CN1759974A - Mesothermal copper based solder without cadmium, and preparation method - Google Patents
Mesothermal copper based solder without cadmium, and preparation method Download PDFInfo
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- CN1759974A CN1759974A CN 200510010466 CN200510010466A CN1759974A CN 1759974 A CN1759974 A CN 1759974A CN 200510010466 CN200510010466 CN 200510010466 CN 200510010466 A CN200510010466 A CN 200510010466A CN 1759974 A CN1759974 A CN 1759974A
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- cadmium
- based solder
- copper based
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- solder
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100104660A CN100443244C (en) | 2005-10-25 | 2005-10-25 | Mesothermal copper based solder without cadmium, and preparation method |
Applications Claiming Priority (1)
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CNB2005100104660A CN100443244C (en) | 2005-10-25 | 2005-10-25 | Mesothermal copper based solder without cadmium, and preparation method |
Publications (2)
Publication Number | Publication Date |
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CN1759974A true CN1759974A (en) | 2006-04-19 |
CN100443244C CN100443244C (en) | 2008-12-17 |
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CNB2005100104660A Active CN100443244C (en) | 2005-10-25 | 2005-10-25 | Mesothermal copper based solder without cadmium, and preparation method |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101829860A (en) * | 2010-04-20 | 2010-09-15 | 哈尔滨工业大学 | Welding wire for unpreheated welding of red copper thick and large part and preparation method thereof |
CN101890592A (en) * | 2010-07-19 | 2010-11-24 | 周炳刚 | Novel brazing material and manufacturing method thereof |
CN101664864B (en) * | 2009-09-24 | 2011-08-03 | 哈尔滨工业大学 | Moderate temperature copper based brazing filler metal and preparation method thereof |
CN102179642A (en) * | 2011-05-06 | 2011-09-14 | 郴州格瑞特焊业有限公司 | Copper-based brazing filler metal and preparation method thereof |
CN101342644B (en) * | 2007-07-13 | 2012-05-23 | 浙江信和科技股份有限公司 | High-ductility environment friendly silver-saving medium-temperature brazing filler metal |
CN102581516A (en) * | 2012-03-27 | 2012-07-18 | 郑州机械研究所 | Super-plastic copper and phosphorous welding rod and preparation method thereof |
CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
CN102744534A (en) * | 2012-07-27 | 2012-10-24 | 张国华 | Preparation method of silver-free solder and product |
CN103624418A (en) * | 2013-12-12 | 2014-03-12 | 杭州华光焊接新材料股份有限公司 | Low-silver-copper-based brazing filler metal and preparation method thereof |
CN104096988A (en) * | 2013-04-07 | 2014-10-15 | 江西金世纪特种焊接材料有限公司 | Rare earth La and Ce-containing low-Ag-Cu-P brazing filler metal |
CN104625471A (en) * | 2014-12-18 | 2015-05-20 | 郴州市金贵银业股份有限公司 | Cadmium-free silver filler metal for vacuum electron brazing and preparation method thereof |
CN106041355A (en) * | 2016-07-20 | 2016-10-26 | 安徽华众焊业有限公司 | Copper-based soldering paste |
CN106141496A (en) * | 2016-07-28 | 2016-11-23 | 华南理工大学 | A kind of copper phosphor tin nickel solder and its preparation method and application |
CN110952017A (en) * | 2019-12-27 | 2020-04-03 | 华北水利水电大学 | High-entropy ultra-silver solder alloy and preparation method thereof |
CN114367764A (en) * | 2022-03-07 | 2022-04-19 | 金华市步扬焊材有限公司 | Bronze welding wire and production process and extrusion equipment thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1508331B1 (en) * | 1966-05-25 | 1971-04-29 | Jurid Werke Gmbh | SOLDER MATERIAL FOR SINTER MATERIALS |
JPS5658941A (en) * | 1979-10-18 | 1981-05-22 | Honda Motor Co Ltd | Solder alloy for sintered alloy |
JPS6040688A (en) * | 1983-08-15 | 1985-03-04 | Toyota Motor Corp | Brazing filler metal |
US5004581A (en) * | 1989-07-31 | 1991-04-02 | Toyota Jidosha Kabushiki Kaisha | Dispersion strengthened copper-base alloy for overlay |
JPH11179588A (en) * | 1997-12-16 | 1999-07-06 | Nhk Spring Co Ltd | Brazing filler metal for stainless steel |
JP3853100B2 (en) * | 1998-02-26 | 2006-12-06 | 三井金属鉱業株式会社 | Copper alloy with excellent wear resistance |
-
2005
- 2005-10-25 CN CNB2005100104660A patent/CN100443244C/en active Active
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101342644B (en) * | 2007-07-13 | 2012-05-23 | 浙江信和科技股份有限公司 | High-ductility environment friendly silver-saving medium-temperature brazing filler metal |
CN101664864B (en) * | 2009-09-24 | 2011-08-03 | 哈尔滨工业大学 | Moderate temperature copper based brazing filler metal and preparation method thereof |
CN101829860A (en) * | 2010-04-20 | 2010-09-15 | 哈尔滨工业大学 | Welding wire for unpreheated welding of red copper thick and large part and preparation method thereof |
CN101890592A (en) * | 2010-07-19 | 2010-11-24 | 周炳刚 | Novel brazing material and manufacturing method thereof |
CN102179642A (en) * | 2011-05-06 | 2011-09-14 | 郴州格瑞特焊业有限公司 | Copper-based brazing filler metal and preparation method thereof |
CN102581516A (en) * | 2012-03-27 | 2012-07-18 | 郑州机械研究所 | Super-plastic copper and phosphorous welding rod and preparation method thereof |
CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
CN102626837B (en) * | 2012-05-09 | 2014-06-04 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
CN102744534A (en) * | 2012-07-27 | 2012-10-24 | 张国华 | Preparation method of silver-free solder and product |
CN104096988A (en) * | 2013-04-07 | 2014-10-15 | 江西金世纪特种焊接材料有限公司 | Rare earth La and Ce-containing low-Ag-Cu-P brazing filler metal |
CN103624418A (en) * | 2013-12-12 | 2014-03-12 | 杭州华光焊接新材料股份有限公司 | Low-silver-copper-based brazing filler metal and preparation method thereof |
CN103624418B (en) * | 2013-12-12 | 2015-10-07 | 杭州华光焊接新材料股份有限公司 | A kind of low silver copper-base filler metals and preparation method thereof |
CN104625471A (en) * | 2014-12-18 | 2015-05-20 | 郴州市金贵银业股份有限公司 | Cadmium-free silver filler metal for vacuum electron brazing and preparation method thereof |
CN106041355A (en) * | 2016-07-20 | 2016-10-26 | 安徽华众焊业有限公司 | Copper-based soldering paste |
CN106141496A (en) * | 2016-07-28 | 2016-11-23 | 华南理工大学 | A kind of copper phosphor tin nickel solder and its preparation method and application |
CN110952017A (en) * | 2019-12-27 | 2020-04-03 | 华北水利水电大学 | High-entropy ultra-silver solder alloy and preparation method thereof |
CN114367764A (en) * | 2022-03-07 | 2022-04-19 | 金华市步扬焊材有限公司 | Bronze welding wire and production process and extrusion equipment thereof |
Also Published As
Publication number | Publication date |
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CN100443244C (en) | 2008-12-17 |
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Address after: 150001 Harbin, Nangang, West District, large straight street, No. 92 Co-patentee after: Jinhua SELENO Brazing Alloys Manufacturing Co.,Ltd. Patentee after: HARBIN INSTITUTE OF TECHNOLOGY Address before: 150001 Harbin, Nangang, West District, large straight street, No. 92 Co-patentee before: Jinhua SELENO Brazing Alloys Manufacturing Co.,Ltd. Patentee before: Harbin Institute of Technology |
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Free format text: FORMER OWNER: ZHEJIANG SELENO SCIENCE AND TECHNOLOGY CO., LTD. Effective date: 20120709 Owner name: ZHEJIANG SELENO SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HARBIN INSTITUTE OF TECHNOLOGY Effective date: 20120709 |
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CP01 | Change in the name or title of a patent holder |
Address after: 150001 Harbin, Nangang, West District, large straight street, No. 92 Co-patentee after: ZHEJIANG SELENO SCIENCE AND TECHNOLOGY CO.,LTD. Patentee after: HARBIN INSTITUTE OF TECHNOLOGY Address before: 150001 Harbin, Nangang, West District, large straight street, No. 92 Co-patentee before: Jinhua SELENO Brazing Alloys Manufacturing Co.,Ltd. Patentee before: Harbin Institute of Technology |
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TR01 | Transfer of patent right |
Effective date of registration: 20120709 Address after: 321017, No. two, section 588, Rainbow Road, Jinhua, Zhejiang Patentee after: ZHEJIANG SELENO SCIENCE AND TECHNOLOGY CO.,LTD. Address before: 150001 Harbin, Nangang, West District, large straight street, No. 92 Co-patentee before: ZHEJIANG SELENO SCIENCE AND TECHNOLOGY CO.,LTD. Patentee before: Harbin Institute of Technology |