CN1885059A - Microelectronic standard matter preparing technology - Google Patents
Microelectronic standard matter preparing technology Download PDFInfo
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- CN1885059A CN1885059A CN 200610019600 CN200610019600A CN1885059A CN 1885059 A CN1885059 A CN 1885059A CN 200610019600 CN200610019600 CN 200610019600 CN 200610019600 A CN200610019600 A CN 200610019600A CN 1885059 A CN1885059 A CN 1885059A
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Abstract
The invention relates to a micro electric standard material preparing technique, which comprises: multi-channel abundant measure technique and auxiliary hardware error eliminate technique. The invention has the advantages that: the micro electric amount indeterminacy of prepared micro electric standard material is lower than 2%; and the micro electric standard material and relative value can be used to transmit the integrated circuit tester, to correct, compare and check. The invention can confirm the accuracy and micro electric amount measurement, and confirm the quality and reliability.
Description
Technical field
The present invention relates to radio, microelectronics, integrated circuit field of measuring techniques, specifically a kind of method of carrying out this technical field measurement verification that provides promptly is used for the microelectronic standard matter preparing technology of microelectronics magnitude tracing, transmission, metering, calibrating, calibration and comparison.
Background technology
Integrated circuit testing is to grow up on the basis of computing machine and integrated circuit, is again simultaneously the high-tech area of computing machine and integrated circuit service.Integrated circuit test system is to carry out verifying design of integrated circuit, production test, admission screening, fail-safe analysis, failure analysis, guarantees the special test equipment of integrated circuit q﹠r.The accuracy of integrated circuit testing value is the key that guarantees the integrated circuit q﹠r.The integrated circuit test system measurement verification is to guarantee integrated circuit testing value effective way accurately and reliably.The integrated circuit test system measurement and examination method is the key issue that realizes the integrated circuit test system measurement verification.
The method of microelectronics magnitude tracing, transmission and approach are to hinder the key issue that microelectronics metering, calibrating, calibration and comparison work are carried out always.Owing to do not have feasible microelectronics magnitude tracing, the method and the approach of transmission, cause that microelectronic integrated circuit test macro value can not be traced to the source, value measures inaccurately, had a strong impact on the q﹠r of integrated circuit and electronic equipment.
Standard substance is the good approach that realizes magnitude tracing and transmission.But, never find the better method and the approach that prepare microelectronic standard matter.According to traditional technology, generally be through special circuit design, preparation circuit mask, the research technology, the integrated circuit production line flow, a whole set of integrated circuit (IC) design production procedures such as microelectronics value definite value are carried out in silicon chip cutting encapsulation.Because the standard substance consumption is little, so this method cost is very high, can't guarantee can be met at last uncertain required standard material.
Summary of the invention
The present invention seeks to seek a kind of approach, method and measure of truly feasible preparation microelectronic standard matter, to realize microelectronics, integrated circuit measurement verification.On existing universal integrated circuit basis, select the characteristic value by a whole set of test, measurement, analytical approach and technical measures and satisfy the integrated circuit of determining requirement scarcely, thereby realize that preparation meets the microelectronic standard matter of microelectronics magnitude tracing, transmission, metering, calibrating, calibration and comparison requirement.
Microelectronic standard matter preparing technology scheme of the present invention is achieved in that
1, preparation approach, method and measure
This technology is selected the parameter value by certain means and method and is satisfied integrated circuit that degree of certainty scarcely requires and it is carried out definite value from existing integrated circuit, thereby realizes the microelectronic standard matter preparation.Microelectronic standard matter preparation method flow process as shown in Figure 1.
Carry out the homogeneity examination by three temperature (high temperature, low temperature, normal temperature) detection.Tested print is tested under temperature (high temperature, low temperature, the normal temperature) condition of print regulation, and the characterisitic parameter value all should be within the range of uncertainty of regulation.
Stability assessment is carried out in check by aging test and specific time interval.Tested print is through static-aging, dynamic aging, temperature shock, leak test under the environment provided condition; Carry out one-shot measurement and check bimester of per; The characterisitic parameter value is continuous all should be within the range of uncertainty of regulation more than six times.
Utilize integrated circuit test system (correlation technique indexs such as Measurement Resolution, precision meet certain requirements), the utilization hyperchannel holds surplus measuring technique, ancillary hardware error concealment technology, and the microelectronic standard matter parameter is measured and definite value.
2, hyperchannel holds surplus measuring technique
Because modern integrated circuits test system and test resource/instrument all is Per-pin structure (the every passage of resource has) or multichannel structure, the essence that hyperchannel holds surplus measuring technique is exactly to adopt the technology of hyperchannel or certain parameter of many instrument duplicate measurements.Checking measurements result's thus dispersiveness.
3, ancillary hardware error concealment technology
In common integrated circuit test system calibration, be that value is metered on the test system channels end (being pogo pin).In the middle of actual measurement, device pin can not directly be received channel end, and needs to be connected with channel end by device clamp (DUT plate), test ancillary hardware (load plate) again.The test ancillary hardware is bridge and the tie that testing apparatus is connected with tested print.It is made up of test interface plate and test fixture.It is one of main source of integrated circuit measuring error.
Test ancillary hardware error concealment technology is that the test ancillary hardware is calibrated together with testing apparatus, value is metered into device clamp, and will test the error that ancillary hardware introduces and measure and store, in actual microelectronics parameter measurement process, revise according to error automatically by testing apparatus.
The advantage of microelectronic standard matter preparing technology of the present invention is:
Utilize microelectronic standard matter microelectronics value uncertainty that the present invention prepares less than 2%, utilize microelectronic standard matter and value thereof to carry out:
(1) the integrated circuit testing equipment amount of carrying out is passed, play the effect of testing apparatus calibration, comparison and calibrating.
(2), play the effect of integrated circuit calibration, comparison and calibrating to passing with the adhesive integrated circuit amount of carrying out.
(3) technological means and the method problem of solution microelectronics magnitude tracing.
(4) establish the technical foundation of setting up defence and military microelectronics magnitude tracing system.
(5) guarantee the measurement of defence and military microelectronics value accurately and reliably.
(6) guarantee the q﹠r of the integrated circuit that armament systems use.
Description of drawings
Fig. 1: microelectronic standard matter preparation method flow process.
Fig. 2: hyperchannel holds surplus measuring technique principle
Fig. 3: microelectronic standard matter is measured valued methods
Fig. 4: the method for microelectronics magnitude tracing and principle
Embodiment
The microelectronic standard matter preparation comprises following 13 aspects: the affirmation of (1) starting material (type of device); (2) buying; (3) temporary mark; (4) three temperature detect; (5) aging (static state and dynamic aging, temperature shock); (6) leak detection; (7) normal temperature detects; (8) parameter is determined; (9) definite value; (10) name and packing (sign); (11) application deciding grade and level; (12) deciding grade and level is identified; (13) examine (issuing licence).Microelectronic standard matter preparation method flow process as shown in Figure 1.
Concrete preparation method is as follows:
1, determines the integrated circuit model, implement buying
The integrated circuit model determines that principle is: integrate circuit function is simple, small scale, generally adopts simple function device on a small scale, as gate circuit, and amplifier etc.Process stabilizing, as: integrated circuit fabrication process such as TTL, CMOS.Device is general and turnout is big, as: 74,54 circuit etc.The device buying should guarantee that device is the original product of internationally famous producer, and the date of manufacture is in 24 months.
2, integrated circuit is carried out temporary mark
Each sheet integrated circuit is set up technology files, comprise: call number; Device model, title, function, technology; Manufacturer, place, date; Measure number of times, result, date etc.Stick adhesive sticker and indicate call number at device surface.
3, determine characteristic parameter and uncertainty grade
Determine required properties of integrated circuit parameter according to application requirements, as: Vil, Vih, TPDHL, TPDLH etc.Determine the uncertainty index according to application requirements, as: 2%, 3% etc.
4, low-temperature measurement, and estimate uncertainty
The utilization hyperchannel holds surplus measuring technique and ancillary hardware error concealment technology, uses the integrated circuit test system of certain measuring accuracy and resolution, according to country's (or national defence) highest measurement standard of characteristic parameter, measures under the cryogenic conditions of regulation.The temperature conditions of regulation is the minimum operating temperature that indicates in the device description book, is about to measured device and places the temperature environment of requirement, keeps temperature to measure later in 30 minutes.Estimate uncertainty according to measuring accuracy and resolution.
5, high temperature measurement, and estimate uncertainty
The utilization hyperchannel holds surplus measuring technique and ancillary hardware error concealment technology, uses the integrated circuit test system of certain measuring accuracy and resolution, according to country's (or national defence) highest measurement standard of characteristic parameter, measures under the hot conditions of regulation.The temperature conditions of regulation is the maximum operating temperature of indicating in the device description book, is about to measured device and places the temperature environment of requirement, keeps temperature to measure later in 30 minutes.Estimate uncertainty according to measuring accuracy and resolution.
6, normal temperature is measured, and estimates uncertainty
The utilization hyperchannel holds surplus measuring technique and ancillary hardware error concealment technology, use the integrated circuit test system of certain measuring accuracy and resolution, according to country's (or national defence) highest measurement standard of characteristic parameter, under normal temperature (being generally 25 ℃) condition, measure.Measured device is placed normal temperature environment, keep temperature to measure later in 30 minutes.Estimate uncertainty according to measuring accuracy and resolution.
7, uncertainty is differentiated
If the characteristic parameter measurement in 4,5,6 satisfies the device that the homogeneity examination requires, then change following stability assessment over to.If do not satisfy the device that uncertainty requires, then stop to carry out and rejecting.
8, normal temperature storage is two months
By the device of homogeneity examination, under normal temperature (being generally 25 ℃) condition, store two months.Should be stored in the environment of ventilation, drying, cool place, no strong electromagnetic.
9, dynamic aging
The application integrated circuit dynamic burn-in systems is according to digestion time, the temperature of aging standard (country or the national defence) regulation of device dynamic and apply regulated procedure and carry out dynamic aging.
10, static-aging
(temperature range should be greater than the maximum storage temperature of this device to use high-temperature test chamber, working volume should be guaranteed air proper flow in the case), device is placed chamber, carry out dynamic aging according to digestion time, the temperature of device static-aging standard (country or national defence) regulation.
11, temperature shock
The high and low temperature impact test case of application continuum (one case method or two casees methods all can) carries out temperature shock test according to attack time, temperature, the cycle index of device temperature normal of impact (country or national defence) regulation.
12, the test of stopping leakage in the roof
According to the device regulation of test standard (country or the national defence) test of stopping leakage in the roof of stopping leakage in the roof.
13, normal temperature detects, and estimates uncertainty
The utilization hyperchannel holds surplus measuring technique and ancillary hardware error concealment technology, use the integrated circuit test system of certain measuring accuracy and resolution, according to country's (or national defence) highest measurement standard of characteristic parameter, under normal temperature (being generally 25 ℃) condition, measure.Measured device is placed normal temperature environment, keep temperature to measure later in 30 minutes.Estimate uncertainty according to measuring accuracy and resolution.
14, uncertainty is differentiated
If the value uncertainty of measurement satisfies stable uncertainty requirement, then repeated for 8 to 13 steps more than N time (N is the positive integer more than or equal to 6).If do not satisfy the device that uncertainty requires, then stop to carry out and rejecting.If satisfy after the N step requirement, then change the following measurement definite value stage over to.
15, definite value is measured
The utilization hyperchannel holds surplus measuring technique and ancillary hardware error concealment technology, use the integrated circuit test system of certain measuring accuracy and resolution, according to country's (or national defence) highest measurement standard of characteristic parameter, under normal temperature (being generally 25 ℃) condition, measure.Measured device is placed normal temperature environment, keep temperature to measure later in 30 minutes.Estimate uncertainty according to measuring accuracy and resolution.
16, examine
Research institute files an application by microelectronic standard matter, and measuring control mechanism is responsible for the tissue deciding grade and level and identifies, examines, provides unified numbering, issues certificate and external the announcement.
17, sign
Cancellation temporary mark, printing or printing permanent identification.The sign content comprises: standard substance title, unified numbering etc.The retinue file comprises: standard substance title, unified numbering, certificate, parameter title, definite value report etc.
18, use
The standard substance of approval, issue is responsible for providing use by measurement technology mechanism (microelectronic standard matter research institute).
Claims (1)
1, a kind of microelectronic standard matter preparing technology is characterized in that:
1. prepare approach, method and measure: this technology is selected the parameter value by certain means and method and is satisfied integrated circuit that degree of certainty scarcely requires and it is carried out definite value from existing integrated circuit, thereby realize the microelectronic standard matter preparation, by three temperature, be high temperature, low temperature, normal temperature detects and carries out the homogeneity examination, tested print is in the temperature of print regulation, be high temperature, low temperature, test under the normal temperature condition, the characterisitic parameter value all should be within the range of uncertainty of regulation, stability assessment is carried out in check by aging test and specific time interval, and tested print is through the static-aging under the environment provided condition, dynamic aging, temperature shock, leak test; Carry out one-shot measurement and check bimester of per; The characterisitic parameter value is continuous all should to utilize integrated circuit test system more than six times within the range of uncertainty of regulation, the utilization hyperchannel holds surplus measuring technique, ancillary hardware error concealment technology, and the microelectronic standard matter parameter is measured and definite value;
2. hyperchannel holds surplus measuring technique: because modern integrated circuits test system and test resource/instrument all is Per-pin structure or multichannel structure, the essence that hyperchannel holds surplus measuring technique is exactly to adopt the technology of hyperchannel or certain parameter of many instrument duplicate measurements, checking measurements result's thus dispersiveness;
3. ancillary hardware error concealment technology: in common integrated circuit test system calibration, be that value is metered on the test system channels end, in the middle of actual measurement, device pin can not directly be received channel end, and need pass through device clamp, the test ancillary hardware is connected with channel end again, the test ancillary hardware is bridge and the tie that testing apparatus is connected with tested print, it is made up of test interface plate and test fixture, it is one of main source of integrated circuit measuring error, test ancillary hardware error concealment technology is that the test ancillary hardware is calibrated together with testing apparatus, value is metered into device clamp, and will test the error that ancillary hardware introduces and measure and store, in actual microelectronics parameter measurement process, revise according to error automatically by testing apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100196008A CN100419452C (en) | 2006-07-11 | 2006-07-11 | Microelectronic standard matter preparing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100196008A CN100419452C (en) | 2006-07-11 | 2006-07-11 | Microelectronic standard matter preparing technology |
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| Publication Number | Publication Date |
|---|---|
| CN1885059A true CN1885059A (en) | 2006-12-27 |
| CN100419452C CN100419452C (en) | 2008-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100196008A Expired - Fee Related CN100419452C (en) | 2006-07-11 | 2006-07-11 | Microelectronic standard matter preparing technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104535950A (en) * | 2014-12-19 | 2015-04-22 | 中国船舶重工集团公司第七0九研究所 | Multi-channel symmetric calibration method of integrated circuit testing system and interface switching device of integrated circuit testing system |
| CN106782667A (en) * | 2016-11-11 | 2017-05-31 | 上海航天测控通信研究所 | Flouride-resistani acid phesphatase grid oxygen punctures ageing test apparatus and method after the programming of type prom memory |
| CN107329103A (en) * | 2017-08-18 | 2017-11-07 | 中国电子技术标准化研究院 | Integrated circuit test system Time Transmission standard group and its method of testing |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85108326A (en) * | 1984-11-20 | 1986-12-03 | 得克萨斯仪器公司 | The very lagre scale integrated circuit (VLSIC) that self-testing capability is arranged |
| US5510721A (en) * | 1994-12-19 | 1996-04-23 | Ford Motor Company | Method and adjustment for known good die testing using resilient conductive straps |
| KR100187727B1 (en) * | 1996-02-29 | 1999-06-01 | 윤종용 | Contact checking apparatus for handler and ic test system having checker thereof |
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2006
- 2006-07-11 CN CNB2006100196008A patent/CN100419452C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104535950A (en) * | 2014-12-19 | 2015-04-22 | 中国船舶重工集团公司第七0九研究所 | Multi-channel symmetric calibration method of integrated circuit testing system and interface switching device of integrated circuit testing system |
| CN106782667A (en) * | 2016-11-11 | 2017-05-31 | 上海航天测控通信研究所 | Flouride-resistani acid phesphatase grid oxygen punctures ageing test apparatus and method after the programming of type prom memory |
| CN106782667B (en) * | 2016-11-11 | 2020-06-30 | 上海航天测控通信研究所 | Anti-irradiation gate oxide breakdown type PROM memory post-programming aging test device and method |
| CN107329103A (en) * | 2017-08-18 | 2017-11-07 | 中国电子技术标准化研究院 | Integrated circuit test system Time Transmission standard group and its method of testing |
| CN107329103B (en) * | 2017-08-18 | 2023-09-19 | 中国电子技术标准化研究院 | Time transfer standard set of integrated circuit test system and test method thereof |
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| Publication number | Publication date |
|---|---|
| CN100419452C (en) | 2008-09-17 |
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