CN1933695A - Flexible radiating circuit substrate - Google Patents
Flexible radiating circuit substrate Download PDFInfo
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- CN1933695A CN1933695A CN 200510103959 CN200510103959A CN1933695A CN 1933695 A CN1933695 A CN 1933695A CN 200510103959 CN200510103959 CN 200510103959 CN 200510103959 A CN200510103959 A CN 200510103959A CN 1933695 A CN1933695 A CN 1933695A
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- support plate
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- heat conduction
- circuit substrate
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Abstract
A heat radiation base plate of flexible type is prepared as setting multiple first trench on heat conductive carrier plate and using these trenches to form a platform being used to carry at least one electronic element, sticking heat radiation fin plate on one side of said heat conductive carrier plate and setting multiple second trench on fin plate to make positions of these second trenches be corresponded to positions of those first ones for providing flexible space when said base plate is bent.
Description
Technical field
The present invention relates to a kind of bendable circuit substrate, particularly a kind of bendable circuit substrate with heat-sinking capability.
Background technology
Along with on the fast development of information, communication field and the market for electronic product be tending towards gently, thin, short, little demand, the importance of bendable circuit substrate (soft circuit board) grows with each passing day.Yet known bendable circuit substrate mostly uses plastic material as base material, plates copper foil circuit again and uses.Yet, the high temperature when such circuit substrate often can't bear the high power electronic element operation, and its flexibility causes the rete knot to be peeled off easily.Therefore, so bendable circuit substrate is subjected to certain limitation on using.
And known heat radiating circuit substrate is to be bottom by coefficient of heat conduction good metal plate, carries the copper foil circuit that sticks together with electric insulating cement or glass above or contains the resin plate of copper foil circuit.Yet, when this metal substrate is bent,, make the then part of upper and lower two interlayers can produce shear stress because of its double-deck upper and lower layer of effect that is subjected to tension stress and compression respectively; Crooked bigger, the shear stress that is produced is also just big, thereby when this shear stress surpassed the intensity of glueing material, such heat radiating circuit substrate just can destroy because of forming delamination.And make the crooked stress that can produce of heat radiating circuit substrate reluctantly, and then influence the reliability of circuit.
In addition, in technique known, U.S. Pat 5 as shown in Figure 1,698,866 disclosed a kind of plane formula heat-radiating substrates, it comprises a metal heat-conducting support plate 20 ' and a radiating fin 10 ', comprises a plurality of high-capacity LEDs 35 ' on this metal heat-conducting support plate 20 ', wherein, the heat energy that these LED produced can be taken away via metal heat-conducting support plate 20 ' and radiating fin 10 '.Plane formula heat-radiating substrate has although it is so possessed heat-sinking capability, yet such board structure is flat shape, makes the light-emitting axis of LED keep vertical all the time with base plan and can't use according to the product demand bending.In addition, U.S. Pat 5 as shown in Figure 2,660,461 disclosed another kinds are by in the formed optical-electric module array of heat-radiating substrate carrying LED electronic component, this heat-radiating substrate has the metab of heat conduction and conductivity equally, wherein, this metab one end radiating fin of fitting equally, the other end then carries the LED electronic component.But same, such heat-radiating substrate interconnects because of the jockey 40 ', 41 ' by solid shape, and its pliability is not good.When above-mentioned two kinds of heat-radiating substrates are used in bending, all need be assembled into the module of sheet earlier, utilize hinge to engage again, to reach the purpose of bending.Yet such design not only increases the complexity of assembling, and member cost height also is to use to go up one of adverse factors.
Comprehensive the above, invention motivation of the present invention promptly produces therefrom.In present known technology, flexual soft circuit substrate is not good because of heat dissipating, and how most circuit substrates with thermal diffusivity then limit its range of application because of lacking pliability.Therefore, in order to overcome the shortcoming in the above-mentioned technology, the present invention proposes a kind ofly can have heat-sinking capability and flexual flexible radiating circuit substrate simultaneously concurrently, with the range of application of the bendable substrate of further expansion.
Summary of the invention
First conception of the present invention is to provide a kind of bendable (flexible) circuit substrate, this bendable circuit substrate comprises at least one circuit support plate, have an insulating barrier and at least one conductive layer on it, this conductive layer forms a circuit structure through graphical (patterned); An and flexible radiating substrate, this flexible radiating substrate also comprises: a heat conduction support plate, and it has one first upper surface and one first lower surface, wherein has a plurality of first grooves on this first upper surface, form a platform between these first grooves, in order to carry this circuit support plate; And a radiator, it has one second upper surface and one second lower surface, and this second upper surface comprises a plurality of second grooves, and this second upper surface and this first lower surface are fitted.
According to above-mentioned conception, the cushion space when wherein these first and second grooves provide this flexible radiating substrate bending.
According to above-mentioned conception, wherein the position of these second grooves of this second upper surface is to the position of these first grooves that should first upper surface.
According to above-mentioned conception, wherein the material of this insulating barrier be selected from resin material and ceramic material wherein it.
According to above-mentioned conception, wherein the material of this conductive layer is selected from the metallic conduction material.
According to above-mentioned conception, wherein the material of this heat conduction support plate be selected from copper, aluminium, the contour heat conducting material of graphite one of them.
According to above-mentioned conception, wherein this second lower surface also comprises a plurality of radiating fins (fin).
Second conception of the present invention is to provide a kind of flexual electrooptical device that has, and it comprises at least one circuit support plate, has a high-capacity LED package module on it; And a flexible radiating substrate, it comprises: a heat conduction support plate, have a plurality of grooves on it, and respectively form a platform between this groove, to carry this circuit support plate; And a radiator, itself and this heat conduction support plate is fitted, to absorb the heat energy on this heat conduction support plate.
According to above-mentioned conception, the cushion space when wherein this groove provides this flexible optoelectronic array bending.
According to above-mentioned conception, wherein the luminous optical axis of this high-capacity LED package module is adjusted along with the bending of these groove widths.
According to above-mentioned conception, wherein also comprise a plurality of radiating fins (fin) on this radiator.
According to above-mentioned conception, wherein this circuit support plate is one to be the circuit board of base material with the resin.
According to above-mentioned conception, wherein the material of this heat conduction support plate be selected from copper, aluminium, the contour heat conducting material of graphite one of them.
The 3rd conception of the present invention is to provide a kind of bendable (flexible) heat-radiating substrate, and it comprises a heat conduction support plate, has a plurality of first grooves on it, forms a platform between these first grooves; And a radiating fin, it fits in a wherein side of this heat conduction support plate, wherein, has a plurality of second grooves on this radiating fin, the position of these second grooves and the corresponding arrangement in the position of these first grooves.
According to above-mentioned conception, the cushion space when wherein these first and second grooves provide this flexible radiating substrate bending.
According to above-mentioned conception, at least one electronic component of this platform bearer wherein.
According to above-mentioned conception, wherein this electronic component is a high power electronic element.
According to above-mentioned conception, wherein the material of this heat conduction support plate be selected from copper, aluminium, the contour heat conducting material of graphite wherein it.
By above-mentioned conception, flexible radiating substrate proposed by the invention can be used for welding high-power electronic component, as light-emitting diode etc.Simultaneously, can reach the advantage that light is penetrated service efficiency, simplified assembly cost that promotes by flexible optoelectronic device proposed by the invention.
By following accompanying drawing and detailed description, can more in depth understand the present invention.
Description of drawings
Fig. 1 represents the specific embodiment of a kind of heat radiating circuit substrate carrying LED electrooptical device in the known technology;
Fig. 2 represents a kind of LED optical-electric module in the known technology and the specific embodiment of package assembly thereof;
Fig. 3 represents the specific embodiment of a flexible radiating circuit substrate of the present invention; And
Fig. 4 represents the specific embodiment of a flexible optoelectronic device of the present invention.
Wherein, description of reference numerals is as follows:
10 ' heat radiation (device) fin, 20 ' metal heat-conducting support plate, 35 ' high-capacity LED
40 ', 41 ' jockey 100 flexible radiating substrates, 10 radiators (fin)
20 heat conduction support plates, 201 first grooves, 101 second grooves, 202 platforms
30 circuit support plates, 35 LED package modules, 200 flexible optoelectronic devices
Embodiment
See also Fig. 3, a kind of flexible radiating substrate 100 that its expression is proposed by the invention.As shown in Figure 3, this flexible radiating substrate 100 mainly comprises a radiator 10 and a heat conduction support plate 20.In order to reach the purpose of this flexible radiating substrate 100 of bending, upper surface at this radiator 10 and this heat conduction support plate 20 has a plurality of grooves respectively, wherein first groove, 201 positions on this heat conduction support plate 20 are corresponding mutually with the position of second groove 101 of this radiator 10, so that strain (strain) that is produced can bear 100 bendings of this flexible radiating substrate on these groove positions time the and the cushion space when bending is provided.The design of this first and second groove 101,201 is not limited to be arranged in parallel, and also can be designed to be radial or cross arrangement according to application need, so that the bending space of various angles to be provided.As shown in Figure 3, in the manufacturing process of this flexible radiating substrate 100, this radiator 10 makes the upper surface of this radiator 10 and the lower surface assembly of this heat conduction support plate 20 after producing first and second groove 101,201 respectively with this heat conduction support plate 20 under flat state again; After treating that its planar structure is finished, optionally be bent into required angle again.
In a preferred embodiment of the present invention, this heat conduction support plate 20 is made of a highly heat-conductive material, the metal material of high-termal conductivity such as copper, aluminium normally, but the nonmetallic materials of other high-termal conductivity as graphite etc., also can be used as this heat conduction support plate 20.And the outer surface of this radiator 10 is made of a plurality of radiating fin usually, to promote the heat-sinking capability of this radiator.
In preferred embodiment of the present invention, on the heat conduction support plate 20 of this flexible radiating circuit substrate 100, form a platform 202 between two adjacent first grooves 201, in order to carry at least one circuit support plate 30.This circuit support plate 30 is made of an insulating barrier and a conductive layer; Wherein this insulating barrier is generally the board substrate of pottery or resin grades, so that this circuit support plate 30 engages with this heat conduction support plate 20 easily; This conductive layer then is to form the circuitry needed structure through graphical (patterned), and wherein this conductive can be selected from the metallic conduction material.By such structural design, can finish a kind of bendable circuit substrate with heat-sinking capability.
See also shown in Figure 4, the preferred embodiment of its explanation a kind of flexible optoelectronic device 200 proposed by the invention.This flexible optoelectronic device 200 comprises flexible radiating substrate 100 and a plurality of high-power LED package module 35 in the aforementioned specific embodiment.As shown in Figure 4, this flexible radiating substrate 100 is made of a heat conduction support plate 20 with a plurality of grooves 201 and a radiator 10, wherein forms a platform 202 between these grooves 201, to carry these LED package modules 35.As previously mentioned, therefore the cushion space when these grooves 201 provide these flexible optoelectronic device 200 bendings can adjust the luminous optical axis of these LED package modules 35, to reach optically focused or other special purpose by the variation of these groove 201 width.As previously mentioned, these LED package modules 35 are carried on this platform 202 by this circuit support plate 30.This circuit support plate 30 is to be the circuit board that base material constituted by pottery or resin equally.
Comprehensive the above, flexible radiating substrate of the present invention can optionally bend to needed radian, therefore can be suitable for using on the three dimensions, for example need to have the display billboard of high power circuit plate, arc of light wave beauty instrument, the needs bending application of the human body skin of specific light harvesting position and spotlight etc. with light harvesting effect.Yet only in order to preferred embodiment of the present invention to be described, scope of the present invention is not subject to above-mentioned every embodiment for the above; And the present invention can be made amendment by those skilled in the art, but does not break away from claims scope required for protection.
Claims (11)
1. a bendable circuit substrate is characterized in that, comprises:
At least one circuit support plate has an insulating barrier and at least one conductive layer on it, this conductive layer is through the graphical circuit structure that forms;
One heat conduction support plate, it has one first upper surface and one first lower surface, wherein has a plurality of first grooves on this first upper surface, forms a platform between these first grooves, in order to carry this circuit support plate; And
One radiator, it has one second upper surface and one second lower surface, and this second upper surface comprises a plurality of second grooves, and this second upper surface and the applying of this first lower surface.
2. bendable circuit substrate as claimed in claim 1 is characterized in that, the cushion space when these first and second grooves provide this bendable circuit substrate to bend.
3. bendable circuit substrate as claimed in claim 1 is characterized in that, the position of these second grooves of this second upper surface is to the position of these first grooves that should first upper surface.
4. bendable circuit substrate as claimed in claim 1 is characterized in that:
The material of this insulating barrier be selected from resin and the pottery one of them; And/or
The material of this conductive layer is selected from the metallic conduction material.
5. bendable circuit substrate as claimed in claim 1 is characterized in that, the material of this heat conduction support plate be selected from copper, aluminium, the contour heat conducting material of graphite one of them.
6. bendable circuit substrate as claimed in claim 1 is characterized in that, this second lower surface also comprises a plurality of radiating fins.
7. a flexible optoelectronic device is characterized in that, comprises:
At least one circuit support plate has a high-capacity LED package module on it;
One heat conduction support plate has a plurality of grooves on it, respectively form a platform between this groove, to carry this circuit support plate; And
One radiator, itself and this heat conduction support plate is fitted, to absorb the heat energy on this heat conduction support plate.
8. flexible optoelectronic device as claimed in claim 7 is characterized in that;
Cushion space when this groove provides this flexible optoelectronic device bending; And/or
The luminous optical axis of this high-capacity LED package module is adjusted along with the bending of these groove widths.
9. flexible optoelectronic device as claimed in claim 7 is characterized in that:
Also comprise a plurality of radiating fins on this radiator; And/or
This circuit support plate is one to be the circuit board of base material with the resin.
10. a flexible radiating substrate is characterized in that, comprises:
One heat conduction support plate has a plurality of first grooves on it, form a platform between these first grooves; And
One radiating fin, it fits in a wherein side of this heat conduction support plate, wherein, has a plurality of second grooves on this San Re Xu sheet, the position of these second grooves and the corresponding arrangement in the position of these first grooves.
11. flexible radiating substrate as claimed in claim 10 is characterized in that, at least one electronic component of this platform bearer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101039599A CN100469217C (en) | 2005-09-16 | 2005-09-16 | Flexible radiating circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101039599A CN100469217C (en) | 2005-09-16 | 2005-09-16 | Flexible radiating circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1933695A true CN1933695A (en) | 2007-03-21 |
| CN100469217C CN100469217C (en) | 2009-03-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101039599A Expired - Fee Related CN100469217C (en) | 2005-09-16 | 2005-09-16 | Flexible radiating circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100469217C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889488A (en) * | 2011-07-21 | 2013-01-23 | 展晶科技(深圳)有限公司 | LED (light emitting diode) lamp strip |
| CN103423640A (en) * | 2012-01-13 | 2013-12-04 | 王成华 | LED lamp and method for processing same |
| CN103582383A (en) * | 2012-07-24 | 2014-02-12 | 李姝江 | Heat dissipating material and technical method thereof |
| US9657931B2 (en) | 2011-12-21 | 2017-05-23 | Intel Corporation | Thermal management for light-emitting diodes |
| CN112888238A (en) * | 2019-11-29 | 2021-06-01 | 神讯电脑(昆山)有限公司 | Heat dissipation framework |
| CN114728858A (en) * | 2019-11-22 | 2022-07-08 | 三菱综合材料株式会社 | Ceramic-copper-graphene bonded body, method for producing same, and ceramic-copper-graphene bonded structure |
-
2005
- 2005-09-16 CN CNB2005101039599A patent/CN100469217C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889488A (en) * | 2011-07-21 | 2013-01-23 | 展晶科技(深圳)有限公司 | LED (light emitting diode) lamp strip |
| US9657931B2 (en) | 2011-12-21 | 2017-05-23 | Intel Corporation | Thermal management for light-emitting diodes |
| CN103423640A (en) * | 2012-01-13 | 2013-12-04 | 王成华 | LED lamp and method for processing same |
| CN103423640B (en) * | 2012-01-13 | 2015-06-17 | 王成华 | LED lamp and method for processing same |
| CN103582383A (en) * | 2012-07-24 | 2014-02-12 | 李姝江 | Heat dissipating material and technical method thereof |
| CN114728858A (en) * | 2019-11-22 | 2022-07-08 | 三菱综合材料株式会社 | Ceramic-copper-graphene bonded body, method for producing same, and ceramic-copper-graphene bonded structure |
| CN112888238A (en) * | 2019-11-29 | 2021-06-01 | 神讯电脑(昆山)有限公司 | Heat dissipation framework |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100469217C (en) | 2009-03-11 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HUAXINLIHUA CO. LTD. Free format text: FORMER OWNER: FINANCIAL GROUP LEGAL PERSON INDUSTRIAL TECHNOLOGY INST. Effective date: 20130110 |
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Effective date of registration: 20130110 Address after: Taoyuan County, Taiwan, China high road, Yangmei City, No. 566-3 Patentee after: Huaxinlihua Co., Ltd. Address before: Hsinchu County, Taiwan, China Patentee before: Industrial Technology Research Institute |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090311 Termination date: 20150916 |
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| EXPY | Termination of patent right or utility model |