CN1946278A - Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment - Google Patents
Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment Download PDFInfo
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- CN1946278A CN1946278A CN 200610141873 CN200610141873A CN1946278A CN 1946278 A CN1946278 A CN 1946278A CN 200610141873 CN200610141873 CN 200610141873 CN 200610141873 A CN200610141873 A CN 200610141873A CN 1946278 A CN1946278 A CN 1946278A
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Abstract
The invention provides heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, and electronic equipment.A method of manufacturing a heat exchanger having a plurality of fine flow channels includes forming a plurality of thin plate members into a predetermined shape, and laminating the plurality of thin plate members and bonding by diffusion bonding.
Description
Technical field
The present invention relates to have the heat exchanger of a plurality of fine channels and the manufacture method of heat exchanger etc.
Background technology
Projector in recent years, seeks miniaturization, high briliancyization, long lifetime, cheap etc.For example, about miniaturization, liquid crystal panel (optical modulation element) size is 1.3 inches from diagonal to be become about 0.5 inch, is becoming area than less than 1/6 miniaturization.
As the light source of projector,, seek miniaturization by light-emitting diode (LED:LightEmitting Diode) or the laser diode (LD:Laser Diode) that is used as solid light source.Led light sources etc. comprise that power supply is small-sized, can instantaneously light/extinguish, and in the wide and long life-span of color reproduction etc., as light source for projector advantage are arranged.In addition, because do not contain harmful substances such as mercury, so be good from environmental protection yet.
, because along with the high briliancyization of led light source etc., from the heating increase of led light source and luminous efficiency reduces, so be necessary to take the countermeasure of generating heat.Cooling effectiveness noise insufficient, fan is a problem general passing through of being adopted in the forced air-cooling mode that fan carries out.
Therefore, the heat exchanger of useful a plurality of streams with liquid communication is forced the method for cooling LED light source etc.As this heat exchanger, as shown in patent documentation 1, a plurality of thin plates of lamination have been proposed, by welding, form the method for a plurality of streams.
Patent documentation 1: the spy opens the 2005-166855 communique
But in above-mentioned technology, the scolder that exists the joint that is used for thin plate flow into stream, causes the problem of stopping up stream.In addition, owing to clip scolder between thin plate, reduce such problem significantly so exist the pyroconductivity of the stack direction of thin plate.And then, owing to clip the metal different with thin plate, thus electrolytic corrosion become problem.
Summary of the invention
The present invention In view of the foregoing makes, and it is a kind of when forming a plurality of fine channel at the lamination thin plate that purpose is to provide, and can engage the manufacture method etc. of the heat exchanger of each thin plate well.
In the manufacture method of heat exchanger according to the present invention, heat exchanger, liquid cooling system, light supply apparatus, projector, electronic device unit, electronic equipment, in order to address the above problem the following means that adopt.
The 1st invention is the manufacture method with heat exchanger of a plurality of fine channels, comprising operation that a plurality of thin-plate elements is formed predetermined shape and the aforementioned a plurality of thin-plate elements of lamination, make it the operation of diffusion bond.
According to the present invention, then owing between each thin-plate element, not clipping different metals, so can carry out the joint of each thin-plate element well.In addition, can avoid fine stream to be stopped up, take place electrolytic corrosion, the not good situations such as reduction to the pyroconductivity of the stack direction of thin plate take place reliably by other metals.
In addition, aforementioned diffusion bond operation comprises: alternatively configuration is formed with a plurality of the 1st thin-plate elements in the space that constitutes aforementioned fine channel and a plurality of the 2nd thin-plate elements of the aforementioned fine channel of formation partition wall each other, and both ends or one end at the stack direction of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element, dispose the operation of the 3rd thin-plate element of the liquid delivery tube that is formed with the through hole that is communicated in aforementioned fine channel and is connected in this through hole, with aforementioned the 3rd thin-plate element except the zone of aforementioned liquids feed tube at least, by the operation of exerting pressure with the direction of the stack direction almost parallel of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element, even so form the occasion of liquid delivery tube at the face of exerting pressure, also can exert pressure by avoiding this liquid delivery tube, to the pressure of the additional approximate equality of a plurality of thin-plate elements, can realize good diffusion bond.
In addition, because comprising the aforementioned a plurality of thin-plate elements that become one by diffusion bond are cut into operation a plurality of, that monolithic changes into a plurality of heat exchangers, so can be roughly side by side the efficient highland make a plurality of heat exchangers, therefore can realize cheap heat exchanger.
The 2nd invention is the heat exchanger with a plurality of fine channels, comprising, be formed with a plurality of the 1st thin-plate elements in the space that constitutes aforementioned fine channel, with a plurality of the 2nd thin-plate elements that constitute aforementioned fine channel partition wall each other, aforementioned a plurality of the 1st thin-plate elements and aforementioned a plurality of the 2nd thin-plate element be diffusion bond alternatively.
According to the present invention, then owing between each thin-plate element, do not clip different metals, so the joint of each thin-plate element carries out well, whereby, can avoid fine stream to be stopped up reliably, electrolytic corrosion take place, the not good situations such as reduction to the pyroconductivity of the stack direction of thin plate take place by other metals.
In addition, owing to, have the 3rd thin-plate element that is formed with the through hole that is communicated in aforementioned fine channel, so can side by side form the intake and the delivery port of liquid in the both ends or one end of the stack direction of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element.
In addition, owing to can connect the pipe junction surface of liquid delivery tube in the end face formation of aforementioned through hole, so the inlet tube and the outlet of liquid can easily be installed.
The 3rd invention is the heat dump that has with the heat generating components thermo-contact, pump to aforementioned heat dump feed fluid, liquid cooling system with the radiator that makes the liquid heat radiation of discharging from aforementioned heat dump, wherein as aforementioned heat dump, adopt heat exchanger, perhaps adopt the heat exchanger of the 2nd invention by the method manufacturing of the 1st invention.
According to the present invention,, the liquid cooling system of high heat exchanger effectiveness is arranged also even then can realize for a short time with the contact area of heat generating components.
The 4th invention is the light supply apparatus that comprises the solid luminescence light source of and heating luminous by supplying electric current and cool off the liquid cooling portions of this solid luminescence light source, wherein as the liquid cooling system of aforementioned liquid cooling portions with the 3rd invention.
According to the present invention, then owing to suppressing the heating of solid luminescence light source effectively, so can realize the light supply apparatus of high briliancy.
The 5th invention, projector has the light supply apparatus of the 4th invention.According to the present invention, then can realize the projector of small-sized and high briliancy.
The 6th invention is the electronic device unit that comprises the electronic device that generates heat by supplying electric current and cool off the liquid cooling portions of this electronic device, wherein as aforementioned liquid cooling portions, with the liquid cooling system of the 3rd invention.
According to the present invention, then owing to suppressing the electronic device heating effectively, so can realize the electronic device unit that disposal ability is high.
The 7th invention, electronic equipment has the electronic device unit of the 6th invention.According to the present invention, then can realize electronic equipment small-sized and that disposal ability is high.
Description of drawings
Fig. 1 is the figure that the summary of expression heat exchanger constitutes.
Fig. 2 is the figure of expression laminated plate.
Fig. 3 is the cutaway view of variation of the internal structure of expression heat exchanger.
Fig. 4 is the figure of the variation of expression laminated plate.
Fig. 5 is the figure to the pressure addition method of laminated plate of expression when the diffusion bond.
Fig. 6 is the figure that represents roughly side by side to make the method for a plurality of heat exchangers.
Fig. 7 is the figure that the summary of expression liquid cooling system constitutes.
Fig. 8 is the vertical view that the summary of expression light supply apparatus constitutes.
Fig. 9 is the cutaway view of light supply apparatus.
Figure 10 is the schematic diagram that the summary of expression projector constitutes.
Figure 11 is that expression is arranged at the figure that the pipeline of the liquid cooling system of projector constitutes.
Figure 12 is the figure that the summary of expression information processor constitutes.
Label declaration
1a ... laminated plate (the 2nd thin-plate element), 1b ... laminated plate (the 1st thin-plate element), 1c ... laminated plate (the 3rd thin-plate element), 1d ... laminated plate (thin-plate element), 2 ... inlet tube (liquid delivery tube), 3 ... outlet (liquid delivery tube), 10 ... heat exchanger, 11 ... stream, 12 ... partition wall, 15 ... slot part, 20 ... liquid cooling system, 22 ... liquid delivery tube, 24 ... pump, 26 ... radiator, 100 ... light supply apparatus, 120 ... led chip, 500 ... projector, 512,513,514 ... light supply apparatus, 700 ... electronic device unit, 702 ... CPU, C ... water (liquid), H ... heater
Embodiment
Below, with reference to accompanying drawing with regard to heat exchanger of the present invention, the manufacture method of heat exchanger, liquid cooling system, light supply apparatus, projector, electronic device unit, the example of electronic equipment describes.
(heat exchanger)
Fig. 1 is the figure that the summary of expression heat exchanger constitutes, and Fig. 1 (a) is a perspective view, and Fig. 1 (b) is a longitudinal section, and Fig. 1 (c) is a sectional elevation.
As shown in Fig. 1 (a),, connecting and be used for water W is incorporated into inner inlet tube 2 and is used for discharging the outlet 3 that is incorporated into inner water W in the side of heat exchanger 10.In addition, the interarea of heat exchanger 10 is in order to contact and to be formed flatly with heater H.
Moreover be the Z direction with the direction (thickness direction of heat exchanger 10) that is orthogonal to the interarea that contacts with heater H, be directions X with the flow direction of the water W in the stream 11.
As shown in Fig. 1 (b),, form a plurality of fine streams 11 in the inside of heat exchanger 10.This stream 11, in order to strengthen the contact area with water W, the aspect ratio of the section shape of stream 11 (depth-width ratio) forms very greatly.Specifically, as shown in Fig. 1 (c), the height that forms each stream 11 is 2～3mm, and width is the essentially rectangular about 50～100 μ m.
By this formation, the water W that is incorporated into the inside of heat exchanger 10 from inlet tube 3 is diverted to a plurality of fine streams 11, then, is discharged to the outside from outlet 3.The flow of water W for example, is 3cc/ about second.
Fig. 2 is the figure of expression laminated plate.
As mentioned above, heat exchanger 10 laminations heat conductivity is high as copper or aluminium laminated plate 1a, 1b etc. and forming.Laminated plate 1a, 1b etc. form predetermined shape by punch process or etching and processing, and these laminated plates of lamination 1a, 1b make it diffusion bond by pressurized, heated, form heat exchanger 10.
Laminated plate 1a (the 2nd thin-plate element) is the thin-plate element that is used for constituting the partition wall 12 that formed a plurality of streams 11 in the inside of heat exchanger 10 are separated each other.Laminated plate 1a, as shown in Fig. 2 (a), rectangular middle body is solid, forms through hole portion 31,32 in the both end sides than length direction.The solid section of central authorities constitutes partition wall 12.On the other hand, through hole portion 31,32 constitutes: in the formed stream in the inside of heat exchanger 10 is a part of, in the formed gap 13,14 of upstream side and downstream (with reference to Fig. 1 (b)) of a plurality of fine streams 11.
Moreover roughly flow and the space that is provided with at each of a plurality of streams 11 equably in order to make water W in gap the 13, the 14th.In addition, though in Fig. 2, through hole portion 31 forms rectangle, also can form circle etc.
Laminated plate 1b (the 1st thin-plate element) is the thin-plate element that is used for being formed in the formed a plurality of streams 11 in inside of heat exchanger 10.Laminated plate 1b, as shown in Fig. 2 (b), form rectangular shaped as frame, the middle body of the through hole portion 33 that it is inboard constitutes stream 11, and the both end sides than length direction of through hole portion 33 is formed in the formed gap 13,14 of upstream side and downstream of stream 11.
Moreover the profile of laminated plate 1b is identical with laminated plate 1a, and then the shape of the part of the through hole portion 33 of laminated plate 1b forms a part of consistent with the through hole portion 31,32 of laminated plate 1a.
Then, if pressurize, heat these members, phase counterdiffusion, this two joint take place in the contact site office then.The bonding method that utilizes this is a diffusion bond.This one engage be not moment ground take place, but after a part was engaged, the junction surface was enlarged by the surface tension at the sharp-pointed part place of contact jaw, disengaged (being called space (Void)) dwindles, its just disappears soon, entire contact surface is engaged.
Because mother metal does not become liquid phase when engaging, so,, stop up the problem of stream 11 because of scolder flow into stream 11 not as occasion with scolder.In addition, not because of solder clip between laminated plate 1a, 1b etc., the problem that causes the pyroconductivity of stack direction to reduce significantly.And then, do not have because of clipping the problem of the metal generation electrolytic corrosion different with laminated plate 1a, 1b.
So, lamination laminated plate 1a, 1b etc. engage by diffusion bond, can form the heat exchanger 10 of the stream 11 with a plurality of fine section shapes well.
Moreover, also can be as shown in Fig. 1 (b), laminated plate 1c (the 3rd thin-plate element) or laminated plate 1d at the two ends of the stack direction that is disposed at heat exchanger 10 are pre-formed inlet tube 2 and outlet 3.This laminated plate 1c or laminated plate 1d also be, with laminated plate 1a, 1b diffusion bond side by side.
Diffusion bond, generally by to stacked arrangement laminated plate 1a～1d apply compression stress with the direction of its stack direction almost parallel, and then be heated to about 500～800 ℃, and carry out.And, thisly be bonded on decompression (in the vacuum) and carry out.Be in order to prevent the corrosion of laminated plate 1a～1d etc.
Fig. 3 is the cutaway view of variation of the internal structure of expression heat exchanger, and Fig. 4 is the figure of the variation of expression laminated plate.
As shown in Figure 3, also can form near the introducing stream 16,17 the stream 11 that is communicated to middle body from the inlet tube 2 and the outlet 3 of heat exchanger 10, so as water W easily the stream 11 of the middle body in the middle of a plurality of streams 11 flow.In this occasion, compare with the occasion of Fig. 1 and to form gap 13,14 narrowlyer.In addition, introducing stream 16,17 is made of laminated plate 1a, 1b.
That is to say, in the middle of laminated plate 1a, 1b, from being disposed at laminated plate (the laminated plate 1a of inlet tube 2 and outlet 3 sides near the stream 11 of middle body
1, 1a
2, 1b
1, 1b
2), further form and be used for constituting the through hole portion 36 that introduces stream 16,17 etc.
Specifically, as shown in Figure 4, at laminated plate 1a
1, 1b
1, further form the through hole portion 36,37 that constitutes introducing stream 16,17 positions (in the coconnected part of Y direction) central, that be connected in inlet tube 2 and outlet 3.At laminated plate 1a
2, 1b
2, further form the through hole portion 19 that constitutes the position (in the coconnected part of directions X) that is connected in gap 13,14.
In addition, in Fig. 3,, also can be pre-formed the pipe conjugate foramen 4,5 that is used for connecting inlet tube 2 and outlet 3 at laminated plate 1c or laminated plate 1d.
Moreover though in this example, just the occasion at Y direction superimposed layer laminated plate 1a, 1b etc. is illustrated, and also can make it lamination on directions X and forms.
Fig. 5 is the figure to the pressure addition method of laminated plate of expression when the diffusion bond.
In the occasion of diffusion bond laminated plate 1a～1d, at lamination behind laminated plate 1a～1d, be necessary to exert pressure being roughly parallel on the direction of its stack direction.But, owing to be pre-formed inlet tube 2 and outlet 3 at laminated plate 1c, so be necessary to exert pressure in the zone of avoiding this inlet tube 2 and outlet 3.
Specifically, as shown in Fig. 5 (a), lamination laminated plate 1a～1d makes laminated plate 1d be closely attached on base plate B ground with its mounting.Then, as shown in Fig. 5 (b), to the region R of the laminated plate 1c P that exerts pressure except inlet tube 2 and outlet 3.
Whereby, owing to, apply towards the pressure of the roughly homogeneous of stack direction, so these laminated plates 1a～1d engages well to constituting the laminated plate 1a～1d of heat exchanger 10.
Fig. 6 is the figure that represents roughly side by side to make the method for a plurality of heat exchangers 10.
The size of heat exchanger 10 is the size about several centimeter square.Therefore, by formation, lamination, laminated plate 1a～1d that diffusion bond is little, the method for making heat exchanger 10 respectively is not efficiently.
Therefore, form each of laminated plate 1a～1d to go up a plurality of states that are connected in directions X and Z direction (with reference to Fig. 1, Fig. 4).Then, laminated plate 1a～1d of forming like this of lamination successively on the Y direction, and then carry out diffusion bond.Whereby, as shown in Fig. 6 (a), a plurality of heat exchangers 10 are manufactured with the state that is connected on directions X and Z direction.
Moreover, when P that laminated plate 1c is exerted pressure, as mentioned above, to the P that exerts pressure except the region R of inlet tube 2 and outlet 3.For example, with the anchor clamps G shown in Fig. 6 (b), the region R of pushing laminated plate 1c.
Then, with the integral body that a plurality of heat exchangers 10 of cut-outs such as fret saw link into an integrated entity like this, carry out singualtion.Specifically, cut off, can obtain a plurality of heat exchangers 10 whereby along the dotted line shown in Fig. 6 (a).
By using this manufacture method, can make a plurality of heat exchangers 10 in the efficient highland, can seek the cost degradation of heat exchanger 10.
(liquid cooling system)
Next, the liquid cooling system 20 that just has an above-mentioned heat exchanger 10 describes.
Fig. 7 is the figure that the summary of expression liquid cooling system 20 constitutes.
By this formation, water W supplies to the inside of heat exchanger 10 via liquid delivery tube 22 and inlet tube 2 from pump 24.Heat exchanger 10 contacts with heater H, is delivered to water W in stream 11 circulations of inside from the heat of heater H.
Because of the heated water W of heat that absorbs heater H is incorporated into radiator 26 from outlet 3 via liquid delivery tube 22.Then, in radiator 26, the heat of water W rejects heat in the atmosphere.
According to liquid cooling system 20, then because heat exchanger 10 is small-sized, even little with the contact area of heater H, the depth-width ratio of the section shape of stream 11 is also big, so the heat exchanger effectiveness height.Thereby, can cool off heater H effectively.
(light supply apparatus)
Next, the light supply apparatus 100 that just has an above-mentioned liquid cooling system 20 describes.
Fig. 8 is the vertical view that the summary of expression light supply apparatus 100 constitutes, and Fig. 9 is the cutaway view of light supply apparatus 100.
Led chip 120 luminous and heating by supplying electric current, install at Submount (submount) flip-chip-on that forms by institutes such as silicon and be formed with the wiring that is used for applying electrical power to led chip 120, each bonding agent by heat conductivity of this Submount (for example, silver-colored paste) is installed on the base station 110.
In addition, on the 1st base station 110, disposing reflector 114, and then surrounding these reflector 114 ground and disposing resin frame 130.And, disposed by the top of resin frame 130 with supporting and cover 140, by cover 140 and resin frame 130 formed spaces in, filling silicone oil etc.
As shown in Fig. 8 and Fig. 9, on resin frame 130, embed mold pressing outer lead (outer lead) 131,132, one end of this outer lead 131,132 is connected with flexible base, board 117,118 on being disposed at base station 110, and the other end is connected with formed connection pads on Submount 121 by wire 122 grades.And electric power is via Submount 121, flexible base, board 117,118, and outer lead 131,132 and wire 122 supply to led chip 120.
Moreover, in this example, on each outer lead 131,132, respectively connect three one metal wires 122, can change the radical of wire 122 according to the electric power amount that supplies to led chip 120.
In the light supply apparatus 100 that is constituted like this, if electric current supply to led chip 120, then penetrates light from led chip 120, this emitted light penetrates from light supply apparatus 100 via cover 140.Then, reflex to cover 140 directions to the emitted light in side by reflector 114, then, penetrate from light supply apparatus 100 via cover 140 from led chip 120.
And, in light supply apparatus 100, because the relative base station 110 of above-mentioned liquid cooling system 20 (heat exchanger 10) is connecting with being adjacent to, so by water W is flowed in the stream 11 of heat exchanger 10, the cooling LED chip 120 effectively, can prevent the breakage that the heat of led chip 120 causes.Thereby, become the light supply apparatus 100 of high briliancy and good reliability.
(projector)
Next, the projector 500 that just has an above-mentioned light supply apparatus 100 describes.
Figure 10 is the schematic diagram that the summary of expression projector 500 constitutes.Figure 11 is the figure that expression is located at the pipeline formation of the liquid cooling system in the projector 500.
Projector 500 has light supply apparatus 512,513,514, liquid crystal light valve 522,523,524, cross colour splitting prism 525, and projecting lens 526.
Three light supply apparatuses 512,513,514 are made of above-mentioned light supply apparatus 100.In each light supply apparatus 512,513,514, adopt luminous led chip respectively for red (R), green (G), blue (B).Moreover the homogeneous illuminator as the Illumination Distribution homogeneous that is used for making light source light can dispose rod-shaped lens or fly lens at the rear of each light supply apparatus.
From the light beam of red light source device 512, the overlapping lens 535R of transmission mirror 517 reflection that is reflected is incident in red light with liquid crystal light valve 522.In addition, from the light beam of green light source device 513, the overlapping lens 535G of transmission is incident in green light liquid crystal light valve 523.
In addition, from the light beam of blue-light source device 514, the overlapping lens 535B of transmission mirror 516 reflection that is reflected is incident in blue light with liquid crystal light valve 524.
Moreover in the occasion of using fly lens as the homogeneous illuminator, overlapping in the viewing area of liquid crystal light valve via overlapping lens from the light beam of each light source, liquid crystal light valve is illuminated equably.
In addition, in the light incident side and the exiting side of each liquid crystal light valve 522,523,524, disposing polarization plates (not shown).And, only, be incident in each liquid crystal light valve 522,523,524 from the rectilinearly polarized light transmission incident lateral deviation vibration plate of the predetermined direction in the middle of the light beam of each light supply apparatus 512,513,514.
In addition, also polarization conversion unit (not shown) can be set in the place ahead of light incident side polarization plates.At this moment, can make by the beam reflected recirculation of light incident side polarization plates institute, be incident in each liquid crystal light valve, the utilization ratio of light is improved.
Three kinds of coloured light being modulated by each liquid crystal light valve 522,523,524 are incident in cross colour splitting prism 525.This prism is pasted four right-angle prisms and is formed, and disposes the dielectric multilayer film of reflection red light and the dielectric multilayer film of reflect blue light within it on the face crisscross.Three kinds of coloured light are synthetic by these dielectric multilayer films, form the light of color display.
Then, the light that is synthesized by as projecting lens 526 projections of projection optical system on projection screen 527, show enlarged image.
Because the light supply apparatus 512,513,514 of above-mentioned example has the liquid cooling system 20 of cooling LED chip, so can realize high briliancyization and can make at an easy rate.Thereby, the good projector of display characteristic 500 can be provided at an easy rate.
Moreover, constitute as the pipeline of the liquid cooling system 20 in the light supply apparatus 512,513,514, also can be the series connection pipeline type shown in Figure 11 (a), a certain with the parallel pipeline type shown in Figure 11 (b).
In addition, though adopt led chip, also can adopt semiconductor laser etc. as the solid luminescence light source as the solid luminescence light source.And then, though in above-mentioned projector, adopt liquid crystal light valve, also can adopt micromirror array device etc. as optical modulator body as optical modulator body.
(electronic device unit, electronic equipment)
Next, electronic device unit 700 and the information processor 800 that just has an above-mentioned liquid cooling system 20 describes.
Figure 12 is the schematic diagram of one of example such as information processor 800 such as expression personal computer etc.
Information processor (electronic equipment) 800 has input parts 802 such as keyboard, information processor main body (housing) 804 and display part 806 etc.
And, be provided with in the inside of information processor main body 804 by CPU (central arithmetic processing apparatus) 702 and electronic device unit 700 that its liquid cooling system 20 that carries out liquid cooling is constituted.Moreover, preferably adopt micropump as the pump that applies to the liquid cooling system 20 of electronic device unit.
CPU, the heating when it drives is absorbed by liquid cooling system 20, is suppressed to below the uniform temperature.Whereby, can bring into play high disposal ability.Thereby, the information processor 800 that can realize having operational capability highly.
Moreover, be not limited to information processor 800 as electronic equipment with electronic device unit 700.So long as it is just passable to have an electronic equipment that be cooled to the following heater H of uniform temperature.
Though more than, just being illustrated with reference to accompanying drawing according to the best example of heat exchanger of the present invention, liquid cooling system, light supply apparatus, projector, electronic device unit, electronic equipment, the present invention is not limited to above-mentioned example certainly.The different shape of each component parts shown in the above-mentioned example, combination etc. are an example just, can carry out all changes based on designing requirement etc. in the scope that does not break away from spirit of the present invention.
For example, the liquid as the inside that supplies to heat exchanger (stream) is not limited to water.So long as it is just passable to be suitable for the liquid of coolant.
Claims (11)
1. the manufacture method of a heat exchanger, this heat exchanger has a plurality of fine channels, and this manufacture method is characterised in that, comprising:
A plurality of thin-plate elements form predetermined shape operation and
The aforementioned a plurality of thin-plate elements of lamination, make the operation of its diffusion bond.
2. the manufacture method of heat exchanger as claimed in claim 1 is characterized in that, aforementioned diffusion bond operation comprises:
Alternatively configuration is formed with a plurality of the 1st thin-plate elements in the space that constitutes aforementioned fine channel and a plurality of the 2nd thin-plate elements of the aforementioned fine channel of formation partition wall each other, and both ends or one end at the stack direction of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element, configuration be formed with the through hole that is communicated in aforementioned fine channel and be connected in this through hole liquid delivery tube the 3rd thin-plate element operation and
To aforementioned the 3rd thin-plate element except the zone of aforementioned liquids feed tube at least, by with the direction of the stack direction almost parallel of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element, the operation of exerting pressure.
3. the manufacture method of heat exchanger as claimed in claim 1 or 2 is characterized in that, comprising: the aforementioned a plurality of thin-plate elements that become one by diffusion bond cut into a plurality of, make its monolithic turn to the operation of a plurality of heat exchangers.
4. heat exchanger, it has a plurality of fine channels, it is characterized in that, has:
Be formed with the space that constitutes aforementioned fine channel a plurality of the 1st thin-plate elements and
Constitute a plurality of the 2nd thin-plate elements of aforementioned fine channel partition wall each other,
Aforementioned a plurality of the 1st thin-plate element and aforementioned a plurality of the 2nd thin-plate element be diffusion bond alternatively.
5. heat exchanger as claimed in claim 4 is characterized in that, the both ends or one end at the stack direction of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element have the 3rd thin-plate element that is formed with the through hole that is communicated in aforementioned fine channel.
6. heat exchanger as claimed in claim 5 is characterized in that, is formed with the pipe junction surface that can connect liquid delivery tube at the end face of aforementioned through hole.
7. liquid cooling system, it has:
With the heat dump of heat generating components thermo-contact,
To the pump of aforementioned heat dump feed fluid and
Make the radiator of the liquid heat radiation of discharging from aforementioned heat dump,
It is characterized in that,
As aforementioned heat dump, adopt heat exchanger by any one the described method manufacturing in the claim 1 to 3, perhaps adopt any one the described heat exchanger in the claim 4 to 6.
8. light supply apparatus, it has: the solid luminescence light source of and heating luminous and cool off the liquid cooling portions of this solid luminescence light source by supplying electric current, it is characterized in that, adopt the described liquid cooling system of claim 7 as aforementioned liquid cooling portions.
9. a projector is characterized in that, has the described light supply apparatus of claim 8.
10. electronic device unit, it has: electronic device that generates heat by supplying electric current and the liquid cooling portions that cools off this electronic device, it is characterized in that, as aforementioned liquid cooling portions, adopt the described liquid cooling system of claim 7.
11. an electronic equipment is characterized in that, has the described electronic device unit of claim 10.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP292192/2005 | 2005-10-05 | ||
| JP2005292192 | 2005-10-05 | ||
| JP025761/2006 | 2006-02-02 |
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|---|---|
| CN1946278A true CN1946278A (en) | 2007-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610141873 Pending CN1946278A (en) | 2005-10-05 | 2006-10-08 | Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment |
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| CN (1) | CN1946278A (en) |
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| CN101900926A (en) * | 2009-04-03 | 2010-12-01 | 精工爱普生株式会社 | Heat exchanger and projector |
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| CN103185249A (en) * | 2013-04-22 | 2013-07-03 | 贵州光浦森光电有限公司 | Large-scale LED (light-emitting diode) bulb with liquid state heat-dissipating method |
| CN103185247A (en) * | 2009-05-11 | 2013-07-03 | 建准电机工业股份有限公司 | Lamp |
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