CN1920720A - Method for adjusting machine set, manufacture control system and semiconductive manufacture system - Google Patents
Method for adjusting machine set, manufacture control system and semiconductive manufacture system Download PDFInfo
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- CN1920720A CN1920720A CN 200510096511 CN200510096511A CN1920720A CN 1920720 A CN1920720 A CN 1920720A CN 200510096511 CN200510096511 CN 200510096511 CN 200510096511 A CN200510096511 A CN 200510096511A CN 1920720 A CN1920720 A CN 1920720A
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- 238000000034 method Methods 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 48
- 238000005259 measurement Methods 0.000 claims description 71
- 238000012544 monitoring process Methods 0.000 claims description 38
- 238000012545 processing Methods 0.000 claims description 35
- 238000013401 experimental design Methods 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000004458 analytical method Methods 0.000 claims description 18
- 238000012806 monitoring device Methods 0.000 claims description 9
- 238000012937 correction Methods 0.000 claims description 5
- 238000003050 experimental design method Methods 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 3
- 238000006467 substitution reaction Methods 0.000 claims 3
- 238000002474 experimental method Methods 0.000 abstract 3
- 239000010408 film Substances 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000004886 process control Methods 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The invention relates to a producing control system, which comprises a test database, a detect database, an experiment design database (DOE), and a processor, wherein said test data stores at least one product test data; said detect database stores at least one machine detect data; said experiment design database (DOE) stores at least one process factor relation decided by the experiment design method; and said process via the preset target data and product test data decides one compensation valve, and via the compensation valve and machine detect data, the factor relation, decides the machine adjust data.
Description
Technical field
The present invention relates to production control, particularly relate to utilization and adjust board initialization system and method in goods measurement data, board Monitoring Data, experimental design data.
Background technology
Along with the development of technology, the live width on the IC assembly is also more and more littler, makes degree of accuracy and cost that IC makes also greatly improve.Whether make the parameter setting of board and can adjust at any time, reach optimization, with regard to the IC manufacturing of little live width, be one of major reason that influences its yield rate.
Referring to Fig. 1, it shows the synoptic diagram of the setting/adjustment of tool parameters in the traditional IC manufacturing.In traditional IC manufacturing course, IC at goods before being handled by board 11, measuring board 131 first earlier measures, obtain one and handle preceding measured value, measured value is sent to control device 15 before the above-mentioned processing, and carry out feed forward process control technology preface 100 according to this, and adjust the parameter setting of board 11 according to this.After being handled by board 11, measure board 135 by second again and measure, obtain one and handle the back measured value, and measured value is sent to control device 15 after the above-mentioned processing, and utilize this processing back measured value to carry out feedback process control technology preface 150, and adjust the parameter setting of board 11 according to this.Board 11 has the phenomenon of drift to take place in the process of running during its operating state.Therefore, only carry out the adjustment of tool parameters, and can't revise the foozle that the operating state drift of above-mentioned board own is caused according to the difference value of measured value before goods are handled and processing back measured value.
Yet tradition is made the processing parameter setting and the adjustment of board, does not include the drift of above-mentioned board operating state in consideration, and makes the yield rate of IC because precisely and greatly not reducing of board setting.
In brief, traditional IC is manufactured on when carrying out the board processing parameter setting, the multinomial factor that fully will influence technology is not included consideration in, it does not also feed back to the error that operating state caused of maker playscript with stage directions body in the setting of technological parameter, make the setting of board technological parameter not attain ideal, and cause the low excessively phenomenon of IC yield rate.
Summary of the invention
In view of this, purpose of the present invention is for providing a kind of manufacture method and system, with the process goal data, the goods measurement data, and factor such as board Monitoring Data all include in the board processing parameter setting, and utilize experimental design data (DOE) in conjunction with in the tool parameters setting, make it possible to correctly set tool parameters, and then the qualification rate that makes semiconductor make improves.
For realizing above-mentioned purpose of the present invention, the invention provides a kind of manufacturing control system, it comprises measured database, monitor database, experimental design data (DOE) storehouse, reaches processor.This measured database is at least one in the goods measurement data in order to store.This monitor database is in order to store at least one board Monitoring Data.This experimental design data (DOE) storehouse is in order to store at least one technological factor relational expression that determines by experimental design method.This processor reaches and should determine an offset in the goods measurement data according to default process goal data, and according to this offset and this board Monitoring Data, cooperates this technological factor relational expression, and the decision board is adjusted data.
The present invention also provides semi-conductor manufacturing system.It comprises: make board, board monitoring device, control device.This manufacturing board is in order to handle at least one semiconductor at goods wherein, and this board monitoring device is in order to monitor this manufacturing board, to obtain its running information.This control device, determine an offset in order to reach this semi-conductive measurement data, and, cooperate a default technological factor relational expression according to this offset and this board Monitoring Data according to default process goal data, the decision board is adjusted data, in order to control this manufacturing board.
The present invention also provides a kind of method that board is set of adjusting, and according to the process goal data, in goods measurement data, and factor and experimental design data (DOE) such as board Monitoring Data, carries out the setting and the running of board technological parameter.This method at first provides the process goal data, in goods measurement data, and board Monitoring Data.Experimental design data (DOE) are provided again, and determine a technological factor relational expression according to this.Subsequently, reach and to determine an offset in the goods measurement data according to these process goal data.Then, according to this offset and this board Monitoring Data, cooperate this technological factor relational expression, the decision board is adjusted data.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and be described with reference to the accompanying drawings as follows.
Fig. 1 shows the synoptic diagram of the setting/adjustment of tool parameters in the traditional IC manufacturing.
Fig. 2 shows the calcspar according to the manufacturing system of the embodiment of the invention.
Fig. 3 shows the process flow diagram of adjusting the board establishing method according to the embodiment of the invention.
Fig. 4 shows according to film thickness synoptic diagram in the embodiment of the invention thin-film technique.
The reference numeral explanation
11 boards; 131 first measure board; 15 control device; 100 feed forward process control technology prefaces; 135 second measure board; 150 feedback process control technology prefaces; 20 manufacturing systems; 21 make board; 22 board monitoring devices; 23 measurement mechanisms; 25 control device; 24 measured value databases; 26 experimental designs (DOE) database; 27 treating apparatus; 29 return devices.
Embodiment
Followingly enforcement of the present invention is described with reference to Fig. 2 to Fig. 4.
Fig. 2 shows the calcspar according to the manufacturing system of the embodiment of the invention.Manufacturing system 20 comprises manufacturing board 21, board monitoring device 22, measurement mechanism 23, control device 25, measured value database 24, experimental design (DOE) database 26, treating apparatus 27, reaches return device 29.
Make board 21 in order to handle at least one semiconductor at goods, it can make board for any that uses in the semiconductor fabrication.Board monitoring device 22 is made the state of board 21 in order to monitoring, and when making board 21 execution processing steps, monitors and obtain the running status data of making board 21, for example: data such as the pH value of acid tank, temperature.
Experimental design data (DOE) storehouse 26 is in order to store at least one experimental design data that determine by experimental design method.For example: the tool parameters of utilizing the DOE gimmick to be found out by the slip-stick artist.For example: optimized result between acid strength, temperature, the rate of etch, and be stored in this experimental design database 26.Wherein, rate of etch is the functional value of acid strength, temperature and acid solution service time, that is:
E＝f(A，B，C)
Wherein E is a rate of etch, and A is an acid strength, and B is a temperature, and C is acid solution service time.
Treating apparatus 27 is carried out feedforward control and FEEDBACK CONTROL by control device 25 at making board 21.Treating apparatus 27 by obtain in the measured value database 24 processed before the related data and measurement mechanism 23 resulting processing of goods/handle back measurement result data, and according to measurement data after measurement data is handled with this before this processing of correspondence, determine one in goods measurement change amount, it is that this is in goods measured value change amount through the PROCESS FOR TREATMENT front and back.Treating apparatus 27 and foundation should be in the related datas of goods, according to should default process goal data and this measurement data at goods determining an offset, and wherein this offset is these process goal data and this difference in the goods measurement data.Treating apparatus 27 also further determines a technological factor relational expression according to these experimental design data, wherein this technological factor relational expression system defines this tool parameters and is somebody's turn to do at the operation relation of goods between the reaction time, and this offset is cooperated this technological factor relational expression, determined this board to adjust data (for example time set value), can be met this process goal data according to what this board adjusted that data adjust that board running makes its processing at goods again.
For confirming that this technological factor relational expression can correctly define tool parameters and in the relation of goods between the reaction time, manufacturing system 20 also further comprises regretional analysis device 29.Regretional analysis device 29 respectively from board monitoring device 22, measured value database 24, experimental design (DOE) database 26, and treating apparatus 27 receives the board Monitoring Data, in goods measurement data, experimental design data and offset data, and, whether correctly define this board Monitoring Data and this operation relation between the goods measurement data to determine this technological factor relational expression with above-mentioned data process regressing calculation.When this technological factor relational expression can not correctly define this board Monitoring Data and this operation relation between the goods measurement data, then according to this technological factor relational expression of this regretional analysis correction as a result, and revised technological factor relational expression is sent to treating apparatus 27, make treating apparatus 27 to carry out tool parameters and set the program of adjusting according to revised technological factor relational expression.
Fig. 3 shows the process flow diagram of adjusting the board establishing method according to the embodiment of the invention, and this method can be implemented on above-mentioned manufacturing system.Adjustment board establishing method shown in Figure 3 is in order to adjust the tool parameters as the running foundation of making board 21.And controlled manufacturing board 21 can be made board for any that uses in the semiconductor fabrication.
Fig. 3 shows that this method at first provides the process goal data (step S311) of a processing step.And before carrying out this processing step, earlier this wafer is measured, preceding to obtain processing at goods measurement data (step S313).As shown in Figure 4, makes board and will on wafer, generate the film that a thickness is A, and the original film thickness that records on the wafer is B that then calculating learns that the film thickness that this step need generate is C=(A-B) (step S314).When making board execution film generation technology, monitor the situation that board operates in real time by the monitoring device of board configuration, to obtain board Monitoring Data (step S315).
After this film generation processing step is finished, measure the thickness (step S317) of this wafer upper film once again, this moment, thickness was D, handled then C '=D-B of back measured value.
Obtain and handle after the measured value of back, promptly handle front/rear measured value and determine an offset (step S32) according to these process goal data and this.This offset is carried out the poor of this processing step institute film former thickness for the film thickness of this processing step expection generation with reality, that is, (C-C '), the target that its representative manufacturing board setting will be reached and the difference of actual operation.
This method also provides experimental design (DOE) data (step S331), and it comprises at least one group of board operational data.And determining a technological factor relational expression (step S333) according to these experimental design data, it is to define this board Monitoring Data and operation relation that should be between the goods measurement data.This technological factor relational expression can define film thickness and similar to the relation between the factors such as technological temperature, pressure.
Subsequently, according to this offset and this board Monitoring Data, cooperate this technological factor relational expression, the decision board is adjusted data (step S34).That is, as mentioned above, film thickness that this offset generates for the expection of this processing step and actual poor (C-C ') that carries out this processing step institute film former thickness, its representative is made board and is set the target that will reach and the difference of actual operation.In step S34, can be according to the film thickness that is defined in this technological factor relational expression and similar as the relation between the factors such as technological temperature, pressure, the tool parameters of the technological temperature when adjusting board execution processing step, pressure etc.
Subsequently, can meet this process goal data (step S35) according to what this board adjusted that data adjust that board running makes its processing at goods.
Said method further utilizes this board Monitoring Data, is somebody's turn to do in goods measurement data, these experimental design data and this offset data, carry out a regretional analysis step, defined the result whether this board Monitoring Data and operation relation that should be between the goods measurement data meet this regretional analysis to determine this technological factor relational expression.And when this technological factor relational expression define this board Monitoring Data and operation relation that should be between the goods measurement data do not meet this regretional analysis as a result the time, further according to this technological factor relational expression of this regretional analysis correction as a result.
Above-mentionedly revise the program of this technological factor relational expression, can carry out, or instruct executions, make it possible to regularly or foundation need be confirmed the correctness of this technological factor relational expression especially according to the user according to a predetermined time-histories by the regretional analysis step.
The pointer of above-mentioned feedforward control to a collection of at goods, measure it and handle preceding initial condition, for example primary thickness, utilize process goal data (Target 1) to deduct this primary thickness again, obtain a feedforward control target data (Target 2), that is this is at the thickness of the in fact required growth of goods.The method according to this invention, the method that can only utilize this feedforward to control, the experimental design data in the collocation experimental design database are obtained tool parameters by treating apparatus, are controlled the running of board again by control device.For example, the real-time Monitoring Data of board that is obtained by the board monitoring device can be passed in the treating apparatus, and treating apparatus can be with this real-time Monitoring Data, and the technological factor relational expression in the collocation experimental design database is obtained preferableization film growth speed.According to this film growth speed and in the data of the thickness of the in fact required growth of goods, can obtain the film growth time, these data will be passed in the control device by treating apparatus.
In addition, the present invention also comprises a kind of method of FEEDBACK CONTROL.That is, according to a collection of treated product, measuring its value after handling, the thickness after for example growing up deducts this at the previous primary thickness that measures of goods, obtains the thickness of actual growth.The difference of the thickness (feedforward control target data) that compares the thickness of this actual generation and estimate to generate (that is, offset), experimental design data in the collocation experimental design database are obtained tool parameters by treating apparatus and are adjusted data, are passed in the control device again.
Because the present invention utilizes the gimmick of the method collocation experimental design of board monitoring in real time, adjusts the board operational data in real time, accurately controls the quality of board processing at goods, realizes process goal.Therefore, can reduce in the measurement frequency of goods, it is such to be different from known technology, for guaranteeing the quality of technology, must carry out measurement work many batches ofly, therefore spends many process times.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; those skilled in the art can do some changes and retouching under the premise without departing from the spirit and scope of the present invention, so protection scope of the present invention is as the criterion with claim of the present invention.
Claims (29)
1. adjust the method that board is set for one kind, it comprises:
The process goal data are provided, in goods measurement data, and board Monitoring Data;
The experimental design data are provided, and determine a technological factor relational expression according to this;
Reach and to determine an offset in the goods measurement data according to these process goal data; And
According to this offset and this board Monitoring Data, cooperate this technological factor relational expression, the decision board is adjusted data.
2. the method that adjustment board as claimed in claim 1 is set wherein should measurement data and be handled the back measurement data before the goods measurement data comprises a processing.
3. the method that adjustment board as claimed in claim 2 is set, this method is further handled the back measurement data according to measurement data before this corresponding processing and this, determine one in goods measurement change amount, it is this measured value change amount before and after goods process PROCESS FOR TREATMENT, and it and these process goal data are compared.
4. the method that adjustment board as claimed in claim 1 is set, wherein this technological factor relational expression is to define this board Monitoring Data and this operation relation between the goods measurement data.
5. the method that adjustment board as claimed in claim 1 is set, wherein this offset is these process goal data and this difference in the goods measurement data.
6. the method that adjustment board as claimed in claim 1 is set further with this technological factor relational expression of this offset substitution, is adjusted data to determine this board.
7. the method that adjustment board as claimed in claim 1 is set further can meet this process goal data according to what this board adjusted that data adjust that board running makes its processing at goods.
8. the method that adjustment board as claimed in claim 1 is set, further utilize this board Monitoring Data, be somebody's turn to do in goods measurement data, these experimental design data and this offset data, carry out a regretional analysis step, defined the result whether this board Monitoring Data and operation relation that should be between the goods measurement data meet this regretional analysis to determine this technological factor relational expression.
9. the method that adjustment board as claimed in claim 8 is set, when this technological factor relational expression define this board Monitoring Data and operation relation that should be between the goods measurement data do not meet this regretional analysis as a result the time, further according to this technological factor relational expression of this regretional analysis correction as a result.
10. manufacturing control system, it comprises:
One measured database, at least one in order to store in the goods measurement data;
One monitor database is in order to store at least one board Monitoring Data;
One experimental design database, in order to storing at least one experimental data set that determines by experimental design method, it comprises at least one group of board operational data and in the goods measurement data; And
One processor, it reaches and should determine an offset in the goods measurement data according to default process goal data, determine a technological factor relational expression according to the data in this experimental design database, and according to this offset and this board Monitoring Data, cooperate this technological factor relational expression, the decision board is adjusted data.
11. manufacturing control system as claimed in claim 10 wherein should measurement data and be handled the back measurement data before the goods measurement data comprises a processing.
12. manufacturing control system as claimed in claim 11, wherein this processor is further handled the back measurement data according to measurement data before this corresponding processing and this, determine one in goods measurement change amount, it is that this is in goods measured value change amount through the PROCESS FOR TREATMENT front and back.
13. manufacturing control system as claimed in claim 10, wherein this technological factor relational expression is to define this board Monitoring Data and this operation relation between the goods measurement data.
14. manufacturing control system as claimed in claim 10, wherein this offset is these process goal data and this difference in the goods measurement data.
15. manufacturing control system as claimed in claim 10, wherein this processor is adjusted data further with this technological factor relational expression of this offset substitution to determine this board.
16. manufacturing control system as claimed in claim 10, wherein this processor further can meet this process goal data according to what this board adjusted that data adjust that board running makes its processing at goods.
17. manufacturing control system as claimed in claim 10, further comprise a regretional analysis device, its according to the board Monitoring Data, in goods measurement data, experimental design data and offset data carrying out a regressing calculation, whether correctly define this board Monitoring Data and operation relation that should be between the goods measurement data to determine this technological factor relational expression.
18. manufacturing control system as claimed in claim 17, when this regretional analysis device can not correctly define this board Monitoring Data and operation relation that should be between the goods measurement data when this technological factor relational expression, then according to this technological factor relational expression of this regretional analysis correction as a result.
19. a semi-conductor manufacturing system, it comprises:
Make board, in order to handle at least one semiconductor at goods;
Monitoring device is in order to monitor this manufacturing board, to obtain the board operational data of this board;
Control device, determine an offset in order to foundation one default process goal data and this semiconductor in the measurement data of goods, and, cooperate a default technological factor relational expression according to this offset and this board Monitoring Data, the decision board is adjusted data, in order to control this manufacturing board.
20. semi-conductor manufacturing system as claimed in claim 19 further comprises one and measures board, and is at least one in the goods measurement data to obtain in order to carry out a measuring process.
21. semi-conductor manufacturing system as claimed in claim 19 further comprises an experimental design database, in order to store at least one this technological factor relational expression that determines by experimental design method.
22. semi-conductor manufacturing system as claimed in claim 19 wherein should measurement data and be handled the back measurement data before the goods measurement data comprises a processing.
23. semi-conductor manufacturing system as claimed in claim 19, wherein this control device is further handled the back measurement data according to measurement data before this corresponding processing and this, determine one in goods measurement change amount, it is that this is in goods measured value change amount through the PROCESS FOR TREATMENT front and back.
24. semi-conductor manufacturing system as claimed in claim 19, wherein this technological factor relational expression is to define this board Monitoring Data and this operation relation between the goods measurement data.
25. semi-conductor manufacturing system as claimed in claim 19, wherein this offset is these process goal data and this difference in the goods measurement data.
26. semi-conductor manufacturing system as claimed in claim 19, wherein this control device is adjusted data further with this technological factor relational expression of this offset substitution to determine this board.
27. semi-conductor manufacturing system as claimed in claim 19, wherein this control device further can meet this process goal data according to what this board adjusted that data adjust that board running makes its processing at goods.
28. semi-conductor manufacturing system as claimed in claim 19, further comprise a regretional analysis device, its according to the board Monitoring Data, in goods measurement data, experimental design data and offset data carrying out a regressing calculation, whether correctly define this board Monitoring Data and operation relation that should be between the goods measurement data to determine this technological factor relational expression.
29. semi-conductor manufacturing system as claimed in claim 28, when this regretional analysis device can not correctly define this board Monitoring Data and operation relation that should be between the goods measurement data when this technological factor relational expression, then according to this technological factor relational expression of this regretional analysis correction as a result.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200510096511 CN1920720A (en) | 2005-08-22 | 2005-08-22 | Method for adjusting machine set, manufacture control system and semiconductive manufacture system |
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| CN 200510096511 CN1920720A (en) | 2005-08-22 | 2005-08-22 | Method for adjusting machine set, manufacture control system and semiconductive manufacture system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101320258B (en) * | 2007-06-08 | 2011-08-10 | 郑芳田 | Two-stage virtual measurement method |
| CN101452272B (en) * | 2007-12-07 | 2011-12-07 | 中芯国际集成电路制造(上海)有限公司 | Monitoring method and system for manufacturing machine |
| CN104465366A (en) * | 2014-11-28 | 2015-03-25 | 上海华力微电子有限公司 | NDC growth control method |
| CN104699019A (en) * | 2013-12-09 | 2015-06-10 | 中芯国际集成电路制造(上海)有限公司 | Machine recovery detection system and method |
| CN105988434A (en) * | 2015-02-04 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | Method and system for monitoring manufacturing machine |
| CN110488512A (en) * | 2019-06-11 | 2019-11-22 | 惠科股份有限公司 | A kind of correction method and correcting system of display panel measuring device |
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2005
- 2005-08-22 CN CN 200510096511 patent/CN1920720A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101320258B (en) * | 2007-06-08 | 2011-08-10 | 郑芳田 | Two-stage virtual measurement method |
| CN101452272B (en) * | 2007-12-07 | 2011-12-07 | 中芯国际集成电路制造(上海)有限公司 | Monitoring method and system for manufacturing machine |
| CN104699019A (en) * | 2013-12-09 | 2015-06-10 | 中芯国际集成电路制造(上海)有限公司 | Machine recovery detection system and method |
| CN104465366A (en) * | 2014-11-28 | 2015-03-25 | 上海华力微电子有限公司 | NDC growth control method |
| CN104465366B (en) * | 2014-11-28 | 2017-12-05 | 上海华力微电子有限公司 | A kind of NDC growth control methods |
| CN105988434A (en) * | 2015-02-04 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | Method and system for monitoring manufacturing machine |
| CN105988434B (en) * | 2015-02-04 | 2019-06-25 | 中芯国际集成电路制造(上海)有限公司 | The method and its system of monitoring manufacture board |
| CN110488512A (en) * | 2019-06-11 | 2019-11-22 | 惠科股份有限公司 | A kind of correction method and correcting system of display panel measuring device |
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