CN1941312A - Chip checking system and method - Google Patents
Chip checking system and method Download PDFInfo
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- CN1941312A CN1941312A CN 200510107023 CN200510107023A CN1941312A CN 1941312 A CN1941312 A CN 1941312A CN 200510107023 CN200510107023 CN 200510107023 CN 200510107023 A CN200510107023 A CN 200510107023A CN 1941312 A CN1941312 A CN 1941312A
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- wafer
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- bearing apparatus
- checking system
- light source
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention is concerned with the wafer visual examination method, it is: provides a wafer visual examination system that is at least consist of the loading equipment, the photosource and the reflection component; the wafer loading equipment is used to load wafer; the photosource is configured corresponding with the loading equipment in order to light the back of the wafer; the reflection component is configured corresponding with the loading equipment and uses the photosource to light the back of the wafer; exams the wafer back that shines by the wafer surface and the reflection component.
Description
Technical field
The present invention relates to a kind of semiconductor manufacturing equipment, the wafer inspection method that particularly relates to a kind of wafer visual examination system and use this wafer visual examination system.
Background technology
In integrated circuit flourish today, often on a wafer, can form ten hundreds of electronic components, in order to ensure the quality of technology, industry is most likely checked for crystal face, to realize defective early, remedies as early as possible.Along with semiconductor industry enters deep-sub-micrometer technology, except the inspection of crystal face, the inspection of the brilliant back of the body also comes into one's own day by day.
The defective of the brilliant back of the body as scratch, particulate, unfilled corner, slight crack, causes many problems easily.For example, it is adsorbed that the particulate that brilliant back adheres to can make wafer not allow to be subject to sucker, or cause the pattern of gold-tinted technology to lose burnt; Scratch, unfilled corner, the slight crack of the brilliant back of the body are technology mechanical disorder omen, can cause being worth not striking wafer damage of product quality continuity or fragmentation take place in technology.Therefore,, will make loss expansion or cause wafer to be scrapped by the gross, and make subsequent technique make a futile effort, and cause the finished product rate to descend if can't find out issue machine in real time.
Industry utilizes the wafer tipper to check the brilliant back of the body at present, yet wafer tipper upset wafer needs extra long working, causes whole visual examination activity duration multiplication.And tipper is used for adsorbing the anchor clamps of wafer, also can cover the subregion at brilliant back of the body edge, make the zone of these cresteds to be subjected to an examination, but the brilliant often again back in these zones is easy to generate the important area of defective, therefore can causes the inconvenience in the inspection on the contrary.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of chip checking system exactly, and its device is simple, and the use that can match with the microexamination machine can improve the utilance of machine.
Another object of the present invention provides a kind of wafer inspection method, do not need additionally to append the brilliant back of the body of turn-over machine check, and can carry out crystal face and brilliant inspection of carrying on the back simultaneously, can significantly reduce the review time, check out the defective of wafer easily, and find out issue machine in real time, and then improve the rate of finished products of product.
The present invention proposes a kind of chip checking system, is made up of chip bearing apparatus, light source and reflecting element at least.Chip bearing apparatus is used for bearing wafer, the corresponding chip bearing apparatus of light source and disposing, and in order to the back side of irradiate wafer, the corresponding chip bearing apparatus of reflecting element and disposing is in order to shine upon the back side of wafer.
According to the described chip checking system of embodiments of the invention, above-mentioned light source for example is light-emitting diode (LED), and the light that light source provides can be gold-tinted.
According to the described chip checking system of embodiments of the invention, above-mentioned chip bearing apparatus for example is the function with rotation, and its rotating speed for example is between 10～120rpm.
According to the described chip checking system of embodiments of the invention, above-mentioned light source and reflecting element can be that to have with the chip bearing apparatus be the function that the axle center rotates.
According to the described chip checking system of embodiments of the invention, above-mentioned chip bearing apparatus for example is to comprise a sucker (chuck), is suitable for adsorbing wafer.Above-mentioned sucker for example is can drive wafer with respect to the horizontal plane to tilt.Wherein, wafer angle of inclination with respect to the horizontal plane for example is in the scope of ± 30 degree.
According to the described chip checking system of embodiments of the invention, above-mentioned reflecting element comprises mirror.Above-mentioned chip bearing apparatus can also comprise an elevating mechanism, in order to the lifting wafer.
The present invention proposes a kind of wafer inspection method, and a chip checking system at first is provided, and chip checking system comprises chip bearing apparatus, light source that is used for irradiate wafer and the reflecting element that is used to shine upon wafer that is used for bearing wafer.Then, wafer is placed on the chip bearing apparatus, and with the back side of light source irradiation wafer.Check that then reflecting element shines upon the back side of the wafer that.
According to the described wafer inspection method of embodiments of the invention, above-mentioned light source for example is a light-emitting diode.The light that light source provides can be gold-tinted.
According to the described wafer inspection method of embodiments of the invention, wherein in the step of checking chip back surface, reflecting element relatively moves for wafer.
According to the described wafer inspection method of embodiments of the invention, above-mentioned chip bearing apparatus for example is the function with rotation, and the rotating speed of chip bearing apparatus can be between 10～120rpm.
According to the described wafer inspection method of embodiments of the invention, above-mentioned chip bearing apparatus for example is to have a sucker, in order to the absorption wafer.Sucker can drive wafer and with respect to the horizontal plane tilt, and wafer angle of inclination with respect to the horizontal plane for example is in the scope of ± 30 degree.
The present invention is because of adopting the chip checking system of being made up of chip bearing apparatus, light source and reflecting element, its device is simple, can combine with the microexamination machine, not only improves the utilance of machine, and can check out the situation of the brilliant back of the body easily, can also inspect the surface of wafer simultaneously.This kind wafer inspection method can significantly shorten the whole review time, pick out the situation of the brilliant back of the body easily, and then find out the issue machine that causes brilliant back of the body defective in real time, not only can effectively implement the online in real time quality management, more can reduce the technology burden, improve output and finished product rate.
For above and other objects of the present invention, feature and advantage can be become apparent, following conjunction with figs. and preferred embodiment are to illustrate in greater detail the present invention.
Description of drawings
Figure 1A is the top view that illustrates a kind of chip checking system of one embodiment of the invention.
Figure 1B is the end view of a kind of chip checking system when checking wafer that illustrates one embodiment of the invention.
Fig. 2 is the flow chart of steps that illustrates a kind of wafer inspection method of one embodiment of the invention.
The simple symbol explanation
100: platform
110: light source
120: chip bearing apparatus
123: sucker
125: elevating mechanism
130: reflecting element
140: wafer
150: the inclination angle
210,220,230,240: step
Embodiment
Figure 1A is the top view of a kind of chip checking system of one embodiment of the invention.Figure 1B is the end view of a kind of chip checking system when checking wafer of one embodiment of the invention.
Please refer to Figure 1A and Figure 1B, the present invention proposes a kind of chip checking system, and it for example is made up of with reflecting element 130 light source 110, chip bearing apparatus 120.Chip bearing apparatus 120 is used for bearing wafer 140.Light source 110 corresponding chip bearing apparatus 120 and disposing, it for example is to be arranged at chip bearing apparatus 120 next doors, is used for the back side of irradiate wafer 140.Reflecting element 130 corresponding chip bearing apparatus 120 and disposing for example are to be arranged at chip bearing apparatus 120 belows, in order to shine upon the back side of wafer 140.
Wherein, light source 110 for example is light-emitting diode, Organic Light Emitting Diode, cathode fluorescent tube (Cold Cathode Fluorescent Lamp, CCFL), cathode ray tube (Cathode Ray Tube, CRT), Halogen lamp LED and various arc lamp (Arc Lamp), as high-pressure mercury lamp, metal halide lamp, xenon (Xenon) lamp etc., the light that provides comprises the various visible lights that can improve brightness such as gold-tinted, white light.Wherein, gold-tinted technology serves as preferred the selection with light-emitting diode sodium yellow light source, even accidental irradiation wafer 140 fronts also can prevent two degree exposures.
Above-mentioned chip checking system, it is provided with very easy, can be applied on the multiple machine, and then improve the utilance of machine.In addition, need not use the wafer tipper can pick out brilliant back of the body defective easily, it is tired not only can to reduce or remit maintenance of equipment, shortens the activity duration of wafer inspection, also can avoid the wafer tipper to cover Waffer edge, can't correctly pick out the problem of brilliant back of the body defective.
Below explanation utilizes above-mentioned chip checking system to check the method for wafer.Fig. 2 is the flow chart of steps that illustrates a kind of wafer inspection method of one embodiment of the invention.
Please refer to Fig. 2, a chip checking system at first is provided, this chip checking system is to have comprised reflecting element, light source that is used for irradiate wafer and the chip bearing apparatus (step 210) that is used for bearing wafer that is used to shine upon wafer at least.Wherein chip checking system such as Figure 1A and Figure 1B illustrate, and have been described in the foregoing about the related description of chip checking system, repeat no more in this.
Then, wafer is placed (step 220) on the chip bearing apparatus.Chip bearing apparatus with Figure 1A and Figure 1B is an example, and it for example is to comprise a sucker, is used for adsorbing wafer, and wafer is placed on the chip bearing apparatus securely.Sucker has the function that the drive wafer is inclined relative to horizontal, and the angle of inclination for example is in the scopes of ± 30 degree.In addition, chip bearing apparatus can also comprise an elevating mechanism, is arranged between absorber and the platform, in order to the lifting wafer, adjusts the vertical height between wafer and the platform.
Afterwards, with the back side (step 230) of light source irradiation wafer.Light source for example is a light-emitting diode, and the light that provides for example is yellow light sources.Owing to be to use gold-tinted technology mostly in the present photoetching process, therefore, use the yellow light sources irradiate wafer back side, even the accidental irradiation crystal face also can be avoided 2 degree exposure problems, and can not influence technological quality.
Then, check the back side (step 240) of the wafer that reflecting element shone upon.Reflecting element can be mirror or metallic diaphragm.In one embodiment, reflecting element possibly can't shine upon the back side of entire wafer, therefore, the reflecting element of wafer and below is relatively moved, and then checks the back side of entire wafer.For example, make wafer, be about the speed rotation of 10～120rpm with rotating speed along with chip bearing apparatus.Perhaps, also can be that reflecting element is rotated around wafer carrying mechanism, to check the whole brilliant back of the body.Certainly, when inspecting chip back surface, also can inspect the surface of wafer.That is to say that we can check the crystal face and the brilliant back of the body simultaneously, and the brilliant back of the body of identification scratch easily.In addition, be noted that can upset the inspection personnel for fear of the reflective of the brilliant back of the body of light source irradiation, the preferred setting of light source should be positioned at the same side of chip bearing apparatus with visual inspection person, easier crystalline substance is carried on the back of visual inspection person checked.
Wafer inspection method of the present invention is utilized above-mentioned chip checking system, can check the surface and the back side of wafer simultaneously, and, owing to need not see through the wafer tipper, can significantly shorten the activity duration of wafer inspection, and inspect the brilliant back of the body apace.Thus, the machine of just can effectively and in real time pinpointing the problems is implemented the online in real time quality management, and can not treat that the technology back segment just finds brilliant back of the body defective, further reaches and reduces the technology burden, improves the target of output and finished product rate.
In sum, because the chip checking system that the present invention proposes,, and shine upon the back side of wafer, add the rotation that chip bearing apparatus provides, the function of inclination angle conversion with reflecting element with the brilliant back of the body of light source irradiation.Therefore, need not use the wafer tipper, can check defectives such as the scratch of the brilliant back of the body, crystal edge foreign matter, crystal edge unfilled corner slight crack rapidly, and be shortened the activity duration of the required cost of wafer inspection, find the defective of the brilliant back of the body apace.Thus, just can effectively and in real time find out issue machine, implement the online in real time quality management, and then reduce the technology burden, and improve output and finished product rate.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.
Claims (20)
1. chip checking system comprises:
One chip bearing apparatus is in order to carry a wafer;
One light source is to should chip bearing apparatus and dispose, in order to shine the back side of this wafer; And
One reflecting element is to should chip bearing apparatus and dispose, in order to shine upon the back side of this wafer.
2. chip checking system as claimed in claim 1, wherein this light source comprises a light-emitting diode.
3. chip checking system as claimed in claim 1, wherein the light that provides of this light source comprises yellow light sources.
4. chip checking system as claimed in claim 1, wherein this chip bearing apparatus has the function of rotation.
5. chip checking system as claimed in claim 4, wherein the rotating speed of this chip bearing apparatus is between 10～120rpm.
6. chip checking system as claimed in claim 1, wherein to have with this chip bearing apparatus be the function that the axle center rotates for this light source and this reflecting element.
7. chip checking system as claimed in claim 1, wherein this chip bearing apparatus comprises a sucker, is suitable for adsorbing this wafer.
8. chip checking system as claimed in claim 7, wherein this absorber can drive this wafer and with respect to the horizontal plane tilts.
9. chip checking system as claimed in claim 8, wherein this wafer angle of inclination with respect to the horizontal plane is in the scope of ± 30 degree.
10. chip checking system as claimed in claim 1, wherein this reflecting element comprises a mirror.
11. chip checking system as claimed in claim 1, wherein this chip bearing apparatus also comprises an elevating mechanism, in order to this wafer of lifting.
12. a wafer inspection method comprises:
One chip checking system is provided, and this chip checking system comprises a chip bearing apparatus, a light source that is used for irradiate wafer and a reflecting element that is used to shine upon wafer that is used for bearing wafer;
One wafer is placed on this chip bearing apparatus;
The back side with this this wafer of light source irradiation; And
Check that this reflecting element shines upon the back side of this wafer that.
13. wafer inspection method as claimed in claim 12, wherein this light source comprises a light-emitting diode.
14. wafer inspection method as claimed in claim 12, wherein the light that provides of this light source comprises yellow light sources.
15. wafer inspection method as claimed in claim 12, wherein in the step of checking this chip back surface, this reflecting element relatively moves for this wafer.
16. wafer inspection method as claimed in claim 12, wherein this chip bearing apparatus has the function of rotation.
17. wafer inspection method as claimed in claim 16, wherein the rotating speed of this chip bearing apparatus is between 10～120rpm.
18. wafer inspection method as claimed in claim 12, wherein this chip bearing apparatus has a sucker, in order to adsorb this wafer.
19. wafer inspection method as claimed in claim 18, wherein this absorber can drive this wafer and with respect to the horizontal plane tilts.
20. wafer inspection method as claimed in claim 19, wherein this wafer angle of inclination with respect to the horizontal plane is in the scope of ± 30 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101070233A CN100382271C (en) | 2005-09-27 | 2005-09-27 | Chip checking system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101070233A CN100382271C (en) | 2005-09-27 | 2005-09-27 | Chip checking system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1941312A true CN1941312A (en) | 2007-04-04 |
| CN100382271C CN100382271C (en) | 2008-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101070233A Expired - Fee Related CN100382271C (en) | 2005-09-27 | 2005-09-27 | Chip checking system and method |
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| Country | Link |
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| CN (1) | CN100382271C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676155A (en) * | 2019-09-27 | 2020-01-10 | 上海申和热磁电子有限公司 | Method for detecting shallow defects on surface of polished silicon wafer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06338558A (en) * | 1993-05-28 | 1994-12-06 | Tel Varian Ltd | Detector and processing device |
| US5466945A (en) * | 1994-03-23 | 1995-11-14 | Eaton Corporation | Apparatus for detecting proper positioning of objects in a holder |
| JPH09218162A (en) * | 1996-02-08 | 1997-08-19 | Olympus Optical Co Ltd | Surface defect inspection device |
| US6809809B2 (en) * | 2000-11-15 | 2004-10-26 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| US7046353B2 (en) * | 2001-12-04 | 2006-05-16 | Kabushiki Kaisha Topcon | Surface inspection system |
-
2005
- 2005-09-27 CN CNB2005101070233A patent/CN100382271C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676155A (en) * | 2019-09-27 | 2020-01-10 | 上海申和热磁电子有限公司 | Method for detecting shallow defects on surface of polished silicon wafer |
| CN110676155B (en) * | 2019-09-27 | 2021-12-10 | 上海中欣晶圆半导体科技有限公司 | Method for detecting shallow defects on surface of polished silicon wafer |
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| Publication number | Publication date |
|---|---|
| CN100382271C (en) | 2008-04-16 |
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Granted publication date: 20080416 Termination date: 20091027 |