CN1849855A - Electronic component mounting module - Google Patents

Electronic component mounting module Download PDF

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Publication number
CN1849855A
CN1849855A CNA2004800259805A CN200480025980A CN1849855A CN 1849855 A CN1849855 A CN 1849855A CN A2004800259805 A CNA2004800259805 A CN A2004800259805A CN 200480025980 A CN200480025980 A CN 200480025980A CN 1849855 A CN1849855 A CN 1849855A
Authority
CN
China
Prior art keywords
electronic component
protective layer
component mounting
mounting module
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800259805A
Other languages
Chinese (zh)
Inventor
小西美佐夫
篠崎润二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of CN1849855A publication Critical patent/CN1849855A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

An electronic component mounting module where an electronic component (3) is mounted on a printed board, e.g. a flexible board (1). The electronic component mounting module comprises a plurality of wiring patterns (2) formed on the flexible board in correspondence with the terminals of the electronic component, a solder resist (6) having an opening in correspondence with a region where the electronic component (3) is mounted and covering the wiring patterns (2) such that the portion where the electronic component (3) is connected is exposed, and an adhesive sheet (e.g. an anisotropic conductive film (5)) having contour dimensions such that the adhesive sheet overlaps with the inner edge part of the solder resist (6) when it is bonded to the region of the flexible board where the electronic component (3) is mounted and electrically connecting the electronic component (3) with the wiring patterns (2) when the electronic component (3) is press-bonded. At least a part (6a) of the opening in the solder resist (6) is extended up to a region where the solder resist (6) does not overlap with the anisotropic conductive film (5).

Description

Electronic component mounting module
Technical field
The present invention relates to a kind of electronic component mounting module that electronic unit is installed on the printed base plates such as flexible base, board.
Background technology
Shown in Figure 1A, general COF (Chip on film) mounting means is to paste anisotropic conductive film 14 on the flexible base, board 13 that scolder protective layer 12 is arranged, and wherein said scolder protective layer 12 surrounds the wiring figure 11 and the installing zone lining wiring figure 11 that surrounds electronic unit corresponding to the terminal of electronic unit; Shown in Figure 1B, the location disposes the electronic unit 16 with protrusion 15 on anisotropic conductive film 14 simultaneously, and hot pressing is bonding then.Like this, just obtain the electronic component mounting module shown in Fig. 1 C.
But shown in Figure 1B, in COF mounting means so, because wiring figure 11 or scolder protective layer 12 etc. is concavo-convex, might be between anisotropic conductive film 14 and flexible base, board 13 residual have an air.If electronic unit 16 is installed under this state, then heat that is applied when mounted and pressure can cause being closed in the air expansion between anisotropic conductive film 14 and the flexible base, board 13, and generation space 17, under the worst situation, can destroy anisotropic conductive film 14 because break in the space, wiring figure might occur and expose problems such as portion 18.This space 17 or wiring figure expose the reliability reduction that portion 18 can cause electronic component mounting module.
Therefore, take place for preventing this type of problem, the someone proposes a kind of technical scheme, is to hole on the flexible base, board thickness direction, airtight air is discharged into the outside goes (for example patent documentation 1: the spy opens flat 5-343844 communique).According to the record of patent documentation 1, with the inflexibility circuit substrate and flexible circuit board is bonding when being integral, on the thickness direction that is connected the zone of flexible circuit board, be drilled with the hole that to ventilate through anisotropic conductive film.Thus, in the method for attachment of patent documentation 1, even heat under the situation of entrapped air pockets (air) expansion on the interface that causes inflexibility circuit substrate and flexible circuit board, it is residual that this zone does not have bubble yet, and bubble can discharge easily through the air vent hole that is connected the zone of flexible circuit board.
But in the method for aforesaid patent documentation 1, must be increased in the operation of holing or processing in advance on the flexible base, board, make installation exercise more numerous and diverse.Therefore, except the described method of patent documentation 1, the also technology that addresses the above problem with other means of expectation exploitation.
Summary of the invention
In view of this, not the object of the present invention is to provide a kind of installation exercise numerous and diverse and can improve the electronic component mounting module of reliability.
For achieving the above object, electronic component mounting module of the present invention is a kind of electronic unit to be installed in electronic component mounting module on the printed base plate, it is characterized in that having the terminal of corresponding electronic unit and be arranged on a plurality of wiring figures on the printed base plate, installing zone corresponding to electronic unit has peristome and envelopes wiring figure so that the scolder protective layer that the part that is connected with electronic unit exposes, the described electronic unit of crimping with on the printed base plate of the installing zone that is secured at electronic unit time the and realize the adhesive sheet that is electrically connected of electronic unit and wiring figure, the inner peripheral of the overall dimension of adhesive sheet and scolder protective layer is overlapping; At least a portion of scolder protective layer peristome extends to scolder protective layer and the nonoverlapping zone of adhesive sheet always.
In aforesaid electronic component mounting module; because the part of scolder protective layer peristome is extended laterally from the adhesive sheet that overlaps on the scolder protective layer, just discharge to the outside effectively through this part so paste the air that is closed between adhesive sheet and the printed base plate in the operation in adhesive sheet.Therefore, the air that can avoid occurring being closed adds thermal expansion and produces the space when the crimping electronic unit, and the problem that wiring figure is exposed.
Description of drawings
Figure 1A represents existing electronic component mounting method, is that the expression anisotropic conductive film is pasted the sectional drawing of operation.
Figure 1B represents existing electronic component mounting method, is the sectional drawing of the installation procedure of expression electronic unit.
Fig. 1 C represents existing electronic component mounting method, is the general view of expression electronic component mounting module.
Fig. 2 A is the general view of one of electronic component mounting module of the present invention example.
Fig. 2 B is the broad cross-section map along A-A ' line among Fig. 2 A.
Fig. 3 is other routine general view of electronic component mounting module of the present invention.
Embodiment
Following with reference to description of drawings electronic component mounting module of the present invention.
Shown in Fig. 2 B, being suitable for electronic component mounting module of the present invention constitutes by so-called COF (Chip on film) mounting means, that is: through anisotropic conductive film 5 protrusion 4 crimping of a plurality of wiring figures on printed base plate such as the flexible base, board 12 with electronic unit 3 are joined together, thus electronic unit 3 are installed on the flexible base, board 1.
On flexible base, board 1, be used for guaranteeing the wiring figure 2 insulating properties each other scolder protective layer 6 lining wiring figures 2 of protecting cloth line graph 2 simultaneously, so that the wiring figure 2 that is connected with electronic unit 3 exposes.In addition, scolder protective layer 6 has the peristome of the installing zone that surrounds electronic unit 3.
Anisotropic conductive film 5 is that the bonding agent of the electroconductive particle that contains dispersion is formed the thin film shape, as anisotropic conductive film, it is got up to guarantee being electrically connected of they with electronic unit 3, flexible base, board 1 crimping.The overall dimension of anisotropic conductive film 5 is made inner peripheral overlaid with scolder protective layer 6, anisotropic conductive film 5 is sticked on the scolder protective layer 6, so that cover the installing zone of electronic unit 3.In addition, adhesive sheet is not limited to aforesaid anisotropic conductive film 5, also can be simple bonding agent thin slice that does not contain electroconductive particle etc.
In the present invention, shown in Fig. 2 A, a part of 6a of peristome that surrounds the scolder protective layer 6 of electronic unit 3 installing zones extends to and anisotropic conductive film 5 nonoverlapping zones always, makes the shape that on Width the scolder protective layer was disconnected in 6 minutes.At this moment, preferably a part of 6a of the peristome of scolder protective layer 6 is arranged in the zone that does not form wiring figure 2.
In the electronic component mounting module of this structure; when sticking on anisotropic conductive film 5 on the flexible base, board 1; enclosed between them under the situation of air, a part of 6a of the peristome of scolder protective layer 6 just plays the effect that the air that is closed is discharged into the path that goes the outside.Therefore; installing in the operation of electronic units 3 through anisotropic conductive film 5, is enclosed air in the space that flexible circuit board 1 and anisotropic conductive film 5 and scolder protective layer 6 surrounded can be easily a part of 6a of peristome by scolder protective layer 6 go outside being discharged to.Therefore, the electronic component mounting module of this structure can suppress the generation because of the space of being caused by the air expansion enclosed, also just drawbacks such as wiring figure 2 exposes can not occur, thereby can improve the quality reliability.In addition,, scolder protective layer 6 just can remove the air of being enclosed as long as being formed certain shape, thus need not additionally to be increased in the operation that is drilled with air vent hole on the flexible circuit board 1, thus can extremely easily improve reliability of products.
As shown in Figure 2; the shape that a part of 6a that the shape of scolder protective layer 6 needn't be made peristome disconnected the scolder protective layer in 6 minutes on Width; as shown in Figure 3, a part of 6a of the peristome of scolder protective layer 6 if extend to always scolder protective layer 6 not with the anisotropic conductive film 5 overlapping areas outsides.At this moment, as shown in Figure 3, a part of 6a of peristome both can be formed into the half-way of scolder protective layer 6, also can run through scolder protective layer 6.In addition, the part that the peristome of scolder protective layer 6 extends is not limited to Fig. 2 and 2 places shown in Figure 3, also can be made as 1 place or more than 3 places.
As the assembly that constitutes aforesaid electronic component mounting module, can adopt any assembly of this type of electronic component mounting module.
Can use polyimides (Polyimide) for example etc. to have flexible insulated substrate etc. as flexible base, board 1.Wiring figure 2 on the flexible base, board 1 is made of conductors such as for example copper, and forms a plurality of wiring figures 2 corresponding to the protrusion 4 of electronic unit 3; As printed base plate, be not limited to aforesaid flexible base, board 1, also can use all circuit boards such as so-called rigid substrates.
Electronic unit 3 for example is IC chips such as semiconductor chip, and the protrusion 4 as the formations such as gold of terminal is arranged on the surface.
Bonding agent as constituting anisotropic conductive film 5 can use various thermosetting resins, thermoplastic resin, rubber etc.Wherein, preferably use thermosetting resin from connecting the angle of back reliability.As thermosetting resin, can use the rubber of synthetic resin such as epoxy resin, melamine resin, phenolic resins, diallyl phthalate ester resin, viscose maleimide cyanate resin, mylar, polyurethane resin, phenoxy resin, polyamide or polyimides and functional groups such as hydroxyl, carboxyl, vinyl, amino or epoxy radicals or synthetic rubber etc.Wherein, preferably use epoxy resin, its various characteristics is good especially.As epoxy resin, can use epoxy compounds that 2 above Oxyranyles are arranged in bisphenol-type epoxy resin, epoxy phenolics or the molecule etc.This based epoxy resin preferably adopts impurity ion, the especially chloride ion high purity product below 50ppm.
In addition, as anisotropic conductive film 5 employed electroconductive particles, can use metal powder, the spherical resin particle surface is applied the goods of metal-plated, the goods etc. and the various various electroconductive particles that are used for the anisotropic conductive bonding agent in the past of insulative resin coating are set on the surface of the particle that is made of these good conductors with the conduction coating particles that electric conducting material coats as formations such as Ni, Ag, Cu or their alloys.The particle diameter of electroconductive particle is preferably between 0.2 μ m～20 μ m.
In addition, can use insulating properties protective material etc. as scolder protective layer 6, so long as it is just passable to be used for the common scolder protective material of this electronic component mounting module.
Below the installation method of the electronic unit of electronic component mounting module of the present invention is made in explanation.
At first, the whole face of etching is pasted with the flexible base, board of Copper Foil, and preparation has the flexible base, board 1 corresponding to a plurality of wiring figures 2 of the protrusion 4 of the electronic unit 3 that is loaded.
Then, the installing zone formation scolder protective layer 6 round electronic unit 3 makes it to have a peristome that an end of the wiring figure 2 that is electrically connected with the protrusion 4 of electronic unit 3 exposes.At this moment, the shape of decision scolder protective layer 6, make a part of 6a of the peristome of scolder protective layer 6 extend to always with the back operation in anisotropic conductive film 5 nonoverlapping zones of pasting.
Then, electronic unit 3 is configured on the position of regulation, is configured in anisotropic conductive film 5 sides so that form the face of the protrusion 4 of electronic unit 3, the electronic unit 3 that hot pressing is simultaneously put.Like this, just the electroconductive particle in anisotropic conductive film 5 is electrically connected the protrusion 4 of electronic unit 3 with wiring figure 2, thereby makes electronic component mounting module.
At this moment, a part of 6a of the peristome of the scolder protective layer 6 through extending laterally from anisotropic conductive film 5 is rejected to the outside effectively with the air that is closed between flexible base, board 1 and the anisotropic conductive film 5.Therefore, the generation in the space that the air that the electronic component mounting module that manufacturing is come out just can be avoided being closed causes or wiring figure disadvantage such as expose, thereby present high reliability.
＜embodiment 〉
It is following that explanation is suitable for specific embodiments of the invention according to experimental result.
In an embodiment; adopt full-bodied relatively material (ACF-1), or the material of low-viscosity (ACF-2) is as anisotropic conductive film, simultaneously; the shape of scolder protective layer 6 is made the shape of the part extension of the sort of peristome shown in Figure 2, make electronic component mounting module.
At first, prepare to be provided with the flexible base, board of wiring figure, form the scolder protective layer of peristome with the installation region that surrounds the IC chip.As shown in Figure 2, the scolder protective layer is in 2 jiaos of shapes that make the branch disconnection at diagonal angle.Then, anisotropic conductive film covers the peristome of scolder protective layer in the stickup.It is 1.0 * 10 that anisotropic conductive film used herein adopts the melting viscosity (100 ℃) with the viscosimeter RS150 mensuration of German Harch corporate system 7The ACF-1 of mPas.Then the assigned position on anisotropic conductive film has been arranged the IC chip, through heating, pressurization the IC chip is installed on the flexible base, board, makes electronic component mounting module.
In addition, employing is 4.0 * 10 with the melting viscosity (100 ℃) of the viscosimeter RS150 mensuration of German Harch corporate system 6The ACF-2 of mPas with above-mentioned the same, makes electronic component mounting module in addition as anisotropic conductive film.
＜comparative example 〉
In comparative example; adopt relative high viscosity material (ACF-1) or low-viscosity material (ACF-2) as anisotropic conductive film; simultaneously the shape of scolder protective layer is made the installation region that surrounds the IC chip fully shown in Figure 1A～1C; the same with the foregoing description in addition, make electronic component mounting module.
For the electronic component mounting module of as above making, anisotropic conductive film is broken and count at the position of exposing inner wiring figure with microscope, it the results are shown in table 1.
Table 1
Comparative example Embodiment
ACF-1 3 0
ACF-2 20 2
As shown in table 1, adopting under the situation of full-bodied anisotropic conductive film, because the part of the peristome of scolder protective layer is extended to not and the anisotropic conductive film overlapping areas always, thereby can prevent fully that wiring figure from exposing.In addition, under the situation that adopts the low-viscosity anisotropic conductive film, also wiring figure can be exposed from 20 of comparative example reducing to 2 places significantly.By above result as can be known, no matter the viscosity of anisotropic conductive film height as long as adjust the shape of scolder protective layer, just can effectively be removed the air that is closed between anisotropic conductive film and the flexible base, board.
Such as above detailed description is crossed, according to the present invention, owing to can easily get rid of the air that is closed between adhesive sheet and the printed base plate, thus can avoid producing drawbacks such as space or wiring figure expose, thus the electronic component mounting module that presents high reliability can be provided.

Claims (4)

1. electronic component mounting module, described electronic component is installed on the printed base plate, it is characterized in that: have a plurality of wiring figures, scolder protective layer and the adhesive sheet that are arranged on corresponding to the terminal of described electronic unit on the described printed base plate; This scolder protective layer has the peristome corresponding to the zone that described electronic unit is installed, and the lining residence states wiring figure, so that expose the coupling part of described wiring figure and electronic unit; Described adhesive sheet is secured on the described printed base plate in the zone that described electronic unit is installed, and have the overall dimension overlapping with the inner peripheral portion of described scolder protective layer, by the described electronic unit of crimping described electronic unit is electrically connected with described wiring figure simultaneously; The peristome of described scolder protective layer has the extension that always extends to not with described adhesive sheet overlapping areas.
2. electronic component mounting module as claimed in claim 1 is characterized in that the extension of the peristome of described scolder protective layer is formed in the zone of the wiring figure that does not form described printed base plate.
3. electronic component mounting module as claimed in claim 1 or 2 is characterized in that described adhesive sheet is an anisotropic conductive film.
4. electronic component mounting module as claimed in claim 1 or 2 is characterized in that described printed base plate is a flexible base, board.
CNA2004800259805A 2003-09-09 2004-05-12 Electronic component mounting module Pending CN1849855A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
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US7936570B2 (en) 2007-03-19 2011-05-03 Hitachi Displays, Ltd. Liquid crystal display device
CN114424351A (en) * 2019-09-25 2022-04-29 京瓷株式会社 Electronic component mounting substrate and electronic device

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JPH10335384A (en) * 1997-05-29 1998-12-18 Sony Corp Method and component for mounting semiconductor device or electronic component
JPH10336776A (en) * 1997-05-30 1998-12-18 Sony Corp Speaker device
JPH10341068A (en) * 1997-06-06 1998-12-22 Sony Corp Printed wiring board and method for mounting electronic parts
JP2001237265A (en) * 2000-02-22 2001-08-31 Sanyo Electric Co Ltd Board for connecting electric apparatus
JP2002076059A (en) * 2000-09-01 2002-03-15 Misuzu Kogyo:Kk Circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7936570B2 (en) 2007-03-19 2011-05-03 Hitachi Displays, Ltd. Liquid crystal display device
CN101271205B (en) * 2007-03-19 2011-05-04 株式会社日立显示器 Liquid crystal display apparatus
CN114424351A (en) * 2019-09-25 2022-04-29 京瓷株式会社 Electronic component mounting substrate and electronic device

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