separate panels then; Yet different with the previous embodiment shown in Figure 27 is that the alignment film that is used for the orientation processing forms at step S2, and uses the microlens array of high refractive index transparent resin to form at step S5.Therefore, the common curable type polyimide film of high temperature can be as the alignment film of orientation processing.

The 8th embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 29.

Figure 29 is the operation block diagram of the manufacturing step of liquid crystal display device in the expression present embodiment, wherein carry out multi-chip module technology at step S1, in step S2～S8 fill order-chip module technology, preparation ML subtend substrate (list-chip module substrate) between step S7 and S8.

In the present embodiment and the embodiment of front different, obtain panel by adopting list-chip module technology replacement multi-chip module technology basically.

The TFT large-size substrate of 8 inch diameters is in step S1 preparation, then by blockage cutting or CO ₂Cut is divided into the single substrate of each TFT with 0.9 square inch of size.If necessary, the single substrate of TFT can be coated with and apply a resist film, to protect surface and the pollution that prevents from halogen gas.

At step S3, the pedestal glass with 0.9 square inch of size is bonded on the single substrate of each TFT.Pedestal glass can be borosilicate glass, and the TFT substrate can be made by the artificial quartz glass.The depth of parallelism of pedestal glass accurately is worked into 1～2 μ m.Pedestal glass is by the double sticky tape of thermoplastic transparent polymer type or UV-curing adhesive, or the double sticky tape of hot setting adhesive, and is bonding with the TFT substrate.

At step S4, the back side of TFT substrate is polished by the single-sided polishing method that optics is suitable for level, so that be thinned to the thickness of 20 μ m.The variation in thickness of TFT substrate preferably is suppressed at ± 3 μ m in.At step S5, wherein be pre-formed on the TFT substrate of the lenticule base plate with 0.9 square inch of size (ML substrate) attenuation that is added on lenticule plane, and the high refractive index transparent resin is injected into the gap between them and obtains sealing.

At step S6, pedestal glass is by peeling off from the TFT substrate as heating, and the TFT substrate cleans with organic solvent again.The pedestal glass of peeling off of high-precision processing can reuse.In addition, can be in step subsequently after encapsulant solidifies by the UV irradiation, peel off pedestal glass again and clean the TFT substrate.At step S7, can be by such as forming low-temperature curable type polyimide alignment film and making polyimide film be subjected to beating the friction treatment of wiping material; Perhaps the ion exposure by forming the DLC film and making the DLC film be subjected to having directivity carries out orientation and handles.

At step S8, single ML subtend substrate and MLTFT substrate overlap mutually, and have a specific gap therebetween, and liquid crystal is injected in the gap also sealed.More specifically, form for example framework of a UV-curing type encapsulant on a substrate, another substrate then overlaps mutually with it, has a specific gap therebetween, simultaneously the orientation mark orientation each other that is provided with on it.Encapsulant solidifies by the UV irradiation, comes two substrates fastened to each other.Blank panel (being in filling liquid crystal state before) has obtained like this.Liquid crystal injects panel and sealed by the filling mouth that is formed in the encapsulant, thereby finishes the making of the liquid crystal display device of double micro-lens array type.

The 9th embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 30.

Figure 30 is the operation block diagram of the manufacturing step of liquid crystal display device in the expression present embodiment, wherein carry out multi-chip module technology at step S1, in step S2～S8 fill order-chip module technology, preparation ML subtend substrate (list-chip module substrate) between step S7 and S8.

In the present embodiment, with previous embodiments shown in Figure 29, panel obtains by adopting list-chip module technology basically; Yet different with previous embodiment shown in Figure 29 is, is used for the alignment film that orientation handles and forms at step S3, and after ML substrate bonding in step S6 is to the TFT substrate, use the microlens array of high refractive index transparent optical resin just to form.

The tenth embodiment of the manufacture method of the liquid crystal display device according to the present invention will be described with reference to Figure 31.

Figure 31 is the operation block diagram of the manufacturing step of liquid crystal display device in the expression present embodiment.

In preliminary step,, obtain ML subtend substrate 1017 by a microlens array being attached to first substrate that has been pre-formed counter electrode on it.In installation step, the subtend substrate (ML substrate) 1017 that combines microlens array with its on the front surface 1001f of TFT substrate 1001 that has been pre-formed pixel electrode and has been used to drive the switching device of pixel electrode overlap mutually, has a specific gap therebetween, liquid crystal injects gap and sealing, to obtain a panel.In adhesion step,,, pedestal glass 1002 is adhered on the ML subtend substrate 1017 that the front surface 1001f with TFT substrate 1001 overlaps mutually as water-dissolubility wax, beeswax or cyanoacrylate based adhesive based on hot melt by using a bonding agent 1003.Can be by obtaining bonding agent 1003 with no chloro organic solvent (acetone, the potpourri of acetone and ethanol, or IPA) dilution acrylate.At polishing step, the back side 1001b of TFT substrate is polished under the state of being fixed by pedestal glass 1002.At bonding step, microlens array is bonded on the polished back face 1001b of TFT substrate 1001.

Different with front embodiment is that after panel prepared in advance, the back side of TFT substrate was polished, and microlens array is bonded on the polished back face of TFT substrate.

In manufacture method shown in Figure 31, polished by the TFT substrate 1001 that combines pixel electrode and thin film transistor (TFT) thereon in advance, therefore preferably take certain measure to resist the destruction of generation of static electricity.

Figure 32 has represented an example of the measure of antistatic destruction, wherein has the measure of the electrocondution slurry 1024 of noresidue coating layer portion as antistatic destruction.Shown in figure 32, one adhesive tape, especially have the noresidue coating layer portion, thickness and comprise the thickness electrocondution slurry adhesive tape much at one of lenticular subtend substrate 1017, to be set up with the mode that is formed at the lead-out terminal short circuit on the TFT substrate 1001, wherein pedestal glass is fixed on the ML subtend substrate 1017 by bonding agent 1003.

Figure 33 has represented another embodiment of the measure of antistatic destruction.As shown in figure 33, be assemblied in the splicing ear of TFT substrate 1001 by being used for the outside connector that flexible printed board constituted 1026 that connects by heat-pressure Method for bonding, pedestal glass 1002 is fixed on the ML subtend substrate 1017 by bonding agent 1003 or double sticky tape.Stablize connector 1026, gap filling adhesive 1003 between pedestal glass 1002 and TFT substrate 1001 or thickness almost are equal to the adhesive tape parts 1025 of the thickness of the subtend substrate 1017 that comprises microlens array.Connector 1026 can foreshorten to a certain degree, and can the polishing that TFT substrate 1001 is carried out not had a negative impact to being suitable for level single-sided polishing method by optics in the later step, and the terminal of connector 1026 is by short circuit or covering, thus not pollute by abrasive etc.Like this, take the measure of antistatic destruction, the back side of TFT substrate 1001 should be polished under following state, and a plurality of external connection terminals that promptly are formed on the TFT substrate keep identical electromotive force.

Figure 34 is the canonical schema that expression is carried out polishing to panel shown in Figure 32.As shown in the figure, pedestal glass 1002 sides of panel are bonded in the worktable 1029 that is used to polish, and the back side 1001b of TFT substrate 1001 is polished as object of reference with pedestal glass 1002.The liquid crystal 1009 that prevents to be enclosed in the panel is heated to a critical temperature or higher, during polishing by the suitable level of an optics single-sided polishing method, preferably TFT substrate 1001 is cooled off.This just makes and keeps the orientation state of liquid crystal 1009 to become possibility.In example as shown in the figure, single face is played wiping and is suitable for a level single-sided polishing method as optics and carries out.By TFT substrate 1001 is applied a fixed load, the back side 1001b of TFT substrate 1001 is forced on the polishing platen (platen) 1027.At this moment, the abrasive of some is transported on the polishing platen 1027.

More specifically, polishing carries out like this, promptly by polishing platen 1027 (as tin platen, ethene platen or cloth platen) is rotated along its axis, on polishing platen 1027, splash into the liquid of some continuously, as comprised abrasive such as emery, aluminium oxide or adamantine water, oil or organic solvent; And, the workpiece that is fixed on the worktable 1029 is pressed onto on the polishing platen 1027 by being applied to a fixed load of workpiece; And the surface of polishing workpiece.Polishing is that the abrasive particle size correspondingly reduces according to rough polishing, middle rank polishing and finishing polish in sequence, thereby improves the polishing precision gradually.If polished amount is bigger, then workpiece earlier by slightly-polishing with reduced thickness to approaching target thickness, and then pass through middle rank-polishing and essence-polishing processed.If TFT substrate 1001 has the thickness of 800 μ m, substrate 100 just earlier by thick-polishing with reduced thickness to 100 μ m, more further by middle rank-polishing with reduced thickness to 50 μ m, the final thickness that is worked into 20 μ m by essence-polishing.In this situation, the tolerance of supposing the TFT substrate thickness is 20 ± 3 μ m, when then finishing polish was carried out, residual thickness was detected by optics or laser class ladder depthmeter (step depth meter), and the orientation mark on the TFT substrate surface is as the reference of each 10 μ m polished amount.During polishing like this, panel is not stripped from.This is because the TFT substrate overlaps on the subtend substrate, have the gap of 1～3 μ m therebetween, and be fixed up by encapsulant, and this sept and each pixel all keeps in touch.

Figure 35 is the canonical schema that the polishing of particulate sandblast is used in expression.As shown in the figure, sandblast is performed such: prepare the laminar flow of a pressure-air, wherein be studded with abrasive such as emery, boron carbide or adamantine particulate; Spray the laminar flow of some again from the injection orifice of a seam-shape nozzle 1030 front ends,, thereby the back side 1001b of TFT substrate 1001 is polished simultaneously at the reciprocal scanning direction nozzle in 1001b upper edge, the back side of TFT substrate 1001.The sandblast process is carried out according to the order of thick sandblast, intermediate sandblast and smart sandblast, and the abrasive particle size correspondingly reduces, thereby little by little improves the polishing precision.If polished amount is bigger, then workpiece earlier by slightly-sandblast with reduced thickness to approaching target thickness, and then pass through middle rank-sandblast and essence-sandblast processed.If TFT substrate 1001 has the thickness of 800 μ m, substrate 100 just earlier by thick-sandblast with reduced thickness to 300 μ m, more further by middle rank-sandblast with reduced thickness to 200 μ m, finally be worked into the thickness of 50 μ m by essence-sandblast.

The tolerance of supposing the TFT substrate thickness is 20 ± 3 μ m, and then after the TFT substrate is worked into the thickness of 50 μ m by essence-sandblast, the TFT substrate can be suitable for the essence of level finishing method-play wiping further to process as optics by shown in Figure 34.When finishing polish was carried out, residual thickness was detected by optics or laser class ladder depthmeter, and the orientation mark on the TFT substrate surface is as the reference of each 10 μ m polished amount.

Figure 36 represented after polishing step shown in Figure 34, ML substrate 1004 bonded to the step on the back side of TFT substrate 1001.As shown in the figure, under the state that pedestal glass 1002, the subtend substrate 1017 that comprises ML and TFT substrate 1001 are bonded to each other, by distributivity-coating encapsulant 1006, approach the framework of the back side periphery formation of substrate 1001 by UV-curing adhesive or UV-curing/heat-encapsulant 1006 that curing mixed type bonding agent is made around TFT.ML substrate 1004 overlaps mutually with the thin substrate 1001 of TFT, has a specific gap therebetween, and the orientation mark orientation each other that is provided with on it, and encapsulant 1006 is simultaneously solidified by the UV irradiation.At this moment, each lenticular focal length has obtained fine setting by the thickness of encapsulant 1006.For easy fine setting (fineadjustment), encapsulant 1006 can comprise that one has and can not reduce the certain size of sealing characteristics, the sept of some (spacer).This sept is made by metal, glass, pottery etc.These materials can use separately or be used in combination.This material preferably uses with the particulate form with sphere or fiber shape.

Figure 37 has represented the filling step after the bonding step shown in Figure 36.As shown in the figure, high refractive index transparent optical resin 1005 is pressed-is annotated in the gap by the filling mouth that is provided with in framework-shape encapsulant 1006 under vacuum, fills mouth and seals with the UV-curing adhesive.But it is unshowned, using under the situation of cyanoacrylate based adhesive as bonding agent 1003, the cyanoacrylate based adhesive passes through heat fused, peel off pedestal glass 1002, and then use organic solvent, as IPA, acetone, acetone and alcohol mixture or methyl alcohol, whole front panel is cleaned.Cured as under the situation of bonding agent 1003 at heat molten type water-dissolubility, water-dissolubility is cured by heat fused, to peel off pedestal glass 1002, and then is the ultrasonic cleaning of carrying out whole front panel with the hot pure water of pure water or 50～60 ℃.

Figure 38 A has represented to substitute the example that pedestal glass comes support panel with anchor clamps 1002a.Anchor clamps 1002a as pedestal glass is fixed on the worktable 1029 of polishing platen.The path 1002b that is used for vacuum attraction is formed on anchor clamps 1002a and worktable 1029.The panel that obtains to the subtend substrate 1017 that comprises microlens array by assembling TFT substrate 1001 obtains polishing under the state fixing by anchor clamps 1002a.In this case, the electrostatic damage in preventing to polish is preferably carried out short circuit to the external connection terminals 1001f of TFT substrate 1001 and the conductive bond pads 1002p that is arranged on the anchor clamps 1002a.

Figure 38 B and 38C have represented that the LCD panel is fixed to the example on the worktable 1029 of a large scale polishing platen, are provided with a plurality of anchor clamps 1002a as pedestal glass above.ML subtend substrate 1017 sides of each panel are arranged in the groove of anchor clamps 1002a, and TFT substrate 1001 sides are towards the top, and are fixed to the upper by vacuum gravitation, and in this state, the back side of TFT substrate obtains polishing.Even in this case, the electrostatic damage in preventing to polish is preferably carried out short circuit with the external connection terminals of TFT substrate and the conductive bond pads that is arranged on the anchor clamps 1002a.

Usually, be prescribed to be processed into as the artificial quartz glass of the material of TFT substrate among the used high temperature polysilicon TFTLCD of projector and subtend substrate and have high-precision surfaceness and size.From this viewpoint, according to embodiment shown in Figure 31～38, during polishing, by detecting the thickness of subtend substrate fully, the subtend substrate can be used to replace pedestal glass, with elimination the demand of pedestal glass is set, thereby reduces manufacturing cost.

Figure 39 is the typical section figure of the another example of liquid crystal display device constructed in accordance.

The subtend substrate 1017 that comprises microlens array overlaps mutually with the TFT substrate 1007 that comprises microlens array and is fixing, has a specific gap therebetween, and liquid crystal 1009 is enclosed in therebetween the gap.Wherein, the microlens array that is combined on TFT substrate 1001 back sides of polishing attenuation is configured to make lens plane " r " to have dual structure.More specifically, be formed at refractive index for the convex lens plane " r " on the transparent resin layer 1004 of " ng1-2 " by encapsulant 1006 be formed at the transparent resin layer 1004 of refractive index for " ng2-2 " ' on convex lens plane " r " relatively separate; And refractive index is enclosed in therebetween for the transparent optical resin 1005 of " n1 ", to form microlens array.At this moment, the refractive index of transparent optical resin 1005 " n1 " to be lower than the refractive index " ng1-2 " of transparent resin layer 1004 and transparent resin layer 1004 ' refractive index " ng2-2 ".Subtend substrate 1017 sides that comprise microlens array have identical structure, wherein refractive index for the transparent optical resin 1015 of " n1 " be inserted into refractive index for the transparent resin layer of " ng1-1 " and refractive index between the transparent resin layer of " ng2-1 ".

Figure 40 has represented the example of the concrete shape and size of liquid crystal display device constructed in accordance.MLTFT substrate 1007 overlaps and also is fixed on the ML subtend substrate 1017, has a specific gap therebetween, and liquid crystal 1009 is enclosed in therebetween the gap.Each lenticular focal length (equivalence value in the air) on ML subtend substrate 1017 sides is F1=30.69 μ m.This lenticule has such structure: refractive index is 1.45 transparent resin layer with refractive index is that 1.66 transparent resin layer 1015 contacts at the boundary by lens plane 1014r definition.Subtend substrate 1011 is made by crystallized glass " new ceramic " (Neo Ceram), and by the polishing attenuation.The degree of depth of lens plane 1014r is 10.3 μ m, and 1011 of subtend substrates are thinned to 20 μ m.On the other hand, each the lenticular focal length (equivalence value in the air) that is formed on the MLTFT substrate 1007 is a F2=41.4 μ m (actual range: 64.6 μ m).Refractive index is 1.44 transparent resin layer with refractive index is that 1.596 transparent optical resin 1005 contacts at the boundary by lens plane 1004r definition, to form lenticule.Refractive index is that 1.46 quartz glass 1001 is thinned to 20 μ m.Therefore, be formed on ML subtend substrate 1017 sides, as the lenticular principal point of collector lens and be formed at MLTFT substrate 1007 sides, be 64.6 μ m as the distance between the lenticular principal point of field lens.In addition, the TFT pel spacing is 18 μ m.Top size all is physical size except focal length.

As previously mentioned, effect of the present invention is to eliminate the needs of cover glass are set, and this cover glass generally is a microlens array, and is necessary as single microlens array (SML) or double micro-lens array (DML), thereby the present invention helps the attenuation of microlens array.Another effect is that because the microlens array with leveling surface has been installed in the liquid crystal panel, the mechanical stress that is applied to microlens array has been dwindled.Therefore, the present invention helps making high-level efficiency and high-precision microlens array, helps improving the output and the performance of microlens array simultaneously.

Another effect of the present invention is the liquid crystal display device of having realized having the double micro-lens array structure, and one of them microlens array is arranged on the subtend substrate-side, and another microlens array is arranged on the TFT substrate-side.A kind of like this display device helps improving effective aperture ratio and from the utilization ratio of source emissioning light, thereby improves brightness.Liquid crystal display device according to the present invention is applied in the projector, can realizes that the compact in size of projector and the cost of projecting lens reduce.

Thereby form the V-connected in star owing to cut the TFT large-size substrate, at the thorough cutting large size substrate of V-arrangement-groove, cut apart the TFT large-size substrate so again, the single substrate of therefore might cutting sth. askew by part.The single substrate of being cut sth. askew like this helps preventing that the thin substrate of TFT from occurring breaking and breach, thereby has improved output and quality.Therefore,, approach in the process of substrate, can prevent that the damage and the TFT that produce owing to static from approaching the cracking of substrate, so improve output and quality at single-sided polishing method polishing TFT with the suitable level of optics according to the present invention.

Although described the preferred embodiments of the present invention with technical term, these are described and also just to be used to the purpose explained, are appreciated that under the condition of the spirit and scope that do not break away from appended claims, can make amendment and change.

Claims (22)

1. liquid crystal display device with panel construction comprises:

At least formed the subtend substrate of counter electrode on it;

At least formed the driving substrate of the switching device of pixel electrode and the described pixel electrode of driving on it; And

Be inserted in the liquid crystal layer between described driving substrate and the described subtend substrate, wherein two substrates is bonded into and makes described pixel electrode relative with described counter electrode and leave a specific gap therebetween;

Wherein on described subtend substrate, assemble the microlens array of forming by the lenticule of arranging with the X-Y scheme of the described pixel electrode array pattern of correspondence at least; And wherein said microlens array has the back side that joins described subtend substrate to and the front surface of leveling; And

Described counter electrode is formed on the leveling front surface of described microlens array by diaphragm.

2. according to the liquid crystal display device of claim 1; wherein; after being pre-formed on the leveling front surface that described diaphragm on supporting is adhered to described microlens array, remove described support described diaphragm is exposed, and described counter electrode being formed on the diaphragm of described exposure.

3. according to the liquid crystal display device of claim 1, wherein said diaphragm is by Al ₂O ₃, a-DLC, TiO ₂, TiN or Si make.

4. according to the liquid crystal display device of claim 1, wherein said microlens array has dual structure, comprises being arranged on away from described liquid crystal layer one side, as first lenticule of collector lens be arranged near described liquid crystal layer one side, basically as second lenticule of field lens; And

Distance between each described second lenticular principal point and described liquid crystal layer is set to the value in 10 μ m or the littler scope.

5. projector comprises:

Light source is used to launch light;

Liquid crystal display device has the function of optical modulation incident light; And

Projecting lens is used for the light of projection through described liquid crystal display device modulation;

Described liquid crystal display device has panel construction, comprising:

Driving substrate has formed pixel electrode and the switching device that drives described pixel electrode at least on it;

The subtend substrate has formed counter electrode at least on it; And

Liquid crystal layer is inserted between described driving substrate and the described subtend substrate, and wherein this two substrates is bonded into and makes described pixel electrode relative with described counter electrode and leave a specific gap therebetween;

Wherein on described subtend substrate, assemble the microlens array of forming by the lenticule of arranging with the X-Y scheme of the described pixel electrode array pattern of correspondence at least; And

Wherein said microlens array has the back side that joins described subtend substrate to and the front surface of leveling; And

Described counter electrode is formed on the leveling front surface of described microlens array by diaphragm.

6. manufacture method with liquid crystal display device of panel construction, this liquid crystal display device comprises:

First substrate, have the switching device that has formed pixel electrode on it at least and driven described pixel electrode front surface and with this front surface opposing backside surface;

Second substrate, have the front surface that formed counter electrode on it at least and with this front surface opposing backside surface; And

Liquid crystal layer is inserted between described first and second substrates, and wherein this two substrates is bonded into and makes described pixel electrode relative with described counter electrode and leave a specific gap therebetween;

Wherein by two-dimensional arrangements, first microlens array formed to the lenticule on the described pixel electrode of converging ray is formed on one of described first and second substrates respectively; And

By two-dimensional arrangements, make that be focused at light on the described pixel electrode respectively passes second microlens array that lenticule wherein forms and be formed on in described first and second substrates another;

Described method comprises:

Adhesion step, the front surface of bonding base plate and each described first and second substrate;

Polishing step, under the state that described substrate is fixed by described base plate, the back side of polishing described substrate is to reduce the thickness of described substrate;

Bonding step is higher or lower than the transparent optical resin of described substrate refractive index by refractive index, a corresponding polished back face to described substrate in bonding described first and second microlens arrays; And

Strip step is peeled off described base plate and is cleaned described substrate from the front surface of described substrate, thereby corresponding microlens array is attached to the back side of described substrate.

7. according to the manufacture method of the liquid crystal display device of claim 6, also comprise segmentation procedure, if one of described at least first and second substrates are the multi-chip module substrates that has corresponding to the zone of a plurality of panels, then described multi-chip module is divided into the single substrate of corresponding separate panels;

Wherein, after being attached on the described multi-chip module substrate by described adhesion step, polishing step, bonding step and strip step corresponding to the corresponding one in described first and second microlens arrays a plurality of panels, a plurality of, described multi-chip module substrate is divided into the single substrate of corresponding separate panels in the suitable stage.

8. according to the manufacture method of the liquid crystal display device of claim 7, one in wherein said first and second substrates is the multi-chip module substrate that has corresponding to the zone of a plurality of panels, and another is a list-chip module substrate; And

Wherein, describedly be formed on the described multi-chip module substrate corresponding to corresponding one in first and second microlens arrays a plurality of panels, a plurality of;

Described multi-chip module substrate is divided into the single substrate of corresponding separate panels immediately in described segmentation procedure;

Preparation combines one described list-chip module substrate corresponding in described first and second microlens arrays in advance; And

From described multi-chip module substrate cut apart and the described single substrate that comes with man-to-man relation with described list-chip module substrate overlapping and leave certain interval therebetween, will be mounted on the separate panels.

9. according to the manufacture method of the liquid crystal display device of claim 7, one in wherein said first and second substrates is the multi-chip module substrate that has corresponding to the zone of a plurality of panels, and another is a list-chip module substrate; And

Wherein, be formed on the described multi-chip module substrate corresponding to the corresponding one in described first and second microlens arrays a plurality of panels, a plurality of;

Preparation combines one described list-chip module substrate corresponding in described first and second microlens arrays in advance;

Described list-chip module substrate is assembled on the described multi-chip module substrate; And

The described multi-chip module substrate that has assembled described list-chip module substrate is divided into separate panels in described segmentation procedure.

10. according to the manufacture method of the liquid crystal display device of claim 7, one in wherein said first and second substrates is the multi-chip module substrate that combines the corresponding one of a plurality of described first and second microlens arrays that are used for a plurality of panels, and in described first and second substrates another also is another the multi-chip module substrate that combines a plurality of described first and second microlens arrays that are used for a plurality of panels; And

Wherein said multi-chip module substrate overlaps each other and leaves certain interval therebetween, will be mounted on the panel pedestal of corresponding a plurality of panels; And

Described panel pedestal is divided into separate panels in described segmentation procedure.

11. according to the manufacture method of the liquid crystal display device of claim 7, wherein said segmentation procedure comprises:

The first blockage cutting step by the cutting of first blockage, along described multi-chip module substrate is divided into the defined border of separate panels, partly cuts described multi-chip module substrate, has the groove of V-shape xsect with formation; And

The second blockage cutting step fully cuts described groove by the cutting of second blockage, thereby forms the single substrate with the end face of cutting sth. askew.

12. the manufacture method according to the liquid crystal display device of claim 6 further comprises:

The orientation step, after in described strip step, peeling off described base plate and clean described substrate from the front surface of described substrate, in the temperature range of not damaging the thermal resistance that is combined in the described microlens array on the described substrate, on the exposure front surface of described substrate, form and be used for the both alignment layers of the described liquid crystal layer of orientation.

13. the manufacture method according to the liquid crystal display device of claim 6 further comprises:

The orientation step forms on the front surface of described substrate and is used for the both alignment layers of the described liquid crystal layer of orientation;

Wherein, described orientation step was carried out before described microlens array is attached on the described substrate back by described adhesion step, polishing step, bonding step and strip step.

14. according to the manufacture method of the liquid crystal display device of claim 6, wherein said polishing step is to be suitable for level by optics to play one or both or multiple combination of wiping, particulate sandblast, chemical-mechanical polishing and chemical etching and carry out.

15. manufacture method according to the liquid crystal display device of claim 6, wherein at described polishing step, come the thickness of the described substrate of attenuate by the back side of polishing described substrate in the following manner, promptly, at described first and second substrates of assembling in panel the time, make as each lenticular focus of described second microlens array of field lens corresponding to each lenticular principal point as described first microlens array of collector lens.

16. according to the manufacture method of the liquid crystal display device of claim 6, wherein said bonding step comprises:

The optical glass material that has a relative low-refraction by processing prepares the step of the described microlens array of being made up of the lenticule plane that is arranged in X-Y scheme; And

Described microlens array is navigated on the polished back face of described substrate, described microlens array is overlapped at this place also leave certain interval betwixt, the transparent optical resin that is higher or lower than described substrate refractive index with refractive index is filled this gap, and the step of solidifying this transparent optical resin.

17. according to the manufacture method of the liquid crystal display device of claim 16, wherein said bonding step comprises:

Be fixed to described microlens array and keep certain interval therebetween with the back side of encapsulant with described substrate polishing, the transparent optical resin that is higher or lower than described substrate refractive index with refractive index is filled this gap, and the step that seals this gap.

18. according to the manufacture method of the liquid crystal display device of claim 16, wherein this lenticule planar shaped becomes the shape of sphere, aspheric surface or Fresnel face.

19. the manufacture method according to the liquid crystal display device of claim 6 further comprises:

Cleaning step, for again-utilize described base plate, in described strip step, clean the described base plate of being stripped from as waste.

20. the manufacture method according to the liquid crystal display device of claim 6 further comprises:

Preliminary step, with in described first and second microlens arrays corresponding one be attached on described second substrate; With

Installation step is assembled to described second substrate that combines described microlens array on the front surface of described first substrate;

Wherein said adhesion step comprises the step that described base plate is adhered to the front surface side of described second substrate on the front surface that is assemblied in described first substrate;

Described polishing step is included in described panel is polished the back side of described first substrate down by the fixing state of described base plate step; And

Described bonding step comprises a corresponding step that bonds to the polished back face of described first substrate in described first and second microlens arrays.

21. according to the manufacture method of the liquid crystal display device of claim 20, wherein said polishing step comprises:

In the step that is used for the back side of described first substrate of polishing under the state that the outside a plurality of terminals that connect remain on same potential that is formed on described first substrate.

22. according to the manufacture method of the liquid crystal display device of claim 20, wherein said adhesion step comprises:

Described second substrate-side of described panel is installed to the described base plate that is fixed on the polishing platen that is used for described polishing step.

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