CN1940103A - Cu.TiB nano-diffusion alloy and its production - Google Patents

Cu.TiB nano-diffusion alloy and its production Download PDF

Info

Publication number
CN1940103A
CN1940103A CN 200510032207 CN200510032207A CN1940103A CN 1940103 A CN1940103 A CN 1940103A CN 200510032207 CN200510032207 CN 200510032207 CN 200510032207 A CN200510032207 A CN 200510032207A CN 1940103 A CN1940103 A CN 1940103A
Authority
CN
China
Prior art keywords
alloy
tib
melt
chamber
tib2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 200510032207
Other languages
Chinese (zh)
Other versions
CN100410402C (en
Inventor
汪明朴
李周
郭明星
谭望
贾延琳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central South University
Original Assignee
Central South University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central South University filed Critical Central South University
Priority to CNB2005100322078A priority Critical patent/CN100410402C/en
Publication of CN1940103A publication Critical patent/CN1940103A/en
Application granted granted Critical
Publication of CN100410402C publication Critical patent/CN100410402C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)

Abstract

This invention relates to a kind of Cu-TiB2 alloy and its preparation method. Taking Cu-Ti and Cu-B as the centre alloy, melting the centre alloy respectively and overheating them till 1300DEG C-1400DEG C, mixing the two melt to take original place reaction, making the uniformity compound body which is composed of the TiB2 nanometer particle and pure cupper fused mass, freezing the compound body quickly with the method of jetting deposition, manufacturing the Cu-TiB2 alloy base ingot , producing the Cu-TiB2 alloy finished product. The alloy in this invention compares with no oxygen copper, have these advantages that it has high intensity, it resists high temperature and its function of anneal and softening are good , whose sigma0.2 is 3-12 times than no oxygen copper, the temperature of the anneal softening is over 900DEG C, the electric conduction rate may arrive at 95% IACS, the electric conduction rate of the high concentration Cu-TiB2 alloy may arrive at 75% IACS , comparing with these deposition strengthening alloys such as the Cu-Fe-P system, Cu-Ni-Si system, Cu-Cr-Zr system , the Cu-TiB2 alloy has the functions that it has higher electric conduction and it resists high temperature as well as the good function of anneal and softening.

Description

Cu-TiB 2Nanometer Dispersing Alloy And Preparation Method
Technical field
The present invention relates to a kind of Cu-TiB 2Alloy And Preparation Method, this copper alloy have high strength, high conduction, high temperature resistance annealing softening characteristic, can be applicable to fields such as electrovacuum, resistance welding electrode, high-voltage switch gear, electron and electrician, nuclear technique.
Background technology
In fields such as microwave technology, microelectronics, electrician, automobile making, metallurgy, nuclear technique, the copper alloy of a kind of high strength of widespread demand, high conduction, high temperature resistance annealing softening characteristic, it is a critical material of making electrovacuum microwave tube, large-scale integrated circuit lead frame, high-voltage switch gear conducting rod, automobile resistance welding electrode, conticaster crystallizer, the heat sink parts of controlled thermonuclear reaction etc.Though fine copper electroconductibility height (98~102%IACS), the too low (σ of intensity 0.250MPa only); Though serial copper alloys such as Cu-Fe-P, Cu-Ni-Si, Cu-Cr-Zr have the characteristic of high strength, high conduction, they are ageing strengthening type alloys, can occur the overaging phenomenon in temperature during greater than 500 ℃, and annealing softening promptly takes place.When particularly temperature was higher than 600 ℃, this class alloy not only reduced because of sharply softening intensity, and can sharply reduce because of the molten electroconductibility that causes of returning of precipitation particles, thereby made the characteristic of alloy forfeiture high-strength highly-conductive.Cu-Al 2O 3Alloy is the nano dispersion reinforced copper alloy that a class has high strength, high conduction, high temperature resistance annealing softening excellent specific property, but its enhanced particles Al 2O 3Non-conductive.This point is particularly unfavorable in the application in microelectronic and electrovacuum field, and it not only influences with the electrical spark of the accurate device of its making or electron beam processing, and can cause the micro element regional area electroconductibility interruption with its making, even can not work.Therefore the material that needs to make this class device not only has Cu-Al 2O 3High strength, high conduction and high temperature resistance annealing softening characteristic that alloy is excellent equally, and need its enhanced particles also to have electroconductibility, be beneficial to the accurate electrospark machining or the electron beam processing of micro element and prevent the interruption of micro element microcell electroconductibility.
In-situ reaction is all adopted in the preparation of nano dispersion reinforced copper alloy usually, prepares Cu-Al as internal oxidation 2O 3Alloy, mechanical alloying method prepare Cu-Al 2O 3, Cu-TiB 2, Cu-Nb alloy etc.Internal oxidation is to utilize the control oxygen partial pressure to make interior oxidation reaction in takes place in the Cu-Al alloy powder, generates Al in the copper powder matrix 2O 3Nanoparticle.This method prepares Cu-Al 2O 3Alloy prior is quite complicated, comprise: the Cu-Al alloy melting, dust, oxygenant preparation, batch mixing, interior oxidation, reduction, isostatic cool pressing, vacuum sintering, jacket hot extrusion, cold machine-shaping etc., process is difficult to control, and both at home and abroad producer seldom has and can really grasp its gordian technique.Mechanical alloying method is to utilize high-energy ball milling to make two or more alloy powder generation reaction in generate nanoparticle, as high-energy ball milling Cu, Ti, B powder, and by subsequent heat treatment or hot-work formation Cu-TiB 2Alloy.
Summary of the invention
Purpose of the present invention is invented a kind of Cu-TiB 2Nano dispersion reinforced copper alloy and two melt in situ reaction method for preparing thereof, this copper alloy have high strength, high conduction, high temperature resistance annealing softening characteristic.
A kind of Cu-TiB 2Alloy, its weight consists of: 0.20~3.0%TiB 2, all the other are copper.
Cu-TiB 2Nano dispersion reinforced process for producing copper alloy adopts Cu-Ti and Cu-B as master alloy, and after master alloy is melted respectively and being superheated to 1300 ℃~1400 ℃, two melt-mixing adopt 10 5~2 * 10 5High-pressure inert gas (the high-purity N of Pa 2Gas or Ar gas), make alloy melt is pressed into reaction chamber from two pipelines respectively, reaction in takes place when collision mixes mutually.Make two melt-mixing generation reaction ins, generate TiB 2The homogeneous mixture of nanoparticle and fine copper melt, with the method rapid condensation of this mixture with jet deposition, the condition of jet deposition is: pressure: 3 * 10 5~6 * 10 5Pa, atomizing gas: N 2Gas or Ar gas are made Cu-TiB 2The alloy billet is processed into Cu-TiB 2The alloy finished product.
A kind of preparation Cu-TiB 2Two melt in situ reaction units of alloy billet, mainly comprise: two furnace chambers and a spraying chamber, the bottom in furnace chamber and spraying chamber is respectively arranged with bleeds to cavity, the hole of supplying gas, in furnace chamber, be provided with the induction furnace that can melt master alloy, the two melt in situ reactors of " Y " type are arranged between two induction furnaces, be used to carry the interior master alloy of induction furnace and carry out reaction in, valve is set on two pipelines in the two melt in situ reactor node tops of " Y " type is used to control the flow of alloy melt and the atmospheric pressure state (vacuum state or high-pressure aerated state) in the control furnace chamber, on the vertical ducting of the two melt in situ reactor node bottoms of " Y " type, Vltrasonic device is set, promptly be provided with spraying gun at the end of the two melt in situ reactors of " Y " type with the contact position in spraying chamber, the spraying gun below is provided with rotatable liftable substrate that supports the jet deposition billet and the guide deflection sheave that draws the billet motion, between furnace chamber and the spraying chamber dividing plate is installed, supports furnace chamber and sealing spraying chamber.
Alloy of the present invention is compared with oxygen free copper (C10100, TU1), has intensity height, advantage that high temperature resistance annealing softening performance is high.Look TiB 2The particle content difference, its σ 0.2Comparable oxygen free copper is high 3~12 times, and anti-annealing softening temperature can be up to more than 900 ℃, and electric conductivity can reach 95%IACS, very near oxygen free copper, and high density Cu-TiB 2The alloy conductive rate can reach 75%IACS, still belongs to high conduction scope.With Cu-Fe-P system, Cu-Ni-Si system, Cu-Cr-Zr be precipitation strength type alloy phase ratio, under the suitable situation of intensity, Cu-TiB 2It is obviously high that alloy conductive is wanted, and do not have intensity that overaging and high temperature Hui Rong cause and the electric conductivity problem that sharply descends.With Cu-Al 2O 3Disperse copper is compared, and the two intensity, electroconductibility, high temperature resistance annealing softening performance are suitable, but TiB 2Particle has electroconductibility, has avoided Cu-Al 2O 3Alloy is difficult to carry out the processing of accurate electrical spark or electron beam, and problem such as the microcell conduction is discontinuous.On the preparation method, to compare with internal oxidation, two melt in situ reaction methods are a kind of short process making methods, have to produce that equipment is simple, preparation cost is low, middle-chain is few, be easy to series of advantages such as control.
Description of drawings
Fig. 1: process flow sheet of the present invention;
Fig. 2: two melt in situ reaction unit figure;
Fig. 3: Cu-TiB 2TiB in the alloy 2Particle TEM photo (a), and respective electronic diffraction pattern (b)
Embodiment
Below in conjunction with accompanying drawing the two melt in situ reaction units of the present invention are described further.Two melt in situ are reflected in the hybrid reaction chamber carries out, and its principle of work is shown in Fig. 2.Two induction furnaces 9 about Cu-Ti and Cu-B alloy placed respectively, valve-off 1, and by the injection well 10 of bleeding two furnace chambers 2 are found time, start two induction furnaces 9 simultaneously, the fusing master alloy.Keep vacuum tightness to 10 in the melting process -1Near the Pa, arrive 1300 ℃~1400 ℃ of design temperatures after, stop to find time, and in two furnace chambers, send into high-purity N by the injection well 10 of bleeding 2Gas or Ar gas make outside chamber internal gas pressure and the chamber identical.Open two valves 1 of two melt in situ reactor 7 tops this moment, start the Vltrasonic device 4 of two melt in situ reactor 7 peripheries, bleed from two respectively simultaneously and send into high pressure gas the injection well 10 melt 3 (Cu-B) and melt 8 (Cu-Ti) are pressed into two melt in situ reactors 7, and make two melts form turbulent flow in the collision of two melt in situ reactor 7 intersections of " Y " type, and the generation reaction in, in the Cu melt, generate TiB 2Nanoparticle.The TiB that carries out and prevent to have generated in the Cu melt for reacting fully 2Particle is grown up, special reaction cavity outer setting at two melt in situ reactors 7 Vltrasonic device 4.Under the effect of high pressure gas, in reaction cavity, finish the Cu-TiB of reaction in 2Mixture enters spraying gun 12 rapidly, with another strand high pressure (3~6 normal atmosphere) N 2Gas or Ar aerosolization, and rapid condensation is deposited as Cu-TiB on the substrate 6 in spraying chamber 14 2Alloy ingot blank 5.Separate by dividing plate 11 and furnace chamber 2 in spraying chamber 14.Not oxidation of alloy when atomizing for making, spraying chamber 14 planted agents elder generation passing hole channel 15 is extracted atmosphere out, and charges into N 2Gas or Ar gas, high pressure gas enter spraying chamber 14 by vent channel 15 discharges during atomizing.Obtain Cu-TiB as stated above 2Alloy ingot blank 5, Cu-TiB 2Alloy ingot blank 5 moves downward by guide deflection sheave 13.Cu-TiB 2Alloy billet 5 is become a useful person through heat, cold working.
Embodiment 1: alloying constituent is TiB 2-0.25wt%, all the other are copper and inevitable impurity.The starting material of preparation alloy are Cu-0.34wt%Ti and Cu-0.17wt%B, with it respectively in two crucibles in device shown in Figure 2 after the fusing, be superheated to 1350 ℃ after, with 2 * 10 5The high pressure high-purity N of Pa 2Gas is pressed into reaction chamber from two pipelines respectively with alloy melt, makes two melts when collision mixes mutually reaction in take place, and generates TiB 2The homogeneous mixture of nanoparticle and fine copper melt, with the method rapid condensation of this mixture with jet deposition, the condition of jet deposition is: pressure: 3 * 10 5~6 * 10 5Pa, atomizing gas: N 2Gas is made Cu-TiB 2The alloy billet, again through hot rolling, make the thin plate of thick 0.30mm after cold rolling.Its salient features sees Table 1, for ease of relatively, has also listed the corresponding performance (two alloys are all through 900 ℃ of annealing in hydrogen atmosphere annealing 0.5h) of TU1 fine copper in the table 1.This routine invention alloy is with preparation microwave tube aperture plate.
The performance of table 1 alloy of the present invention and TU1 fine copper relatively
σ b(MPa) σ 0.2(MPa) δ 5(%) g(%IACS)
Alloy TU1 of the present invention 270 190 150 45 30 40 95 100
Embodiment 2: alloying constituent is TiB 2-0.5wt%, all the other are copper and inevitable impurity.The starting material of preparation alloy are Cu-0.68wt%Ti, Cu-0.34wt%B, with its respectively in two crucibles in device shown in Figure 2 the fusing back and be superheated to 1350 ℃ after, with 2 * 10 5The high pressure high-purity Ar gas of Pa is pressed into reaction chamber from two pipelines respectively with alloy melt, makes two melts when collision mixes mutually reaction in take place, and generates TiB 2The homogeneous mixture of nanoparticle and fine copper melt, with the method rapid condensation of this mixture with jet deposition, the condition of jet deposition is: pressure: 3 * 10 5~6 * 10 5Pa, atomizing gas: Ar gas, make Cu-TiB 2The alloy billet becomes the bar of Φ 12 through hot extrusion, cold drawing.Its salient features sees Table 2, for ease of relatively, has also listed Cu-0.35wt%Al in the table 2 2O 3The corresponding performance of dispersion strengthening copper alloy (two alloys are all through 900 ℃ of annealing in hydrogen atmosphere annealing 0.5h), as seen both are suitable.Fig. 3 shows this routine invention alloy TEM photo and corresponding electron diffraction pattern, and visible alloy strengthening particle of the present invention is TiB 2, its size is about 10~50nm.
Table 2 alloy of the present invention and Cu-0.35wt%Al 2O 3The dispersion-strengthened Cu performance relatively
σ b(MPa) σ 0.2(MPa) δ 5(%) g(%IACS)
Alloy Cu-0.35wt%Al of the present invention 2O 3 380 385 320 310 18 20 90 90

Claims (3)

1. Cu-TiB 2Alloy is characterized in that: weight consists of: 0.20~3.0% TiB 2, all the other are copper.
2. described Cu-TiB of claim 1 2The preparation method, it is characterized in that: adopt Cu-Ti and Cu-B as master alloy, after master alloy is melted respectively and being superheated to 1300 ℃~1400 ℃, make two melt-mixing generation reaction ins, generate TiB 2The homogeneous mixture of nanoparticle and fine copper melt, with the method rapid condensation of this mixture with jet deposition, the condition of jet deposition is: pressure: 3 * 10 5~6 * 10 5Pa, atomizing gas: N 2Gas or Ar gas are made Cu-TiB 2The alloy billet is processed into Cu-TiB 2The alloy finished product.
3. one kind is adopted the described method of claim 2 to prepare the described Cu-TiB of claim 1 2Two melt in situ reaction units of alloy, it is characterized in that: mainly comprise: two furnace chambers and a spraying chamber, the bottom in furnace chamber and spraying chamber is respectively arranged with bleeds to cavity, the hole of supplying gas, in furnace chamber, be provided with the induction furnace that can melt master alloy, the two melt in situ reactors of " Y " type are arranged between two induction furnaces, be used to carry the interior master alloy of induction furnace and carry out reaction in, valve is set on two pipelines in " Y " type reaction in device node top is used to control the flow of alloy melt and the atmospheric pressure state in the control furnace chamber, on the vertical ducting of " Y " type reaction in device node bottom, Vltrasonic device is set, promptly be provided with spraying gun at the end of " Y " type reaction in device with the contact position in spraying chamber, the spraying gun below is provided with rotatable liftable substrate that supports the jet deposition billet and the guide deflection sheave that draws the billet motion, between furnace chamber and the spraying chamber dividing plate is installed, supports furnace chamber and sealing spraying chamber.
CNB2005100322078A 2005-09-30 2005-09-30 Cu.TiB nano-diffusion alloy and its production Expired - Fee Related CN100410402C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2005100322078A CN100410402C (en) 2005-09-30 2005-09-30 Cu.TiB nano-diffusion alloy and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100322078A CN100410402C (en) 2005-09-30 2005-09-30 Cu.TiB nano-diffusion alloy and its production

Publications (2)

Publication Number Publication Date
CN1940103A true CN1940103A (en) 2007-04-04
CN100410402C CN100410402C (en) 2008-08-13

Family

ID=37958625

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100322078A Expired - Fee Related CN100410402C (en) 2005-09-30 2005-09-30 Cu.TiB nano-diffusion alloy and its production

Country Status (1)

Country Link
CN (1) CN100410402C (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102560163A (en) * 2012-01-12 2012-07-11 广东新劲刚超硬材料有限公司 Method for preparing dispersion strengthened copper by adopting ultrasonic dispersion
CN102581519A (en) * 2012-04-06 2012-07-18 哈尔滨工业大学 Modified Fe-Cr-B surfacing material
CN103540829A (en) * 2013-10-29 2014-01-29 大连理工大学 Method and device for in-situ preparing TiB2 strengthened copper-based composite material
CN107043899A (en) * 2017-02-07 2017-08-15 西安理工大学 A kind of TiB/TiB2Hybrid buildup Cu based composites and preparation method thereof
CN107675011A (en) * 2017-09-06 2018-02-09 西安理工大学 A kind of preparation method of TiB2/Cu materials
CN108080626A (en) * 2018-01-04 2018-05-29 北京理工大学 A kind of spherical atomization magnesium antimony alloy powder and preparation method thereof
CN109351916A (en) * 2018-07-31 2019-02-19 湖南人文科技学院 A kind of preparation method of high boron alloy
CN110528035A (en) * 2019-09-24 2019-12-03 江苏师范大学 It is a kind of for improving the mask-type jet stream electric deposition device and its method of small-sized EDM electrode performance
CN110814305A (en) * 2019-11-07 2020-02-21 中南大学 Cu-Fe composite material double-melt mixed casting equipment and process
CN113278842A (en) * 2021-04-30 2021-08-20 西安理工大学 Preparation method of titanium diboride copper-based spherical composite material powder
CN114318025A (en) * 2021-12-23 2022-04-12 中南大学 Bimetal liquid phase in-situ smelting device
CN114427046A (en) * 2021-12-27 2022-05-03 中南大学 Short-process preparation device and preparation method of alloy
CN114752810A (en) * 2022-03-24 2022-07-15 江苏恒盈电子科技有限公司 High-strength semiconductor lead frame for circuit board and preparation method thereof
CN114892057A (en) * 2020-06-16 2022-08-12 中山火炬职业技术学院 High-sphericity Cr-based alloy-TiB with strong bonding strength 2 Micro-nano powder and preparation method thereof
CN115747557A (en) * 2022-10-31 2023-03-07 西安理工大学 HfB 2 Cu- (Hf) copper-based composite material and preparation method thereof
CN115947602A (en) * 2022-10-10 2023-04-11 中南大学 ZrB 2 Metal ceramic inert anode and preparation method and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2552679B2 (en) * 1987-09-07 1996-11-13 福田金属箔粉工業株式会社 Method for manufacturing high hardness composite copper alloy
CA2010887C (en) * 1990-02-26 1996-07-02 Peter George Tsantrizos Reactive spray forming process
CN2258500Y (en) * 1995-11-23 1997-07-30 中南工业大学 Jet sedimentation device for preparing metal base composite material
CN1250108A (en) * 1999-08-26 2000-04-12 张曰林 Ceramic-reinforced copper alloy and its producing process
CN1108389C (en) * 2000-06-27 2003-05-14 北京科技大学 Process for in-situ alloying and reaction particles reiforced metal-base composition

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102560163A (en) * 2012-01-12 2012-07-11 广东新劲刚超硬材料有限公司 Method for preparing dispersion strengthened copper by adopting ultrasonic dispersion
CN102581519A (en) * 2012-04-06 2012-07-18 哈尔滨工业大学 Modified Fe-Cr-B surfacing material
CN103540829A (en) * 2013-10-29 2014-01-29 大连理工大学 Method and device for in-situ preparing TiB2 strengthened copper-based composite material
CN103540829B (en) * 2013-10-29 2015-10-28 大连理工大学 Original position prepares TiB 2strengthen the method and apparatus of Cu-base composites
CN107043899A (en) * 2017-02-07 2017-08-15 西安理工大学 A kind of TiB/TiB2Hybrid buildup Cu based composites and preparation method thereof
CN107675011A (en) * 2017-09-06 2018-02-09 西安理工大学 A kind of preparation method of TiB2/Cu materials
CN107675011B (en) * 2017-09-06 2019-04-02 西安理工大学 A kind of preparation method of TiB2/Cu material
CN108080626B (en) * 2018-01-04 2020-02-14 北京理工大学 Spherical atomized magnesium-antimony alloy powder and preparation method thereof
CN108080626A (en) * 2018-01-04 2018-05-29 北京理工大学 A kind of spherical atomization magnesium antimony alloy powder and preparation method thereof
CN109351916B (en) * 2018-07-31 2021-03-12 湖南人文科技学院 Preparation method of high-boron alloy
CN109351916A (en) * 2018-07-31 2019-02-19 湖南人文科技学院 A kind of preparation method of high boron alloy
CN110528035A (en) * 2019-09-24 2019-12-03 江苏师范大学 It is a kind of for improving the mask-type jet stream electric deposition device and its method of small-sized EDM electrode performance
CN110814305A (en) * 2019-11-07 2020-02-21 中南大学 Cu-Fe composite material double-melt mixed casting equipment and process
CN110814305B (en) * 2019-11-07 2021-06-15 中南大学 Cu-Fe composite material double-melt mixed casting equipment and process
CN114892057A (en) * 2020-06-16 2022-08-12 中山火炬职业技术学院 High-sphericity Cr-based alloy-TiB with strong bonding strength 2 Micro-nano powder and preparation method thereof
CN114892057B (en) * 2020-06-16 2023-09-15 中山火炬职业技术学院 High sphericity Cr-base alloy-TiB with strong binding degree 2 Micro-nano powder and preparation method thereof
CN113278842A (en) * 2021-04-30 2021-08-20 西安理工大学 Preparation method of titanium diboride copper-based spherical composite material powder
CN113278842B (en) * 2021-04-30 2022-04-12 西安理工大学 Preparation method of titanium diboride copper-based spherical composite material powder
CN114318025A (en) * 2021-12-23 2022-04-12 中南大学 Bimetal liquid phase in-situ smelting device
CN114318025B (en) * 2021-12-23 2022-06-21 中南大学 Bimetal liquid phase in-situ smelting device
CN114427046A (en) * 2021-12-27 2022-05-03 中南大学 Short-process preparation device and preparation method of alloy
CN114752810A (en) * 2022-03-24 2022-07-15 江苏恒盈电子科技有限公司 High-strength semiconductor lead frame for circuit board and preparation method thereof
CN115947602A (en) * 2022-10-10 2023-04-11 中南大学 ZrB 2 Metal ceramic inert anode and preparation method and application thereof
CN115947602B (en) * 2022-10-10 2023-11-07 中南大学 ZrB (ZrB) 2 Metal ceramic-based inert anode and preparation method and application thereof
CN115747557A (en) * 2022-10-31 2023-03-07 西安理工大学 HfB 2 Cu- (Hf) copper-based composite material and preparation method thereof

Also Published As

Publication number Publication date
CN100410402C (en) 2008-08-13

Similar Documents

Publication Publication Date Title
CN100410402C (en) Cu.TiB nano-diffusion alloy and its production
CN101240387B (en) Cu-Al2O3 nano strengthened dispersion alloy and preparation method thereof
CN100436634C (en) Zero-sintering and hydrogen-expansion nano-diffusion reinforced Cu-Al2O3 alloy and its production
CN106086511B (en) A kind of high-performance copper conducting wire and preparation method thereof
KR101334156B1 (en) Fabrication method of amorphous alloy powder using gas atomization
CN100497690C (en) Multiphase oxide particles enhanced copper-base composite material and preparing method thereof
CN105132736B (en) Disperse carbon/carbon-copper composite material and preparation method thereof
CN109207766B (en) High-aluminum-content Cu-Al with controllable structure2O3Preparation process of nano dispersed copper alloy
EP2511032A1 (en) Production method for high purity copper powder using a thermal plasma
CN104988438A (en) High-strength and high-conductivity carbon nano tube strengthening copper-based composite material and preparing method thereof
CN106756376B (en) Tungsten-copper alloy and its processing method and application
CN101818273B (en) Method for preparing Cu-Nb alloy with high strength, high conductivity and high-temperature softening resistance
CN106381414A (en) Copper-based in-situ composite alloy and preparing method thereof
CN109576529A (en) High-performance disperse copper alloy and preparation method thereof
CN101127253B (en) Silver nickel electricity-conductive ceramic electrical contact material and its production method
CN108677057A (en) A kind of acid bronze alloy blank and preparation method thereof
CN102676867A (en) Alumina particle dispersion strengthened copper composite material and preparation method thereof
CN111996405A (en) Method for preparing high-strength and high-conductivity copper alloy through metal injection molding
CN111172422B (en) Preparation method of aluminum oxide dispersion strengthening copper-based composite material
CN111101043B (en) CrMoVNbAl high-entropy alloy manufactured by laser additive manufacturing and forming process thereof
CN109722561B (en) High-performance Cu-Cr alloy and preparation method thereof
CN111992727A (en) Preparation process of CuCrZr powder for additive manufacturing based on VIGA method
CN114427046B (en) Alloy short-process preparation device and preparation method
CN114807670B (en) Fe-containing copper-based material with dispersion and precipitation strengthening functions and preparation method thereof
CN106756207A (en) A kind of short process making method of high-strength highly-conductive deformation Cu Cr Ag in-situ composites

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Changsha Zhonggong New Material Co., Ltd.

Assignor: Central South University

Contract fulfillment period: 2008.9.20 to 2013.9.20 contract change

Contract record no.: 2008430000032

Denomination of invention: Cu-TiB#-[2] nano dispersion alloy and preparation method thereof

Granted publication date: 20080813

License type: Exclusive license

Record date: 20081119

LIC Patent licence contract for exploitation submitted for record

Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.9.20 TO 2013.9.20; CHANGE OF CONTRACT

Name of requester: CHANGSHA ZHONGGONG NEW MATERIALS CO., LTD.

Effective date: 20081119

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080813

Termination date: 20120930