CN1842245A - Electronic assembly with conductive layer and conductive film and its producing method - Google Patents
Electronic assembly with conductive layer and conductive film and its producing method Download PDFInfo
- Publication number
- CN1842245A CN1842245A CN 200510060050 CN200510060050A CN1842245A CN 1842245 A CN1842245 A CN 1842245A CN 200510060050 CN200510060050 CN 200510060050 CN 200510060050 A CN200510060050 A CN 200510060050A CN 1842245 A CN1842245 A CN 1842245A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive
- adhesive film
- knitting
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to an electronic building brick with conductive layer and the conductive bond and the making method. The conductive bond comprises: laminated supporting layer, conductive layer and joint layer, wherein the joint layer is used to joint the conductive layer and attach the conductive bond on the electronic building brick; the supporting layer is moved after the conductive bond attached on the electronic building brick so that the up-and-down surface of the conductive layer can connected with the earth return of the electronic building brick. It also provides a method for making the conductive bond.
Description
Technical field
The present invention is about a kind of electronic building brick and this conductive adhesive film and its manufacture method with conductive layer, especially a kind of conductive adhesive film with good earth effect and anti-electromagnetic interference usefulness, and have the characteristics of thin thickness and low cost of manufacture.
Background technology
Usually pass through conductive adhesive film shield electromagnetic interference noise in the existing electronic equipment, comprise at least one ground plane in the conventional conductive glued membrane, this ground plane is made by metal material usually, but its thinner thickness, in order to support this ground plane, conductive adhesive film generally includes sandwich construction.
Japan Patent discloses 2000-269632 number and discloses a kind of reinforcement screened film, it comprises a basalis, is provided with screen, is provided with reinforced layer in the another side of basalis in the one side of basalis, be provided with the printing loop of strengthening screened film and be placed on the matrix film, after heating and pressurizing is sticked together aforementioned reinforced layer is peeled off.
Japan Patent discloses 2003-298285 number and discloses the another kind of screened film of strengthening, it comprise a basalis, in the one side of basalis be provided with screen, being provided with in the another side of basalis can be from the strengthening membrane of being peeled off by the adhesive layer that thermal endurance and the adhesive agent of anti-the dissolubility constituted.Be pasted with on the matrix film strengthen screened film and flexible printed circuit board (Flexible Printed Circuit, FPC) etc., the conductivity adhesion layer of screen sticks together mutually with the part of grounded circuit, heating and pressurizing is to peel off strengthening membrane afterwards.Aforementioned two Japan Patents expose basalis after being all and peeling off strengthening membrane.This kind structure processing procedure complexity, the cost height, and screen only has a few contact and grounded circuit to electrically connect, the contact resistance height, so shield effectiveness is relatively poor.
United States Patent (USP) the 6th, 768 discloses a kind of flexible printed circuit board No. 052, and it comprises basalis, metal level, and cover layer and Copper Foil, each layer utilize viscose glue to be bonded together, and two layers of conductive material metal level and Copper Foil are used for electromagnetic protection, and Copper Foil is exposed to outer surface.Because this circuit board also needs to adopt sandwich construction, its manufacturing cost is higher, and outside Copper Foil all is exposed in the production and transport process, is scratched easily and influences its capability of electromagnetic shielding.
See also Fig. 1; Japan is big to comprise five-layer structure from the conductive adhesive film product that reaches (Tatsuta) company; at PPS (polyphenylene sulfide; phenylene sulfone) forms the metal level 91 of silver or copper on the basalis 92 of material with sputtering way; the opposite side of metal level 91 applies knitting layer 94; this knitting layer 94 can be a thermosetting epoxy resin; stick release film 95 and supporting layer 93 respectively in the outside of knitting layer 94 and basalis 92, release film 95; supporting layer 93 is respectively applied for to be protected knitting layer 94 and supports and protect conductive adhesive film in transportation and before the processing procedure in transportation.The thickness of metal level 91 is about 1 μ m～1.5 μ m, and the thickness that the thickness of basalis 92 is about 9 μ m, supporting layer 93 is about 30 μ m, and the thickness of knitting layer 94 is about 20～25 μ m, and the thickness of release film 95 is about 30 μ m.When needs are applied to circuit board with above-mentioned conductive adhesive film, supporting layer 93, release film 95 need be removed, thereby knitting layer 94 is attached on the circuit board behind the thermosetting processing procedure.The remaining basalis 92 of this conductive adhesive film this moment, metal level 91 and knitting layer 94 are so its thickness is about 30～35.5 μ m.
This kind structure applications is to circuit board the time; though the basalis of PPS material can be protected metal level because the PPS material can't conduct electricity, metal level only can be by knitting layer via the internal circuit conducting of circuit board to ground connection; make the elongated and impedance of grounding path become big, reduce the screening effectiveness of this conductive adhesive film.In addition, when being applied on the circuit board, comprise this basalis, the thickness of this conductive adhesive film can't further be reduced, do not meet the frivolous trend of present electronic product requirement, and use PPS material cost higher owing to this conductive adhesive film.
Summary of the invention
Main purpose of the present invention is to provide a kind of electronic building brick with conductive layer, and it has splendid ground connection and anti-electromagnetic interference effect.
Another object of the present invention is to provide a kind of conductive adhesive film, its thin thickness and have splendid ground connection and anti-electromagnetic interference effect, and can reduce manufacturing cost.
Another purpose of the present invention is to provide a kind of method in order to the conductive adhesive film of making an anti-electromagnetic interference, and its processing procedure is simple, cost is low.
Conductive adhesive film provided by the present invention, it includes supporting layer, conductive layer and the knitting layer that stacks gradually together, knitting layer is used to engage conductive layer and conductive adhesive film is attached at a circuit board, conductive adhesive film after being attached at circuit board removes supporting layer, thereby makes the upper and lower surface of conductive layer all can reach electrical the contact with the grounded circuit of circuit board.
Wherein supporting layer can be the thermo-labile material of microviscosity and makes, as PET (Polyethylen-theraphthalat, polyester) material; Conductive layer can be electric conducting materials such as silver, copper and makes, and is plated on the supporting layer with methods such as metallide (water plating), evaporation or sputters.If needed, anti oxidation layer can be set in addition between conductive layer and supporting layer.Conductive layer can also be an aluminium foil, attaches on the supporting layer in the mode of direct attaching.Knitting layer is made by epoxy resin (Epoxy), wherein contains many small conductive particles, and one deck release liners also can be pasted in the knitting layer outside, to protect knitting layer not by foreign substance pollution.Wherein each layer thickness can be: supporting layer is about that 30 μ m, conductive layer are about 3 μ m, knitting layer is about 15～25 μ m.If conductive layer is an aluminium foil, then conductive layer thickness is about 6 μ m.
The present invention also provides a kind of manufacture method of conductive adhesive film of anti-electromagnetic interference, comprises the steps:
Step 1: the conductive layer of plate silver or copper on supporting layer;
Step 2: the knitting layer that on conductive layer, applies one deck epoxide resin material;
Step 3: epoxy resin is carried out a specific program.This program can be a heating schedule, as inciting somebody to action
Epoxy resin is heated to one first temperature range, and this first temperature range can be 40 ℃～130 ℃.
Wherein before being coated with the step of conductive layer, can between supporting layer and conductive layer, plate one deck anti oxidation layer earlier earlier, conductive layer can be electric conducting materials such as silver, copper, adopts methods such as metallide, evaporation or sputter to be coated with on the supporting layer, and anti oxidation layer then can be selected nickel for use.Knitting layer is made by epoxy resin, wherein contains several small conductive particles.
If conductive layer adopts aluminium foil, then the manufacture method of the conductive adhesive film of anti-electromagnetic interference comprises the steps:
Step 1: aluminium foil is attached on the supporting layer;
Step 2: the knitting layer that on conductive layer, applies one deck epoxide resin material;
Step 3: epoxy resin is carried out a specific program.This program can be a heating schedule, as inciting somebody to action
Epoxy resin is heated to one first temperature range, and this first temperature range can be 40 ℃～130 ℃.
Compare with known techniques, but the conductive layer of conductive adhesive film provided by the present invention is in the equal ground connection of upper and lower surface, so shield effectiveness is good, and because conductive adhesive film has only knitting layer and conductive layer to exist when user mode, so thickness conductive adhesive film more of the prior art is thin, and cost is lower.
Description of drawings
Fig. 1 is known conductive adhesive film product schematic diagram.
Fig. 2 is the generalized section of conductive adhesive film of the present invention.
Fig. 3 is the schematic diagram of conductive adhesive film of the present invention when attaching on the circuit board.
Fig. 4 is the schematic diagram of conductive adhesive film after heating as shown in Figure 3.
Fig. 5 is a schematic diagram of removing supporting layer after conductive adhesive film of the present invention is attached on the circuit board.
Embodiment
See also Fig. 2, the conductive adhesive film of anti-electromagnetic interference of the present invention has supporting layer 31, conductive layer 32 and knitting layer 33, and this three-decker stacks gradually.Wherein supporting layer 31 is that the thermo-labile material of microviscosity is made, as PET (Polyethylen-theraphthalat, polyester) material, when knitting layer 33 when the thermosetting processing procedure is bonded on the circuit board, because the supporting layer material is thermo-labile, so supporting layer 31 can produce deflection and can't keep fitting tightly with conductive layer 32 when the thermosetting processing procedure, therefore can behind the thermosetting processing procedure, it be removed, and make conductive layer 32 be exposed to the outside.Conductive layer 32 is for to be plated on silver (Ag), copper electric conducting materials such as (Cu) on the supporting layer 31 in modes such as metallide, evaporation or sputters.For increasing the non-oxidizability and the resistance to wear of conductive layer 32, also can above conductive layer 32, plate an anti-oxidant metal layer (not shown) in addition.This anti-oxidant metal layer can be oxidation-resistant metallic materials such as nickel, and conductive layer 32 also can be an aluminium foil, attaches on the supporting layer 31 in the mode of direct attaching.Knitting layer 33 can be epoxy resin (Epoxy) material and makes, and wherein contains several small conductive particles.One deck release liners (not shown) also can be pasted in the outside of knitting layer 33, with protection knitting layer 33 transportation when depositing not by foreign substance pollution.
The manufacture method of conductive adhesive film of the present invention comprises the steps:
Step 1: the conductive layer 32 of plate silver or copper on supporting layer 31;
Step 2: the knitting layer 33 that on conductive layer 32, applies one deck epoxide resin material;
Step 3: epoxy resin is carried out a specific program.This program can be a heating schedule, and as epoxy resin being heated to one first temperature range, this first temperature range can be 40 ℃～130 ℃.
In the step 1 of said method, also can on supporting layer 31, plate one deck anti oxidation layer (as nickel etc.) earlier, and then carry out silver-plated or copper-plated step; After step 3, also can paste one deck release liners to protect knitting layer 33 not contaminated in the outside of knitting layer 33.
If adopt aluminium foil as conductive layer, then the manufacture method of conductive adhesive film comprises the steps:
Step 1: aluminium foil is attached on the supporting layer 32;
Step 2: the knitting layer 33 that on conductive layer, applies one deck epoxide resin material;
Step 3: epoxy resin is carried out a specific program.This program can be a heating schedule, and as epoxy resin being heated to one first temperature range, this first temperature range can be 40 ℃～130 ℃.
After the step 3 of said method, also can paste one deck release liners to protect knitting layer 33 not contaminated in the outside of knitting layer 33.
See also Fig. 3,4, when using conductive adhesive film of the present invention, at first the knitting layer 33 with conductive adhesive film fits on the circuit board 34, this conductive adhesive film is heated to one second temperature range, between 180 ℃～220 ℃, in a special time, keep this temperature range, as 30 minutes, and simultaneously conductive adhesive film is applied the pressure to the circuit board direction, as 100 kilograms/square centimeter, make epoxy resin cure and fit on the circuit board 34, the conductive particle (not shown) in the epoxy resin makes conductive layer 32 and the earth point 35 on the circuit board reach electric connection.Supporting layer 31 can produce deflection and can't keep fitting tightly with conductive layer 32 when the thermosetting processing procedure, therefore can behind the thermosetting processing procedure it be removed, and makes conductive layer 32 be exposed to the outside.Therefore, conductive layer 32 is promptly reached electric connection with the grounded circuit on the circuit board.When the circuit board 34 of above-mentioned attaching conductive adhesive film is applied to electronic equipment,, therefore also can be connected to grounded circuit by outer surface institute contacting electronic apparatus casing or other mechanism's part because conductive layer 32 is exposed to the outer surface of this conductive adhesive film.
As shown in Figure 5, conductive adhesive film of the present invention is behind the thermosetting processing procedure, because supporting layer 31 can produce deflection and be torn off, therefore only remaining conductive layer 32 is attached on the circuit board 34 with knitting layer 33.Conductive layer 32 can be reached electric connection by conductive particle in the epoxy resin and the earth point on the circuit board 35, and outside conductive layer 32 is exposed to, therefore also can utilize the surface of conductive layer 32 and the electric connection that other mechanism's part is reached ground connection, so its ground connection effect is splendid.
Because but the conductive layer 32 of conductive adhesive film of the present invention is in the equal ground connection of upper and lower surface, so shield effectiveness is good, and owing to this conductive adhesive film after being attached on the circuit board through the thermosetting processing procedure, supporting layer 31 can be removed, only remaining knitting layer 33 of this conductive adhesive film this moment and conductive layer 32 are so thickness is thin than known techniques.According to the conductive adhesive film of the inventive method manufacturing, the better embodiment of its each layer thickness is: supporting layer 31 is about that 30 μ m, conductive layer 32 are about 3 μ m, knitting layer 33 is about 15～25 μ m.If conductive layer 32 is an aluminium foil, then its thickness is about 6 μ m.When conductive adhesive film of the present invention was applied on the circuit board, only remaining at last conductive layer and knitting layer were so its thickness is about 18～28 μ m.If conductive layer adopts aluminium foil, then its final thickness is about 21～31 μ m.
Claims (31)
1. electronic building brick that is attached with conductive layer, one surface of this conductive layer forms with the grounded circuit on this electronic building brick and electrically connects, it is characterized in that: another surface exposure of this conductive layer in outside, but another grounding path of conducting is to reach electric connection with grounded circuit.
2. electronic building brick as claimed in claim 1 is characterized in that: this conductive layer is engaged on this electronic building brick by a knitting layer, and forms electric connection via the grounded circuit on this knitting layer and this electronic building brick.
3. electronic building brick as claimed in claim 2 is characterized in that: this knitting layer is that epoxy resin (Epoxy) material is made, and contains many small conductive particles in this knitting layer.
4. electronic building brick as claimed in claim 1 is characterized in that: this conductive layer is made with metal material.
5. electronic building brick as claimed in claim 1 is characterized in that: this electronic building brick is a circuit board.
6. conductive adhesive film, be applied to as on the claim 1 described electronic building brick, this conductive adhesive film comprises a conductive layer and a knitting layer, it is characterized in that: this knitting layer is used to engage this conductive layer and this conductive adhesive film is attached at this electronic building brick, and lower surface all can be reached electric connection with the grounded circuit of this electronic building brick on this conductive layer.
7. conductive adhesive film as claimed in claim 6 is characterized in that: this conductive layer is an aluminium foil.
8. conductive adhesive film as claimed in claim 6 is characterized in that: this knitting layer is that epoxy resin (Epoxy) material is made, and contains many small conductive particles in this knitting layer.
9. conductive adhesive film as claimed in claim 6 is characterized in that: one deck release liners is posted in this knitting layer outside in addition, and is not contaminated with protection knitting layer before being attached at this electronic building brick.
10. conductive adhesive film as claimed in claim 6 is characterized in that: this conductive adhesive film is before being attached on this electronic building brick, and other comprises a supporting layer, and this supporting layer is attached on this conductive layer.
11. conductive adhesive film as claimed in claim 10 is characterized in that: this supporting layer is that tool microviscosity and heat labile material are made.
12. conductive adhesive film as claimed in claim 11 is characterized in that: this supporting layer is that PET (Polyethylen-theraphthalat, polyester) material is made.
13. conductive adhesive film as claimed in claim 10 is characterized in that: this conductive layer forms in the wherein a kind of mode in metallide, evaporation and the sputtering way.
14. conductive adhesive film as claimed in claim 10 is characterized in that: comprise that also the formed anti oxidation layer of an anti-oxidation metal is formed between this conductive layer and this supporting layer.
15. conductive adhesive film as claimed in claim 14 is characterized in that: this anti-oxidation metal is a nickel.
16. a method of making conductive adhesive film, this conductive adhesive film comprise a supporting layer, a conductive layer and a knitting layer, this method may further comprise the steps:
1) this conductive layer of plating on this supporting layer;
2) on this conductive layer, apply this knitting layer;
3) this knitting layer is carried out a specific program.
17. method as claimed in claim 16 is characterized in that: this supporting layer is that tool microviscosity and heat labile material are made.
18. method as claimed in claim 17 is characterized in that: this supporting layer is that PET (Polyethylen-theraphthalat, polyester) material is made.
19. method as claimed in claim 16 is characterized in that: before the plating conductive layer, elder generation's plating one deck anti-oxidation metal on supporting layer.
20. method as claimed in claim 19 is characterized in that: this anti-oxidation metal is a nickel.
21. method as claimed in claim 16 is characterized in that: this conductive layer forms in the one kind of mode in metallide, evaporation and the sputtering way.
22. method as claimed in claim 16 is characterized in that: this knitting layer is that epoxy resin (Epoxy) material is made, and contains many small conductive particles in this knitting layer.
23. method as claimed in claim 16 is characterized in that: this specific program is a heating schedule.
24. method as claimed in claim 23 is characterized in that: this heating schedule is for to be heated to 40 ℃～130 ℃ with this knitting layer.
25. a method of making conductive adhesive film, this conductive adhesive film comprise a supporting layer, a conductive layer and a knitting layer, this method may further comprise the steps:
1) this conductive layer is attached on this supporting layer;
2) on this conductive layer, apply this knitting layer;
3) this knitting layer is carried out a specific program.
26. method as claimed in claim 25 is characterized in that: this conductive layer is an aluminium foil.
27. method as claimed in claim 25 is characterized in that: this supporting layer is that tool microviscosity and heat labile material are made.
28. method as claimed in claim 27 is characterized in that: this supporting layer is that PET (Polyethylen-theraphthalat, polyester) material is made.
29. method as claimed in claim 25 is characterized in that: this knitting layer is that epoxy resin (Epoxy) material is made, and contains many small conductive particles in this knitting layer.
30. method as claimed in claim 25 is characterized in that: this specific program is a heating schedule.
31. method as claimed in claim 30 is characterized in that: this heating schedule is for to be heated to 40 ℃～130 ℃ with this knitting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510060050 CN1842245A (en) | 2005-03-28 | 2005-03-28 | Electronic assembly with conductive layer and conductive film and its producing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510060050 CN1842245A (en) | 2005-03-28 | 2005-03-28 | Electronic assembly with conductive layer and conductive film and its producing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1842245A true CN1842245A (en) | 2006-10-04 |
Family
ID=37031042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510060050 Pending CN1842245A (en) | 2005-03-28 | 2005-03-28 | Electronic assembly with conductive layer and conductive film and its producing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1842245A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889197A (en) * | 2012-12-21 | 2014-06-25 | 财团法人工业技术研究院 | Shielding composite membrane |
| CN104527170A (en) * | 2014-12-16 | 2015-04-22 | 苏州城邦达力材料科技有限公司 | Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film |
| CN108300359A (en) * | 2016-09-19 | 2018-07-20 | 东莞爵士先进电子应用材料有限公司 | High conductivity adhesive tape and preparation method thereof |
-
2005
- 2005-03-28 CN CN 200510060050 patent/CN1842245A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889197A (en) * | 2012-12-21 | 2014-06-25 | 财团法人工业技术研究院 | Shielding composite membrane |
| CN103889197B (en) * | 2012-12-21 | 2016-12-28 | 财团法人工业技术研究院 | Shielding composite membrane |
| CN104527170A (en) * | 2014-12-16 | 2015-04-22 | 苏州城邦达力材料科技有限公司 | Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film |
| CN108300359A (en) * | 2016-09-19 | 2018-07-20 | 东莞爵士先进电子应用材料有限公司 | High conductivity adhesive tape and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101561132B1 (en) | Shield film for printed wiring board, and printed wiring board | |
| KR101405361B1 (en) | Electromagnetic shielding materials for fpc | |
| CN1095173C (en) | Rigid/flex printed circuit board and manufacturing method therefor | |
| KR101607552B1 (en) | Electromagnetic-wave shielding material, and printed-wiring board | |
| CN200983717Y (en) | Intensity compensation structure for flexible circuit board and flexible circuit board with intensity compensation structure | |
| CN1302179A (en) | Method for producing multilayer printed circuit board using adhesive film | |
| CN1867226A (en) | Method of manufacturing wiring circuit board | |
| CN1956629A (en) | Flexible printed circuit board and its manufacturing method | |
| US20060197176A1 (en) | Electronic subassembly having conductive layer, conductive film and method of making the same | |
| CN105246313B (en) | A kind of electromagnetic shielding film, the preparation method containing the printed wiring board of the screened film and the wiring board | |
| JP2002535808A (en) | Electrical connections for electrochemical and photoelectrochemical cells | |
| JP2016063117A (en) | Electromagnetic wave shield film, electromagnetic wave shield film-attached flexible printed wiring board, and manufacturing methods thereof | |
| CN111163623A (en) | Shielding film with multilayer metal structure | |
| JP2004273577A (en) | Shield film and its manufacturing method | |
| JP2864270B2 (en) | Multilayer wiring board and method of manufacturing the same | |
| CN1842245A (en) | Electronic assembly with conductive layer and conductive film and its producing method | |
| KR20180064349A (en) | Multilayered ceramic capacitor, and method for manufacturing the same | |
| WO2017077933A1 (en) | Film for transparent conductive layer lamination, method for producing same, and transparent conductive film | |
| KR101311443B1 (en) | Electromanetic wave shielding film and preparing method thereof | |
| CN210130065U (en) | Shielding film with multilayer metal structure | |
| EP2426735A1 (en) | Conductive adhesive member and solar cell module | |
| JP2006007589A (en) | Laminated film with metallic film and adhesive layer and method for manufacturing laminated film | |
| KR101411978B1 (en) | The fabrication method of adhesive tape for thin electromagnetic shield with color layer in polymer film and adhesive tape thereby | |
| CN1875669A (en) | Printed circuit board including track gap-filled resin and fabricating method thereof | |
| JP2003060387A (en) | Electromagnetic shielding material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |