CN1851358A - Electronic direct refrigeration-heating air-conditioner - Google Patents
Electronic direct refrigeration-heating air-conditioner Download PDFInfo
- Publication number
- CN1851358A CN1851358A CN 200610051805 CN200610051805A CN1851358A CN 1851358 A CN1851358 A CN 1851358A CN 200610051805 CN200610051805 CN 200610051805 CN 200610051805 A CN200610051805 A CN 200610051805A CN 1851358 A CN1851358 A CN 1851358A
- Authority
- CN
- China
- Prior art keywords
- heat
- chipset
- heats
- semiconductor refrigerating
- heating air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The invention discloses electron directness refrigeration heat producing air conditioning. It includes outdoor and indoor machines. The indoor includes controller, semiconductor refrigeration heat producing chipset, heat elimination components, and heat conduction components. The controller sends current signal to the semiconductor refrigeration heat producing chipset. The heat elimination components are set at one side of the chipset. And the heat conduction components are set at another side. It has no pollution for air and little noise. And its useful life is prolonged by using electron device compared with the mechanical movement of the original components.
Description
[technical field]
The present invention relates to refrigerating plant, relate in particular to air-conditioning.
[background technology]
Existing air-conditioning all is that the thermal energy exchange that converts the air-conditioning indoor and outdoors of two states mainly is made up of elements such as compressor, evaporimeter, condensers by the exchange of compressor with volatile freon evaporation and condensation generation heat energy.
There are following many shortcomings in present compressor formula air-conditioning: the critical piece compressor is a frame for movement, and the life-span is short, noise is bigger; Working media is a freon, and this material is more serious to the destruction of atmospheric ozone layer, is unfavorable for environmental protection, and existent environment of people is constituted serious threat; The air outlet temperature of air-conditioning is fixing non-adjustable, bigger influence air humidity, cause air conditioner disease easily, user's body and mind is damaged; Owing in the circulating line bigger pressure is arranged, is easy to generate principal fault; The limit system cold efficiency of air-conditioning immobilizes.
These unsurmountable shortcomings have seriously limited the development of compressor formula air-conditioner, also can not satisfy the living needs that people improve constantly, people look forward to working out a kind of both environmental protection, comfortable forwardly, noise is little again, the life-span is long, the air-conditioning that also can not damage simultaneously to user's body and mind, to satisfy the living needs that improves constantly, further improve the quality of living.
[summary of the invention]
Purpose of the present invention solves the problems of the prior art exactly, proposes a kind of electronic direct refrigeration-heating air-conditioner, both environmental protection, comfortable, and noise is little again, the life-span is long, also can user's body and mind not damaged simultaneously.
For achieving the above object, the present invention proposes a kind of electronic direct refrigeration-heating air-conditioner, comprise off-premises station and indoor set, described indoor set comprises that controller, semiconductor refrigerating heat chipset, radiating subassembly and heat-conductive assembly, described controller output current signal heats chipset to semiconductor refrigerating, radiating subassembly is electrically connected the one side that heats chipset at semiconductor refrigerating, and heat-conductive assembly is electrically connected the another side that heats chipset at semiconductor refrigerating.
As preferably, also comprise electric ceramic auxiliary heat core sheet group, described electric ceramic auxiliary heat core sheet group is connected in series between controller and the radiating subassembly, receives the current signal of controller, and the heat that work produces is exported to radiating subassembly.
As preferably, described radiating subassembly comprises radiating fin and fan, and radiating fin links to each other with the output that semiconductor refrigerating heats chipset, and fan is installed near the relevant position of radiating fin, aims at the radiating fin blowing.
As preferably, semiconductor refrigerating heats between chipset and the radiating fin by being welded to connect, and is aided with heat pipe.
As preferably, described heat-conductive assembly comprises heat conduction hydroecium and water pump, and the heat conduction hydroecium heats chipset with semiconductor refrigerating and contacts, the indoor water channel that contains of heat-conductive water, and water channel is connected with water pump.
As preferably, it is that N-type semiconductor element and P-type semiconductor element are formed galvanic couple that described semiconductor refrigerating heats chipset, and the pile piece that a plurality of galvanic couples are connected and composed is rearranged by a plurality of pile pieces again.
As preferably, described N-type semiconductor element and P-type semiconductor element adopt bismuth telluride or bismuth antimonide raw material, mix with conventional method and make.
Beneficial effect of the present invention: the present invention utilizes the principle of peltier effect, promptly form galvanic couple with N-type semiconductor element and P-type semiconductor element, a plurality of galvanic couples are connected and composed the pile piece, and add forward dc for the NP galvanic couple, then prepare face in the two sides of pile piece formation temperature, the current direction of a side is to flow to the P-type semiconductor element from the N-type semiconductor element in the base, is heat-absorbent surface; The current direction of another side is to flow to the N-type semiconductor element from the P-type semiconductor element, is heat delivery surface, and the series connection of NP galvanic couple can increase the refrigerated medium heat, and the parallel connection of NP galvanic couple can reduce cryogenic temperature and raising heats temperature.The present invention does not adopt pernicious gases such as freon commonly used, and without any pollution, the feature of environmental protection is good to air; Removed traditional compressor, main like this noise source has only fan, greatly reduces the operation noise of system, and noise is very low, has eliminated the body and mind injury of traditional air-conditioning to the user, for the user provides comfortable environment; Because the components and parts of refrigeration change electronic device into by original mechanical movement, its main frame for movement is the low-power water pump, and its life-span is long more a lot of than traditional compressor formula air-conditioning; Because the electronics air-conditioning can be adjusted operating power fully linearly, the several duties limited with respect to traditional air-conditioning, the parameter of its power is selected more much more than traditional air-conditioning, and controllability is well good; Adjust temperature and the control humidity of air and the sterilizing function of self in air port by linearity, overcome the user and used the be easy to get defective of air conditioner disease of traditional air-conditioning.
Feature of the present invention and advantage will be elaborated in conjunction with the accompanying drawings by embodiment.
[description of drawings]
Fig. 1 is the structural principle block diagram of electronic direct refrigeration-heating air-conditioner;
Fig. 2 is the critical piece STRUCTURE DECOMPOSITION schematic diagram of electronic direct refrigeration-heating air-conditioner.
[specific embodiment]
Fig. 1 is the structural principle block diagram of electronic direct refrigeration-heating air-conditioner; Comprise off-premises station and indoor set, the present invention mainly is the improvement that indoor set is carried out, and original compressor formula air-conditioning is improved to the electronic type air-conditioning.Indoor set comprises that mainly controller 1, semiconductor refrigerating heat chipset 2, radiating subassembly 3 and heat-conductive assembly 4, controller 1 output current signal heats chipset 2 to semiconductor refrigerating, radiating subassembly 3 is electrically connected the one side that heats chipset 2 at semiconductor refrigerating, and heat-conductive assembly 4 is electrically connected the another side that heats chipset 2 at semiconductor refrigerating.Also comprise electric ceramic auxiliary heat core sheet group 23, described electric ceramic auxiliary heat core sheet group 23 is connected in series between controller 1 and the radiating subassembly 3, receives the current signal of controller 1, and the heat that work produces is exported to radiating subassembly 3.Radiating subassembly 3 mainly comprises radiating fin 31 and fan 32, radiating fin 31 links to each other with the output that semiconductor refrigerating heats chipset 2, fan 32 is installed near the relevant position of radiating fin 31, aim at radiating fin 31 blowings, semiconductor refrigerating heats between chipset 2 and the radiating fin 31 and preferably is connected by heat pipe.Heat-conductive assembly 4 comprises heat conduction hydroecium 41 and water pump 42, and a termination semiconductor refrigerating of heat conduction hydroecium 41 heats the output of chipset 2, other end water pump 42.
The present invention mainly is a principle of utilizing peltier effect, promptly form galvanic couple with N-type semiconductor element and P-type semiconductor element, a plurality of galvanic couples are connected and composed the pile piece, and add forward dc for the NP galvanic couple, then prepare face in the two sides of pile piece formation temperature, the current direction of a side is to flow to the P-type semiconductor element from the N-type semiconductor element in the base, is heat-absorbent surface; The current direction of another side is to flow to the N-type semiconductor element from the P-type semiconductor element, be heat delivery surface, the series connection of NP galvanic couple can increase the refrigerated medium heat, the parallel connection of NP galvanic couple can reduce cryogenic temperature and raising heats temperature, N-type semiconductor element and P-type semiconductor element adopt bismuth telluride or bismuth antimonide raw material, mix with conventional method and make.By changing the operating voltage that semiconductor refrigerating heats chipset 2, can change the air-conditioner air outlet temperature effectively, problem such as solved that traditional Air Conditioning is of poor quality, poor working environment and volume are big.
During refrigeration work, semiconductor refrigerating heats chipset 2 and is in refrigerating state, the refrigerating capacity of its generation is transmitted on the radiating fin 31 by heat pipe, again by fan 32 with the air cooling-down after-blow to indoor, semiconductor refrigerating heat heat that chipset 2 another sides are produced by heat conduction hydroecium 41, water pump 42 with thermal energy transfer to the off-premises station radiator, heat is blowed to outdoor by outdoor fan.Radiating fin 31 is the heat pipe-type radiating fin.
When heating work, semiconductor refrigerating heats chipset 2 and is in the state of heating, electric ceramic auxiliary heat core sheet group 23 is also in running order simultaneously, its common heating capacity that produces is transmitted on the radiating fin 3 by heat pipe, again by fan 32 with the atmosphere temperature rising after-blow to indoor, semiconductor refrigerating heats the refrigerating capacity that chipset 2 produced and by heat conduction hydroecium 41, water pump 42 it is delivered on the off-premises station radiator, it is blowed to outdoor by outdoor fan.
Fig. 2 is the critical piece STRUCTURE DECOMPOSITION schematic diagram of electronic direct refrigeration-heating air-conditioner; Fan 32 is by fan electromotor 321 drive work, fan 32, fan electromotor 321 and controller 1 are installed on the mainboard together, the one side that semiconductor refrigerating heats chipset 2 is a heat conduction hydroecium 41, one side is a radiating fin 31, one end of deep bead is an air inlet butterfly 51, and the other end is an air outlet butterfly 52.Said structure is in the specific embodiment of the present invention, and structure of the present invention can also be made multiple concrete structural design under the guidance of its structural principle block diagram.
In the software design when air-conditioning is in refrigerating state, the difference of measures ambient temperature and design temperature at first, when the difference of environment temperature and design temperature was spent greater than 2, semiconductor refrigerating heated chipset 2 and is in the refrigeration work full load condition; When the difference of environment temperature and design temperature between the 0-2 degree, semiconductor refrigerating heats chipset 2 and is in the state that refrigeration work constantly reduces power; When the difference of environment temperature and design temperature was spent less than 0, semiconductor refrigerating heated the refrigeration work consumption state operation of chipset 2 with minimum.
When air-conditioning is in when heating state, at first measure the difference of design temperature and environment temperature, when the difference of design temperature and environment temperature was spent greater than 2, semiconductor refrigerating heated chipset 2 and is in and heats the work full load condition, and electric ceramic auxiliary heat core sheet group 23 is in full load condition simultaneously; When the difference of design temperature and environment temperature between the 0-2 degree, close semiconductor refrigerating and heat chipset 2 and heat state, reduce electric ceramic auxiliary heat core sheet group 23 and heat power; When the difference of design temperature and environment temperature was spent less than 0, electric ceramic auxiliary heat core sheet group 23 was moved with the power rating that heats of minimum.
When air-conditioning is in intellectual status, at first measures ambient temperature and Celsius 25 the degree differences, when difference was spent greater than 1, air-conditioning entered the refrigeration work state automatically; When difference was spent less than-1, air-conditioning entered automatically and heats duty; When difference-1 to 1 the degree between the time air-conditioning do not work autostop.
The telecommand that is sterilized when air-conditioning, make 23 oeprations at full load of electric ceramic auxiliary heat core sheet group earlier, timer is started working simultaneously, close fan 32 in the indoor set, the temperature of measuring radiating fin 31 is lower than 110 when spending, and electric ceramic auxiliary heat core sheet group 23 continues operation, when temperature is higher than 110 when spending, close electric ceramic auxiliary heat core sheet group 23, when timer to 300 second, close the disinfection of air-conditioning.
When air-conditioning is in except that wet condition, semiconductor refrigerating heat chipset 2, fan 32 be in the state semiconductor refrigerating of operating at full capacity heat heat that chipset 2 produced by heat conduction hydroecium 41, water pump 42 with thermal energy transfer to the off-premises station radiator, heat is blowed to outdoor by outdoor machine fan.
When air-conditioning is in ventilation state, fan in the indoor set 32 is operated at full capacity.
The foregoing description is to further specify of the present invention, is not to concrete qualification of the present invention, any structure after the simple transformation of the present invention is all belonged to protection scope of the present invention.
Claims (8)
1. electronic direct refrigeration-heating air-conditioner, comprise off-premises station and indoor set, it is characterized in that: described indoor set comprises that controller (1), semiconductor refrigerating heat chipset (2), radiating subassembly (3) and heat-conductive assembly (4), described controller (1) output current signal heats chipset (2) to semiconductor refrigerating, radiating subassembly (3) is electrically connected the one side that heats chipset (2) at semiconductor refrigerating, and heat-conductive assembly (4) is electrically connected the another side that heats chipset (2) at semiconductor refrigerating.
2. electronic direct refrigeration-heating air-conditioner as claimed in claim 1, it is characterized in that: also comprise electric ceramic auxiliary heat core sheet group (23), described electric ceramic auxiliary heat core sheet group (23) is connected in series between controller (1) and the radiating subassembly (3), receive the current signal of controller (1), the heat that work produces is exported to radiating subassembly (3).
3. electronic direct refrigeration-heating air-conditioner as claimed in claim 1 or 2, it is characterized in that: described radiating subassembly (3) comprises radiating fin (31) and fan (32), radiating fin (31) links to each other with the output that semiconductor refrigerating heats chipset (2), fan (32) is installed near the relevant position of radiating fin (31), aims at radiating fin (31) blowing.
4. electronic direct refrigeration-heating air-conditioner as claimed in claim 3 is characterized in that: semiconductor refrigerating heats between chipset (2) and the radiating fin (31) by being welded to connect, and is aided with heat pipe.
5. as claim 1 or 2 or 4 described electronic direct refrigeration-heating air-conditioners, it is characterized in that: described heat-conductive assembly (4) comprises heat conduction hydroecium (41) and water pump (42), heat conduction hydroecium (41) heats chipset (2) with semiconductor refrigerating and contacts, heat conduction hydroecium (41) includes water channel, and water channel is connected with water pump (42).
6. electronic direct refrigeration-heating air-conditioner as claimed in claim 3, it is characterized in that: described heat-conductive assembly (4) comprises heat conduction hydroecium (41) and water pump (42), heat conduction hydroecium (41) heats chipset (2) with semiconductor refrigerating and contacts, heat conduction hydroecium (41) includes water channel, and water channel is connected with water pump (42).
7. as claim 1 or 2 or 4 or 6 described electronic direct refrigeration-heating air-conditioners, it is characterized in that: described semiconductor refrigerating heats chipset (2) and is N-type semiconductor element and P-type semiconductor element composition galvanic couple, the pile piece that a plurality of galvanic couples are connected and composed is rearranged by a plurality of pile pieces again.
8. electronic direct refrigeration-heating air-conditioner as claimed in claim 7 is characterized in that: described N-type semiconductor element and P-type semiconductor element adopt bismuth telluride or bismuth antimonide raw material, mix with conventional method and make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610051805 CN1851358A (en) | 2006-06-05 | 2006-06-05 | Electronic direct refrigeration-heating air-conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610051805 CN1851358A (en) | 2006-06-05 | 2006-06-05 | Electronic direct refrigeration-heating air-conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1851358A true CN1851358A (en) | 2006-10-25 |
Family
ID=37132847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610051805 Pending CN1851358A (en) | 2006-06-05 | 2006-06-05 | Electronic direct refrigeration-heating air-conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1851358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105698271A (en) * | 2016-04-01 | 2016-06-22 | 浙江嘉熙科技有限公司 | Temperature difference electric heat pump type air conditioner |
-
2006
- 2006-06-05 CN CN 200610051805 patent/CN1851358A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105698271A (en) * | 2016-04-01 | 2016-06-22 | 浙江嘉熙科技有限公司 | Temperature difference electric heat pump type air conditioner |
| CN105698271B (en) * | 2016-04-01 | 2019-07-16 | 浙江嘉熙科技有限公司 | Thermoelectric heat pump type air conditioner |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201311124Y (en) | Air conditioner specially used for naturally cooling double cold source machine room | |
| CN201416960Y (en) | Integrated fresh air conditioner | |
| CN203432016U (en) | Desk-type portable semiconductor refrigeration air conditioner | |
| CN2937902Y (en) | Electronic air conditioner of regulating air comprehensive quality | |
| CN100439847C (en) | Plate-type heat exchanger antifreeze apparatus and control method thereof | |
| CN1851359A (en) | Electronic air-conditioner capable of regulating air comprehensive quality | |
| CN105318453A (en) | Outdoor unit defrosting device and air conditioner | |
| CN1995855A (en) | Air conditioning water heater using air source heat pump | |
| CN102829519B (en) | Dehumidifying unit of double cold source all fresh air heat pump provided with cold carrying heat exchanger | |
| CN1851358A (en) | Electronic direct refrigeration-heating air-conditioner | |
| KR20000000136A (en) | Cooling and heating system for vehicle | |
| CN2740970Y (en) | Two-purpose air conditioning fan for heating and cooling | |
| CN2937901Y (en) | Electronic direct cold, warm air conditioner | |
| CN2681026Y (en) | Heat pump direct current energy-saving air conditioner | |
| CN2665624Y (en) | Cold-hot dual-purpose electric fan | |
| CN201730805U (en) | Cooling system | |
| CN204786965U (en) | Utilize toilet sparge water refrigerated semiconductor refrigeration air conditioner device | |
| CN209517046U (en) | A kind of solar photovoltaic controller | |
| CN203687247U (en) | Partitioned temperature-controlled air-conditioner system | |
| CN106051997A (en) | Air exchange device | |
| CN213713217U (en) | Air conditioner linkage heating system | |
| CN212029800U (en) | Energy-saving air conditioner | |
| CN2453305Y (en) | Two purpose means for air-conditioning and shower | |
| CN217178767U (en) | Multifunctional energy-saving efficient dehumidifier | |
| CN2360766Y (en) | Household central air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20061025 |