CN1817071A - 使用无Pb焊料的回流焊接方法以及混载实装方法和结构体 - Google Patents

使用无Pb焊料的回流焊接方法以及混载实装方法和结构体 Download PDF

Info

Publication number
CN1817071A
CN1817071A CNA2004800186749A CN200480018674A CN1817071A CN 1817071 A CN1817071 A CN 1817071A CN A2004800186749 A CNA2004800186749 A CN A2004800186749A CN 200480018674 A CN200480018674 A CN 200480018674A CN 1817071 A CN1817071 A CN 1817071A
Authority
CN
China
Prior art keywords
free solder
reflow soldering
solder alloy
circuit substrate
mounting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800186749A
Other languages
English (en)
Chinese (zh)
Inventor
中塚哲也
高野信英
菅原贞幸
大村智之
佐伯敏男
芹泽弘二
石原昌作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Communication Technologies Ltd
Original Assignee
Hitachi Ltd
Hitachi Communication Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Communication Technologies Ltd filed Critical Hitachi Ltd
Publication of CN1817071A publication Critical patent/CN1817071A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
CNA2004800186749A 2003-07-01 2004-07-01 使用无Pb焊料的回流焊接方法以及混载实装方法和结构体 Pending CN1817071A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003189290A JP2005026393A (ja) 2003-07-01 2003-07-01 Ｐｂフリーはんだ合金を用いたリフローはんだ付け方法および混載実装方法並びに混載実装構造体
JP189290/2003 2003-07-01

Publications (1)

Publication Number Publication Date
CN1817071A true CN1817071A (zh) 2006-08-09

Family

ID=33562282

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800186749A Pending CN1817071A (zh) 2003-07-01 2004-07-01 使用无Pb焊料的回流焊接方法以及混载实装方法和结构体

Country Status (5)

Country Link
US (1) US20060239855A1 (ja)
JP (1) JP2005026393A (ja)
KR (1) KR100671394B1 (ja)
CN (1) CN1817071A (ja)
WO (1) WO2005004564A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102222630A (zh) * 2011-06-03 2011-10-19 中国科学院上海微系统与信息技术研究所 一种制备Sn-Ag-In三元无铅倒装凸点的方法
CN102625596A (zh) * 2011-01-28 2012-08-01 纬创资通股份有限公司 焊接插件式元件于电路板的方法及焊接系统
CN101960931B (zh) * 2008-04-10 2012-09-05 松下电器产业株式会社 流焊装置和流焊方法
CN103307572A (zh) * 2012-03-07 2013-09-18 欧司朗股份有限公司 模块及其制造方法和配有该模块的照明装置
CN105592972A (zh) * 2013-08-05 2016-05-18 千住金属工业株式会社 无铅软钎料合金
CN108422151A (zh) * 2017-06-15 2018-08-21 甘肃虹光电子有限责任公司 一种捷变频磁控管“热卡”的解决方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
JP4595835B2 (ja) 2006-03-07 2010-12-08 株式会社日立製作所 鉛フリーはんだを用いたリード付き電子部品
JP2009200411A (ja) * 2008-02-25 2009-09-03 Mitsubishi Electric Corp はんだ接合部、プリント配線板およびはんだの接合方法
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
JP5168156B2 (ja) * 2009-01-08 2013-03-21 株式会社デンソーウェーブ Ｂｇａ搭載用基板
JP5339968B2 (ja) * 2009-03-04 2013-11-13 パナソニック株式会社 実装構造体及びモータ
US8598464B2 (en) 2009-04-20 2013-12-03 Panasonic Corporation Soldering material and electronic component assembly

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03204193A (ja) * 1989-12-29 1991-09-05 Aisin Seiki Co Ltd 半田材料
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
US5752182A (en) * 1994-05-09 1998-05-12 Matsushita Electric Industrial Co., Ltd. Hybrid IC
JP2001244622A (ja) * 2000-03-01 2001-09-07 Hitachi Ltd 電子回路装置
JP2002261104A (ja) * 2001-03-01 2002-09-13 Hitachi Ltd 半導体装置および電子機器
JP4073183B2 (ja) * 2001-08-01 2008-04-09 株式会社日立製作所 Ｐｂフリーはんだを用いた混載実装方法及び実装品

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101960931B (zh) * 2008-04-10 2012-09-05 松下电器产业株式会社 流焊装置和流焊方法
CN102625596A (zh) * 2011-01-28 2012-08-01 纬创资通股份有限公司 焊接插件式元件于电路板的方法及焊接系统
US8690041B2 (en) 2011-01-28 2014-04-08 Wistron Corporation Method and soldering system of soldering a DIP component on a circuit board
US8740046B2 (en) 2011-01-28 2014-06-03 Wistron Corporation Soldering system of soldering a dip component on a circuit board
CN102625596B (zh) * 2011-01-28 2014-12-10 纬创资通股份有限公司 焊接插件式元件于电路板的方法及焊接系统
CN102222630A (zh) * 2011-06-03 2011-10-19 中国科学院上海微系统与信息技术研究所 一种制备Sn-Ag-In三元无铅倒装凸点的方法
CN103307572A (zh) * 2012-03-07 2013-09-18 欧司朗股份有限公司 模块及其制造方法和配有该模块的照明装置
CN105592972A (zh) * 2013-08-05 2016-05-18 千住金属工业株式会社 无铅软钎料合金
TWI648408B (zh) * 2013-08-05 2019-01-21 日商千住金屬工業股份有限公司 Lead-free solder alloy
CN108422151A (zh) * 2017-06-15 2018-08-21 甘肃虹光电子有限责任公司 一种捷变频磁控管“热卡”的解决方法
CN108422151B (zh) * 2017-06-15 2019-05-31 甘肃虹光电子有限责任公司 一种捷变频磁控管“热卡”的解决方法

Also Published As

Publication number Publication date
WO2005004564A1 (ja) 2005-01-13
KR100671394B1 (ko) 2007-01-22
KR20060052719A (ko) 2006-05-19
US20060239855A1 (en) 2006-10-26
JP2005026393A (ja) 2005-01-27

Similar Documents

Publication Publication Date Title
CN1295783C (zh) 电子装置
CN1978122B (zh) 高温焊锡和高温焊锡膏材料以及功率半导体装置
JP4817418B2 (ja) 回路装置の製造方法
CN1269612C (zh) 焊锡箔、半导体器件、电子器件、半导体组件及功率组件
EP2692478B1 (en) Lead-free solder ball
CN104602862B (zh) 无铅焊料球
CN1817071A (zh) 使用无Pb焊料的回流焊接方法以及混载实装方法和结构体
CN1443625A (zh) 焊料
EP0875331A2 (en) Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
TWI494441B (zh) Bi-Sn high temperature solder alloy
CN1186009A (zh) 软钎料及使用该软钎料的电子器件
JP5707886B2 (ja) パワーモジュール用基板、冷却器付パワーモジュール用基板、パワーモジュールおよびパワーモジュール用基板の製造方法
CN1301049C (zh) 锡焊方法及焊接结构体
KR20160046808A (ko) 접합체 및 파워 모듈용 기판
CN101374630B (zh) 焊料合金、焊球及使用了它们的焊料接合部
CN1558960A (zh) 用于高温无铅焊料的改良的组成物、方法和装置
US7413110B2 (en) Method for reducing stress between substrates of differing materials
CN1384699A (zh) 焊锡接合方法,用该方法制作的电子电路基板及电子装置
TW200819012A (en) Mounting structure
CN1200316A (zh) 焊料和使用该焊料的电子部件
CN1531472A (zh) 钎料合金和钎焊接头
KR100808746B1 (ko) 회로 장치의 제조 방법
JP5724088B2 (ja) 金属フィラー及びこれを含む鉛フリーはんだ
CN1605427A (zh) 无铅焊接合金和焊接材料以及使用这些材料的焊接接点
JP2004034134A (ja) 線はんだおよび電子機器の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication