CN1901198A - Electronic assembly and method for producing an electronic assembly - Google Patents

Electronic assembly and method for producing an electronic assembly Download PDF

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Publication number
CN1901198A
CN1901198A CNA2006101513240A CN200610151324A CN1901198A CN 1901198 A CN1901198 A CN 1901198A CN A2006101513240 A CNA2006101513240 A CN A2006101513240A CN 200610151324 A CN200610151324 A CN 200610151324A CN 1901198 A CN1901198 A CN 1901198A
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CN
China
Prior art keywords
semiconductor substrate
electric conductor
cmos structure
electronic building
layer
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Pending
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CNA2006101513240A
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Chinese (zh)
Inventor
杰拉尔德·埃克斯坦
奥利弗·弗罗伊登伯格
冈特·米勒
迈克尔·希尔
斯蒂芬·沃思
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Siemens AG
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Siemens AG
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Publication of CN1901198A publication Critical patent/CN1901198A/en
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

A method for producing an electronic assembly and an electronic assembly which has been correspondingly produced are specified. In this case, CMOS structures are formed in a semiconductor substrate to form a circuit and, after the CMOS structures have been formed, at least one electrical conductor is introduced, in a low-temperature process into an opening in the semiconductor substrate in such a manner that the electrical conductor is formed between a first side and a second side, which is opposite the first side, of the semiconductor substrate to connect the circuit. The electronic assembly allows a close arrangement of electronics and detectors and is suitable, for example, for a medical apparatus.

Description

Electronic building brick and the method that is used to make electronic building brick
Technical field
The present invention relates to a kind of electronic building brick and the method that is used to make this electronic building brick especially for the medical skill device.
Background technology
WO2004/012274 A1 discloses a kind of photodetector array.Each photoelectric detector constitutes on substrate as photodiode, and wherein, each photodiode constitutes on substrate surface as active area.For each photodiode constitutes the connecting path of conduction from the upper surface of substrate to lower surface, so that the active area of each photodiode is electrically connected with the lower surface of substrate.Big amount detector setting adjacent one another are is to form this array.Disclose a kind of imaging system for this reason, had towards the radiation source of photodetector array and be used to control the detector of photodetector array and the control device of radiation source with this photodetector array.
In WO2004/012274 A1, the hole that will have high length diameter ratio by plasma etching is set in the substrate of the photodiode that will constitute.Connection extends to second surface from the first surface of photodiode substrate between the conductive layer that is also referred to as path that after this constitutes in the hole, and and insulated substrate.Path has the polysilicon as conductor in addition, and it is deposited on the inwall to extension in pyroprocess.For the inwall of this path that insulate is oxidized to silicon dioxide in advance in pyroprocess.
Summary of the invention
The object of the present invention is to provide a kind of method that is used to make electronic building brick, make this electronic building brick constitute as far as possible reliably.This purpose is achieved by the feature of claim 1.Another object of the present invention is to provide a kind of electronic building brick of particularly having realized the electronic component setting of close detector.This purpose is achieved by the feature of claim 18.Preferred development is the content of dependent claims.
For the implementation method purpose has a kind of method that is used to make electronic building brick.In the process steps of this method, on Semiconductor substrate, be configured for forming the CMOS structure (CMOS that wherein abridges represents complementary metal oxide semiconductors (CMOS)) of circuit.The CMOS structure has nmos fet (wherein " N " expression negative pole) and pmos fet (wherein " P " expression is anodal), and they interconnect in circuit inside.In this regard, the CMOS structure also refers to the BiCMOS structure, i.e. the combination of field effect transistor and bipolar electrostatic induction transistor, and HV-CMOS structure, i.e. high voltage CMOS structure.
For form that the CMOS structure produces gate oxide and on gate oxide deposit spathic silicon for example, to form the grid of field-effect transistor.Dopant is injected Semiconductor substrate from gate oxide one side for this reason, form the drain electrode and the source semiconductor district of respective fields effect transistor in this dopant method step below.In that having been carried out, polysilicon and drain electrode and source semiconductor district metallize to connect grid and drain electrode and source semiconductor district for forming the CMOS structure after surface siliconization handles.
After constituting the CMOS structure, in chilling process, particularly under, at least one electric conductor is packed in the hole of Semiconductor substrate like this less than 450 ℃ temperature, make between first of Semiconductor substrate and relative with first second to constitute electric conductor.At this, chilling process is meant the quality that do not influence already present CMOS structure and the process of function.Pyroprocess then may be disturbed or even destroy the metallization be used to connect grid and drain electrode and source semiconductor district.
This electric conductor is used for other elements of connecting circuit and electronic circuit, as circuit block on other substrate or wiring pin.
What have advantage is in another process steps of manufacture method, by detector being bonded with each other or being connected with the CMOS structure by means of metallization, detector is connected with the CMOS structure.What have advantage in this regard is that detector is arranged on by the CMOS structure.Detector is preferably disposed on the top and/or next door of CMOS structure, preferably is adjacent.General consideration is used for electromagnetic radiation as detector---especially for the transducer of visible light, UV or x-ray radiation.
Consider the detector arrangement that is connected with the CMOS structure in addition as detector, wherein, connect scintillator in described transducer front, be used for electromagnetic radiation, particularly x-ray radiation converts the radiation by sensor of being applicable to coupling wavelength to.In this regard, transducer also can directly be imbedded in the Semiconductor substrate on CMOS structure next door.This structure is particularly suitable for using on x-ray tomography radiography device.Interchangeable, can consider x-ray radiation is directly changed into the so-called directly transducer of the signal of telecommunication as the detector that is connected with the CMOS structure.
In a kind of expansion with advantage, the CMOS structure is also referred to as on positive first in Semiconductor substrate and constitutes.Detector preferably is arranged on this first at this.The main pad that is also referred to as the front end pad is used for from this first connection.This main pad preferably constitutes on first of Semiconductor substrate for this reason.On first of Semiconductor substrate, constitute at least one secondary pad.Secondary pad is preferably in abutting connection with at least one electric conductor.At this, pad is meant metallized metalized surface, and it has the corresponding size that for example contacts with closing line with other metals.
Secondary pad preferably constitutes on the metallized plane of the particularly foot on electric circuit metal plane.Making secondary pad have advantage ground like this can be set directly near the Semiconductor substrate or the adjacent semiconductor substrate.But preferred secondary pad is by thin dielectric layer and Semiconductor substrate insulation.
According to a kind of execution mode with advantage, secondary pad is connected with at least one main pad conduction.What have advantage here is metallization.Also can select secondary pad and the direct adjacency of main pad.
In a kind of variation of expansion, the CMOS structure is covered by first passivation layer.In the process steps of back, for connecting local first passivation layer of removing of electric conductor, electric conductor particularly connects by the metallization conduction.
Though the hole on the Semiconductor substrate also can produce by machinery,, constitute the after etching Semiconductor substrate in the CMOS structure for constituting the hole according to a kind of preferred development of the present invention.
In etched first changes, be etched to small part wet-chemical ground and carry out.Can use for example potassium hydroxide (KOH), tetramethylammonium hydrogen-oxygen (TMAH) or choline as etchant.According to Semiconductor substrate and the employed etchant for example formed by monocrystalline silicon or carborundum atomic lattice, the different structure of wet-chemical ground etching on Semiconductor substrate.If the Semiconductor substrate of for example using potassium hydroxide etch to be made up of monocrystalline silicon then constitutes the etch structures of pyramid.
In etched second changes, be etched to small part and carry out as plasma etching.For carrying out plasma etching, the ion of the plasma that is caused by inert gas accelerates on the Semiconductor substrate.Should not protect by mask at etched position in this Semiconductor substrate.Angle between the surface of preferred speeding-up ion and Semiconductor substrate changes during etching, thereby can etch for example conical hole of frustum on Semiconductor substrate according to angle and mask.Plasma etching is also referred to as ICP (English Inductive-Coupled-Plasma, inductively coupled plasma).Angle changing between etching and the semiconductor substrate surface has advantage ground and can adjust between 50 °-90 °.
Preferred especially wet chemical etching and dry ecthing mutually combine, and method is that at first structure of the pre-etching of wet-chemical is also deepened etching with this structure by dry ecthing.Also can select at first to carry out dry corrosion and be carved into this degree of depth, act in this degree of depth of Semiconductor substrate by wet chemical etching then and produce etch structures.
In first constitute to change, carry out etching from first face of Semiconductor substrate.At this, on first of Semiconductor substrate, constitute the CMOS structure in advance.In second constitute to change, carry out etching from second face of Semiconductor substrate.Metallization, particularly secondary pad is preferably formed etching to be stopped, and it at least obviously slows down etching or generation and can be used for the signal of estimating that etching stops.
According to a kind of formation, hole wall is covered by second passivation layer, particularly nitride or oxide after the etching.At this, for example by SiO 2Perhaps Si 3N 4This passivation layer that constitutes adopts the chilling process deposition.Passivation layer is used herein to the later metal that applies of electric conductor and insulate with respect to Semiconductor substrate, to prevent for example so-called crosstalking.
In a kind of expansion with advantage, second passivation layer to small part is covered by the diffusion impervious layer of tantalum or tantalum/nickel alloy particularly.Interchangeable, passivation layer itself constitutes diffusion impervious layer, and method is to use a kind of material that has less diffusion constant concerning the employed metal of electric conductor under the temperature that is provided with for passivation.
In the expansion that another kind also can make up, the metal level that second passivation layer and/or diffusion impervious layer to small part is used to form high conduction value covers.This metal level for example applies by deposition (MOCVD metal organic chemical vapor deposition), vapour plating or the sputter of metallorganic.This metal is tungsten, aluminium or copper particularly.
This metal level preferably the metal by this layer, electroplate or the no current thickening by other metal of for example copper or by the metal alloy of for example copper nickel.Because the different currentless depositions of deposition velocity is particularly favourable to thin bed thickness, and electroplating deposition can shorten the process time of big bed thickness.The thickening complete closed of metal level is preferably passed through in the hole.
Change coated with solder and be connected on second of Semiconductor substrate with the electric conductor conduction according to a kind of formation.Scolder preferably applies in the mode of solder ball, and it is used for connecting circuit with so-called flip chip technology (fct).Solder ball has advantage ground and other elements in the reflux solder process, particularly other substrate produces electrical connection and mechanical connection.If scolder is arranged on the position of electric conductor, can be directly or below the intermediate layer on barrier layer coated with solder.If welding is arranged on other position at the Semiconductor substrate back side, because the metallizing layer needs wiring again.
Change according to another kind of formation, on second of Semiconductor substrate, engage other substrates, particularly wafer.Locate like this at these these other substrates, the circuit structure of other substrates of electric conductor and this is connected.
For realizing purpose at device, the circuit that has the CMOS structure according to electronic building brick of the present invention, wherein, the CMOS structure constitutes on Semiconductor substrate, and wherein with the CMOS structure at a distance of at first of Semiconductor substrate with and constitute electric conductor with connecting circuit between first relative second.
Detector preferably is connected with circuit.Just as mentioned, these detectors are light sensor particularly, can be used for the electromagnetic radiation of visible light, ultraviolet ray or X line scope.This photosensitive detector is semiconductor detector preferably.The circuit that is connected with detector is used for the signal of analyzing and testing device.The analysis of signal is meant amplification, correction, simulation or digital filtering (signal processor), the analog-to-digital conversion and/or multiplexed of all simulations or the digital processing, particularly signal of signal at this.
The inverter that the digital CMOS structure example is made up of nmos fet and pmos fet in this way.Differentiating amplifier that the analog cmos structure example is made of nmos fet and pmos fet in this way or the current mirror that constitutes by nmos fet and/or pmos fet.
The CMOS structure of circuit constitutes on Semiconductor substrate.This Semiconductor substrate preferably anisotropically forms structure by engraving method.Semiconductor substrate preferably has monocrystalline silicon, carborundum, lithium niobate or lithium tantalate, and they can adopt dry ecthing method (plasma etching) or chemical method for etching anisotropically to form structure.
With the CMOS structure apart, electric conductor constitutes with connecting circuit between first of Semiconductor substrate and with first relative second.This electric conductor also can be called conductive via structure.The CMOS structure constitutes in the so-called fore-end of manufacture process, and electric conductor constitutes in so-called back-end process.This electronic building brick at this preferably according to the said method manufacturing.
In a kind of formation with advantage, be connected with at least one main pad conduction of CMOS structure in abutting connection with the secondary pad of electric conductor.Secondary pad is used herein to the formation electric conductor, and main pad then particularly can have the side connection and the test CMOS structure of CMOS structure from Semiconductor substrate before electric conductor constitutes.
According to a kind of preferred expansion, electric conductor separates with Semiconductor substrate by diffusion impervious layer.This diffusion impervious layer advantageously stops metallic atom to be diffused in the Semiconductor substrate fully, and metallic atom may disturb the function of CMOS structure as impurity in Semiconductor substrate.
Electric conductor preferably has a plurality of layers that are made of different metal or different metal alloy.These metals or metal alloy can make each layer of chemistry, heat and electrical characteristics and abutting interface, particularly barrier layer or metal level match.
According to a kind of preferred expansion, electric conductor on the depth direction in hole at least segmentation constitute pyramid.Pyramid-shaped structures for example can produce by the wet chemical etching process.Compare with pure vertical stem etching like this, particularly can particularly cover the hole wall that is produced better with other layers with metal level.
In a kind of formation with advantage, electric conductor is in abutting connection with the conduction region of other substrates, particularly wafer, and wherein, other substrates engage with Semiconductor substrate.Conduction region for example is highly doped semiconductor region or silicon area.
According to a kind of preferred expansion, a large amount of Semiconductor substrate settings adjacent one another are.At this, each Semiconductor substrate has a large amount of electric conductors that constitute between first and second.Adjacently be arranged on this and be meant function element is not set between Semiconductor substrate, closing line particularly is not set.
Another aspect of the present invention is that the electronic building brick that will introduce previously or the method for introducing previously are used to constitute medical skill device, particularly computed tomograph, nuclear magnetic resonance device, X radiodiagnosis x device or diagnostic ultrasound equipment, pet instrument or single photon emission computed tomography radiography device.
Description of drawings
The present invention is described in detail by the embodiment of accompanying drawing below.Wherein:
Fig. 1 illustrates the constructed profile of portions of electronics assembly;
Fig. 2 illustrates the constructed profile of an embodiment part of electronic building brick;
Fig. 3 illustrates the constructed profile of etch structures on the Semiconductor substrate;
Fig. 4 illustrates the constructed profile of the etch structures of having filled metal on the Semiconductor substrate;
Fig. 5 a-Fig. 5 c illustrates the constructed profile between the process steps that is used to constitute electric conductor;
Fig. 6 a and Fig. 6 b illustrate and are used for connecting constructed profile between the process steps of embodiment of two substrates by means of electric conductor conduction;
Fig. 7 a and Fig. 7 b illustrate and are used for connecting constructed profile between the process steps of another embodiment of two substrates by means of electric conductor conduction;
Fig. 8 illustrates the constructed profile of the Semiconductor substrate embodiment with first pyramid electric conductor; And
Fig. 9 illustrates the constructed profile of the Semiconductor substrate embodiment with second pyramid electric conductor.
Embodiment
Photoelectric detector the medical treatment, safe practice imaging system in and use in the commercial Application.It is computer-tomography apparatus (CT) that the known medical skill of photodetector array is used.In computer-tomography apparatus, be provided for producing the x-ray source and the corresponding two-dimensional photodetector array of X ray with mechanical structure.This structure ring is around captured object rotation, to obtain the X line image at all anglecs of rotation with respect to wanted shot object during work.
Fig. 1 for example illustrates the constructed profile for the part of the electronic building brick of this computer-tomography apparatus (CT).This electronic building brick have with the photodetector array 80,80 of scintillator 81,81 ' optical coupled '.Scintillator 81,81 ' convert X-radiation to can pass through photodetector array 80,80 ' detection light for example is in the visible or ultraviolet scope.Photodetector array 80,80 ' be provided with and be fixed on Semiconductor substrate 10,10 ' on.Semiconductor substrate 10,10 ' for example has the silicon crystal lattice of monocrystalline.
Semiconductor substrate 10,10 ' on forming circuit CMOS structure 20,20 ', they by analog to digital converter, digital filtering or like that can analyze photodetector array 80,80 ' signal.CMOS structure 20,20 ' preferably has circuit building block simulation and/or numeral.
Semiconductor substrate 10,10 ' following setting have other circuit structure 200,200 ' other substrate 100,100 '.This substrate equally particularly has the Semiconductor substrate of other integrated CMOS structure.Interchangeable, this substrate is made up of pottery or the printed circuit board of epoxy resin have other circuit structure 200,200 '.
Semiconductor substrate 10,10 ' on constitute electric conductor 30,30 ', this electric conductor from Semiconductor substrate 10,10 ' first S1 to Semiconductor substrate 10,10 ' second S2 constitute.Electric conductor 30,30 ' this CMOS structure 20 with circuit, 20 ' with other substrate 100,100 ' other circuit structure 200,200 ' be connected.
Other substrate 100,100 ' circuit structure 200,200 ' by the welding 40,40 ' with electric conductor 30,30 ' conduction and mechanical connection.Equally can other substrate 100,100 ' below unshowned other substrate among Fig. 1 is set, wherein, (in this case) substrate 100,100 ' equally have be used for connecting circuit structure 200,200 ' electric conductor.
For by the big as far as possible detector surface of a plurality of photodetector arrays 80,80 ' obtain, to the major general have first of scintillator 81, photodetector array 80 and Semiconductor substrate 10 be provided with have scintillator 81 ', photodetector array 80 ' and Semiconductor substrate 10 ' second adjacent setting is set, and the conduction that need not to constitute cable or closing line mode between these two kinds of settings connects.Spacing d selects very for a short time at this, to consider manufacturing tolerance or temperature expansion coefficient.Spacing d is preferably less than 10 μ m, especially preferably less than 5 μ m.
Although lateral expansion is very little, this stacked what is called " accumulation " frame mode can be directly adjacent to the highdensity circuit 20,20 of photodetector array 80,80 ' formation ', 200,200 '.This point is by a large amount of electric conductors 30,30 ' obtain, and they are constituting CMOS structure 20,20 ' afterwards pack into Semiconductor substrate 10,10 ' inside.
The following example of following accompanying drawing also illustrate the electric conductor 30,30 that passes Semiconductor substrate 10,10 ' extension ' and be used to constitute this electric conductor 30,30 ' process steps after state.
Fig. 2 illustrates the thin portion of the signal profile of the Semiconductor substrate 10 with electric conductor 30.The CMOS structure 20 that only schematically illustrates has the wiring 21 of metal or silicide, and it is connected with metallization structure 23 conductions that for example have aluminium.Have dielectric 22 and 24 in addition, they prevent that as passivation layer CMOS structure, Semiconductor substrate 10 and metallization structure 23 are subjected to ectocine.
The contiguous metal of in Semiconductor substrate 10, packing into structure 23 and the electric conductor 30 that therefore is connected with its conduction.For making electric conductor 30 and Semiconductor substrate 10 insulation, utilize the dielectric 31 of silicon nitride for example or silicon dioxide to cover hole walls.Deposit for example diffusion impervious layer 32 of TaN, TaSi, TaSiN or TiN on dielectric 31, it prevents that the metallic atom of electric conductor 30 is diffused in the Semiconductor substrate 10.
On diffusion impervious layer 32, apply the thin metal layer 33 that for example contains copper, wherein, prevent that by diffusion impervious layer 32 copper atom is diffused in the Semiconductor substrate 10.Apply thin metal layer 33 by material vapour plating (PVD), sputter or the deposition (MOCVD) by metallorganic in chilling process.
If Alloy instead of Copper is used not obvious other material to Semiconductor substrate 10 diffusions, also can remove diffusion impervious layer 32 and thin metal layer 33 directly is coated on the dielectric 31.Can use the layer that preferably has radium, palladium, tungsten, aluminium, titanium and/or copper as metal level 33.
In the embodiment of Fig. 2, fill by metal 34 in the hole, method be for example with copper or gold is electroplated or currentless deposition on the thin metal layer 33 of thickness 200 μ m-1000 μ m.Do not need the zone of coating in plating, to cover by lacquer or film.On electric conductor 30, also apply and be used for the solder ball 35 that flip-chip is installed, it for example in solder reflow process, produce with other substrates 100 on being connected of other conductors.In the embodiment shown in Figure 2,36 solder ball 35 is arranged on the position different with the hole of Semiconductor substrate 10 by passing connecting up again of metal level 33,34, wherein, solder ball 35 is used for the position that flip-chip installs and is optimized.
Fig. 3 schematically illustrates and is used for having crystal orientation＜100〉Semiconductor substrate 10 on constitute the preferred embodiment in hole.On the one side of Semiconductor substrate 10, apply the alternately mask of sequence with nitride layer and oxide skin(coating).Be depicted as Si 3N 4Layer 301, SiO 2Layer 302 and another Si 3N 4Layer 303.The window interior of this mask with the structure wet-chemical etch in the Semiconductor substrate 10, this structure constitutes the sidewall of 54.7 ° of angles.For example use potassium hydroxide, choline or tetramethylammonium hydrogen-oxygen for carrying out wet chemical etching.
Etch into to this structure wet-chemical degree of depth w 0Then carry out plasma dry etch (ICP, inductively coupled plasma) and reach degree of depth w 1, wherein, shown in Fig. 3 dotted line, the pre-etched structure of wet-chemical structurally remains on degree of depth w substantially 1On.Can on this degree of depth in hole, utilize diffusion impervious layer 32 or metal level 33 covering wall better like this.According to Fig. 1,, need not mandatory requirement so and further handle first with CMOS structure 20 if this structure begins etching from second S2 relative with first S1 with CMOS structure.
Fig. 4 illustrates another embodiment, and wherein, the pure taper in hole etches in the Semiconductor substrate.This point particularly has advantage under the situation of film, semiconductor substrate 10, because the width in hole depends on the thickness of Semiconductor substrate 10.The filler 340 of electroplating deposition gold on metal level 33.The deposition of gold thing utilizes the electrically conductive barrier 341 of TiCu to cover, to prevent the material generation chemical reaction of gold and solder ball 35.
Fig. 5 a-5c illustrates a plurality of process steps that are used to connect electric conductor 30.In this embodiment, etching semiconductor substrate 10 constitutes the hole of first S1 of CMOS structure.At first on having the face S1 of CMOS structure 20, pitting is carved in the front end passivation 22, so that after applying the etching mask that stops to coat with lacquer, resist dried agent or low temperature silicon nitride or silicon dioxide mask to form by scolder, protect front end pad 21 (main pad) and CMOS structures 20.Then arrive and determine the degree of depth by plasma dry etch process (ICP) structuring access structure.Proceed to the degree of depth w of at least 250 μ m in the Semiconductor substrate 10 according to Fig. 5 a etching 2, preferred 300 μ m.
Inside, hole is coated in passivation layer 220 on the hole wall after pitting is carved, and this passivation layer can have diffusion impervious layer in addition when needed.Passivation layer 220 has for example PECVD nitride layer, PECVD oxide skin(coating) or other dielectric layer or Parylene for this reason.As long as will be used for Seed Layer 330 as copper or golden this metal, the diffusion impervious layer of unshowned for example TiN or TaN among also necessary deposition Fig. 5 a-5c is to prevent that copper or gold diffusion are in the silicon of Semiconductor substrate 10.This diffusion impervious layer has advantage ground at this and has layer thickness between 10 to 100nm.
Then, be also referred to as metal seed layer at the long-pending metal level 330 that for example has aluminium, gold, copper or tungsten of inner hole deposition.This is deposited on this and is undertaken by physics or chemical deposition.This thin metal layer is subsequently by electroplating (Cu, Ni, Au) or 340 thickenings of no current (Ni, Cu) plated metal, have advantage be the hole local at least at this, preferably fill with metal 340 fully.If the hole of local filling vias only, passivation has the metal 330,340 of PECVD nitride layer, PECVD oxide skin(coating) or other dielectric or Parylene so at first again.If but this step then can be cancelled in the hole of complete filling path.
Then open the passivation layer 220 that leads to front end pad (main pad) 21 and continue the metal level 210 of the metallized plane that deposition for example is made up of aluminium, gold, copper or tungsten through chemistry or physical etch process.Utilize this metal level 210 that front end pad 21 is connected with metal level 330,340 conductions of electric conductor 30.
The rear end metal pad 213 of configuration example as being made up of aluminium, copper, tungsten or gold on metal level 330,340, wherein, rear end metal pad 213 also can be called secondary pad.Then with rear end passivation layer 221 coverings of rear end metal pad 213 and metal level 210 by for example forming by PECVD oxide or silicon nitride or polyimides or polybenzoxazoles dielectric.
Then the wafer that will have a Semiconductor substrate 10 by chemico-mechanical polishing (CMP) is thinned to thickness 250 μ m+/-30 μ m of lines CMP shown in the dotted line among Fig. 5 b, thus the path of electric conductor 30 formations from first S1 of Semiconductor substrate 10 to second relative S2 with CMOS structure.Can be connected by the metal 330,340 of process of lapping electric conductor 30 again.
Carry out the backside processesization of 10 second S2 of Semiconductor substrate, method is at first second S2 of Semiconductor substrate for example to be utilized passivated dielectric medium and it is opened by lithoprinting mask etching process in the zone of electric conductor 30.On this second relative S2 of Semiconductor substrate 10, by means of thin film metallized coating be used for connecting up again in the back side and soldering, for example have a thin metal layer 336 of copper, nickel and/or gold.At this, on the printed conductor 336 that is used for connecting up again, apply passivation layer 360 again, wherein, in order in pad area, to remove passivation layer 360 again with scolder 35 solderings.
If the wiring again on the cancellation back side, carry out and also coated with solder 35 in the same area the metallization of 10 second S2 of Semiconductor substrate part in the zone of electric conductor 30 so.
Fig. 6 a and Fig. 6 b illustrate an alternative embodiment of the invention, wherein wafer joined on the Semiconductor substrate 10, and in the embodiment of Fig. 6 a and 6b first silicon substrate 10.In Fig. 6 a, after being coated in passivation layer 220 on the hole wall, with Semiconductor substrate 10 chemico-mechanical polishings (CMP) to the thickness shown in the dotted line.Then go up the wafer that joint particularly has second monocrystalline substrate 1010 at the burnishing surface (S2) of Semiconductor substrate 10.On this second monocrystalline substrate 1010, formation has the dopant areas 1030 of high dopant on the position of the inner contact metal layer 3300 in hole, so that can connect second silicon substrate 1010 low ohmly.
Fig. 7 a and 7b schematically illustrate another embodiment in the process status, wherein, only wafer with just passivation layer 2200 is coated on the hole wall after second silicon substrate 1010 engages.Then, the bottom 2201 in hole is exposed and thin metal layer 3310 is inserted in the hole from passivation layer by etching step, and the highly doped wiring semiconductor region of this layer and second silicon substrate 1010 is in abutting connection with to be used for low ohm the contact.As replacement, can on wafer, have metal guide rail in order to contact also to high doping semiconductor district 1030.
Fig. 8 is illustrated in the hole of using metal 331,341 to fill before the process steps of chemico-mechanical polishing.Fig. 9 is illustrated in the hole of using metal 332,342 to fill before the chemico-mechanical polishing equally.Metal 331,341 or 332,342 insulate with Semiconductor substrate 10 by passivation layer 2210 or 2220.Metal 331,341 or 332,342 forms electric conductor 30 in two embodiment of Fig. 8 and 9.The pyramid in hole or conical structure are undertaken by the plasma dry etch method that the etching angle changes between 60 ° and 90 °.
The structure that Fig. 9 illustrates electric conductor 30 in this regard by the etching angle cause after cut situation.
These embodiment can improve the metallization that utilizes 331,341 or 332,342 pairs of holes of metal.On the back side that deviates from the CMOS structure directly under the situation of contact pad, change for the enforcement of cutting after having, dry ecthing can process be used to constitute the hole of pad metal layer more reliably.
Fig. 8 and 9 embodiment have advantage ground also can be changed like this, from two sides etching semiconductor substrate 10 to constitute the hole.

Claims (26)

1. be used to make the method for electronic building brick, wherein:
-on Semiconductor substrate (10,10 '), be configured for forming the CMOS structure (20,20 ') of circuit;
-constitute CMOS structure (20,20 ') afterwards in chilling process, particularly under less than 450 ℃ temperature in the hole with at least one electric conductor (30,30 ') Semiconductor substrate of packing into (10,10 '), make to constitute electric conductor (30,30 ') between first (S1) of Semiconductor substrate (10,10 ') and second (S2) relative and be used for connecting circuit with first (S1).
2. by the described method of claim 1, wherein, described detector (80,80 ') is connected with CMOS structure (20,20 ').
3. by claim 1 or 2 described methods, wherein:
-go up formation CMOS structure (20,20 ') at first (S1) of Semiconductor substrate (10,10 '),
-on first (S1) of Semiconductor substrate (10,10 '), be configured for contacting the main pad (21) of this face (S1), and
-upward constitute secondary pad (213) at first (S1) of Semiconductor substrate (10,10 ') in abutting connection with at least one electric conductor (30,30 ').
4. by the described method of claim 3, wherein, on a metallized plane of the metallized plane of described circuit, constitute secondary pad (213).
5. by one of claim 3 or 4 described method, wherein, secondary pad (213) is connected with at least one main pad (21) conduction.
6. by the described method of one of aforesaid right requirement, wherein:
-CMOS structure (20,20 ') is covered by first passivation layer (22,220,2200,2210), and
First passivation layer (22,220,2200,2210) is removed with contact electric conductor (30,30 ') in-part.
7. by the described method of one of aforesaid right requirement, wherein, constituting CMOS structure (20,20 ') etching semiconductor substrate (10,10 ') afterwards for constituting the hole.
8. by the described method of claim 7, wherein, the described small part wet-chemical ground that is etched to carries out.
9. by claim 7 or 8 described methods, wherein, the described small part that is etched to is as plasma etching, particularly with pre-etched combination of wet-chemical under carry out.
10. by each described method in the claim 7 to 9, wherein, etching is carried out from first (S1) of Semiconductor substrate (10,10 ').
11. by claim 7 or 8 described methods, wherein, etching is carried out from second (S2) of Semiconductor substrate (10,10 ').
12., wherein, pass through second passivation layer (31), particularly nitride or oxide covering wall and hole after the described etching by each described method in the claim 7 to 11.
13. by the described method of claim 12, wherein, second passivation layer (31) is covered by diffusion impervious layer (32), particularly tantalum or tantalum/nickel to small part, perhaps itself constitutes diffusion impervious layer.
14. by claim 12 or 13 described methods, wherein, second passivation layer (31) and/or diffusion impervious layer (32) to small part is covered by the layer (33,330,331,332,336) that has metal, particularly has tungsten, aluminium or copper.
15. by the described method of claim 14, wherein, described metal with layer (33,330,331,332,336) of metal by this layer by other metals, particularly copper, is perhaps electroplated ground or the thickening of no current ground by metal alloy, particularly copper/nickel.
16., wherein, go up coated with solder (35) at second (S2) of Semiconductor substrate (10,10 ') and also this scolder be connected with electric conductor (30,30 ') conduction by the described method of one of aforesaid right requirement.
17., wherein, go up joint other substrates (1010) at second (S2) of Semiconductor substrate (10,10 ') by each described method in the claim 1 to 15.
18. an electronic building brick,
-have a circuit that comprises CMOS structure (20,20 '),
-wherein, the CMOS structure of this circuit (20,20 ') goes up in Semiconductor substrate (10,10 ') and constitutes,
-wherein, between first (S1) of Semiconductor substrate (10,10 ') and second (S2) relative, constitute electric conductor (30,30 ') at a distance of ground with CMOS structure (20,20 ') and be used for connecting circuit with first (S1).
19. by the described electronic building brick of claim 18, wherein, described circuit and detector (80,80 ') are connected and are used for the signal of analyzing and testing device (80,80 ').
20. by claim 18 or 19 described electronic building bricks, wherein, secondary pad (213) is connected in abutting connection with described electric conductor (30,30 ') and with at least one main pad (21) conduction of CMOS structure (20,20 ').
21. by each described electronic building brick in the claim 18 to 20, wherein, described electric conductor (30,30 ') separates with Semiconductor substrate (10,10 ') by diffusion impervious layer (32).
22. by each described electronic building brick in the claim 18 to 21, wherein, described electric conductor (30,30 ') has a plurality of layers (33,330,331,332,336,3310,34,340,341,342) that are made of different metal or different metal alloy.
23. by each described electronic building brick in the claim 18 to 22, wherein, described electric conductor (30,30 ') constitutes pyramid in the piecewise at least.
24. by each described electronic building brick in the claim 18 to 23, wherein, electric conductor (30,30 ') is in abutting connection with the conduction region (1030) of other substrates (1010), wherein, these other substrates (1010) engage with described Semiconductor substrate (10,10 ').
25., wherein, have a plurality of Semiconductor substrate (10,10 ') setting adjacent one another are of a plurality of electric conductors (30,30 ') that between first (S1) and second (S2), constitute by each described electronic building brick in the claim 18 to 24.
26. one kind by the application when constituting medical skill device, particularly computer-tomography apparatus, nuclear magnetic resonance device, X radiodiagnosis x device, diagnostic ultrasound equipment, pet device or single photon emission computed tomography radiography device of the described electronic building brick of one of aforesaid right requirement or method.
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US5618752A (en) * 1995-06-05 1997-04-08 Harris Corporation Method of fabrication of surface mountable integrated circuits
FR2765398B1 (en) * 1997-06-25 1999-07-30 Commissariat Energie Atomique STRUCTURE WITH MICROELECTRONIC COMPONENT IN SEMICONDUCTOR MATERIAL DIFFICULT OF ENGRAVING AND WITH METAL HOLES
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