CN1844845A - Alignment detection structure and alignment offset detection method - Google Patents
Alignment detection structure and alignment offset detection method Download PDFInfo
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- CN1844845A CN1844845A CN 200610068206 CN200610068206A CN1844845A CN 1844845 A CN1844845 A CN 1844845A CN 200610068206 CN200610068206 CN 200610068206 CN 200610068206 A CN200610068206 A CN 200610068206A CN 1844845 A CN1844845 A CN 1844845A
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Abstract
The invention relates to an aim detecting structure, which comprises an aim picture on the basic plate, and a frame with known width on the periphery of said picture. The invention can be used in COG (Chip-On-Glass) technique, that with the aim mark of chip, after COG pressing, judging the deflection amount via the relative position of aim mark and the frame; therefore, the invention can directly calculate the deflection after compressing chip to adjust the machine after COG process.
Description
Technical field
The present invention is relevant for the detection method of a kind of aim detecting structure and alignment offset amount, and be particularly to a kind of substrate after the pressing of COG (Chip-On-Glass) processing chip, can be used for detection chip pressing side-play amount aim detecting structure and detect the method for skew.
Background technology
The type of drive of general LCD is to drive by chip for driving (IC), wherein the part chip for driving then is the technology via the pressing of High Temperature High Pressure, press to the correspondence position on the substrate accurately, therefore before pressing, have the action of aligning, and the mode of aiming at is by in correspondence with each other mechanism on the chip and on the substrate, promptly carries out pressing after aiming at.Yet have machinery or artificial error in the process of pressing unavoidably, produce the situation of misalignment skew, therefore need to observe the skew situation, and with board adjustment again.
Fig. 1 is the method for tradition about the skew condition detection assessment of glass substrate and chip pressing in the COG technology, it is the situation that utilizes after the pressing of microscope direct observing COG technology chips on the alignment mark of substrate relatively, though alignment mark 1 on the chip and the alignment mark 2 on the substrate, existing between the two fixing length and width, but if behind the chip pressing when being offset to some extent, because between two alignment marks not being is the situation of complete driving fit, when so skew takes place, estimate that the skew situation can only do estimation just slightly, can't more clearly know the amount of skew.Be merely able to the amount of "ball-park" estimate direction that board may be offset in COG technology and rough estimate as the method, so when board skew adjustment, can only adjust, often need adjustment repeatedly can obtain result accurately in the mode of first summary.
In addition, the method that the skew condition evaluation of glass substrate and chip pressing in the another kind of COG of the detection technology is arranged in the prior art, the pressing that is applied to the projection of the contact mat of glass substrate and chip detects, during detection, utilize side direction light source irradiation glass substrate, and pass through from the pressing district, the reflected light in deviate region and non-pressing district has different brightness, and judge glass substrate with the side-play amount of chip pressing, the shortcoming of this method remains with a "ball-park" estimate side-play amount carries out adjustment, and utilizing catoptrical brightness to judge that side-play amount must come assessment result via the process that converts, is the detection method that belongs to more complicated therefore.
Summary of the invention
For improving yield of producing and the discarded rate that reduces chip, the object of the present invention is to provide a kind of aim detecting structure of novelty, to calculate the situation that is offset after the pressing of COG technology chips accurately, improve the efficient of board adjustment, estimate that fast the skew situation needn't increase extra-pay again simultaneously and measure brightness.
For reaching above-mentioned purpose, aim detecting structure of the present invention comprises substrate; Aligned pattern is located on this substrate, the alignment mark complementation on this aligned pattern and the chip; And first frame, have the first known width, be positioned at this aligned pattern periphery.
The present invention also comprises the detection method of using above-mentioned detection architecture, comprises following steps: the chip with alignment mark is provided; Substrate with aligned pattern is provided, the alignment mark complementation on this aligned pattern and this chip, this aligned pattern periphery has first frame of known width; And the alignment mark of this chip aimed at the aligned pattern of this substrate, on this substrate, the overlapping degree by this first frame and this alignment mark is with estimation pressing side-play amount with this chip pressing.
For above and other objects of the present invention, feature and advantage can be become apparent, cited below particularlyly go out preferred embodiment, and conjunction with figs., be described in detail below:
Description of drawings
Fig. 1 is the alignment mark of substrate and chip in the known COG technology;
Fig. 2 is a preferred embodiment of the present invention;
Fig. 3 is a preferred embodiment alignment mark enlarged drawing of the present invention;
Fig. 4 is the embodiment of triangle aligned pattern of the present invention;
Fig. 5 is the embodiment of L shaped aligned pattern of the present invention;
Fig. 6 is the embodiment of fan-shaped aligned pattern of the present invention;
Fig. 7 is for there being the embodiment of constant spacing between frame of the present invention;
Fig. 8 is the embodiment of three frames of the present invention;
Fig. 9 is the implementing procedure that COG pressing of the present invention detects;
Figure 10 is an embodiments of the invention alignment mark pressing migration result.
[primary clustering symbol description]
Alignment mark on the 1-chip; Alignment mark on the 2-substrate;
The 3-substrate; The 4-colored filter;
5-chip pressing district; The 14-aligned pattern;
The 15-alignment mark; 16-first frame;
17-first width; 18-second frame;
19-second width; The known separation of 20-first frame and second frame;
21-the 3rd frame.
Embodiment
Below please refer to the aim detecting structure that Fig. 2 illustrates one embodiment of the present invention, wherein comprise: substrate 3; Colored filter 4; Aligned pattern 14, it is arranged in the chip pressing district 5 on the substrate 3.Owing to is to explain with COG technology at following embodiment, so substrate 3 is glass substrates, but it should be noted that the present invention also can be used on other process for pressing, for example plastic base.
Fig. 3 is the enlarged drawing of aim detecting structure of the present invention, and it is complementary fully with the alignment mark 15 on the chip wherein to comprise aligned pattern 14.This aligned pattern 14 has first frame 16 in addition, has the first known width 17, is positioned at this aligned pattern 14 peripheries.With present embodiment, the alignment mark 15 on the chip is cross, and aligned pattern 14 is four square pattern, lays respectively at four corners.The length of side of this square pattern is not particularly limited, and in a preferred embodiment, for example be 30 μ m, and first frame 16 of its periphery has known width 17, for example is 4 μ m.
Because chip alignment mark 15 is cross, when if pressing process chips does not have drift condition fully, then chip alignment mark 15 and the complete complementation of aligned pattern 14 meetings are as shown in Figure 3, both form square at driving fit, and four identical patterns of aligned pattern 14 lay respectively at 15 4 corners of cross alignment mark of aligning.In other embodiments, aligned pattern 14 also can be other figure such as triangle, L shaped or fan-shaped, as Fig. 4, Fig. 5, shown in Figure 6, thus chip alignment mark 15 with this aligned pattern 14 when complementary fully (the pressing side-play amount is 0 o'clock), both driving fits form polygon or driving fit figures.
Shown in Fig. 3～6, the aim detecting structure of present embodiment also can comprise second frame 18, has the second known width 19, be positioned at this first frame periphery, and first frame 16 is close to second frame 18.It should be noted that first frame 16 and second frame 18 are selected from continuous or discrete frame figure identical or differently, for example first frame 16 is discontinuous frame in Fig. 3,4, and second frame 18 is continuous frame; Two frames all are discontinuous frames in Fig. 5; First frame 16 is continuous frame in Fig. 6, and second frame 18 is discontinuous frame.In addition, first width 17 can also have identical known width or different known width with second width 19.
In addition, the aim detecting structure of present embodiment, its first frame 16 and second frame 18 can also have a known separation 20, as shown in Figure 7.Moreover aim detecting structure of the present invention can also comprise the frame of two above known width, is positioned at this first frame, 16 peripheries, and as shown in Figure 8, it more is provided with the 3rd frame 21 outside second frame 18.And can be continuous or discrete frame figure as first frame 16 and second frame, 18, the three frames 21, and the width of the 3rd frame 21 can be identical or different with first frame 16 or second frame 18; In like manner, can also have or not have spacing between the 3rd frame 21 and second frame 18.
By aim detecting structure of the present invention, can accurately estimate the side-play amount behind the chip pressing, below will cooperate the process flow diagram of Fig. 9 and Figure 10 to do an explanation:
Chip with alignment mark at first is provided, the substrate with aligned pattern is provided, both must be earlier with the alignment mark on aligned pattern and the chip when carrying out pressing.Then carry out High Temperature High Pressure with chip pressing to substrate, can observe after pressing with microscope, confirm whether the pressing result accurate, and observe the situation whether the pressing skew is arranged.If drift condition is arranged, then directly estimate the pressing side-play amount by the known width of frame and the overlapping degree of alignment mark.Carry out the adjustment of board by the pressing side-play amount of estimation at last.
If wherein this alignment mark 15 and these aligned pattern 14 complete zero lap situations, please refer to Fig. 3, just when the aligning pressing was very accurate, alignment mark 15 can constitute polygon or driving fit figure between the two with this aligned pattern 14, and can judge then that the pressing side-play amount is 0 this moment.
If when wherein this alignment mark 15 and 14 appearance of this aligned pattern are overlapping, please refer to Figure 10, when just aiming at pressing appearance skew, this moment, alignment mark 15 and this aligned pattern 14 can produce a directive skew between the two.The overlapping degree that can produce this moment by first frame 16 of this alignment mark 15 and this aligned pattern 14 and periphery thereof is to calculate the pressing side-play amount.Because this moment, the width of first frame 16 was a known numeric value 17, so can calculate the alignment mark 15 of chip be offset to first frame 16 and with the known width 17 overlapping situations of first frame 16, so just, can learn the chip pressing side-play amount, the offset direction also can be learnt by pattern shift simultaneously.
With the embodiment of Fig. 2, this aligned pattern is a square pattern, lays respectively at four corners, and the length of side of this square pattern is 30 μ m; It is 4 μ m that first frame 16 of its outer figure has a known width 17, if when producing the pressing skew, as shown in figure 10, alignment mark 15 can overlap situation with this aligned pattern 14 and first frame 16, include downwards and be offset two kinds of situations left as the migration result of Figure 10, offset downward that partly can known width 17 to be arranged partly by the below frame of first frame be 4 μ m, the lap that can calculate the alignment mark 15 and first frame 16 is between 0～4 μ m; It is 4 μ m that skew left partly can partly have a known width 17 by the left border of first frame, the lap that also can calculate the alignment mark 15 and first frame 16 is between 0～4 μ m, just can know the amount and the direction of board skew, the process description that refers again to Fig. 9 is aimed at original value upwards and carry out adjustment to the right with board; The amount of the skew of pressing just can be learnt by microscopical Direct observation.
When if this alignment mark 15 more serious skew occurs with this aligned pattern 14, this moment, this alignment mark 15 may all overlap with this first frame 16, second frame 18 of this aligned pattern 14 and periphery thereof, therefore calculate the pressing side-play amount, the width that can utilize first frame 16 is a known numeric value 17, the lap of adding with the known width 19 of second frame 18 adds up to the total drift amount, and the offset direction also can be learnt by pattern shift simultaneously.
Though in above-mentioned detection method is that embodiment with Fig. 2 does an explanation, but also can use any among Fig. 3～Fig. 8, therefore those of ordinary skill in the art should understand, in detection method of the present invention, aligned pattern is not limited to the square of Fig. 2, frame can be continuous or discontinuous, and two or more frames can be arranged, and the spacing of known width also can be arranged between the frame.
Though the present invention discloses as above with several preferred embodiments; right its is not in order to qualification the present invention, those of ordinary skills, without departing from the spirit and scope of the present invention; when can changing arbitrarily and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (14)
1. aim detecting structure comprises:
Substrate;
Aligned pattern is located on this substrate, the alignment mark complementation on this aligned pattern and the chip; And
First frame has the first known width, is positioned at this aligned pattern periphery.
2. aim detecting structure as claimed in claim 1, wherein this alignment mark and this aligned pattern are complementary fully, and when the pressing side-play amount was 0, both constituted polygon or full graphics.
3. aim detecting structure as claimed in claim 2, wherein this alignment mark is cross, and this aligned pattern comprises the figure of four identical patterns.
4. aim detecting structure as claimed in claim 1 also comprises second frame, has the second known width, is positioned at this first frame periphery, and wherein this first frame and second frame are selected from continuous or discrete frame figure identical or differently.
5. aim detecting structure as claimed in claim 4, wherein this first frame and this second frame have known separation.
6. aim detecting structure as claimed in claim 4, wherein this first frame is close to this second frame.
7. the detection method of an alignment offset amount comprises following steps at least:
Chip with alignment mark is provided;
Substrate with aligned pattern is provided, the alignment mark complementation on this aligned pattern and this chip, this aligned pattern periphery has first frame of known width;
The alignment mark of this chip is aimed at the aligned pattern of this substrate;
With this chip pressing on this substrate; And
Overlapping degree estimation pressing side-play amount by this first frame and this alignment mark.
8. the detection method of alignment offset amount as claimed in claim 7 is wherein utilized the overlapping degree of this first frame of observation by light microscope and this alignment mark.
9. the detection method of alignment offset amount as claimed in claim 7, wherein this alignment mark is cross, and this aligned pattern comprises four identical patterns figures, and this alignment mark and this aligned pattern are complementary fully, when both constituted polygon or full graphics, the pressing side-play amount was 0.
10. the detection method of alignment offset amount as claimed in claim 7 also comprises second frame, has the second known width, is positioned at this first frame periphery, and wherein this first frame and second frame are selected from continuous or discrete frame figure identical or differently.
11. as the detection method of the alignment offset amount of claim 10, wherein the alignment mark of this chip is aimed at pressing with the aligned pattern of this substrate, wherein the overlapping degree by this first frame, this second frame and this alignment mark is to estimate the pressing side-play amount.
12. as the detection method of the alignment offset amount of claim 10, wherein this first frame and this second frame have known separation.
13. as the detection method of the alignment offset amount of claim 10, wherein this first frame is close to this second frame.
14. detection method as the alignment offset amount of claim 10, the frame that also comprises a plurality of known width, be positioned at this first frame periphery, wherein estimate the step of pressing side-play amount, the overlapping degree by estimating this first frame, these a plurality of frames and this alignment mark is with estimation pressing side-play amount.
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| CN2006100682063A CN100406846C (en) | 2006-03-20 | 2006-03-20 | Alignment detection structure and alignment offset detection method |
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| CN2006100682063A CN100406846C (en) | 2006-03-20 | 2006-03-20 | Alignment detection structure and alignment offset detection method |
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| CN1844845A true CN1844845A (en) | 2006-10-11 |
| CN100406846C CN100406846C (en) | 2008-07-30 |
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| CN103884358A (en) * | 2014-03-31 | 2014-06-25 | 北京控制工程研究所 | Digital closed-loop optical fiber gyroscope full-loop detection and simulation test system |
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| CN113192930A (en) * | 2021-04-27 | 2021-07-30 | 上海华虹宏力半导体制造有限公司 | Offset detection structure and method for detecting substrate offset |
| CN114723752A (en) * | 2022-06-07 | 2022-07-08 | 成都新西旺自动化科技有限公司 | High-precision alignment method and system integrating target detection and template matching |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5545570A (en) * | 1995-09-29 | 1996-08-13 | Taiwan Semiconductor Manufacturing Company | Method of inspecting first layer overlay shift in global alignment process |
| JP3047863B2 (en) * | 1997-08-04 | 2000-06-05 | 日本電気株式会社 | Alignment method |
| JP2001265244A (en) * | 2000-03-22 | 2001-09-28 | Toshiba Corp | Flat display device |
| US6366468B1 (en) * | 2000-04-28 | 2002-04-02 | Hewlett-Packard Company | Self-aligned common carrier |
| JP2002162206A (en) * | 2000-11-22 | 2002-06-07 | Toray Eng Co Ltd | Method and device for alignment |
| JP2004334491A (en) * | 2003-05-07 | 2004-11-25 | Seiko Epson Corp | Adhesion position image inspection device, adhesion position image inspection method, manufacturing device of electro-optical device module, manufacturing method of electro-optical device module, manufacturing device of circuit board with electronic component, and manufacturing method of circuit board with electronic component |
-
2006
- 2006-03-20 CN CN2006100682063A patent/CN100406846C/en not_active Expired - Fee Related
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| CN103884358B (en) * | 2014-03-31 | 2016-06-01 | 北京控制工程研究所 | A kind of digital closed-loop optic fiber gyroscope full loop detection and emulation test system |
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| CN104576615B (en) * | 2014-11-28 | 2017-08-15 | 友达光电股份有限公司 | panel device and detection method thereof |
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| CN100406846C (en) | 2008-07-30 |
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