CN1865505A - Acidwash solution for copper and copper alloy - Google Patents
Acidwash solution for copper and copper alloy Download PDFInfo
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- CN1865505A CN1865505A CN 200610091476 CN200610091476A CN1865505A CN 1865505 A CN1865505 A CN 1865505A CN 200610091476 CN200610091476 CN 200610091476 CN 200610091476 A CN200610091476 A CN 200610091476A CN 1865505 A CN1865505 A CN 1865505A
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- copper
- copper alloy
- acidwash solution
- inhibiter
- complexing agent
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Abstract
The invention discloses an acid cleaning solution of copper and copper alloy in the chemical disposal domain, which comprises the following parts: cleaning agent, complex builder and inhibitor. The invention removes natural and heat-disposal oxide film completely to avoid the over-erosion and black surface phenomena with stable washing quality, whose product percent of pass reaches over 99.98 percent.
Description
Technical field:
The invention belongs to the chemical treatment field, relate to the Acidwash solution of a kind of copper and copper alloy specifically.
Background technology:
Copper and copper alloy products are in the course of processing, particularly carry out the copper and the copper alloy products of Overheating Treatment, in order to guarantee the attractive in appearance of copper and copper alloy products outward appearance and to satisfy the requirement of processing such as follow-up welding, need carry out pickling to copper and copper alloy products and remove the oxide film that nature and thermal treatment generate.At present; usually still adopt traditional cleanup acid treatment method to be: sulfuric acid and ammonium nitrate mixing solutions; perhaps sulfuric acid and nitric acid mixing solutions carry out cleanup acid treatment; though also can play pickling effectiveness; but have the following disadvantages; in treating processes, produce a large amount of tobacco; time weakness reason is unclean; treatment time length then produces excessive erosion; and can cause the pollution of copper and copper alloy products, surface blackening can not reach thorough removing oxide film; and the requirement that keeps the surface to be cleaned light, influence the outward appearance of goods and the quality of following process.
Summary of the invention:
A kind of copper formed by clean-out system, complexing agent, inhibiter and the Acidwash solution of copper alloy products have been the purpose of this invention is to provide, to overcome above-mentioned deficiency.
The objective of the invention is to realize by following technical scheme:
The Acidwash solution of a kind of copper and copper alloy, its characteristics are: it is the Acidwash solution that clean-out system, complexing agent, inhibiter with following ratio are made,
Clean-out system is meant sulfuric acid 350-450ml, nitric acid 30-40ml;
Complexing agent is meant ammonium chloride 8-12g/L;
Inhibiter is meant benzotriazole 5-10g/L;
During use, the above-mentioned raw materials water is mixed with Acidwash solution, scavenging period is 0.25-2min, and room temperature is carried out cleanup acid treatment.
Adopt Acidwash solution of the present invention can thoroughly remove nature and thermal treatment generation oxide film, and keep the surface to be cleaned light, avoided the generation of excessive erosion and surface blackening phenomenon simultaneously.Copper after the pickling and copper alloy products surface-brightening, No oxided film presents the metalluster of copper, and cleaning quality is stable, and product percent of pass reaches more than 99.98%.
Technical scheme of the present invention: the Acidwash solution of a kind of copper and copper alloy products, wherein contain clean-out system, complexing agent, inhibiter.The Acidwash solution of preparation is by clean-out system technical pure sulfuric acid 350～450ml/L, technical pure nitric acid 30～40ml/L; Complexing agent technical pure ammonium chloride 8～12g/L; Inhibiter technical pure benzotriazole 5～10g/L; Water is mended to 1L and is formed.Room temperature is carried out cleanup acid treatment, and scavenging period is 0.25～2min.
The effect in solution of sulfuric acid and nitric acid is and the patina on copper and copper alloy products surface and the oxide film reaction natural, that thermal treatment generates, cleans patina and oxide film.But, excessive erosion takes place when simple sulfuric acid and nitric acid will make copper and copper alloy products surface cleaning, add the inhibiter benzotriazole can prevent the excessive erosion phenomenon generation, and improve surface brightness after copper and the copper alloy products pickling.During pickling, in solution, generate a large amount of Cu
2+Ion, and copper and copper alloy products surface are activated, add complexing agent ammonium chloride, contain NH in the ammonium chloride
+The Cu of ion in both can complex solution
2+Ion can be eliminated the activation phenomenon of product surface again, makes the goods can be because of airborne O after cleaning is finished
2Existence and reoxidation takes place, cause the generation of copper and copper alloy products surface stain phenomenon.
The invention will be further described below in conjunction with embodiment:
Embodiment:
Embodiment 1:
The pickling of red copper system serpentine tube.Prepare 500L pickling cleaning solution in following ratio: technical pure sulfuric acid 400ml/L, technical pure nitric acid 35ml/L; Complexing agent technical pure ammonium chloride 10g/L; Inhibiter technical pure benzotriazole 6g/L; The water preparation.
Carry out the immersion type cleanup acid treatment at ambient temperature, scavenging period is 1min.
Red copper system serpentine tube annealing rear surface has serious oxide skin, just can carry out follow-up welding job after need cleaning up.Red copper system serpentine tube after the annealing of cleaning by above-mentioned Acidwash solution and method, surface-brightening, non-scale presents the metalluster of copper, and cleaning quality is stablized, and product percent of pass reaches more than 99.98%.
Embodiment 2:
The pickling of brass ware.Prepare 500L pickling cleaning solution in following ratio: technical pure sulfuric acid 360ml/L, technical pure nitric acid 30ml/L; Complexing agent technical pure ammonium chloride 8g/L; Inhibiter technical pure benzotriazole 5g/L; The water preparation.
Carry out the immersion type cleanup acid treatment at ambient temperature, scavenging period is 0.5min.
Brass ware mainly is oxide film and the patina that nature generates to cleaning object.The 800mm * 300mm with a plurality of holes * 3mm sheet brass by above-mentioned Acidwash solution and method are cleaned cleans the rear surface light, and No oxided film presents the metalluster of copper, and cleaning quality is stable, and product percent of pass reaches more than 99.98%.
Claims (1)
1, the Acidwash solution of a kind of copper and copper alloy is characterized in that: it is the Acidwash solution that clean-out system, complexing agent, inhibiter with following ratio are made,
Clean-out system is meant sulfuric acid 350-450ml, nitric acid 30-40ml;
Complexing agent is meant ammonium chloride 8-12g/L;
Inhibiter is meant benzotriazole 5-10g/L;
During use, the above-mentioned raw materials water is mixed with Acidwash solution, scavenging period is 0.25-2min, and room temperature is carried out cleanup acid treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100914766A CN100383284C (en) | 2006-06-14 | 2006-06-14 | Acidwash solution for copper and copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100914766A CN100383284C (en) | 2006-06-14 | 2006-06-14 | Acidwash solution for copper and copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1865505A true CN1865505A (en) | 2006-11-22 |
| CN100383284C CN100383284C (en) | 2008-04-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100914766A Active CN100383284C (en) | 2006-06-14 | 2006-06-14 | Acidwash solution for copper and copper alloy |
Country Status (1)
| Country | Link |
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| CN (1) | CN100383284C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103060828A (en) * | 2013-02-04 | 2013-04-24 | 北京蓝星科技有限公司 | Pickling passivation agent for copper and copper alloy as well as preparation method and application of pickling passivation agent |
| CN104388961A (en) * | 2014-11-14 | 2015-03-04 | 平高集团有限公司 | Copper cleaning agent and preparation method thereof |
| CN105369267A (en) * | 2015-12-02 | 2016-03-02 | 芜湖楚江合金铜材有限公司 | Connector copper alloy wire pickling solution and pickling technological method thereof |
| CN107338442A (en) * | 2017-06-20 | 2017-11-10 | 祝国忠 | Handle copper and the lotion and its processing method of copper alloy surface oxide layer |
| CN114260534A (en) * | 2021-12-31 | 2022-04-01 | 合肥聚能电物理高技术开发有限公司 | Vacuum brazing method for connecting Ti-6Al-4V and CuZrCr |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643910B (en) * | 2009-08-27 | 2012-01-04 | 杭州百木表面技术有限公司 | Beryllium bronze oxidation film cleaning agent and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD124923A1 (en) * | 1975-12-19 | 1977-03-23 |
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2006
- 2006-06-14 CN CNB2006100914766A patent/CN100383284C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103060828A (en) * | 2013-02-04 | 2013-04-24 | 北京蓝星科技有限公司 | Pickling passivation agent for copper and copper alloy as well as preparation method and application of pickling passivation agent |
| CN103060828B (en) * | 2013-02-04 | 2015-06-17 | 北京蓝星清洗有限公司 | Pickling passivation agent for copper and copper alloy as well as preparation method and application of pickling passivation agent |
| CN104388961A (en) * | 2014-11-14 | 2015-03-04 | 平高集团有限公司 | Copper cleaning agent and preparation method thereof |
| CN105369267A (en) * | 2015-12-02 | 2016-03-02 | 芜湖楚江合金铜材有限公司 | Connector copper alloy wire pickling solution and pickling technological method thereof |
| CN107338442A (en) * | 2017-06-20 | 2017-11-10 | 祝国忠 | Handle copper and the lotion and its processing method of copper alloy surface oxide layer |
| CN114260534A (en) * | 2021-12-31 | 2022-04-01 | 合肥聚能电物理高技术开发有限公司 | Vacuum brazing method for connecting Ti-6Al-4V and CuZrCr |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100383284C (en) | 2008-04-23 |
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Owner name: INNER MONGOLIA FIRST MACHINERY GROUP CO., LTD. Free format text: FORMER NAME: INNER MONGOLIA FIRST MACHINERY MANUFACTURING (GROUP) CO., LTD. |
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Address after: 014032 Baotou Qingshan District Inner Mongolia first machinery manufacturing (Group) Co., Ltd. (the Inner Mongolia Autonomous Region) Patentee after: Inner Mongolia First Machinery Group Corporation Address before: 014032 Baotou Qingshan District Inner Mongolia first machinery manufacturing (Group) Co., Ltd. (the Inner Mongolia Autonomous Region) Patentee before: Inner Mongolia First Machinery Group Corp. |
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Effective date of registration: 20161209 Address after: 014032 Baotou rare earth hi tech Industrial Development Zone, the first functional area of the Inner Mongolia Autonomous Region Patentee after: Baotou Beifang Venture Co., Ltd. Address before: 014032 Baotou Qingshan District Inner Mongolia first machinery manufacturing (Group) Co., Ltd. (the Inner Mongolia Autonomous Region) Patentee before: Inner Mongolia First Machinery Group Corporation |
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Address after: 014032, Baotou, Inner Mongolia two mailbox technology and Information Technology Department Patentee after: Inner Mongolia First Machinery Group Limited by Share Ltd Address before: 014032 Baotou rare earth hi tech Industrial Development Zone, the first functional area of the Inner Mongolia Autonomous Region Patentee before: Baotou Beifang Venture Co., Ltd. |