CN1852635A - Improved structure of high-frequency signal circuit board - Google Patents

Improved structure of high-frequency signal circuit board Download PDF

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Publication number
CN1852635A
CN1852635A CNA2005100344236A CN200510034423A CN1852635A CN 1852635 A CN1852635 A CN 1852635A CN A2005100344236 A CNA2005100344236 A CN A2005100344236A CN 200510034423 A CN200510034423 A CN 200510034423A CN 1852635 A CN1852635 A CN 1852635A
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CN
China
Prior art keywords
reference ground
circuit board
ground layer
transmssion line
signal transmssion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2005100344236A
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Chinese (zh)
Other versions
CN100396166C (en
Inventor
许寿国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNB2005100344236A priority Critical patent/CN100396166C/en
Priority to US11/377,142 priority patent/US20060237322A1/en
Publication of CN1852635A publication Critical patent/CN1852635A/en
Application granted granted Critical
Publication of CN100396166C publication Critical patent/CN100396166C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The improved structure includes following parts: signal transmission lines setup on the circuit board; first reference ground layer near to the said signal transmission lines; second reference ground layer farther to the said signal transmission lines. Under condition of keeping unchanged interval between transmission lines and width of transmission line, the invention let the signal transmission lines refer the farther second reference ground layer. The invention raises impedance value of transmission line to meet requirement of impedance of signal transmission line in high frequency.

Description

The improvement structure of high-frequency signal circuit board
[technical field]
The invention relates to a kind of improvement structure of high-frequency signal circuit board, particularly a kind of high-frequency circuit board that can improve signal transmssion line impedance magnitude on the circuit board improves structure.
[background technology]
IEEE 1394 (hereinafter to be referred as 1394) is a kind of technical specification of signal transmission, the transmission rate that meets the high-speed serial bus of this standard can reach 400Mbps, utilizes 1394 technology computer can be connected with multiple multimedia equipments such as video camera, high speed hard-disk, sound equipments.1394b is 1394 upgraded version, adopt the sort signal transmission line that higher transmission performance can be provided, can be 100 meters and realization and various wired medias such as plastic fiber, glass fibre, Shielded Twisted Pair, unshielded twisted pair etc. up to 3200Mbps, transmission range as transmission rate and be connected.For home network, the transmission speed of 1394b signal transmssion line on 100 meters cable can reach 100Mbps.
In general, the thickness of printed circuit board (PCB) is thin more, its signal transmission performance is good more, for example using solid pressure sheet model is that printed circuit board (PCB) noise when bus runs up of 2116 is bigger, time of delay and rise time are longer, signal transmission effect is undesirable, but if uses the solid pressure sheet of model 1080 that the problems referred to above are improved.Because 1080 solid pressure sheet thickness is less than 2116 solid pressure sheet thickness, therefore reduced whole printed circuit board (PCB) plate thickness, the reducing of printed circuit board (PCB) plate thickness can effectively reduce the noise of crosstalking that produces when running up bus, improves the signal transmission performances.But after being to use 1080 solid pressure sheets, the transmission line impedance value of printed circuit board (PCB) reduces, and does not reach the desired resistance value of 1394b signal transmssion line.
Please refer to Fig. 1, it is a kind of structural representation of high frequency printed circuit board.Wherein said printed circuit board (PCB) 10 has differential signal transmission 11, the first reference ground layers, 12, the second reference ground layer 13 and dielectric layer 14, and wherein differential signal transmission 11 comprises first differential lines 110 and second differential lines 112.W represents the width of signal transmssion line 11, and H1 represents the distance of the transmission line 11 and the first reference ground layer 12, and S represents the distance between first differential lines 110 and second differential lines 112.The impedance Z of differential signal transmission 11 is relevant apart from S and circuit board plane material with width W, first differential lines 110 and second differential lines 112 of the distance H 1 of transmission line 11 and the first reference ground layer 12, differential signal transmission mainly, be that impedance Z is directly proportional with H1, S, be inversely proportional to W.Therefore after using solid pressure sheet 1080, because the thickness of circuit board 10 reduces, the distance H 1 of the differential signal transmission 11 and the first reference ground layer 12 reduces thereupon, do not changing between transmission line 11 live width W and first differential lines 110 and second differential lines under the situation apart from S, the impedance of differential signal transmission 11 reduces, and does not reach the desired impedance magnitude of 1394b signal transmssion line.
[summary of the invention]
In view of above content, be necessary to provide a kind of improvement structure of high-frequency signal circuit board, particularly a kind of high-frequency circuit board that can improve signal transmssion line impedance magnitude on the circuit board improves structure.
A kind of improvement structure of high-frequency signal circuit board, described circuit board be provided with some signal transmssion lines, from the first reference ground layer of described signal transmssion line close together and from the described signal transmssion line distance second reference ground layer far away, under the situation that distance and transmission line width are constant between the described transmission line of maintenance, make described signal transmssion line with reference to the second reference ground layer far away, thereby improve the resistance value size of transmission line.
Compare prior art, the transmission performance that the improvement structure of described high-frequency signal circuit version can improve signal transmssion line can improve the resistance value of transmission line again to meet the impedance requirement of high-frequency signal transmission wire.
[description of drawings]
Fig. 1 is the structure chart of high-frequency signal circuit board of the prior art.
Fig. 2 is the improvement structure chart of the high-frequency signal circuit board of the present invention's one better embodiment.
Fig. 3 is the improvement structure chart of the high-frequency signal circuit board of another better embodiment of the present invention.
[embodiment]
Please refer to Fig. 2, be a better embodiment of the present invention, it comprises the signal transmssion line 21 on a circuit board 20 and the circuit board.Described circuit board 20 comprises some dielectric layers 24, the first reference ground layer 22 and the second reference ground layer 23, and wherein the first reference ground layer, 22 mid portion are hollowed out and form blanket layer 220.Described signal transmssion line 21 is a differential signal transmission, is made up of first differential lines 210 and second differential lines 212.
The width of described signal transmssion line 21 is W, distance between first differential lines 210 and second differential lines 212 is S, described signal transmssion line 21 is H1 from the distance of the first reference ground layer 22, is H2 from the distance of the second reference ground layer, and the width of the blanket layer 220 of the first reference ground layer 22 is B.Because described signal transmssion line 21 is positioned at the top of the blanket layer 220 of the first reference ground layer 22, therefore described signal transmssion line 21 walk around the first nearer reference ground layer 22 and the second reference ground layer 23 that will be far away as with reference to ground floor.
Being directly proportional and the width W of signal transmssion line 21 is inversely proportional to of 212 of the distance H 1 that the first reference ground layer of the impedance Z of differential signal transmission 21 and signal transmssion line 21 is 22 and first differential lines 210 and second differential lines apart from S.In order to improve transmission performance when circuit board 20, use solid pressure sheet 1080 to replace solid pressure sheet 2116, transmission characteristic for inhibit signal differential lines 21, all remaining unchanged of 212 of the width W of signal transmssion line 21 and first differential lines 210 and second differential lines apart from S, therefore the thickness of circuit board 20 reduces to cause the distance H 1 of 22 on signal transmssion line and the first reference ground layer to reduce, thereby the impedance Z of signal transmssion line is reduced, but because the reference ground layer of signal transmssion line 21 is converted to the second reference ground layer 23 far away by the first nearer reference ground layer 22, therefore signal transmssion line 21 is H2 with the distance of reference ground interlayer, the impedance Z of signal transmssion line 21 is improved, and meets the desired resistance value of high-frequency signal transmission.
Simultaneously, the width B of the blanket layer of the first reference ground layer 22 need be slightly larger than the distance H 2 between the signal transmssion line 21 and the second reference ground layer 23, disturbs to avoid producing noise.
Please refer to Fig. 3, be another better embodiment of the present invention, part different from the embodiment described above is the first reference ground layer 22 of circuit board 20 is hollowed out fully, making described signal transmssion line 21 is the reference ground layer with the second reference ground layer 23 far away, to reach the purpose that improves signal transmssion line 21 resistance values.

Claims (5)

1. the improvement structure of a high-frequency signal circuit board, described circuit board be provided with some signal transmssion lines, from the first reference ground layer of described signal transmssion line close together and from the described signal transmssion line distance second reference ground layer far away, it is characterized in that: keeping making described signal transmssion line with reference to the second reference ground layer far away under the constant situation of described transmission line width.
2. the improvement structure of high-frequency signal circuit board as claimed in claim 1 is characterized in that: part corresponding with described signal transmssion line on the first reference ground layer is hollowed out form a blanket layer, make described signal transmssion line with reference to the second reference ground layer.
3. the improvement structure of high-frequency signal circuit board as claimed in claim 2, it is characterized in that: the width of the blanket layer on the first reference ground layer is slightly larger than the distance of the described signal transmssion line and the second reference ground interlayer.
4. the improvement structure of high-frequency signal circuit board as claimed in claim 1 is characterized in that: the first reference ground layer integral body is hollowed out, make described signal transmssion line with reference to the second reference ground layer.
5. the improvement structure of high-frequency signal circuit board as claimed in claim 1 is characterized in that: described signal transmssion line comprises the first difference line and second differential lines, and the distance between described first differential lines and second differential lines remains unchanged.
CNB2005100344236A 2005-04-23 2005-04-23 Improved structure of high-frequency signal circuit board Expired - Fee Related CN100396166C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB2005100344236A CN100396166C (en) 2005-04-23 2005-04-23 Improved structure of high-frequency signal circuit board
US11/377,142 US20060237322A1 (en) 2005-04-23 2006-03-16 Printed circuit board for improving impedance of signal transmission lines

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100344236A CN100396166C (en) 2005-04-23 2005-04-23 Improved structure of high-frequency signal circuit board

Publications (2)

Publication Number Publication Date
CN1852635A true CN1852635A (en) 2006-10-25
CN100396166C CN100396166C (en) 2008-06-18

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CN (1) CN100396166C (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101932192A (en) * 2009-06-18 2010-12-29 鸿富锦精密工业（深圳）有限公司 Printed circuit board
CN101562939B (en) * 2008-04-18 2011-05-04 鸿富锦精密工业（深圳）有限公司 Flexible circuit board
US8022309B2 (en) 2007-08-17 2011-09-20 Hon Hai Precision Industry Co., Ltd. Flexible printed circuit board
CN101909401B (en) * 2009-06-05 2013-11-06 鸿富锦精密工业（深圳）有限公司 Printed circuit board structure
CN103687290A (en) * 2013-12-03 2014-03-26 广州杰赛科技股份有限公司 Flex-rigid PCB and wiring method and device of signal transmission line of flex-rigid PCB
CN105449463A (en) * 2014-09-19 2016-03-30 广迎工业股份有限公司 High frequency printed circuit board stacking structure
CN106385765A (en) * 2016-09-09 2017-02-08 郑州云海信息技术有限公司 Method and system for determining signal line reference layer
CN106486736A (en) * 2015-08-28 2017-03-08 爱思开海力士有限公司 Three-dimensional electromagnetic interference suppression structure and the electronic installation with three-dimensional electromagnetic interference suppression structure
CN113133185A (en) * 2021-03-30 2021-07-16 珠海景旺柔性电路有限公司 Multilayer flexible circuit board for stably transmitting bent medium-high frequency signals and communication equipment
CN113709993A (en) * 2021-08-27 2021-11-26 博敏电子股份有限公司 Method for manufacturing dynamic impedance product
CN113709961A (en) * 2020-05-22 2021-11-26 北京小米移动软件有限公司 Circuit board and terminal equipment

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CN104219870A (en) * 2013-06-04 2014-12-17 鸿富锦精密工业（深圳）有限公司 Printed circuit board
JP6441850B2 (en) * 2016-03-31 2018-12-19 Ｒｉｔａエレクトロニクス株式会社 Multilayer printed wiring board
TWI687136B (en) * 2016-05-09 2020-03-01 易鼎股份有限公司 The circuit board structure corresponding to the ground layer can be selected
KR20220062211A (en) * 2020-11-06 2022-05-16 삼성디스플레이 주식회사 Printed circuit board and display device including the same
CN115023026B (en) * 2021-10-27 2023-04-14 荣耀终端有限公司 Circuit board and electronic device

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JP2000031650A (en) * 1998-07-14 2000-01-28 Sony Corp Printed circuit board
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
FR2819937A1 (en) * 2001-01-22 2002-07-26 St Microelectronics Sa SEMICONDUCTOR DEVICE WITH IMPROVED TRANSMISSION LINE
CN2563884Y (en) * 2002-04-28 2003-07-30 神达电脑股份有限公司 Design structure of signal transmission line in high frequency circuit board
EP1443810A1 (en) * 2003-01-23 2004-08-04 Alcatel Multilayer backplane with vias for pin connection

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8022309B2 (en) 2007-08-17 2011-09-20 Hon Hai Precision Industry Co., Ltd. Flexible printed circuit board
CN101370351B (en) * 2007-08-17 2012-05-30 鸿富锦精密工业（深圳）有限公司 Flexible circuit board
CN101562939B (en) * 2008-04-18 2011-05-04 鸿富锦精密工业（深圳）有限公司 Flexible circuit board
CN101909401B (en) * 2009-06-05 2013-11-06 鸿富锦精密工业（深圳）有限公司 Printed circuit board structure
CN101932192A (en) * 2009-06-18 2010-12-29 鸿富锦精密工业（深圳）有限公司 Printed circuit board
CN103687290A (en) * 2013-12-03 2014-03-26 广州杰赛科技股份有限公司 Flex-rigid PCB and wiring method and device of signal transmission line of flex-rigid PCB
CN103687290B (en) * 2013-12-03 2016-08-17 广州杰赛科技股份有限公司 Rigid-flex combined board and signal transmssion line wiring method thereof and device
CN105449463B (en) * 2014-09-19 2018-03-27 广迎工业股份有限公司 High frequency printed circuit board stacking structure
CN105449463A (en) * 2014-09-19 2016-03-30 广迎工业股份有限公司 High frequency printed circuit board stacking structure
CN106486736B (en) * 2015-08-28 2019-10-18 爱思开海力士有限公司 Three-dimensional electromagnetic interference inhibits structure and inhibits the electronic device of structure with the three-dimensional electromagnetic interference
CN106486736A (en) * 2015-08-28 2017-03-08 爱思开海力士有限公司 Three-dimensional electromagnetic interference suppression structure and the electronic installation with three-dimensional electromagnetic interference suppression structure
CN106385765B (en) * 2016-09-09 2018-09-04 郑州云海信息技术有限公司 A kind of determination method and system of signal wire reference layer
CN106385765A (en) * 2016-09-09 2017-02-08 郑州云海信息技术有限公司 Method and system for determining signal line reference layer
CN113709961A (en) * 2020-05-22 2021-11-26 北京小米移动软件有限公司 Circuit board and terminal equipment
CN113133185A (en) * 2021-03-30 2021-07-16 珠海景旺柔性电路有限公司 Multilayer flexible circuit board for stably transmitting bent medium-high frequency signals and communication equipment
CN113133185B (en) * 2021-03-30 2022-08-12 珠海景旺柔性电路有限公司 Multilayer flexible circuit board for stably transmitting bent medium-high frequency signals and communication equipment
CN113709993A (en) * 2021-08-27 2021-11-26 博敏电子股份有限公司 Method for manufacturing dynamic impedance product

Also Published As

Publication number Publication date
US20060237322A1 (en) 2006-10-26
CN100396166C (en) 2008-06-18

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