CN1861321A - Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring - Google Patents
Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring Download PDFInfo
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- CN1861321A CN1861321A CN 200610014302 CN200610014302A CN1861321A CN 1861321 A CN1861321 A CN 1861321A CN 200610014302 CN200610014302 CN 200610014302 CN 200610014302 A CN200610014302 A CN 200610014302A CN 1861321 A CN1861321 A CN 1861321A
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CNB200610014302XA CN100491073C (en) | 2006-06-09 | 2006-06-09 | Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring |
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CNB200610014302XA CN100491073C (en) | 2006-06-09 | 2006-06-09 | Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring |
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CN1861321A true CN1861321A (en) | 2006-11-15 |
CN100491073C CN100491073C (en) | 2009-05-27 |
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CNB200610014302XA Expired - Fee Related CN100491073C (en) | 2006-06-09 | 2006-06-09 | Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102294648A (en) * | 2010-06-23 | 2011-12-28 | 中芯国际集成电路制造(上海)有限公司 | Method for chemically and mechanically polishing metals |
CN105419651A (en) * | 2015-12-25 | 2016-03-23 | 天津晶岭微电子材料有限公司 | Application of alkalescence polishing liquid in CMP for inhibiting galvanic corrosion of GLSI copper and cobalt barrier layer |
CN105506632A (en) * | 2015-12-24 | 2016-04-20 | 天津晶岭微电子材料有限公司 | Application of alkaline polishing solution in increment of copper film removal rate of GLSI (Great Large Scale Integration) copper wiring at low pressure |
CN105619235A (en) * | 2015-12-24 | 2016-06-01 | 天津晶岭微电子材料有限公司 | Application of alkaline polishing fluid in controlling extending of dishing pit for fine polishing of multilayer copper wirings of GLSI |
CN105647390A (en) * | 2015-12-28 | 2016-06-08 | 天津晶岭微电子材料有限公司 | Application of alkaline polishing solution in improving surface roughness of barrier layer in CMP |
CN106118491A (en) * | 2016-07-11 | 2016-11-16 | 河北工业大学 | A kind of alkalescence polishing liquid for thin copper film barrier layer cobalt and preparation method thereof |
CN106433479A (en) * | 2016-07-19 | 2017-02-22 | 河北工业大学 | Control method for controlling surface roughness of cobalt barrier layer of multi-layer copper wiring |
CN113092203A (en) * | 2021-03-29 | 2021-07-09 | 北京科技大学 | Metallographic phase preparation method of lead bismuth alloy |
CN115058198A (en) * | 2022-03-21 | 2022-09-16 | 康劲 | Novel polishing solution and preparation method and application thereof |
-
2006
- 2006-06-09 CN CNB200610014302XA patent/CN100491073C/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102294648A (en) * | 2010-06-23 | 2011-12-28 | 中芯国际集成电路制造(上海)有限公司 | Method for chemically and mechanically polishing metals |
CN102294648B (en) * | 2010-06-23 | 2013-03-13 | 中芯国际集成电路制造(上海)有限公司 | Method for chemically and mechanically polishing metals |
CN105506632A (en) * | 2015-12-24 | 2016-04-20 | 天津晶岭微电子材料有限公司 | Application of alkaline polishing solution in increment of copper film removal rate of GLSI (Great Large Scale Integration) copper wiring at low pressure |
CN105619235A (en) * | 2015-12-24 | 2016-06-01 | 天津晶岭微电子材料有限公司 | Application of alkaline polishing fluid in controlling extending of dishing pit for fine polishing of multilayer copper wirings of GLSI |
CN105419651A (en) * | 2015-12-25 | 2016-03-23 | 天津晶岭微电子材料有限公司 | Application of alkalescence polishing liquid in CMP for inhibiting galvanic corrosion of GLSI copper and cobalt barrier layer |
CN105647390A (en) * | 2015-12-28 | 2016-06-08 | 天津晶岭微电子材料有限公司 | Application of alkaline polishing solution in improving surface roughness of barrier layer in CMP |
CN106118491A (en) * | 2016-07-11 | 2016-11-16 | 河北工业大学 | A kind of alkalescence polishing liquid for thin copper film barrier layer cobalt and preparation method thereof |
CN106118491B (en) * | 2016-07-11 | 2018-06-12 | 河北工业大学 | It is a kind of for alkalescence polishing liquid of thin copper film barrier layer cobalt and preparation method thereof |
CN106433479A (en) * | 2016-07-19 | 2017-02-22 | 河北工业大学 | Control method for controlling surface roughness of cobalt barrier layer of multi-layer copper wiring |
CN106433479B (en) * | 2016-07-19 | 2019-08-13 | 河北工业大学 | The control method of multi-layer copper metallization cobalt barrier layer surface roughness |
CN113092203A (en) * | 2021-03-29 | 2021-07-09 | 北京科技大学 | Metallographic phase preparation method of lead bismuth alloy |
CN115058198A (en) * | 2022-03-21 | 2022-09-16 | 康劲 | Novel polishing solution and preparation method and application thereof |
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Publication number | Publication date |
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CN100491073C (en) | 2009-05-27 |
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Owner name: TIANJIN, HEBEI UNIVERSITY OF TECHNOLOGY ASSET MANA Free format text: FORMER OWNER: HEBEI UNIVERSITY OF TECHNOLOGY Effective date: 20140402 |
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Effective date of registration: 20140402 Address after: 300000 T-shaped road, Hongqiao District, Tianjin Patentee after: Tianjin, Hebei University of Technology Asset Management Co., Ltd. Address before: 300130 Tianjin Road, Hongqiao District, No. 8 Patentee before: Hebei University of Technology |
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