CN1795459A - 生产包括芯片的非接触式票的方法 - Google Patents

生产包括芯片的非接触式票的方法 Download PDF

Info

Publication number
CN1795459A
CN1795459A CNA2004800144356A CN200480014435A CN1795459A CN 1795459 A CN1795459 A CN 1795459A CN A2004800144356 A CNA2004800144356 A CN A2004800144356A CN 200480014435 A CN200480014435 A CN 200480014435A CN 1795459 A CN1795459 A CN 1795459A
Authority
CN
China
Prior art keywords
antenna
dielectric layer
chip
paper
ticket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2004800144356A
Other languages
English (en)
Other versions
CN100375117C (zh
Inventor
克里斯托夫·哈洛普
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASK SA
Original Assignee
ASK SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASK SA filed Critical ASK SA
Publication of CN1795459A publication Critical patent/CN1795459A/zh
Application granted granted Critical
Publication of CN100375117C publication Critical patent/CN100375117C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
  • Printing Methods (AREA)
  • Ticket-Dispensing Machines (AREA)

Abstract

一种用于多步骤制造非接触式票或卡片的方法，这些票或卡片包括与在纸张载体上的天线(10)连接的芯片(24)。本发明的方法包括以下步骤：使用丝网印刷油墨在纸张承载带上连续印刷天线；通过使芯片的焊盘与天线(14，16)的焊盘连接来将芯片固定在每张票上；并且用胶粘纸带覆盖包括丝网印刷天线和相应芯片的纸带。在每个步骤之后在下一个步骤开始之前进行将纸张承载带卷绕。本发明的方法还包括用通过印刷尤其是丝网印刷涂覆的一保护层(12)覆盖每个所述丝网印刷天线的步骤，所述保护层用于防止丝网印刷油墨在在每个步骤之后的其连续卷绕期间转印到纸张承载带的背面上。

Description

生产包括芯片的非接触式票的方法
技术领域
本发明涉及一种制造设有芯片和丝网印刷天线的票的方法，并且尤其涉及一种制造非接触式票的方法和由该方法生产出的票。
背景技术
更通常被称为非接触式可读票或非接触式可读标签的非接触式射频识别(RFID)电子票配有天线和以与天线连接的电子芯片形式的集成电路，该组件形成在柔性支撑件上。非接触式票能够使用也配有天线的读取器利用其天线通过电感耦合远程交换和传送数据。柔性支撑件由纸张、卡片或塑料制成。在票的经济实施方案中，通过丝网印刷方法印刷出天线。丝网印刷包括使用例如主要由银粉末构成的导电油墨在优选由纸张制成的电绝缘基底上印刷出天线线圈。可以使用连续的制造方法来制造出配有丝网印刷天线的票。
因此，申请人个人研制出这样一种制造方法，其中在其宽度能够制造出一张或多张票的环形纸带的一面上进行天线的丝网印刷。在该纸带与承载着天线的那面相反的面上，沿着纸带的输送方向制作出由印刷符号或孔构成的标记，从而可以使与每张票对应的区域以及沿着纸带宽度的票排被定位。这些标记对于连续制造票的该方法是必不可少的。实际上，在每个票制造阶段处，由于纸带完全开绕然后重新卷绕从而它在两个制造步骤之间被操纵和存储，所以要设定每张票的准确位置。因此，连续制造非接触票的方法分解成多个步骤，这些步骤包括印刷用户说明、印刷天线、安装芯片并且进行最终层压，层压步骤包括将预印刷有用户说明的层层压在承载有天线和芯片的票面上。印刷天线需要几个过程。实际上，天线的形成包括印刷形成导电螺线的天线的线圈、形成与线圈垂直的介电条并且在介电条上印刷导电油墨桥，从而使得天线的一个端部与将用来与芯片形成电连接的连接端子连接。
在被设置以为了与天线连接的位置处将电子芯片设置在票上的步骤在票的制造中是一个必不可少的步骤并且需要高精度。由于已经将标记设在天线的支撑部分的相对侧面上并且对标记进行光学检测，所以可以准确地将芯片设置在所要求的位置处。但是，定位可能错误地进行，在该情况中，芯片与天线的连接是不合格的。这些标记还用来将该纸带切成单位票。
这种连续制造方法的主要缺点在于，为了完成票制造，连续卷绕和开绕期间构成天线的银粉末通过摩擦转印到纸带的背面上。在纸带背面被预先打印有用户说明时，可以由肉眼看到的记号出现在用户说明上，这损害了票的美观品质。另外，在这些处于天线区域中的情况下墨的转印也会覆盖在纸带背面上标记并且因此妨碍在票制造和分配步骤期间进行的光学定位。因此，使芯片定位和切割这些票的步骤将失败并且造成票生产产出率降低。
发明内容
因此本发明的目的在于通过提供一种在环形带上连续制造非接触式票的方法，允许通过导电油墨丝网印刷来形成天线，并且油墨不会通过摩擦转印到纸带的背面上并且不会增加额外的票制造步骤。
本发明的目的因此在于一种用于多步骤制造非接触式票或卡片的方法，这些票或卡片包括与在纸张载体上的天线连接的芯片，该方法在于使用丝网印刷油墨在纸张承载带上连续地印刷天线、通过使芯片的焊盘与天线的焊盘连接从而将芯片固定在每张票上、和用胶带纸覆盖包括丝网印刷天线和相应芯片的纸带，每个步骤之后在转到下一个步骤之前进行将纸张承载带卷绕。该方法包括用保护层覆盖每个丝网印刷天线的步骤，用于防止丝网印刷油墨在在每个步骤之后的其连续卷绕期间转印到纸张承载带的背面上。
附图说明
通过参照以下附图阅读以下说明书将更加清楚地了解本发明的这些目标、目的和特征，在这些附图中：
图1显示出已经通过印刷丝网印刷油墨生产出的非接触式票的天线；
图2显示出用根据本发明原理生产出的介电保护层覆盖的天线；并且
图3显示出具有用介电层覆盖的丝网印刷天线并且之后通过与天线端部连接来固定芯片的票。
具体实施方式
在根据本发明的非接触式票制造方法中，每个步骤在于在环形带上进行相同的操作，该环形带的宽度允许同时制造出一张或多张票(例如6张票)。在已经进行了所有步骤时，进行裁切以便获得单张票。
在制造方法的第一步之前，将具有普通纸带长度的纸卷安装在制造机器中。将该纸卷开卷以便进行第一步，该第一步通过使用银基油墨进行丝网印刷生产出在图1中所示的天线10。
下一步在于仍然通过丝网印刷沉积覆盖着天线10的保护层12。在图2所示的优选实施方案中，将保护层涂覆在天线10的整个表面上，从而覆盖着后者。但是，可以设计出这样一种实施方案，其中保护层只覆盖天线线圈匝，也就是说其准确的印记。还有根据该优选实施方案，保护层为一介电层。
保护层的目的在于防止构成已经固定的天线10的油墨在跟随着丝网印刷步骤进行的随后纸带卷绕期间摩擦转印到纸带上。
如上所述，这种转印损害了票的最终美学品质，并且容易覆盖着位于纸带背面上的标记并且因此妨碍其光学定位。
该介电层具有两个特征。首先，它不能覆盖将用作与芯片的连接部分的天线的端部14、16。第二，介电质的这个单步骤丝网印刷没有针对矩形部分18，在下面的步骤中将把用于使天线的连接端部14与芯片的焊盘连接的导电条印刷到其上。
介电层12优选在与丝网印刷天线的同一步骤期间印刷，由此防止了油墨转印到票的背面。介电层的这种印刷也可以在随后的步骤中即在卷绕刚刚丝网印刷有天线的纸带之后进行。
如上所述，印刷介电层对于覆盖天线的线圈的矩形部分18是不同的。实际上，在整个天线上的介电层的唯一目的在于防止墨水转印到票的背面上，而矩形部分18的介电质的目的在于使天线的线圈与在图3中所示的导电条20绝缘。该矩形部分因此必须优选是电绝缘的，这对于为了保护目的而形成的全部介电层而言不会必须的。一个优选技术涉及采用这样一种印刷网屏，其大部分为半色调印刷，除了与矩形部分18对应的部分之外，该部分为全色调印刷。这使得矩形部分18覆盖100％介电质，而剩余的介电层12只有覆盖30％介电质。
在已经再次卷绕纸带之后，该方法前进至下面的步骤，该步骤在于丝网印刷从天线到芯片的连接部分，即来自天线10的端部14的导电条20和来自天线的端部16的导电条22。如图3所示，这使得能够在下面的步骤中通过将芯片的焊盘固定到导电条20和22的端部上来与芯片24连接。
应该指出的是，在印刷保护介电层12之后丝网印刷导电条20和22不会出现与天线相同的油墨转印问题。实际上，天线的纵向线圈在卷绕之后相互叠置，因此产生出过大的厚度，因此油墨由于由这个过大厚度引起的压力而摩擦转印到票的背面上的危险增大。相反，尺寸更小的导电条20和22没有位于在通过卷绕纸带而得到的纸卷中的相同地方处。因此，不会有过大的厚度，因此油墨摩擦转印到票的背面上的危险很小。
虽然已经参照纸票的制造对本发明的方法进行了说明，但是本发明也可以应用于非接触式卡片或任意其他非接触式物体(标志、标签等)，其中采用了丝网印刷油墨形成天线。

Claims (6)

1.一种用于多步骤制造非接触式票或卡片的方法，这些票或卡片包括与在纸张载体上的天线(10)连接的芯片(24)，所述方法在于使用丝网印刷油墨在纸张承载带上连续地印刷天线、通过使芯片的焊盘与天线(14，16)的焊盘连接来将芯片固定在每张票上、和用粘胶纸带覆盖包括丝网印刷天线和相应芯片的纸带，每个步骤之后在转到下一个步骤之前进行纸张承载带的卷绕，
所述方法其特征在于，它包括用通过印刷尤其是丝网印刷涂覆的一保护层(12)覆盖每个所述丝网印刷天线的步骤，所述保护层被设置用于防止丝网印刷油墨在每个步骤之后的其连续卷绕期间转印到纸张承载带的背面上。
2.如权利要求1所述的方法，其中所述保护层为一介电层。
3.如权利要求2所述的方法，其中所述介电层是在将天线丝网印刷到纸张载体上的步骤期间采用丝网印刷油墨印刷出的。
4.如权利要求3所述的方法，其中所述介电层(12)的用于接收连接丝网印刷天线(10)的端部与芯片(24)的焊盘的导电条的部分(18)比所述介电层的剩余部分重要。
5.如权利要求4所述的方法，其中所述介电层(12)的用于接收所述导电条的所述部分(18)由100％介电质构成，而所述介电层的剩余部分由30％介电质构成。
6.如权利要求5所述的方法，其中用来形成所述介电层(12)的所述印刷网屏包括与用于接收所述导电条的所述部分(18)对应的全色调网屏，而所述介电层的剩余部分为半色调印刷。
CNB2004800144356A 2003-05-26 2004-05-26 生产包括芯片的非接触式票的方法 Expired - Fee Related CN100375117C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0306309A FR2855637B1 (fr) 2003-05-26 2003-05-26 Procede de fabrication d'un ticket sans contact et ticket obtenu a partir de ce procede
FR03/06309 2003-05-26

Publications (2)

Publication Number Publication Date
CN1795459A true CN1795459A (zh) 2006-06-28
CN100375117C CN100375117C (zh) 2008-03-12

Family

ID=33427419

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800144356A Expired - Fee Related CN100375117C (zh) 2003-05-26 2004-05-26 生产包括芯片的非接触式票的方法

Country Status (19)

Country Link
US (1) US7337975B2 (zh)
EP (1) EP1629420B1 (zh)
JP (1) JP4676436B2 (zh)
KR (1) KR101044267B1 (zh)
CN (1) CN100375117C (zh)
AT (1) ATE370463T1 (zh)
AU (1) AU2004243968B2 (zh)
BR (1) BRPI0410622A (zh)
CA (1) CA2526081C (zh)
DE (1) DE602004008263T2 (zh)
ES (1) ES2293331T3 (zh)
FR (1) FR2855637B1 (zh)
HK (1) HK1093251A1 (zh)
IL (1) IL171971A (zh)
MX (1) MXPA05012600A (zh)
RU (1) RU2336565C2 (zh)
TW (1) TWI395141B (zh)
WO (1) WO2004107260A2 (zh)
ZA (1) ZA200509307B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102708392A (zh) * 2011-02-25 2012-10-03 纳格雷德股份有限公司 结合应答器的卡
CN108885709A (zh) * 2016-03-30 2018-11-23 兰克森控股公司 制造芯片卡和芯片卡天线支撑件的方法
CN111832687A (zh) * 2020-06-23 2020-10-27 厦门大学 一种rfid标签及其制备方法
CN112781482A (zh) * 2020-08-21 2021-05-11 哈尔滨工业大学（威海） 可变形曲面的空间曲率的测量方法以及电感式空间曲率测量敏感元件的制作方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2900485B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900484B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
KR100697844B1 (ko) * 2006-06-30 2007-03-20 (주) 케이비씨테크 한지를 이용한 알에프아이디 카드 및 그 제조방법
DE102006043021A1 (de) * 2006-09-13 2008-03-27 Giesecke & Devrient Gmbh Datenträger mit Transponder
CA2678556C (en) 2007-02-23 2012-01-31 Newpage Wisconsin System Inc. Multifunctional paper identification label
KR101054448B1 (ko) * 2009-05-25 2011-08-04 주식회사 이그잭스 직접인쇄방식으로 에이치에프 알에프아이디 안테나를 제조하는 방법
US9122964B2 (en) * 2010-05-14 2015-09-01 Mark Krawczewicz Batteryless stored value card with display
DE102010040867A1 (de) * 2010-09-16 2012-03-22 Robert Bosch Gmbh Elektronikbauteil mit verbesserter Leitungsstruktur
CN102176234B (zh) * 2011-02-22 2013-01-23 厦门振泰成科技有限公司 金属薄片转移定位工艺及定位装置
FR3002108A1 (fr) * 2013-02-14 2014-08-15 Ask Sa Procede de fabrication d'une antenne pour dispositif radiofrequence sur support mince et dispositif comprenant une antenne ainsi obtenue
DE20168827T1 (de) 2017-06-30 2021-01-21 Gtx Medical B.V. System zur neuromodulierung
DE102017122054A1 (de) 2017-09-22 2019-03-28 Kennametal Inc. Schneidwerkzeug sowie Verfahren zur Herstellung eines Schneidwerkzeugs
DE18205821T1 (de) 2018-11-13 2020-12-24 Gtx Medical B.V. Steuerungssystem zur bewegungsrekonstruktion und/oder wiederherstellung für einen patienten
DE102019127027A1 (de) 2019-10-08 2021-04-08 Kennametal Inc. Schneidwerkzeug
IT202200003290A1 (it) * 2022-02-22 2023-08-22 Pearfid Soc A Responsabilita Limitata Semplificata Metodo di realizzazione di dispositivi a radiofrequenza

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322256B2 (ja) * 1997-01-31 2002-09-09 株式会社デンソー Ｉｃカードの製造方法
FR2769109B1 (fr) * 1997-09-26 1999-11-19 Gemplus Sca Dispositif electronique a puce jetable et procede de fabrication
TW424204B (en) * 1997-12-30 2001-03-01 Hitachi Ltd Semiconductor device
JP4187278B2 (ja) * 1998-07-08 2008-11-26 大日本印刷株式会社 非接触ｉｃカードおよびその製造方法
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
FR2800518B1 (fr) * 1999-10-28 2007-02-23 A S K Antenne de couplage a inductance elevee
JP2002157564A (ja) * 2000-11-21 2002-05-31 Toyo Aluminium Kk Ｉｃカード用アンテナコイルとその製造方法
FR2829857B1 (fr) 2001-09-14 2004-09-17 A S K Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102708392A (zh) * 2011-02-25 2012-10-03 纳格雷德股份有限公司 结合应答器的卡
CN108885709A (zh) * 2016-03-30 2018-11-23 兰克森控股公司 制造芯片卡和芯片卡天线支撑件的方法
CN111832687A (zh) * 2020-06-23 2020-10-27 厦门大学 一种rfid标签及其制备方法
CN112781482A (zh) * 2020-08-21 2021-05-11 哈尔滨工业大学（威海） 可变形曲面的空间曲率的测量方法以及电感式空间曲率测量敏感元件的制作方法

Also Published As

Publication number Publication date
HK1093251A1 (en) 2007-02-23
CA2526081A1 (fr) 2004-12-09
WO2004107260A2 (fr) 2004-12-09
AU2004243968B2 (en) 2010-09-02
MXPA05012600A (es) 2006-02-22
IL171971A (en) 2009-11-18
AU2004243968A1 (en) 2004-12-09
US20070029391A1 (en) 2007-02-08
EP1629420A2 (fr) 2006-03-01
KR20060023973A (ko) 2006-03-15
EP1629420B1 (fr) 2007-08-15
ATE370463T1 (de) 2007-09-15
CN100375117C (zh) 2008-03-12
CA2526081C (fr) 2013-11-19
IL171971A0 (en) 2006-04-10
KR101044267B1 (ko) 2011-06-29
RU2336565C2 (ru) 2008-10-20
ES2293331T3 (es) 2008-03-16
DE602004008263T2 (de) 2008-05-08
FR2855637A1 (fr) 2004-12-03
BRPI0410622A (pt) 2006-06-20
US7337975B2 (en) 2008-03-04
FR2855637B1 (fr) 2005-11-18
JP4676436B2 (ja) 2011-04-27
JP2007502475A (ja) 2007-02-08
DE602004008263D1 (de) 2007-09-27
ZA200509307B (en) 2006-09-27
RU2005140572A (ru) 2006-05-27
WO2004107260A3 (fr) 2005-02-03
TW200506744A (en) 2005-02-16
TWI395141B (zh) 2013-05-01

Similar Documents

Publication Publication Date Title
CN100375117C (zh) 生产包括芯片的非接触式票的方法
KR100756789B1 (ko) 종이형 ｒｆｉd 태그 및 그 제조 방법
US7434739B2 (en) Antenna circuit, IC inlet, IC tag, and IC card, as well as manufacturing method of IC tag and manufacturing method of IC card
US7843341B2 (en) Label with electronic components and method of making same
EP1817721B1 (en) Rfid tags with modifiable operating parameters
US20070164867A1 (en) Thin ic tag and method for manufacturing same
MXPA04006913A (es) Tecnica para etiquetas por rfid.
US7883021B2 (en) Connecting part for mounting IC chip, antenna circuit, IC inlet, IC tag and method of adjusting capacitance
CN108369658B (zh) 具有包括电气和/或电子模块的可调节的lc电路的射频装置
JP2007157140A (ja) 無線周波装置
CN113993712B (zh) 射频识别的平坦片材
US8031071B2 (en) IC tag label
US20240028861A1 (en) Rfid label and method of using rfid label
KR101204074B1 (ko) 스마트 라벨 및, 그것의 제조 방법
JP6911958B2 (ja) パッケージ用板紙およびその製造方法
CN115298666A (zh) Rfid标签
WO2024029194A1 (ja) Ｒｆｉｄタグ、ｒｆｉｄタグの製造方法及びｒｆｉｄタグロール
WO2024029193A1 (ja) Ｒｆｉｄタグ、ｒｆｉｄタグの製造方法及びｒｆｉｄタグロール
JP4952030B2 (ja) 非接触型データキャリア装置とこれを配設したデータキャリア装置配設部材

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1093251

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1093251

Country of ref document: HK

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080312

Termination date: 20160526

CF01 Termination of patent right due to non-payment of annual fee