CN1913108B - 基板处理方法及其装置 - Google Patents
基板处理方法及其装置 Download PDFInfo
- Publication number
- CN1913108B CN1913108B CN2006101087474A CN200610108747A CN1913108B CN 1913108 B CN1913108 B CN 1913108B CN 2006101087474 A CN2006101087474 A CN 2006101087474A CN 200610108747 A CN200610108747 A CN 200610108747A CN 1913108 B CN1913108 B CN 1913108B
- Authority
- CN
- China
- Prior art keywords
- sulfuric acid
- mentioned
- treatment
- treatment fluid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title abstract description 22
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 216
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 68
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000012530 fluid Substances 0.000 claims description 70
- 238000005259 measurement Methods 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005233324 | 2005-08-11 | ||
JP2005-233324 | 2005-08-11 | ||
JP2005233324A JP2007049022A (ja) | 2005-08-11 | 2005-08-11 | 基板処理方法及びその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1913108A CN1913108A (zh) | 2007-02-14 |
CN1913108B true CN1913108B (zh) | 2010-05-12 |
Family
ID=37721989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006101087474A Expired - Fee Related CN1913108B (zh) | 2005-08-11 | 2006-08-10 | 基板处理方法及其装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070034231A1 (zh) |
JP (1) | JP2007049022A (zh) |
CN (1) | CN1913108B (zh) |
TW (1) | TW200746279A (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI406330B (zh) | 2007-09-26 | 2013-08-21 | Dainippon Screen Mfg | 基板處理裝置及基板處理方法 |
JP2009231579A (ja) * | 2008-03-24 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
US20120048303A1 (en) * | 2010-08-26 | 2012-03-01 | Macronix International Co., Ltd. | Process system and cleaning process |
JP2012074601A (ja) * | 2010-09-29 | 2012-04-12 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP5890198B2 (ja) * | 2011-03-25 | 2016-03-22 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
JP5792094B2 (ja) * | 2012-02-24 | 2015-10-07 | 東京エレクトロン株式会社 | 液処理装置、液処理方法および液処理方法を実行するためのコンピュータプログラムが記録された記録媒体 |
JP6220503B2 (ja) * | 2012-07-13 | 2017-10-25 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
JP6352143B2 (ja) * | 2013-11-13 | 2018-07-04 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法 |
CN104043621A (zh) * | 2014-05-21 | 2014-09-17 | 江苏德峰药业有限公司 | 一种气相或液相进样小瓶的清洗方法 |
JP2016162774A (ja) * | 2015-02-26 | 2016-09-05 | 株式会社Screenホールディングス | ヒータ異常検出装置、処理液供給装置、基板処理システム、およびヒータ異常検出方法 |
JP6456792B2 (ja) * | 2015-08-07 | 2019-01-23 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法及び記憶媒体 |
KR101657510B1 (ko) * | 2016-01-04 | 2016-09-19 | 씨앤지하이테크 주식회사 | 반도체 제조용 약액 혼합 장치 |
US11869780B2 (en) * | 2017-09-11 | 2024-01-09 | Tokyo Electron Limited | Substrate liquid processing apparatus |
JP2023111228A (ja) * | 2022-01-31 | 2023-08-10 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148267C (zh) * | 1996-03-27 | 2004-05-05 | 阿尔卑斯电气株式会社 | 清洁方法及其所用的装置 |
CN1603470A (zh) * | 2004-11-04 | 2005-04-06 | 上海华虹(集团)有限公司 | 一种金属前接触孔清洗工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8701759D0 (en) * | 1987-01-27 | 1987-03-04 | Laporte Industries Ltd | Processing of semi-conductor materials |
US20040000322A1 (en) * | 2002-07-01 | 2004-01-01 | Applied Materials, Inc. | Point-of-use mixing with H2SO4 and H2O2 on top of a horizontally spinning wafer |
US20040163681A1 (en) * | 2003-02-25 | 2004-08-26 | Applied Materials, Inc. | Dilute sulfuric peroxide at point-of-use |
US20040245636A1 (en) * | 2003-06-06 | 2004-12-09 | International Business Machines Corporation | Full removal of dual damascene metal level |
JP4494840B2 (ja) * | 2003-06-27 | 2010-06-30 | 大日本スクリーン製造株式会社 | 異物除去装置、基板処理装置および基板処理方法 |
-
2005
- 2005-08-11 JP JP2005233324A patent/JP2007049022A/ja not_active Abandoned
-
2006
- 2006-08-03 US US11/462,170 patent/US20070034231A1/en not_active Abandoned
- 2006-08-10 CN CN2006101087474A patent/CN1913108B/zh not_active Expired - Fee Related
- 2006-08-10 TW TW095129306A patent/TW200746279A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148267C (zh) * | 1996-03-27 | 2004-05-05 | 阿尔卑斯电气株式会社 | 清洁方法及其所用的装置 |
CN1603470A (zh) * | 2004-11-04 | 2005-04-06 | 上海华虹(集团)有限公司 | 一种金属前接触孔清洗工艺 |
Also Published As
Publication number | Publication date |
---|---|
US20070034231A1 (en) | 2007-02-15 |
TW200746279A (en) | 2007-12-16 |
JP2007049022A (ja) | 2007-02-22 |
CN1913108A (zh) | 2007-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20170810 |