CN1779998A - Light emitting diode structure and growth thereof - Google Patents
Light emitting diode structure and growth thereof Download PDFInfo
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- CN1779998A CN1779998A CNA2004100523250A CN200410052325A CN1779998A CN 1779998 A CN1779998 A CN 1779998A CN A2004100523250 A CNA2004100523250 A CN A2004100523250A CN 200410052325 A CN200410052325 A CN 200410052325A CN 1779998 A CN1779998 A CN 1779998A
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Abstract
An epitaxially grown LED structure is composed of substrate, buffer layer, u GaN layer, N-type GaN:Si layer, composite quantum trap layer-overlap layer and P-type GaN:Mg layer. It features that an undoped isolating u GaN layer is grown between trap layer and overlap layer for decreasing reverse leakage current.
Description
Technical field
The present invention relates to a kind of light-emitting diode (LED) structure and growing method thereof, the growth that more specifically relates to a kind of quantum well layer by control LED-base layer structure suppresses the method for reverse leakage.
Background technology
At Chinese invention patent application " composite quantum well structure high brightness GaN base blue-ray LED the epitaxial wafer growth method " (application number: 03118956.3) in of the applicant in proposition on April 16th, 2003, a kind of light-emitting diode (LED) epitaxial wafer growth method of composite quantum well structure has been proposed, wherein disclose the basic LED semiconductor structure of gallium nitride (GaN) that a kind of employing MOCVD (metal-organic chemical vapor deposition equipment) technology comes epitaxial growth to go out, comprised the resilient coating on the substrate layer, plain uGaN layer, n type GaN:Si layer, composite quantum well layer-base layer, and p type GaN:Mg layer.By this LED semiconductor structure, under certain excitation current (for example 20mA), can inspire the blue light that wavelength is 455-475nm.
Because the composite quantum well layer of this LED semiconductor structure-base layer extremely thin (about the 5-50 nanometer), and it is very responsive to the fluctuation of MOCVD growing environment, therefore in the growth course of reality, be difficult to occur above-mentioned desirable LED semiconductor structure, for example the interface of quantum well layer and base layer is unintelligible, elements such as Si, the Mg that mixes, Zn can run through quantum well layer and build layer, and are well-known, elements such as Si, Mg, Zn mix problems such as obviously can causing occurring the LED reverse leakage; In addition, can there be defective inevitably during crystal growth, the for example particularly appearance of helical dislocation of dislocation, if unfavorable words such as doping Si, Mg, Zn, meetings such as Si, Mg, Zn run through semiconductor structure together in company with dislocation when for example helical dislocation runs through the LED structure, cause part " conducting ", bring very big secondary face to ring for the photoelectric characteristic of LED structure.The reverse leakage that one of them main secondary face sound is exactly LED, in normal product, if the LED structure is worked under 5V voltage, 20mA electric current, ideally electric leakage should be zero, but actual conditions are really not so, generally speaking the reverse leakage that all can occur exceeding standard.
Reverse leakage is to influence a LED important indicator in useful life.If bigger leakage current, not only can limit photoelectric characteristic and the service condition of LED, but also anti-attenuation performance and the useful life that can reduce LED significantly.According to the requirement of producing and using, under above-mentioned operating mode, general reverse leakage electric current preferably is no more than 1 μ A, and the maximum reverse leakage current can not surpass 10 μ A.But in the LED of prior art structure, reverse leakage surpasses the situation of 1 μ A even 10 μ A when regular meeting reverse leakage occurs and works under 5V voltage, 20mA electric current, greatly reduces the yields of LED reliability of structure and production.
The reason that reverse leakage occurs is many-sided, except the influencing factor of the manufacturing process of led chip and LED packaging technology, the architectural characteristic of the epitaxially grown LED crystal layer of MOCVD is maximum " congenital " influencing factor, and the negative effect that this factor causes is irremediable in subsequent technique.Therefore, press for the method that the reverse leakage of light-emitting diode is controlled in a kind of growth by control LED layer structure, to realize LED photoelectric characteristic preferably, reverse leakage performance particularly.
Summary of the invention
According to the above, the present invention proposes the LED structure growth method of a kind of New LED structure and control LED reverse leakage, the reverse leakage when it can reduce LED work significantly, the while can not cause other decreased performance of LED again.
According to design of the present invention, a kind of light emitting diode construction has been proposed, comprise resilient coating, uGaN layer, n type GaN:Si layer, composite quantum well layer-base layer, p type GaN:Mg layer on the substrate layer, wherein trap layer and base layer are spaced by adding the uGaN interlayer.
According to a further aspect in the invention, propose a kind of light emitting diode construction, comprised resilient coating, uGaN layer, n type GaN:Si layer, uGaN interlayer-quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer on the substrate layer.
According to a further aspect in the invention, propose a kind of light emitting diode construction, comprised resilient coating, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer-uGaN interlayer, p type GaN:Mg layer on the substrate layer.
According to a further aspect in the invention, propose a kind of light emitting diode construction, comprised resilient coating, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer on the substrate layer.
According to a further aspect in the invention, proposed the method for a kind of growth, comprised resilient coating, uGaN layer, n type GaN:Si layer, uGaN interlayer-quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer on the growth substrates layer successively according to light emitting diode construction of the present invention.
According to a further aspect in the invention, proposed the method for a kind of growth, comprised resilient coating, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer-uGaN interlayer, p type GaN:Mg layer on the growth substrates layer successively according to light emitting diode construction of the present invention.
According to a further aspect in the invention, proposed the method for a kind of growth, comprised resilient coating, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer on the growth substrates layer successively according to light emitting diode construction of the present invention.
According to the present invention, by coming suitably to grow the uGaN interlayer like this, can reduce the reverse leakage electric current I r of led chip significantly, and improve the yield of led chip, guarantee that simultaneously other performance of chip can not descend.
Embodiment
Introduce the present invention in more detail below by specific embodiment.The method according to this invention is intended to by improving quantum well layer-base layer structure, between trap layer and base layer, insert the uGaN interlayer of one deck without any doped chemical (for example silicon, magnesium, zinc etc.), prevent that elements such as Si, Mg, Zn from penetrating the interface and producing local conducting, thereby reach the purpose that suppresses or prevent reverse leakage.
At first introduce traditional GaN based LED construction and growing method, this method is seen the detailed introduction of comparative example 1.
Comparative example 1
The extension LED structure of conventional growth is: the resilient coating on the substrate layer, uGaN layer, n type GaN:Si layer, composite quantum well layer-base layer, p type GaN:Mg layer.
The conventional growth method of this extension LED structure adopts the epitaxial growth on sapphire, carborundum or other suitable substrate of metal-organic chemical vapor deposition equipment (MOCVD) method to go out the LED structure, and embodiment is as follows:
The TS-19 type CCS-MOCVD machine that utilizes Britain Thomas Swan company to produce, epitaxial growth LED structure on substrate, the substrate of employing is the Sapphire Substrate of the diameter 50mm of company of Kyocera production, reaction with former material is:
Trimethyl gallium, trimethyl aluminium, trimethyl magnesium, trimethyl indium (photoelectricity company of Jiangsu Nanjing University provides);
High-purity hydrogen, nitrogen, high-purity ammon and silane (grand gas companies provides in Shenzhen)
Certainly, these raw material also can other producer from the market have been bought.
Process route is as follows:
1) buffer growth: reaction temperature 500-800 ℃, reaction chamber pressure 76-250Torr, carrier gas flux be the 10-30 liter/minute, the trimethyl gallium flow be the 20-120 micromole/minute, ammonia flow is the 20-80 moles/min.Time is 0.1-20 minute.
2) uGaN layer growth: reaction temperature 950-1150 ℃, reaction chamber pressure 76-250Torr, carrier gas flux be the 5-20 liter/minute, the trimethyl gallium flow be the 80-400 micromole/minute, ammonia flow is the 200-800 moles/min.Time is 20-60 minute.
3) GaN:Si layer growth: reaction temperature 950-1150 ℃, reaction chamber pressure 76-250Torr, carrier gas flux be the 5-20 liter/minute, the trimethyl gallium flow be the 80-400 micromole/minute, ammonia flow is the 200-800 moles/min, silane flow rate be the 0.2-2.0 nanomole/minute.Time is 10-30 minute.
4) composite quantum well layer-base layer growth:
Trap layer: reaction temperature 700-900 ℃, reaction chamber pressure 100-500Torr, carrier gas flux be the 5-20 liter/minute, ammonia flow is the 200-800 moles/min, the trimethyl gallium flow be the 0.1-1.0 micromole/minute, the trimethyl indium flow be the 10-50 micromole/minute.Time is 0.1-5 minute.
Build layer: reaction temperature 700-900 ℃, reaction chamber pressure 100-500Torr, carrier gas flux be the 5-20 liter/minute, ammonia flow is the 200-800 moles/min, the trimethyl gallium flow be the 10-50 micromole/minute, the trimethyl indium flow be the 5-30 micromole/minute.Time is 0.1-5 minute.
5) p type GaN:Mg layer growth: reaction temperature 950-1100 ℃, reaction chamber pressure 76-250Torr, carrier gas flux be the 5-20 liter/minute, the trimethyl gallium flow be the 80-400 micromole/minute, ammonia flow is the 200-800 moles/min, trimethyl magnesium flow be the 0.5-5.0 micromole/minute.Time is 10-50 minute.
The present invention mainly is by visualizing a kind of LED structure growth method of the plain uGaN interlayer of growing between composite quantum well layer-base layer, reaching the purpose of improving reverse leakage.LED structure growth method according to the present invention realizes by following examples.
Embodiment 1
Embodiments of the invention 1 are basic identical with the LED layer structure of comparative example 1, and difference is, on the basis of the LED of comparative example 1 layer structure, and the plain uGaN interlayer of one deck of growing respectively of the quantum well layer both sides in quantum well layer-bases layer.The extension LED structure of being grown is: the resilient coating on the substrate layer, uGaN layer, n type GaN:Si layer, uGaN
Interlayer-quantum well layer-UGaN
Interlayer- Build layer, p type GaN:Mg layer.
Therefore, the growing method of embodiment 1 is, in order grown buffer layer, uGaN layer, n type GaN:Si layer, uGaN interlayer-quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer successively.Except the technology of growth uGaN interlayer, other growth technique condition is identical with comparative example 1, here repeats no more.The growth technique of each layer in the two-layer uGaN interlayer is all as follows:
UGaN interlayer: reaction temperature 700-1000 ℃, reaction chamber pressure 76-300Torr, carrier gas flux be the 5-20 liter/minute, the trimethyl gallium flow be the 80-400 micromole/minute, ammonia flow is the 200-800 moles/min, growth time is 5-200 second.
Embodiment 2
Embodiments of the invention 2 are basic identical with the LED layer structure of comparative example 1, and difference is, on the basis of the LED of comparative example 1 layer structure, and the plain uGaN interlayer of one deck of growing respectively of the layer both sides, base in quantum well layer-bases layer.The extension LED structure of being grown is: the resilient coating on the substrate layer, uGaN layer, n type GaN:Si layer,
Quantum well layer-UGaN
Interlayer-base layer-UGaN
Every Layer, p type GaN:Mg layer.
Therefore, the growing method of embodiment 2 is, in order grown buffer layer, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer-uGaN interlayer, p type GaN:Mg layer successively.Except the technology of growth uGaN interlayer, other growth technique condition is identical with comparative example 1, here repeats no more.The growth technique of each layer in the two-layer uGaN interlayer is all as follows:
UGaN interlayer: reaction temperature 700-1000 ℃, reaction chamber pressure 76-300Torr, carrier gas flux be the 5-20 liter/minute, the trimethyl gallium flow be the 80-400 micromole/minute, ammonia flow is the 200-800 moles/min, growth time is 5-200 second.
Embodiment 3
Embodiments of the invention 3 are basic identical with the LED layer structure of comparative example 1, and difference is, on the basis of the LED of comparative example 1 layer structure, at quantum well layer-plain uGaN interlayer of base layer interstitial growth one deck.The extension LED structure of being grown is: the resilient coating on the substrate layer, uGaN layer, n type GaN:Si layer,
Quantum well layer-UGaN
Interlayer-base layer, p type GaN:Mg layer.
Therefore, the growing method of embodiment 3 is, in order grown buffer layer, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer successively.Except the technology of growth uGaN interlayer, other growth technique condition is identical with comparative example 1, here repeats no more.The growth technique of each layer in the two-layer uGaN interlayer is all as follows:
UGaN interlayer: reaction temperature 700-1000 ℃, reaction chamber pressure 76-300Torr, carrier gas flux be the 5-20 liter/minute, the trimethyl gallium flow be the 80-400 micromole/minute, ammonia flow is the 200-800 moles/min, growth time is 20-200 second.
We become above-mentioned three embodiment the standard chips of 14 mils with the LED structure fabrication of comparative example 1, the KEITHLEY2400 type photoelectricity test instrument that employing company provides, the photoelectric characteristic of the led chip of above-mentioned three embodiment of test and comparative example 1 under 20 milliamperes operating current.
In order to guarantee precision of test result, the epitaxial wafer of the LED structure that adopts above-mentioned three embodiment and comparative example 1 technology to grow is made into 14 mil led chips according to identical standard technology respectively, each test is respectively got 100 above-mentioned led chips and is carried out, measure its mean value, the result is compared as follows:
| Forward voltage Vf (V) | Reverse breakdown voltage Vz (V) | Dominant wavelength λ (nm) | Reverse leakage electric current I r (μ A) | Chip brightness (mcd) | Yields | |
| Comparative example 1 embodiment 1 embodiment 2 embodiment 3 | 3.1 3.3 3.3 3.4 | 12.5 13.5 13.7 17.5 | 464 466 465 462 | 5 0.5 0.3 0 | 45 43.5 48 42 | 82.6％ 98.5％ 96.0％ 96.5％ |
From the The above results analysis, can find out significantly that by suitably adding the uGaN interlayer, can reduce the reverse leakage electric current I r of led chip significantly, and improve the yield of led chip, other performance of chip can not descend simultaneously.Therefore, the present invention has obtained the effect of highly significant for the performance that the improves led chip yields made of reverse leakage performance and led chip particularly.
Although introduced the present invention in conjunction with the embodiments, but those skilled in the art is appreciated that fully, based on identical principle, come the epitaxial growth except adopting MOCVD (metal-organic chemical vapor deposition equipment) technology, also can adopt other growing method, for example adopt molecular beam epitaxial growth (MOVPE) technology, perhaps halide chemical gaseous phase growth technology waits and grows according to LED structure of the present invention.
Claims (7)
1, a kind of light emitting diode construction comprises resilient coating, uGaN layer, n type GaN:Si layer, composite quantum well layer-base layer and p type GaN:Mg layer on the substrate layer, it is characterized in that, by adding the uGaN interlayer described trap layer and base layer is spaced.
2, light emitting diode construction according to claim 1, it is characterized in that, trap layer both sides in the described quantum well layer-base layer plain uGaN interlayer of one deck of growing respectively makes the extension LED structure of being grown be: the resilient coating on the substrate layer, uGaN layer, n type GaN:Si layer, uGaN interlayer-quantum well layer-uGaN interlayer-bases layer, p type GaN:Mg layer.
3, light emitting diode construction according to claim 1, it is characterized in that, layer both sides, base in the described quantum well layer-base layer plain uGaN interlayer of one deck of growing respectively makes the extension LED structure of being grown be: the resilient coating on the substrate layer, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer-uGaN interlayer, p type GaN:Mg layer.
4, light emitting diode construction according to claim 1, it is characterized in that, the plain uGaN interlayer of growth one deck between described quantum well layer-base layer makes the extension LED structure of being grown be: the resilient coating on the substrate layer, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer.
5, a kind of method of the light emitting diode construction according to claim 1 of growing, its feature in, carry out following steps successively: the resilient coating on the growth substrates layer, uGaN layer, n type GaN:Si layer, uGaN interlayer-quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer.
6, a kind of method of the light emitting diode construction according to claim 1 of growing, it is characterized in that, carry out following steps successively: the resilient coating on the growth substrates layer, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer-uGaN interlayer, p type GaN:Mg layer.
7, a kind of method of the light emitting diode construction according to claim 1 of growing, it is characterized in that, carry out following steps successively: the resilient coating on the growth substrates layer, uGaN layer, n type GaN:Si layer, quantum well layer-uGaN interlayer-base layer, p type GaN:Mg layer.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211999B (en) * | 2006-12-29 | 2010-07-14 | 上海蓝光科技有限公司 | Luminous diode multi-quantum well manufacture method |
| CN113451462A (en) * | 2020-11-24 | 2021-09-28 | 重庆康佳光电技术研究院有限公司 | LED epitaxial structure, preparation method thereof and LED chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10261816A (en) * | 1997-03-19 | 1998-09-29 | Fujitsu Ltd | Semiconductor light emitting element and its manufacture |
| KR100497890B1 (en) * | 2002-08-19 | 2005-06-29 | 엘지이노텍 주식회사 | Nitride semiconductor LED and fabrication method for thereof |
| CN1316567C (en) * | 2003-04-16 | 2007-05-16 | 方大集团股份有限公司 | Preparation f green light fallium nitride base LED epitaxial wafer by adopting multiquantum well |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211999B (en) * | 2006-12-29 | 2010-07-14 | 上海蓝光科技有限公司 | Luminous diode multi-quantum well manufacture method |
| CN113451462A (en) * | 2020-11-24 | 2021-09-28 | 重庆康佳光电技术研究院有限公司 | LED epitaxial structure, preparation method thereof and LED chip |
| CN113451462B (en) * | 2020-11-24 | 2022-07-26 | 重庆康佳光电技术研究院有限公司 | LED epitaxial structure, preparation method thereof and LED chip |
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