CN1955741A - 用于被测器件接触器的方法和设备 - Google Patents

用于被测器件接触器的方法和设备 Download PDF

Info

Publication number
CN1955741A
CN1955741A CNA2006100875051A CN200610087505A CN1955741A CN 1955741 A CN1955741 A CN 1955741A CN A2006100875051 A CNA2006100875051 A CN A2006100875051A CN 200610087505 A CN200610087505 A CN 200610087505A CN 1955741 A CN1955741 A CN 1955741A
Authority
CN
China
Prior art keywords
contactor
dut
pad
multilayer board
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100875051A
Other languages
English (en)
Inventor
罗米·梅德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inovys Corp
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of CN1955741A publication Critical patent/CN1955741A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

本发明公开了一种集成到DUT/探针板中的DUT接触器。集成到DUT/探针板中的DUT接触器可以包括位于多层的印刷电路板的一个表面上的凸起的金属化接触层。

Description

用于被测器件接触器的方法和设备
技术领域
本发明涉及用于DUT接触器的方法和设备。
背景技术
高端自动测试系统设计的中心是接触器。接触器本质上是作为连接测试系统至被测器件的最终联接。传统上，自动测试设备(ATE)产业已经使用被测器件(DUT)板或探针板来使信号从ATE系统通行至DUT引脚的位置。然后接触器可以放在DUT/探针板之上。然后DUT可以插入到接触器中，这可以使得DUT的球或引线电接触至DUT板或探针板。DUT球与接触器之间有一个接触，而在接触器与DUT板或探针板之间有一个接触。由此，DUT的每个引脚需要两个触头以电接触至DUT或探针板。此外，典型接触器的电气长度给DUT和ATE系统之间的信号路径增加了不需要的电感。
具体地设计各个不同的接触器以满足将被测试的每个特定DUT的需要。一般来说，不止一种接触器可以与特定的DUT板或探针板配合，每个接触器被转换成适应将被检测的特定DUT。尽管有许多接触器类型，但是大多数接触器通常使用弹簧销、弹性体、悬臂或微带线框架作为触头。由此，以前的接触器通常较昂贵，从设计到交货具有很长的交货时间，并易于接触失效。因此，有必要减少ATE产业中的现有DUT接触器的一些限制。
发明内容
相应地，本发明提供了一种集成于DUT板的DUT接触器，包括：多层印刷电路板；在所述多层印刷电路板的外层上的凸起的接触器垫；在所述多层印刷电路板中的过孔，其中，所述过孔用于耦合来自测试系统的信号并将信号耦合至测试系统，所述过孔电结合至凸起的接触器垫，所述凸起的接触器垫被间隔开以与DUT上的焊料球结合。
本发明还提供了一种用于制造集成于DUT板的DUT接触器的方法，包括以下步骤：形成多层印刷电路板；在所述多层印刷电路板中形成过孔；在所述多层印刷电路板的外层上对对应于DUT上的接触球的垫进行掩蔽；蚀刻金属化部分以在所述多层印刷电路板上形成接触器垫。
附图说明
结合附图，可以从以下的详细描述中得到对本教导的理解，其中：
图1示出带有探针或DUT板并且上面有接触器的测试头的立体图。
图2示出带有DUT和DUT/探针板的弹簧销接触器的侧剖图。
图3示出带有DUT和DUT/探针板的悬臂接触器的侧剖图。
图4示出DUT与组合的接触器/DUT板的侧剖图。
具体实施方式
图1示出安装在探针或DUT板104上的典型接触器102。探针或DUT板104可以用连接圈106紧固到装载板108。装载板108安装到测试头110。测试头110通过线缆组件112或其它数据传输装置与测试系统(未示出)通讯。接触器102使DUT的球或引线(未示出)电连接至DUT/探针板104。
图2示出的是用典型的柱塞或夹子202将DUT 204紧固到DUT/探针板208上的具有弹簧销210的接触器206。图2图示了在DUT 204和接触器206之间在弹簧销210一端处的接触212以及在弹簧销210的第二端与探针/DUT板208之间的第二接触214。图3示出的是用典型的柱塞或夹子302将DUT304紧固到DUT/探针板308上的带悬臂触头310的接触器306。图3图示DUT 304的球或引线312和悬臂310的第一端314之间的的第一接触以及悬臂310的第二端316与DUT/探针板308上的接触器垫318之间的第二接触。
图4示出带有诸如引线或焊料球之类的接触器垫404的DUT 402。在图4中还示出了带有多个层412、过孔408以及凸起的金属接触器垫406的集成的接触器和DUT/探针板400，过孔408用于从自动测试系统(ATE)输送信号410并输送信号至自动测试系统(ATE)。接触器垫406与DUT上的接触球404对齐。由此，当DUT 402通过柱塞或夹子(未示出)与集成的接触器/DUT板400接触时，在DUT球404和接触器的接触器垫406之间可以实现充分的接触。
集成的接触器/DUT板400可以包括在外层上带有200微英寸的镍和50微英寸的金的多层412印刷电路板。接下来，通过使用平板印刷工艺或其它类似的工艺，可以对DUT球404下面并与其对应的垫进行掩蔽。接下来，金属化部分用化学方法进行蚀刻，以使金属从PCB层上部分地脱离。然后由于金属所受的拉伸载荷导致金属浮起离开PCB的表面。可替换地，可以利用机械的后处理步骤以确保PCD的外部金属化层有足够的拉伸载荷。例如，机械的柱体可以从PCB的背侧插过过孔，以将载荷作用到蚀刻后的指状簧片，而产生将弹簧升高到合适高度的永久变形。此外，另一个可能的替换方法是使用引线键合机来升高蚀刻后的指状簧片。
金属可以是BeCu、磷青铜或类似特性的其它金属或合成物以适应接触器垫406所需要的弹簧力。可以通过PCB上的掩蔽面积的尺寸来调整弹簧力。制造过程控制和金属的蚀刻速率可以被控制以确保凸起的金属接触器垫406是均匀的高度，以确保在测试过程中当用柱塞或夹子压DUT球404时与DUT球404的接触。利用热和压力用标准的箔片加工技术，或其它公知的技术，可以将BeCu、磷青铜或其它金属覆盖到PCB的外层。
集成的接触器和DUT板400能够为每个DUT引脚消除一个触头，有效地去除了接触器的电长度，这充分改善了信号路径中的电感。接触器的成本将被DUT板下的PCB上的金属接触器垫406升高所需的最小成本所代替。对于平板印刷或其它类似的工艺来说，这可能相对便宜，特别是在与典型接触器的价格和设计复杂性相比时。
DUT板上可以增加其他构造，例如与被用于产生接触器的接触器垫406的相同或类似工艺对齐的构造。

Claims (4)

1.一种集成于被测器件板的被测器件接触器，包括：
多层印刷电路板；
在所述多层印刷电路板的外层上的凸起的接触器垫；
在所述多层印刷电路板中的过孔，其中，所述过孔用于耦合来自测试系统的信号以及将信号耦合至测试系统，所述过孔电连接至所述凸起的接触器垫，所述凸起的接触器垫被间隔开，用来与被测器件上的焊料球结合。
2.根据权利要求1所述的集成于被测器件板的被测器件接触器，其中，所述凸起的接触器垫是BeCu。
3.根据权利要求1所述的集成于被测器件板的被测器件接触器，其中，所述凸起的接触器垫是磷青铜。
4.一种用于制造集成于被测器件板的被测器件接触器的方法，包括以下步骤：
形成多层印刷电路板；
在所述多层印刷电路板中形成过孔；
垫在所述多层印刷电路板的外层上对对应于被测器件上的接触球的垫进行掩蔽；
蚀刻金属化部分以在所述多层印刷电路板上形成接触器垫。
CNA2006100875051A 2005-10-24 2006-06-13 用于被测器件接触器的方法和设备 Pending CN1955741A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/257,143 2005-10-24
US11/257,143 US20070090849A1 (en) 2005-10-24 2005-10-24 Method and apparatus for a DUT contactor

Publications (1)

Publication Number Publication Date
CN1955741A true CN1955741A (zh) 2007-05-02

Family

ID=37905465

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100875051A Pending CN1955741A (zh) 2005-10-24 2006-06-13 用于被测器件接触器的方法和设备

Country Status (6)

Country Link
US (1) US20070090849A1 (zh)
JP (1) JP2007121285A (zh)
KR (1) KR20070044366A (zh)
CN (1) CN1955741A (zh)
DE (1) DE102006034191A1 (zh)
TW (1) TW200717944A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008054077B4 (de) * 2008-10-31 2021-04-01 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Verfahren und Vorrichtung zur Herstellung von Bonddrähten auf der Grundlage mikroelektronischer Herstellungstechniken
KR101000573B1 (ko) 2008-11-10 2010-12-14 앰코 테크놀로지 코리아 주식회사 반도체 패키지 실장용 인쇄회로기판
US8837162B2 (en) * 2010-05-06 2014-09-16 Advanced Micro Devices, Inc. Circuit board socket with support structure
US8938876B2 (en) 2010-05-06 2015-01-27 Advanced Micro Devices, Inc. Method of mounting a circuit board
US8912810B2 (en) 2011-09-09 2014-12-16 Texas Instruments Incorporated Contactor with multi-pin device contacts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000180506A (ja) * 1998-12-15 2000-06-30 Nec Corp 半導体装置検査用コンタクト装置
JP2001133514A (ja) * 1999-11-05 2001-05-18 Mitsubishi Electric Corp Ｄｕｔボード及びそれを用いるテスト方法
JP4323055B2 (ja) * 2000-03-22 2009-09-02 富士通マイクロエレクトロニクス株式会社 半導体装置試験用コンタクタ及びその製造方法
AU2003275636A1 (en) * 2002-10-31 2004-05-25 Advantest Corporation Connection unit, board mounting device to be measured, probe card, and device interface unit
JP2005114594A (ja) * 2003-10-09 2005-04-28 Hitachi Cable Ltd 半導体装置検査用配線板及びその製造方法

Also Published As

Publication number Publication date
KR20070044366A (ko) 2007-04-27
DE102006034191A1 (de) 2007-04-26
TW200717944A (en) 2007-05-01
US20070090849A1 (en) 2007-04-26
JP2007121285A (ja) 2007-05-17

Similar Documents

Publication Publication Date Title
KR100745104B1 (ko) 컨택터 프로브, 전기 프로브 유닛, 컨택터 프로브를 위한 프로브 어셈블리와 절연체의 조합체 및 컨택터 프로브를 위한 탄성의 도전성 프로브 어셈블리
US20210123950A1 (en) Probe card for high frequency applications
US7898276B2 (en) Probe card with stacked substrate
US20040012383A1 (en) Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance
US20100176831A1 (en) Probe Test Card with Flexible Interconnect Structure
KR20170131678A (ko) 향상된 필터링 특성을 갖는 전자 기기의 테스트 장치용 프로브 카드
CN101183118B (zh) 连接电气信号用坐标变换装置
US20210190822A1 (en) Multi-layer mems spring pin
CN102656468A (zh) 用于对加载印刷电路板进行测试的布线板
CN1955741A (zh) 用于被测器件接触器的方法和设备
US20100182029A1 (en) Electrical testing device and electrical testing method for electronic device
JP3714344B2 (ja) 回路基板検査装置
US7733104B2 (en) Low force interconnects for probe cards
KR102012202B1 (ko) 프로브 카드와 그 제조 방법 및 이를 이용한 반도체 소자의 검사 방법
KR102671633B1 (ko) 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법
KR20220023438A (ko) 도전성 입자 및 이를 포함하는 검사용 소켓
KR100583794B1 (ko) 도전성 접촉자 및 전기 프로브 유닛
KR102644473B1 (ko) 반도체 패키지의 테스트 장치
KR102597274B1 (ko) 신호 전송 커넥터
KR102667580B1 (ko) 컴포넌트를 내장한 러버 소켓
JP3966357B2 (ja) 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法
KR20230031638A (ko) 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법
KR101340416B1 (ko) 프로브 시트, 이를 포함하는 프로브 카드 및 이의 제조방법
JP2008122240A (ja) 電気抵抗測定用コネクター装置および回路基板の電気抵抗測定装置
KR20010093028A (ko) 프로브 카드의 제조 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
C41 Transfer of patent application or patent right or utility model
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20081114

Address after: Singapore Singapore

Applicant after: Inovys Corp.

Address before: American California

Applicant before: Anjelen Sci. & Tech. Inc.

ASS Succession or assignment of patent right

Owner name: VERIGY (SINGAPORE) PTE LTD

Free format text: FORMER OWNER: ANJELEN SCI. + TECH. INC.

Effective date: 20081114

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20070502