CN1944717B - Pcb板负压电镀方法 - Google Patents
Pcb板负压电镀方法 Download PDFInfo
- Publication number
- CN1944717B CN1944717B CN2006100615410A CN200610061541A CN1944717B CN 1944717 B CN1944717 B CN 1944717B CN 2006100615410 A CN2006100615410 A CN 2006100615410A CN 200610061541 A CN200610061541 A CN 200610061541A CN 1944717 B CN1944717 B CN 1944717B
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- pcb board
- nozzle
- negative pressure
- electroplating method
- pcb
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
板厚(mm) | 孔径(mm) | 传统的电镀方法TP平均值(%) | 本发明电镀方法TP平均值(%) | ΔTP(%) |
2.0 | 0.25 | 75 | 92 | 17 |
3.0 | 0.30 | 70 | 90 | 20 |
4.0 | 0.60 | 71 | 88 | 17 |
5.0 | 0.70 | 65 | 82 | 17 |
6.0 | 0.70 | 59 | 73 | 14 |
7.2 | 0.70 | 50↓ | 70 | 20+ |
8.4 | 0.70 | 无法满足生产需要 | 66 | |
10.6 | 0.70 | 无法满足生产需要 | 60 |
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2006100615410A CN1944717B (zh) | 2006-07-04 | 2006-07-04 | Pcb板负压电镀方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100615410A CN1944717B (zh) | 2006-07-04 | 2006-07-04 | Pcb板负压电镀方法 |
Publications (2)
Publication Number | Publication Date |
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CN1944717A CN1944717A (zh) | 2007-04-11 |
CN1944717B true CN1944717B (zh) | 2010-08-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2006100615410A Active CN1944717B (zh) | 2006-07-04 | 2006-07-04 | Pcb板负压电镀方法 |
Country Status (1)
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CN (1) | CN1944717B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103305882B (zh) * | 2012-03-07 | 2016-08-10 | 深南电路有限公司 | Pcb板电镀方法及装置 |
CN105862097B (zh) * | 2016-06-06 | 2018-10-30 | 浙江振有电子股份有限公司 | 基于脉冲技术的hdi板通孔填铜系统 |
CN106350841B (zh) * | 2016-10-18 | 2019-03-05 | 东莞宇宙电路板设备有限公司 | 一种电镀装置 |
CN112501664B (zh) * | 2020-11-24 | 2022-04-22 | 深圳明阳芯蕊半导体有限公司 | Pcb板电镀方法和pcb板电镀设备 |
CN112680760B (zh) * | 2020-12-10 | 2021-12-21 | 广东天承科技股份有限公司 | 一种印刷电路板电镀装置及其电镀方法 |
CN113502516A (zh) * | 2021-08-09 | 2021-10-15 | 博敏电子股份有限公司 | 一种提高vcp电镀线深镀能力及改善孔内无铜的喷流方法 |
-
2006
- 2006-07-04 CN CN2006100615410A patent/CN1944717B/zh active Active
Non-Patent Citations (3)
Title |
---|
JP特公平6-80199B2 1994.10.12 |
JP特公平7-65209B2 1995.07.12 |
JP特开平6-280084A 1994.10.04 |
Also Published As
Publication number | Publication date |
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CN1944717A (zh) | 2007-04-11 |
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C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518053 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee after: Shenzhen Shennan Circuits Co., Ltd. Address before: 518053 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: Shenzhen Shennan Circuits Co., Ltd. Address before: 518053 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |