CN1796133A - Process for manufacturing liquid ejection head - Google Patents
Process for manufacturing liquid ejection head Download PDFInfo
- Publication number
- CN1796133A CN1796133A CNA2005101361192A CN200510136119A CN1796133A CN 1796133 A CN1796133 A CN 1796133A CN A2005101361192 A CNA2005101361192 A CN A2005101361192A CN 200510136119 A CN200510136119 A CN 200510136119A CN 1796133 A CN1796133 A CN 1796133A
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- Prior art keywords
- resin layer
- soluble resin
- substrate
- liquid
- generating element
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- 239000007788 liquid Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000010410 layer Substances 0.000 claims abstract description 56
- 229920005989 resin Polymers 0.000 claims abstract description 54
- 239000011347 resin Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000011241 protective layer Substances 0.000 claims abstract description 24
- 239000007864 aqueous solution Substances 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000009832 plasma treatment Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 36
- 238000010438 heat treatment Methods 0.000 description 22
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- 239000007921 spray Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000004528 spin coating Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012472 biological sample Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/05—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers produced by the application of heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
Abstract
A process includes forming a protective layer in a region of a substrate including a PAD electrode; forming a soluble resin layer in a region including a region on the substrate where an energy generating element has been formed, for forming a liquid chamber; forming a coating resin layer in a region covering the soluble resin layer and a region where an opening is formed above the electrode; forming an opening in the coating resin layer above the energy generating element to form a nozzle; dipping the substrate in an dissolving liquid to dissolve the soluble resin layer; and removing the protective layer after dissolution of the soluble resin layer.
Description
Technical field
The present invention relates to a kind of manufacture method of jet head liquid, this jet head liquid is included as the nozzle that forms from the fluid chamber atomizing of liquids.More specifically, the present invention relates to a kind ofly allow soluble resin layer safety to dissolve and prevent the technology that the electrode on the substrate is corroded.
Background technology
Celebrated technology a kind of commonly used comprises and utilizes energy generating element to spray the China ink that is included in black chamber by nozzle with the form of ink droplet with the technology of the ink gun that is used for ink-jet printer (jet head liquid a type), thereby ink droplet is landed on the recording medium that is oppositely arranged with black jeting surface, arrange the point that is essentially circular, thus character, image etc. is expressed as a picture with latticed form such as printing paper etc.
The example of known black spraying system comprises the hot system that wherein utilizes heating element heater (heating resistor) to spray China ink by heat energy as energy generating element, and the piezoelectric system of wherein utilizing piezoelectric element to spray China ink as energy generating element by the deformation of vibrating reed, or the like.In any system, the China ink that is included in the black chamber sprays by nozzle.
Thereby each flow channel that the structure of such jet head liquid comprises fluid chamber, be arranged on energy generating element in each fluid chamber, be arranged on nozzle on the energy generating element, be communicated with separately fluid chamber, be communicated to each flow channel to public flow channel of its supply liquid or the like.
The known method that is used to make such ink gun for example comprises: be provided with thereon on the substrate of energy generating element the soluble resin layer is formed black chamber pattern, this soluble resin layer can be follow-up dissolved; Coating resin solution is to form resinous coat on the soluble resin layer that forms black chamber pattern; And, in described resinous coat, form nozzle and with the dissolving of the soluble resin layer under the described resinous coat to form black chamber (reference, for example open No.59-274689 of Japanese Unexamined Patent Application).
Summary of the invention
Yet above-mentioned technology has following problem:
As utilizing the assessment result of printing by the jet head liquid of above-mentioned technology manufacturing, might owing to from some nozzle not liquid droplets informal voucher (white stripes) appears.Therefore, dismantle and analyzed this ink gun.Found that, should pass through to dissolve and the partly dissolving of maintenance in flow channel of removed substantially soluble resin layer, stoped the mobile of China ink thus and formed its China and Mexico less than the part that reaches nozzle.
Therefore, studied the dissolving liquid that to remove the soluble resin layer fully.Found that the developer that is used for photoresists by use is as dissolving liquid, the soluble resin layer can be dissolved fully and do not stay not dissolving part and do not damage resinous coat that wherein said photoresists are used for described soluble resin layer.
Yet because mainly the PAD electrode that is made of aluminium (Al) contacts with dissolving liquid, the developer that is used for photosensitive resin has the problem of corroding this PAD electrode, because developer is alkaline aqueous solution (tetramethylammonium hydroxide 2% to 3% the aqueous solution).
Therefore, the required manufacture method that provides a kind of jet head liquid, this method can dissolve the soluble resin layer fully and can be owing to the dissolving liquid that is used for this soluble resin layer the corroding electrode part, prevent defective thus such as flow channel obstruction etc.
According to one embodiment of present invention, provide a kind of manufacture method of jet head liquid, this jet head liquid comprises: be formed on the energy generating element on the substrate, be used for applying energy to liquid; The fluid chamber of holding described energy generating element and liquid that will be injected; Be used for spraying the nozzle of the liquid that is contained in described fluid chamber; And, be formed on the electrode on the described substrate, be used to realize and outside being electrically connected.Described method comprises: form protective layer in comprising the substrate zone of described electrode; In the zone that comprises the substrate zone that forms described energy generating element, form the soluble resin layer, to be used to form described fluid chamber; In covering the zone of described soluble resin layer and be to form on the described electrode in the zone of opening and form resinous coat; Form opening in the resinous coat on described energy generating element to form described nozzle; Described substrate is immersed in the dissolving liquid to dissolve described soluble resin layer; And, after described soluble resin layer dissolving, remove described protective layer.
According to embodiments of the invention, on described electrode, formed protective layer, therefore when the described soluble resin layer of dissolving, the covering of electrode protected seam has prevented thus owing to the dissolving liquid that is used for the soluble resin layer corrodes described electrode.Therefore, the soluble resin layer is dissolved safely and is not had the corrosion that notes electrode.And, after dissolving soluble resin layer, remove protective layer.Therefore, electrode is protected safely.
According to the manufacture method of the jet head liquid of the embodiment of the invention, prevented corroding electrode owing to be used for the dissolving liquid of soluble resin layer.Therefore, for example can be with alkaline aqueous solution as dissolving liquid, and remove the soluble resin layer fully and can not leave over the residue of this soluble resin layer.Therefore, can provide the jet head liquid that does not cause flow channel obstruction etc.
Description of drawings
Fig. 1 illustrates by the sectional view of the ink gun of method manufacturing according to an embodiment of the invention;
Fig. 2 illustrates the sectional view that wherein forms the state of protective layer on the PAD electrode;
Fig. 3 illustrates the sectional view that wherein forms the state of adhesion layer on the whole surface of the substrate that comprises the PAD electrode;
Fig. 4 illustrates the sectional view that wherein forms the state of soluble resin layer on heating element heater;
Fig. 5 illustrates the sectional view that wherein forms resin-coated state on the soluble resin layer;
Fig. 6 illustrates wherein to dissolve the sectional view of soluble resin layer with the state that forms black chamber and individual flow passage; And
Fig. 7 is the sectional view that the state of wherein having removed protective layer is shown.
The specific embodiment
Hereinafter with reference to accompanying drawing embodiments of the invention are described.
Jet head liquid by method manufacturing according to an embodiment of the invention is corresponding to the ink gun 10 that is used for ink-jet printer.In the present embodiment, China ink is as liquid, and China ink is contained in each black chamber 14.In the present embodiment, heating element heater (heating resistor) 12 is used as energy generating element and is arranged on the substrate 11.Certainly, jet head liquid is not limited to present embodiment.
As shown in Figure 1, in ink gun 10, heating element heater 12 is arranged on the substrate 11.A plurality of heating element heaters 12 be arranged in parallel with predetermined space on the direction perpendicular to accompanying drawing.For example, in the ink gun 10 with 600DPI resolution ratio, heating element heater 12 is arranged with the spaced and parallel of 42.3 μ m.
And resinous coat 35 is formed on the heating element heater 12 on the substrate 11.Resinous coat 35 has the predetermined space that is formed on the heating element heater 12 to form black chamber 14.In addition, thus forming each flow channel 15 is communicated in separately black chamber 14.Each flow channel 15 also is communicated in the following public flow channel 23 that will describe.
In addition, nozzle 18 is formed in the resinous coat 35 on each heating element heater 12.
In the ink gun 10 with above-mentioned structure, the China ink of supplying by supply opening 22 is transported to black chamber 14 by public flow channel 23 and each flow channel 15.
On the other hand, control the driving of heating element heater 12 by the control module (not shown), make when heating element heater 12 is heated rapidly, produce bubble on the heating element heater 12 in black chamber 14, and, China ink is sprayed with the form of ink droplet from nozzle 18 by the suspending power (flying force) that the growth owing to bubble produces.Each black chamber 14 is filled with and the corresponding China ink amount of the amount of the drop that is sprayed from corresponding each flow channel 15.
Below, will the manufacture method of ink gun according to another embodiment of the present invention be described.
At first, as shown in Figure 2, utilize the retrofit technology that for example is used for semiconductor and electronic device on the substrate of making by silicon, glass, pottery etc. 11, to form heating element heater 12 (corresponding to energy generating element).
And, on substrate 11, form the PAD electrode 31 that constitutes by photoresists.
Then, on PAD electrode 31, form protective layer 32.Thereby protective layer 32 forms on PAD electrode 31 by spin coating and photoetching composition and stays a skim.The thickness of protective layer is about 1 to 2 μ m.
Replace as shown in Figure 2 only formed protective layer 32 in the zone that covers PAD electrode 31; can on the whole surface of the substrate 11 that comprises PAD electrode 31, apply the adhesion layer 33 that constitutes by photoresists by spin coating etc.; thereby and by photoetching its composition is stayed a skim on the PAD electrode, as shown in Figure 3.Form this adhesion layer 33 to be used to increase substrate 11 and following with the adhesiveness between the resinous coat of describing 35.In this case, adhesion layer 33 can be as the protective layer 32 of PAD electrode 31.
Then, as shown in Figure 4, on the zone that comprises heating element heater 12, apply soluble resin layer 34 (sacrifice layer) by spin coating etc., and by photoetching to its composition to form the flow channel pattern.This soluble resin layer 34 is as the part that forms black chamber 14 and each flow channel 15.
Then, as shown in Figure 5, on the whole basically surface of the substrate 11 that comprises soluble resin layer 34, apply the resinous coat 35 that for example constitutes by photoresists by spin coating etc.Then, in resinous coat 35, form nozzle 18 (spray-hole) by photoetching thus make its be positioned at each heating element heater 12 directly over.In this case, as shown in Figure 5, thereby form opening 36 in the resinous coat 35 of design photomask on PAD electrode 31 in advance.
Then, for example utilizing, scriber etc. cuts into each chip with substrate 11.In this case, carry out cutting and make at least a portion of line of cut and soluble resin layer 34 overlap, expose soluble resin layer 34 thus in the part after cutting.
Next, thereby the gained chip is immersed in the dissolving liquid that is used for soluble resin layer 34 and begins to dissolve soluble resin layer 34 from the part (left end Fig. 5) of the soluble resin layer 34 that is exposed, only stay resinous coat 35 as the structure on the substrate 11, as shown in Figure 6.As a result, once existed therein in the part of soluble resin layer 34 to have formed the space, and in ink gun 10, formed black chamber 14 and each flow channel 15.
As dissolving liquid, use alkaline aqueous solution (for example 2% of tetramethylammonium hydroxide to 3% the aqueous solution), this alkaline aqueous solution developer that acts on the soluble resin layer.In this case, soluble resin layer 34 is dissolved fully and do not stayed the soluble resin layer in flow channel.And, owing to cover PAD electrode 31 with protective layer 32, so PAD electrode 31 is not corroded by alkaline aqueous solution.
Then, as shown in Figure 7, the pattern that utilizes resinous coat 35 is as mask, by the whole surface removal protective layer 32 of oxygen plasma treatment from substrate 11.As mentioned above; protective layer 32 has the thickness of about 1 to 2 μ m; this thickness is significantly less than the thickness (about 20 μ m) of resinous coat 35, and the oxygen plasma treatment on the whole surface of substrate 11 can not lost resinous coat 35, as long as this processing is carried out being used to remove under the condition of protective layer 32.As a result, expose PAD electrode 31.Although protective layer 32 partly is retained under the resinous coat 35, the PAD electrode self is exposed to the outside, therefore can not cause problem.
The chip of Xing Chenging comprises the heating element heater 12 as energy generating element, the nozzle 18 that holds the black chamber 14 of heating element heater 12 and be formed on 14 tops, black chamber as mentioned above.
Then, from black delivery member 21 predetermined spacing, this China ink delivery member 21 has supply opening 22 and is made of for example material of aluminium, stainless steel, pottery or resin with the chip setting.And, the described space of the incompatible covering of thermo-compressed of the top board 24 by applying adhesive on it in advance, described top board 24 is made of the metal forming of the resin molding of polyimides, PET etc. or nickel, aluminium, stainless steel etc.Therefore, formed public flow channel 23, formed ink gun 10 (Fig. 1) thus to be used for that China ink is fed to each of each flow channel 15 from supply opening 22.
(example)
Below example of the present invention will be described.
Be formed with thereon on the silicon wafer as the heating element heater 12 of energy generating element and applied the negative photoresist that is used for protective layer 32 that thickness is 1 μ m.Then, utilize mask aligner (maskaligner) that photoresist is exposed.
Afterwards, thereby come the composition photoresist on PAD electrode 31, to stay a skim, and it is toasted behind quilt down at 200 ℃, to be used to improve resistance to water by development and cleaning.
Then, apply the positive photoresist PMER-LA900 that thickness is 10 μ m (making) by spin coating, and utilize mask aligner that it is exposed by Tokyo Ohka Kogyo Co., Ltd.
Then, utilize developer (tetramethylammonium hydroxide 3% the aqueous solution) this photoresist that develops, clean to form the flow channel pattern with pure water then.Afterwards, utilize the whole face exposure of mask aligner, it was kept 24 hours in blanket of nitrogen naturally the resist pattern.
Then, apply photocurable negative photoresist on the photoresist pattern by being spin-coated on, make that the thickness on the soluble resin layer 34 is 10 μ m with controlled rotary speed.Next, photoresist is adopted the mask aligner exposure, by developer (OK73 diluent, Ohka Co., Ltd by Tokyo makes) be developed, and be cleaned by cleaning agent (IPA), be nozzle 18 and the opening on PAD electrode 31 36 of 15 μ m thereby form diameter in desired location.
Next, utilize scriber that wafer is divided into each chip size.In scribing, the positive photoresist of scribe line and patterning is overlapped thereby design the positive photoresist photomask in advance.
Then, under ultrasonic vibration each chip immersed in 3% the aqueous solution of tetramethylammonium hydroxide and dissolved fully until positive photoresist, 3% the aqueous solution of wherein said tetramethylammonium hydroxide is as the developer of positive photoresist.
Then, carry out pure water displacement and dry.
In addition, utilize the oxygen plasma treatment chip to remove the negative photoresist (protective layer 32) on the PAD electrode 31.
Next, die attach to ink-supplying part 21 and use the top board 24 made by polyimide film that it is covered, and is connected to PAD electrode 31 by the printed panel that the lead-in wire bonding will be used to drive chip.Thereby utilizing epoxy adhesive to seal described connection prevents and black contacting.
Spray the result of test as the China ink that utilizes the ink gun 10 that forms as mentioned above, not have to find owing to the informal voucher that does not spray due to the China ink.
Although below described embodiments of the invention, the present invention is not limited to described embodiment, but can carry out following various modification:
(1) although described ink gun 10 in the above-described embodiments, the invention is not restricted to this.For example, injected liquid is not limited to China ink, and the present invention can be applied to be used to spray the jet head liquid of various liquid.
For example, the present invention can be applied to the jet head liquid that it is colored to the surge dyestuff.And, the present invention can be applied to spray contain DNA solution to be used for the jet head liquid of detection of biological sample.
(2) although in the above-described embodiments, ink gun 10 is to utilize the hot system ink gun of heating element heater 12 as energy generating element, but ink gun is not limited thereto, promptly, energy generating element is not limited to heating element heater 12, and the present invention can be applied to utilize the piezoelectric system ink gun of piezoelectric element as energy generating element.
It will be understood by those skilled in the art that and depend on design needs and other factors, can have multiple modification, combination, sub-portfolio and change, as long as it is in the scope of the equivalent of attached claim or claim.
The present invention is contained in the relevant subject content of submitting in Japan Patent office on December 21st, 2004 of Japanese patent application JP2004-369933, and its full content is hereby incorporated by.
Claims (4)
1. the manufacture method of a jet head liquid, described jet head liquid comprises: be formed on the energy generating element on the substrate, be used for applying energy to liquid; The fluid chamber of holding described energy generating element and liquid that will be injected; Be used for spraying the nozzle of the liquid that is contained in described fluid chamber; And, be formed on the electrode on the described substrate, be used to realize and outside being electrically connected, said method comprising the steps of:
In comprising the substrate zone of described electrode, form protective layer;
In the zone that comprises the substrate zone that is formed with described energy generating element, form the soluble resin layer, to be used to form described fluid chamber;
In covering the zone of described soluble resin layer and be to form on the described electrode in the zone of opening and form resinous coat;
Form opening in the resinous coat on described energy generating element to form described nozzle;
Described substrate is immersed in the dissolving liquid to dissolve described soluble resin layer; And
After described soluble resin layer dissolving, remove described protective layer.
2. method according to claim 1 is included in the substrate zone that comprises described electrode adhesion layer is set, and described resinous coat and described substrate is combined being used for, and described adhesion layer is as described protective layer.
3. method according to claim 1 and 2 is wherein with the dissolving liquid of alkaline aqueous solution as the described soluble resin layer of dissolving.
4. method according to claim 1 and 2 wherein removes described protective layer by the oxygen plasma treatment on the whole surface of described substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP369933/04 | 2004-12-21 | ||
| JP2004369933A JP4241605B2 (en) | 2004-12-21 | 2004-12-21 | Method for manufacturing liquid discharge head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1796133A true CN1796133A (en) | 2006-07-05 |
| CN100423943C CN100423943C (en) | 2008-10-08 |
Family
ID=36596517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101361192A Expired - Fee Related CN100423943C (en) | 2004-12-21 | 2005-12-21 | Process for manufacturing liquid ejection head |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7371591B2 (en) |
| JP (1) | JP4241605B2 (en) |
| KR (1) | KR20060071328A (en) |
| CN (1) | CN100423943C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102673147A (en) * | 2011-03-11 | 2012-09-19 | 东芝泰格有限公司 | Ink-jet head |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5591011B2 (en) * | 2010-07-30 | 2014-09-17 | キヤノン株式会社 | Manufacturing method of liquid discharge head. |
| US11642887B2 (en) * | 2021-04-22 | 2023-05-09 | Funai Electric Co., Ltd. | Ejection head having optimized fluid ejection characteristics |
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| JPH0645242B2 (en) * | 1984-12-28 | 1994-06-15 | キヤノン株式会社 | Liquid jet recording head manufacturing method |
| EP0491560B1 (en) * | 1990-12-19 | 1997-10-01 | Canon Kabushiki Kaisha | Method for producing liquid discharging recording head |
| JP2960608B2 (en) * | 1992-06-04 | 1999-10-12 | キヤノン株式会社 | Method for manufacturing liquid jet recording head |
| JP3343875B2 (en) * | 1995-06-30 | 2002-11-11 | キヤノン株式会社 | Method of manufacturing inkjet head |
| JPH09109392A (en) * | 1995-10-13 | 1997-04-28 | Canon Inc | Manufacture of ink jet recording head, ink jet recording head manufactured by such manufacturing method and ink jet recorder |
| US6123863A (en) * | 1995-12-22 | 2000-09-26 | Canon Kabushiki Kaisha | Process for producing liquid-jet recording head, liquid-jet recording head produced thereby, and recording apparatus equipped with recording head |
| KR100232853B1 (en) * | 1997-10-15 | 1999-12-01 | 윤종용 | Heating apparatus for inkjet printer head and method for fabricating thereof |
| JPH11151817A (en) * | 1997-11-22 | 1999-06-08 | Nec Corp | Method for protecting electrode of printer head |
| US6331259B1 (en) * | 1997-12-05 | 2001-12-18 | Canon Kabushiki Kaisha | Method for manufacturing ink jet recording heads |
| EP0962320B1 (en) * | 1998-06-03 | 2005-01-05 | Canon Kabushiki Kaisha | Ink-Jet head, ink-jet head substrate, and a method for making the head |
| JP2000071451A (en) * | 1998-09-02 | 2000-03-07 | Konica Corp | Piezoelectric ceramic element and production thereof |
| JP2001191532A (en) * | 2000-01-17 | 2001-07-17 | Casio Comput Co Ltd | Thermal ink jet printer head |
| JP3728210B2 (en) * | 2001-02-23 | 2005-12-21 | キヤノン株式会社 | Ink jet head, manufacturing method thereof, and ink jet recording apparatus |
| JP2002337347A (en) * | 2001-05-15 | 2002-11-27 | Canon Inc | Liquid jet head and its manufacturing method |
| JP2003011371A (en) * | 2001-06-28 | 2003-01-15 | Kyocera Corp | Ink-jet head |
| JP4532785B2 (en) * | 2001-07-11 | 2010-08-25 | キヤノン株式会社 | Structure manufacturing method and liquid discharge head manufacturing method |
| US6908563B2 (en) * | 2001-11-27 | 2005-06-21 | Canon Kabushiki Kaisha | Ink-jet head, and method for manufacturing the same |
| US6993840B2 (en) * | 2002-07-18 | 2006-02-07 | Canon Kabushiki Kaisha | Manufacturing method of liquid jet head |
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| CN100355573C (en) * | 2002-12-27 | 2007-12-19 | 佳能株式会社 | Ink-jet recording head and mfg. method, and substrate for mfg. ink-jet recording head |
| JP4078295B2 (en) * | 2002-12-27 | 2008-04-23 | キヤノン株式会社 | Ink-jet head substrate, ink-jet head using the same, and method for producing the same |
| JP3998254B2 (en) * | 2003-02-07 | 2007-10-24 | キヤノン株式会社 | Inkjet head manufacturing method |
| KR100517515B1 (en) * | 2004-01-20 | 2005-09-28 | 삼성전자주식회사 | Method for manufacturing monolithic inkjet printhead |
| JP4480141B2 (en) * | 2004-06-28 | 2010-06-16 | キヤノン株式会社 | Method for manufacturing ink jet recording head |
| US7497962B2 (en) * | 2004-08-06 | 2009-03-03 | Canon Kabushiki Kaisha | Method of manufacturing liquid discharge head and method of manufacturing substrate for liquid discharge head |
| JP5027991B2 (en) * | 2004-12-03 | 2012-09-19 | キヤノン株式会社 | Ink jet head and manufacturing method thereof |
| US20060243701A1 (en) * | 2005-04-19 | 2006-11-02 | Shogo Ono | Liquid discharge head and liquid discharge head manufacturing method, chip element, and printing apparatus |
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| JP4693496B2 (en) * | 2005-05-24 | 2011-06-01 | キヤノン株式会社 | Liquid discharge head and manufacturing method thereof |
| KR100653088B1 (en) * | 2005-12-06 | 2006-12-04 | 삼성전자주식회사 | Fabrication method for inkjet print head |
-
2004
- 2004-12-21 JP JP2004369933A patent/JP4241605B2/en not_active Expired - Fee Related
-
2005
- 2005-12-09 US US11/298,187 patent/US7371591B2/en not_active Expired - Fee Related
- 2005-12-20 KR KR1020050125886A patent/KR20060071328A/en not_active Application Discontinuation
- 2005-12-21 CN CNB2005101361192A patent/CN100423943C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102673147A (en) * | 2011-03-11 | 2012-09-19 | 东芝泰格有限公司 | Ink-jet head |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060071328A (en) | 2006-06-26 |
| US7371591B2 (en) | 2008-05-13 |
| JP4241605B2 (en) | 2009-03-18 |
| JP2006175679A (en) | 2006-07-06 |
| US20060134896A1 (en) | 2006-06-22 |
| CN100423943C (en) | 2008-10-08 |
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