CN1755911A - Liquid processing apparatus - Google Patents

Liquid processing apparatus Download PDF

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Publication number
CN1755911A
CN1755911A CN 200510108471 CN200510108471A CN1755911A CN 1755911 A CN1755911 A CN 1755911A CN 200510108471 CN200510108471 CN 200510108471 CN 200510108471 A CN200510108471 A CN 200510108471A CN 1755911 A CN1755911 A CN 1755911A
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China
Prior art keywords
aforementioned
wafer
rotatable parts
foup
transported
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CN 200510108471
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Chinese (zh)
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CN100411129C (en
Inventor
上川裕二
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Abstract

The invention relates to a liquid processing device, which carries out liquid processing for the processing liquid supplied by a base plate, and comprises a retaining mechanism, a rotary mechanism, an inbound-outbound port, a processing chamber and a cover body, wherein, the retaining mechanism retains the base plate; the retaining mechanism is rotated by the rotary mechanism; the inbound-outbound port is used for entering and withdrawing the retaining mechanism; the processing chamber is used for containing the retaining mechanism, and carries out the specified liquid processing to the base plate retained on the retaining mechanism; the inbound-outbound port formed on the processing chamber is closed by the cover body in a state that the retaining mechanism is contained in the processing chamber; the retaining mechanism, the rotary mechanism and the cover body are integrated into an integral structure.

Description

Liquid handling device
Technical field
The present invention relates to various substrates such as semiconductor wafer and LCD substrate are carried out liquid handling and desiccant liquid handling device.
Background technology
For example, in semiconductor device sheet manufacturing process, use will be cleaned with the soup of regulation and pure water etc. as the semiconductor wafer (wafer) of substrate, remove the wafer cleaner that degranulation, organic pollution, metal impurity etc. are removed impurity from wafer, and with nitrogen (N 2) IPA steam that inert gas such as body and volatility and hydrophily are high etc. removes drop from wafer wafer is carried out dry wafer drying device.
As this cleaning device and drying device, known have an one chip that wafer is handled one by one, and a plurality of wafers are carried out batch processing in wafer purge chamber and wafer hothouse device.
As this one chip processing unit, for example, keep this wafer at its circumference or the back side, one side makes it rotate surface and the back side injection cleaning fluid of one side to wafer in horizontal plane, simultaneously, rotary brush etc. is known the so-called scrubber that wafer surface scans.
But, carry out under the situation of clean wafer being remained on level, when the wafer rotation will be got rid of attached to the cleaning fluid on the wafer, exist the problem of unsatisfactorily cleaning fluid being removed.Simultaneously, wafer is being remained on level when carrying out clean, the volume of cleaning process room is big in general, so air displacement is big during with cleaning process room's exhaust.Therefore, the temperature of employed soup descends easily, exists the problem that is difficult to use the high temperature soup.And then, wafer is remained on when carrying out clean under the level, for atmosphere is controlled under the situation of cleaning process room being made closed structure, exist to the switching mechanism of cleaning process room and with the control program complicated problems of wafer to control of indoor conveying of clean and output mechanism etc.And then be difficult under occasion, each wafer is overlapped into multilayer handle with the wafer-level mounting.
On the other hand, cleaning processing apparatus as batch type, for example, as shown in figure 31, wafer cleaner 500 with following structure is known, the structure of described cleaning device 500 is, it has the treatment chamber 502 that forms wafer purge chamber 501, make the rotatable parts 505 that can keep wafer W and rotatably be provided with can be from wafer delivery port 503 advance and retreat that are formed at treatment chamber 502 front sides, rotatable parts 505 are entered under the state of process chamber 502, can between the wafer chuck 509a of rotatable parts 505 and conveying arm and 509b, pass on to wafer W.In addition, the reference number 507 among Figure 31 is driving mechanisms that expression makes rotatable parts can advance, retreat and rotate, and 508 is rotating shaft, and 504 is the lid of treatment chamber 502, and 506 is the retaining member of rotatable parts.
But in the wafer cleaner shown in Figure 31, owing to must make wafer chuck 509a, the retaining member 506 of 509b and rotatable parts 505 can not clash each other, thereby exists the very complicated problems that becomes such as working procedure.
And in recent years, along with the fine highly integrated and large batch of generation of semiconductor device, the size of wafer is from the heavy caliber development of φ 200mm to φ 300mm.Corresponding therewith, as storage containers such as the preservation of wafer, carryings, under the situation of the wafer of φ 200mm, employing is deposited wafer with plumbness storing containers, and for the wafer of φ 300mm, because its size and weight increase the general storing containers of depositing wafer with level that adopts.
Under this situation,, also preferably wafer was carried out basically in vertical mode with the past to the clean of wafer itself with level carrying wafer.Thereby, be not only wafer cleaner 500, always in the device that wafer is kept with the state of perpendicular and carry, posture mapping device that wafer is altered one's posture between level and plumbness etc. also must be set, therefore, exist the problem that makes carrying wafers mechanism complicated, and cause problems such as the pollution of wafer and damage because the number of times that moves increases easily between the processing mechanism of wafer.
Simultaneously, if do not change existing clean structure, when strengthening the each several part mechanism that handles wafer and member, can strengthen whole cleaning processing apparatus inevitably for the size of accommodate wafer.Therefore, need to avoid as much as possible the maximization of device urgently by the structure of modifying device.In the one chip cleaning processing apparatus, wish to avoid the maximization of this cleaning processing apparatus too.
Summary of the invention
First purpose of the present invention provide a kind of can high accuracy and carry out the liquid handling device of the liquid handling such as cleaning of substrate expeditiously.It is the device that a substrate is carried out liquid handling basically that second purpose of the present invention provides a kind of, but the liquid handling device that also can properly deal with at an easy rate for the processing of a plurality of substrates.Thereby the 3rd purpose of the present invention provides a kind of along with improve the liquid handling device that design can suppress the compactness of processing unit maximization for the big substrate of external diameter is carried out liquid handling.
According to the present invention, a kind of liquid handling device is provided, comprise in the liquid handling device of liquid handling carrying out: the maintaining body that keeps substrate to the supply substrate treatment fluid; Make the rotating mechanism of aforementioned maintaining body rotation; Have make that aforementioned maintaining body enters/withdraw from usefulness be transported into, transport mouth, hold the chamber of the liquid handling that aforementioned maintaining body stipulates the substrate that remains on the aforementioned maintaining body; Under the state that aforementioned maintaining body is contained in the aforementioned processing chamber, be transported into, transport a mouth lid of closing on the aforementioned cavity being formed at; Wherein, aforementioned maintaining body and aforementioned rotating mechanism and aforementioned lid have overall structure.
According to liquid handling device of the present invention, by adopting coming conversion to keep the method that was not adopted in this prior art of posture of maintaining body of substrate in the mode of the maintenance of substantial horizontal or perpendicular substrate, compare with the situation that merely strengthens liquid handling device corresponding to large-area substrate in the prior art, the maximization of unitary fluid processing unit can be suppressed, compact liquid handling device can be realized.Simultaneously, even be contained in substrate under the situation of container with level, owing to can conversion keep the posture of the maintaining body of substrate, so, between container and maintaining body, the posture mapping device needn't be set separately, can simplify the transport process of substrate whereby, to such an extent as to can simplify the mechanism of whole liquid processing unit.And then, since substrate move that to change number of times few, can be suppressed at and produce particle on the substrate and be difficult for substrate is polluted, and be difficult for causing the damage of substrate.Simultaneously, carry out liquid handling because substrate is remained essentially in plumbness, thereby can will remove attached to the treatment fluid on the substrate easily, and can carry out liquid handling equably the surface and the back side of substrate.In addition, because the atmosphere that can carry out at an easy rate in the treatment chamber is controlled, also carry out dried easily.
Description of drawings
Fig. 1, be expression as the perspective view of the simple structure of the monolithic of a kind of form of implementation of liquid handling device of the present invention or cleaning processing apparatus;
Fig. 2, be the end view of the simple structure of expression cleaning processing apparatus shown in Figure 1;
Fig. 3, be the plane graph of the simple structure of expression cleaning processing apparatus shown in Figure 1;
Fig. 4, be the cutaway view that expression will the rotating disk that cleaning device possessed shown in Figure 1 be inserted into a kind of form of the interior state of treatment chamber;
Fig. 5, be that expression is inserted into the another one cutaway view of a kind of form of the state in the treatment chamber with the rotating disk that cleaning processing apparatus shown in Figure 1 possessed;
Fig. 6, be that expression will keep the wafer retaining member of two wafers to be configured in the key diagram of a kind of form on the rotating disk;
Fig. 7, be the cutaway view of a kind of form of lateral compartments when being illustrated in the wafer retaining member that adopt to keep two wafers and medial compartment;
The plane graph of a kind of form of Fig. 8, chip processing device that to be expression combine cleaning processing apparatus shown in Figure 1 and vacuum treatment portion;
Fig. 9, be the perspective view of expression as the simple structure of the batch type cleaning processing apparatus of the another kind of form of implementation of liquid handling device of the present invention;
Figure 10, be the end view of the simple structure of expression cleaning processing apparatus shown in Figure 9;
Figure 11, be the plane graph of the simple structure of expression cleaning processing apparatus shown in Figure 9;
Figure 12, be the key diagram of the structure of expression rotatable parts that cleaning processing apparatus possessed shown in Figure 9;
Figure 13, be the cutaway view that expression is configured in a kind of form of implementation of the treatment chamber on the liquid-treatment unit that constitutes cleaning processing apparatus shown in Figure 9;
Figure 14, be the another one cutaway view that expression is configured in a kind of form of implementation of the treatment chamber on the liquid-treatment unit that constitutes cleaning processing apparatus shown in Figure 9;
Figure 15, be the end view of expression as the simple structure of the batch type cleaning processing apparatus of another form of implementation of liquid handling device of the present invention;
Figure 16, be the plane graph of the simple structure of expression cleaning processing apparatus shown in Figure 15;
Figure 17, be the cutaway view of a kind of form of the expression peripheral structure that is configured in the treatment chamber on the liquid-treatment unit that constitutes cleaning processing apparatus shown in Figure 15;
Figure 18 A, be that the FOUP that is illustrated in the cleaning processing apparatus shown in Figure 15, on the FOUP platform goes up the key diagram of the mechanism of supply scavenging air;
Figure 18 B, be illustrated in the cleaning processing apparatus shown in Figure 15, the key diagram of the another kind of mechanism of supply clean air on the batch type cleaning processing apparatus of the another kind of form of implementation of the supply of the FOUP on FOUP platform clean air;
Figure 19, be the perspective view of expression as the simple structure of the batch type cleaning processing apparatus of another form of implementation of liquid handling device of the present invention;
Figure 20, be the plane graph of the simple structure of expression cleaning processing apparatus shown in Figure 19;
Figure 21, be the end view of the simple structure of expression cleaning processing apparatus shown in Figure 19;
Figure 22, be the end view of state that expression makes a part of mechanism action of cleaning processing apparatus shown in Figure 19;
Figure 23 A, be the cutaway view of the simple structure of the expression rotatable parts rotating mechanism that cleaning processing apparatus possessed shown in Figure 19;
Figure 23 B, be that expression is inserted into the front view of the state in the lateral compartments with the rotatable parts rotating mechanism shown in Figure 23 A;
Figure 24, to be expression be inserted into the cutaway view of the state in the treatment chamber that the clean unit of cleaning processing apparatus shown in Figure 19 possessed with rotatable parts;
Figure 25, to be expression be inserted into another cutaway view of the state in the treatment chamber that the clean unit of cleaning processing apparatus shown in Figure 19 possessed with rotatable parts;
Figure 26 A, be the key diagram of the motion track of the rotatable parts rotating mechanism that possessed of the clean unit of expression cleaning device shown in Figure 19;
Figure 26 B, be the key diagram that is illustrated in the posture of the P1 point place rotatable parts rotating mechanism shown in Figure 26 A;
Figure 26 C, be the key diagram that is illustrated in the posture of the P2 point place rotatable parts rotating mechanism shown in Figure 26 A;
Figure 26 D, be the key diagram that is illustrated in the posture of the P3 point place rotatable parts rotating mechanism shown in Figure 26 A;
Figure 26 E, be the key diagram that is illustrated in the posture of the P4 point place rotatable parts rotating mechanism shown in Figure 26 A;
Figure 27 A is to be illustrated in the mobile form of the rotatable parts rotating mechanism shown in Figure 26 B～E the key diagram of rotatable parts rotating mechanism requisite space;
Figure 27 B, be the front view that expression is arranged on the position of the length measurement sensor in the treatment chamber that cleaning unit possessed of cleaning processing apparatus shown in Figure 19;
Figure 28, be the perspective view of the structure of the rotatable parts that possessed of the clean unit of expression cleaning processing apparatus shown in Figure 19;
Figure 29 A, be the cutaway view of simple structure of the sealing mechanism of the expression treatment chamber that cleaning unit possessed that is used for cleaning processing apparatus shown in Figure 19;
Figure 29 B, be the cutaway view that expression makes the state of the sealing mechanism action shown in Figure 29 A;
Figure 30, be the plane graph of expression as the simple structure of the batch type cleaning processing apparatus of the further another kind of form of implementation of liquid handling device of the present invention;
Figure 31, be the key diagram of simple structure of the batch type cleaning device of expression prior art.
Embodiment
Below, with reference to the accompanying drawings form of implementation of the present invention is specifically described.Liquid handling device of the present invention, go for the cleaning device of various substrates as handled object, drying process device, but in this form of implementation, to being transported into of semiconductor wafer (wafer), clean, occasion dry, that transport the cleaning processing apparatus that the mode of carrying out continuously constitutes describes.
Fig. 1 is the perspective view of expression as the simple structure of the modular cleaning processing apparatus 1 of a kind of form of implementation of liquid handling device of the present invention, and Fig. 2 is its end view, and Fig. 3 is its plane graph.To shown in Figure 3, cleaning device 1 is mainly by constituting with the lower part as these Fig. 1; Mounting can be held a plurality of with level, and for example, the storing containers of 25 wafer W is (hereinafter to be referred as " FOUP ": Front Opening Unified Pod: the FOUP platform 2a that uses of the F whole container of open-front), 2b; Wafer W is carried out the clean unit 3a～3c of clean; Be arranged on FOUP platform 2a, the delivery unit 4 that transmits between 2b and the clean unit 3a～3c, to wafer W, store the soup storage unit 5a～5c of clean, drive and be arranged on the power subsystem 6 that the various electric driving mechanisms in the cleaning processing apparatus 1 are used with soup.
FOUP platform 2a, 2b is the position of mounting FOUPF, what be formed at that being used on the FOUPF be transported into, transport wafer W is transported into, transports actinal surface to the 12a of window portion in the wall portion 11 that is located at wafer handling unit 4 (FOUP platform 2a side), 12b (FOUP platform 2b side), and FOUP F mounting is in FOUP platform 2a, on the 2b.
Go up configuration in the inboard of wall portion 11 (wafer handling unit 4 sides) and have opening and closing device 14a (in the FOUP2a side), the 14b (in FOUP platform 2b side) that the gate that opens and closes the window 12a of portion, 12b and the lid that is transported into, transports mouthful that opens and closes FOUP F is opened and closed the cover body opening/closing mechanism of usefulness, FOUPF not mounting in FOUP platform 2a, under the state on the 2b, gate is in closed condition.On the other hand, when wafer W being transported or being transported in the FOUP F in FOUPF, the lid of gate and FOUP F is opened by opening and closing device 14.
In wafer handling unit 4,, the detecting sensor 13a (in FOUP platform 2a side) that the sheet number of the wafer W in the FOUPF is measured usefulness is set, 13b (in the FOUP2b side) near opening and closing device 14a, 14b place.Detecting sensor 13a, 13b, for example, along the Z scanning direction, one side is checked the sheet number in the wafer W at two positions of the directions X end of wafer W to one side with the infrared ray sensor head.
As detecting sensor 13a, 13b, more preferably, in the sheet number that detects wafer W, the function that also has the storage configuration of the wafer W of detecting, for example, in FOUP F wafer W whether in accordance with regulations spacing deposit in parallel to each other blocks ofly, whether wafer W leaves in the FOUPF with the crustal inclination that staggers highly mutually, and whether wafer W breaks away from the assigned position of FOUPF etc.In addition, also can, after detecting the storage configuration of wafer W, go out the sheet number of wafer W with same sensor.If adopt simultaneously the structure that this detecting sensor is installed on the wafer handling device 7, can moves simultaneously with wafer handling device 7, detecting sensor only can be configured in a position.
In wafer handling unit 4, in mounting in the FOUPF between FOUP platform 2a, the 2b and be configured between the wafer retaining member 33 on the rotating disk 31, be configured to the wafer handling device 7 that level transmits.Wafer handling device 7 has the utilization transferring arm 21a that uses of untreated wafer W and transmits the transferring arm 21b that wafer W that clean finishes is used, each transferring arm 21a, and 21b can keep a slice wafer W respectively.
Keep the transferring arm maintaining part 22 of transferring arm 21a, 21b, its inside has a not shown Y-axis driving mechanism, and can slide along the Y direction along guiding mechanisms such as being located at slot part on the workbench 23 or guide rail.Simultaneously, transferring arm maintaining part 22 can be with transferring arm 21a, 21b (Q direction) rotation in X-Y plane.Carry out the not shown Q rotary drive mechanism of this Q direction rotation, for example can be installed in the transferring arm maintaining part 22, but also can have the structure of rotating together with workbench 23.
Transferring arm 21a, 21b and transferring arm maintaining part 23 and workbench 23 can move along Z direction (vertical direction) by Z axle driving mechanism 19.In FOUPF, because wafer W leaves different height and position places in, so available this Z axle driving mechanism 19 overlaps transferring arm 21a with the height and position of the wafer W of regulation.For example, when the wafer W of depositing in the assigned position place of FOUP F is transported, with the mode that this transferring arm 21a can be inserted into the downside of this wafer W, by Z axle driving mechanism 19 with after the height of transferring arm 21a aligns, make the action of Y-axis driving mechanism, transferring arm 21a is inserted in the FOUP F, then, transferring arm 21a is risen to the height place of regulation by Z axle driving mechanism 19, wafer W is remained on the transferring arm 21a, in this state, utilize the Y-axis driving mechanism that transferring arm 21a is returned to original position, can from FOUP F, transport wafer W.
In addition, transferring arm 21a, 21b and transferring arm maintaining part 22 and workbench 23 can move at directions X along guide rail 17 by X-axis driving mechanism 18, and wafer handling device 7 can touch in mounting any one FOUP F on FOUP platform 2a, 2b.Simultaneously, wafer handling device 7 can touch any one rotating disk 31 that is configured on clean unit 3a～3c.
By adopting this Y-axis driving mechanism, the θ rotary drive mechanism, X-axis driving mechanism 18 and Z axle driving mechanism 19, for example, drive Y-axis driving mechanism and Z axle driving mechanism 19, the FOUP F of transferring arm 21a on mounting and FOUP platform 2a inserted, wafer W is transported from FOUP F, then, drive θ rotary drive mechanism and X-axis driving mechanism 18, with transferring arm 21a direction Rotate 180 °, wafer W is pointed to clean unit 3a side, then, drive Y-axis driving mechanism and Z axle driving mechanism 19, can carry out wafer W is transplanted on action and the action opposite with it on the wafer retaining member 33 on the rotating disk 31 that is configured in the clean unit 3a from transferring arm 21a.In addition, also can replace the Y-axis driving mechanism, perhaps make transferring arm 21a, 21b have the form of retractables such as multi-joint arm, between FOUPF and rotating disk 31, transmit wafer W with the Y-axis driving mechanism.
Configurating filtered fan (FFU) 28a on the top plate portion of wafer handling unit 4 blows the air of removing particle in wafer handling unit 14.Simultaneously, at wafer handling device 7 and be located between each rotating disk 31 on clean unit 3a～3c and transfer wafer W, in the wall portion 25 on the border that forms wafer handling unit 4 and clean unit 3a～3c, form the window 26a～26c of portion to be opened/closed.On the 26a～26c of window portion, will be configured in wafer handling unit 4 sides to gate 27a～27c that the 26a～26c of window portion opens and closes, wafer handling unit 4 and the atmosphere of clean unit 3a～3c can be isolated.By gate 27a～27c, prevent in the steam flow conveyer 4 of the various soups that in clean unit 3a～3c, use.Gate 27a～27c also can be arranged on clean unit 3a～3c side.
Clean unit 3a～3c adopts spaced walls 29a, 29b spaced structural, makes atmosphere indiffusion each other between cleaning unit 3a～3c, can carry out clean with different cleaning fluids in each clean unit 3a～3c.Because clean unit 3a～3c all has identical structure, thereby, be that example describes its structure with clean unit 3a below.
On the top plate portion of clean unit 3a, configurating filtered fan (FFU) 28b will blow in clean unit 3a except that the air of degranulation.Clean unit 3a has a wafer whirligig 8, and this whirligig 8 is installed to the motor 32 that makes rotating disk 31 rotations on the rotating disk 31 through pivot 37 by the centre and constitutes.The wafer retaining member 33 that keeps wafer W to use is set on the surface of rotating disk 31, wafer W is in the surperficial substantially parallel mode of its surface and the back side and rotating disk 31, above rotating disk 31, promptly, under the state of the distance of floating regulation from the surface of rotating disk 31, remain on the wafer retaining member 33.
Wafer retaining member 33 preferably has the structure that keeps wafer W at circumference, for example, can list, and forms the pin of the groove that keeps wafer W.Fig. 3 is illustrated in the state of four position configuration pin shape wafer retaining members 33, in this case, in order between wafer retaining member 33 and transferring arm 21a, 21b, to transfer wafer W, at the position of wafer retaining member 33 near the 26a of window portion side, for example be arranged on when transferring wafer W to slip of the position of the action that does not hinder transferring arm 21a, 21b or switching mechanism, and employing will be slided when keeping wafer W or switching mechanism locks, and prevents the structure that wafer W comes off from wafer retaining member 33.
The pivot 37 that connects rotating disk 31 and motor 32, perforation is configured in the central part of the disk 38 of rotating disk 31 downsides.Disk 38 is closed the rotating disk insertion mouth 54 of treatment chamber when inserting rotating disk 31 in the treatment chamber 51.But disk 38 itself does not rotate.Thereby, connecting at pivot 37 on the part of disks 38, employing can make pivot 37 rotate but the hermetically-sealed construction that can not cause that cleaning fluid leaks etc. from treatment chamber 51.
For making disk 38 and wafer whirligig 8 in the Y-X face, rotate the angle of regulation, the posture mapping device 9 with shank 34 and rotating shaft 35 and disk retaining member 36 is set on disk 38.Utilize this posture mapping device 9, can remain on wafer W and be essentially level and be essentially free position between the plumbness.
The driving of posture mapping device 9 is undertaken by drive units such as motor and actuators.Disk retaining member 36 plays a part the lid of pivot 37, for example, when disk retaining member 36 is the form that pivot 37 and motor 32 all are surrounded, can suppress the pollution to the atmosphere in the clean unit 3a such as the particle that produced by motor 32 grades.
The shank 34 of posture mapping device 9 is set at can be on the Y-axis driving mechanism 10 that guide rail 39 upper edge Y directions move, thereby wafer whirligig 8 and posture mapping device 9 can move along the Y direction in clean unit 3a.Utilize this Y-axis driving mechanism 10, the part of rotating disk 31 that wafer W is transformed into the wafer whirligig 8 of vertical substantially posture can be inserted in the treatment chamber 51.
In the casing 15 of mounting guide rail 39, for example can hold wafer whirligig 8, posture mapping device 9, the control device of Y-axis driving mechanism 10 grades.In addition, in Fig. 1 to Fig. 3, do not illustrate, between the space of the space of arrangement guide rail 39 and configuration process chamber 51, gate to be opened/closed is set, make the structure that atmosphere in the treatment chamber 51 can not be diffused into whole clean unit 3a.
In clean unit 3a, be provided with the wafer W that remains on the rotating disk 31 is carried out the treatment chamber 51 that clean is used.Fig. 4 and Fig. 5 are the profiles that expression is inserted into rotating disk 31 a kind of form of the state in the treatment chamber 51.In Fig. 4 and Fig. 5, posture mapping device 9 and Y-axis driving mechanism 10 have been omitted among the figure, for treatment chamber 51, express it and have lateral compartments 52a that the cross section is trapezoidal tubular form substantially and the dual structure that can constitute along the medial compartment 52b that the Y direction is slided.
Fig. 4 represents to make medial compartment 52b to keep out of the way right side among the figure, and the state when carrying out clean with lateral compartments 52a, Fig. 5 are represented medial compartment 52b is contained in the lateral compartments 52a, carry out the state of clean with medial compartment 52b.When keeping in repair etc., lateral compartments 52a can be slided into the position of medial compartment 52b, move back wall.
As shown in Figure 4, the processing in lateral compartments 52a, by vertical wall 53a, form rotating disk and insert mouthfuls 54 vertical wall 53b, and close rotating disk and insert in the process chamber 70a that the disk 38 of mouthfuls 54 wafer whirligig 8 forms and carry out.Top at vertical wall 53b is provided with the exhaust channel that is made of vent valve 65 and blast pipe 67, can adjust the atmosphere of handling in the 70a.In addition, constitute drain line (discharge opeing path) by tapping valve 61 and discharging tube 63, from process chamber 70a, discharge used cleaning fluid in the setting of the bottom of vertical wall 53b.Lateral compartments 52a, the external diameter of its vertical wall 53b side is bigger than the external diameter of vertical wall 53a side, and, the mode that forms gradient with the below of vertical wall 53b side is fixed on the lower wall of main part of lateral compartments 52a, so in lateral compartments 52a, can at an easy rate used cleaning fluid be discharged by discharging tube 63 from tapping valve 61.
The nozzle 56 that is provided with jet 55 at two positions is installed in jet 55 along continuous straight runs mode arranged side by side on the upper wall of main part of lateral compartments 52a.Can discharge go out the pure water of the source of supply supply in the soup storage unit 5a, IPA, N from jet 55 2Gas etc.For example, in Fig. 4, spray pure water etc. from the face of jet 55 that is positioned at the right side to the wafer W right side, spray pure water etc. preferably from the jet that is positioned at the left side to the face in wafer W left side, spray pure water etc. from jet 55 to one of wafer W bigger area, for example, eject pure water etc. to be extended to conical mode.
On vertical wall 53b, the nozzle 69a that the back side of cleaning rotating disk 31 is used is set, nozzle 69a is mainly used in handling with various soups and then the back side of rotating disk 31 is being cleaned with pure water.In addition, in Fig. 4 and Fig. 5, only express a nozzle 56, but also a plurality of nozzles can be set.
Medial compartment 52b has the shape that its end external diameter cross section littler than lateral compartments 52a is essentially trapezoidal tubular, can be between position shown in Figure 4 and position shown in Figure 5 moves (slip) along the Y direction is parallel.Medial compartment 52b has annular component 59b on the end face of its smaller diameter side, has annular component 59a in its larger diameter side, in the time of in medial compartment 52b is configured to lateral compartments 52a, annular component 59a is close to vertical wall 53a and goes up its sealing, simultaneously, annular component 59b is close to vertical wall 53b and goes up its sealing, forms process chamber 70b.
When making medial compartment 52b when lateral compartments 52a backs out, when being close to vertical wall 53a by annular component 59b, annular component 59a is close to vertical wall 53c, and atmosphere and the atmosphere in the medial compartment 52b of the process chamber 70a that will be formed by lateral compartments 52a are isolated.Contact the part place that contacts disengaging with vertical wall 53b with the part and the annular component 59b of disengaging with vertical wall 53a at annular component 59a not shown containment member is set.
On the main part upper wall in medial compartment 52b, the nozzle 58 that forms jet 57 at two positions is installed, jet 57 along continuous straight runs are disposed side by side.The various soups of the source of supply supply in from jet 57 injections from soup storage unit 5a, pure water, IPA etc.For example, in Fig. 5, spray soup etc., spray soup etc. from the face of jet 57 that is positioned at the left side to the wafer W left side from the face of jet 57 that is positioned at the right side to the wafer W right side.Preferably, spray soup etc., for example, spray soup etc. to be essentially plane fan-shaped expansion ground from jet 57 concentrated areas to wafer W.
On the upper inside wall of medial compartment 52b, the nozzle 69b of the surface usefulness of cleaning rotating disk 31 is set, can spray pure water etc.Preferably, on rotating disk 31, spray pure water etc. in large area, for example spray pure water etc. with the shape that is extended to circular cone from nozzle 69a, 69b.Also can be from these various nozzles 56,58,69a, 69b provide additional hyperacoustic cleaning fluid.
In the upper end of annular component 59a the blast pipe 68 that vent valve 66 is communicated with vent valve 66 is set, can adjusts the atmosphere in the process chamber 70b, and when medial compartment 52b is in retreating position, the atmosphere in the medial compartment 52b be adjusted.Simultaneously, form cleaning fluid outlet 4b in the lower end of annular component 59a, and be provided for and discharge opeing guiding elements 47 that this cleaning fluid outlet 4b is communicated with.Discharge opeing guiding piece 47 extends downwards, and its front end 48 points to horizontal direction.
Below vertical wall 53a, dispose discharging tube 49 individually, on the front end of discharging tube 49, form cover portion 50.When medial compartment 52b is in retreating position, the leading section 48 and the cover portion 50 of discharge opeing guiding elements 47 are in state spaced apart from each other, when being received in the lateral compartments 52a when medial compartment 52b is slided, front end 48 matches with cover portion 50, and hermetic sealing, whereby discharge opeing guiding elements 47 is communicated with discharging tube 49, becomes the structure that cleaning fluid can be discharged.On the other hand, when utilizing medial compartment 52b wafer W to be disposed, makes medial compartment 52b withdraw from lateral compartments 52a, leading section 48 breaks away from cover portion 50.
Medial compartment 52b, the mode that forms the inclined plane with motor 32 sides as smaller diameter side, on the little wall of main part disposes, and, cleaning fluid outlet 46 is formed at the lower side on inclined plane of the main part lower wall of medial compartment 52b, used cleaning fluid can flow in the discharge opeing guiding elements 47 from cleaning fluid outlet 46 at an easy rate in process chamber 70b, discharges by discharging tube 49.
Because lateral compartments 52a and medial compartment 52b are along the length of Y direction, that is, the length of main part can be set according to the rotating disk 31 and the interval of wafer W, thereby can easily save the space of treatment chamber 51 and clean unit 3a.In this case, processing atmosphere, reduction air displacement owing to easy control and treatment chamber 70a, 70b even also can not reduce its temperature in the occasion of using the high temperature soup, thereby can enlarge the scope of the kind of the soup that can use.Simultaneously, cleaning fluid directly can be sprayed on the surface of wafer W from nozzle 55,57, needn't use brush etc., thereby can the control of the various structures of following clean be more prone to.
Below, be that example describes the cleaning that is contained in the wafer W on the FOUP F with the situation that the wafer W in the FOUPF of mounting on FOUP platform 2a is handled in clean unit 3a～3c.At first, the FOUP F that deposits a plurality of wafer W with predetermined space abreast with on the FOUP F wafer W is transported into transport be transported into, transport mouthful the mode mounting faced with the 12a of window portion on FOUP platform 2a.
Utilize opening and closing device 14a with the gate that the 12a of window portion closes for the wafer W of the regulation in the FOUP F being transported, opening, open simultaneously the lid that is transported into, transports mouth of closing FOUP F is opened, the inside of FOUP F and the internal communication of delivery unit 4.Then, make detecting sensor 13a, check the sheet number and the storage configuration of the wafer W in the FOUPF along the Z scanning direction.Here,,, for example, upload under the situation that is equipped with other FOUP F, begin to carry out same processing from this other FOUP F at FOUP platform 2b with handling interrupt detecting under the unusual situation.
Wafer W in the FOUP F is not being detected under the unusual situation, make 19 actions of Z axle driving mechanism, transferring arm 21a is placed the position of the wafer W downside of the regulation that transports, after the height that makes transferring arm 21a is suitable, the Y-axis driving mechanism action that wafer handling device 7 is had, transferring arm 21a is inserted in the FOUP F, make Z axle driving mechanism 19 rise to the height of regulation, regulation a slice wafer W is remained on the transferring arm 21a, make the action of Y-axis driving mechanism once more, make transferring arm 21a turn back to original position.Then, till wafer W being transported with respect to FOUP F next time, going into wafer W, the lid of 12a of window portion and FOUP F is closed in opening and closing device 14a action.
So that remain on wafer W on the transferring arm 21a, make rotary drive mechanism Rotate 180 that wafer handling device 7 had ° in the face of being formed at the mode of the 26a of window portion in the wall portion 25 that constitutes wafer handling unit 4 and the border of clean unit 3a.Simultaneously, open the gate 27a that closes the 26a of window portion, be adjusted to the height that wafer retaining member 33 can be kept wafer W by Z axle driving mechanism 19 height transferring arm 21a.Then, in clean unit 3a, make the Y-axis driving mechanism action of wafer handling device 7, slip transferring arm 21a, make it to point to the wafer retaining member 33 that is in position on the rotating disk 31 of holding state in the face of the 26a of window portion.
From this transferring arm 21a when wafer retaining member 33 is transferred wafer W, the wafer retaining member 33 that is positioned at the 26a of window portion side is kept out of the way assigned position, becomes the state of the action that does not hinder transferring arm 21a.
If wafer W has been maintained on the retaining member 33, Z axle driving mechanism 19 actions that wafer handling device 7 is had, the position that reduces transferring arm 21a, and then, make the action of Y-axis driving mechanism, the position that transferring arm 21a is returned, 27a closes with gate.On rotating disk 31, wafer retaining member 33 keeps wafer W reliably at the circumference of wafer W.
Wafer handling device 7 utilizes and the front is sent to same transfer approach in the clean unit 3a from FOUP F, in rapid succession other wafer W in the FOUP F is sent in the clean unit 3b, then, further the wafer W of stipulating in the FOUP F is sent in the clean unit 3c, at cleaning unit 3b, use one by one in the 3c that identical cleaning method begins to carry out clean among the clean unit 3a.
Clean as follows in clean unit 3a.At first, with Y-axis driving mechanism 10 wafer whirligig 8 distance is in accordance with regulations slided into after treatment chamber 51 sides, utilize posture mapping device 9 to make rotating disk 31 wafer whirligig 8 be remained on level wafer whirligig 8 half-twists towards treatment chamber 51 sides.At this moment, wafer W is maintained at the state of perpendicular.Then, further utilize Y-axis driving mechanism 10 that rotating disk 31 is received in the lateral compartments 52a, simultaneously, slip wafer whirligig 8 and posture mapping device 9 are closed the rotating disk insertion mouth 54 of lateral compartments 52a with disk 38.
In treatment chamber 51, for example, the processing of removing polymer at medial compartment 52b innerlich anwenden liquid, in lateral compartments 52a, handle and during later dried with pure water, during beginning, form process chamber 70b with the state that medial compartment 52b is configured in the lateral compartments 52a, one side utilizes motor 32 to make the revolution rotation of rotating disk 31 with regulation, and one side is sprayed the soup of regulation with nozzle 58 to the surface and the back side of wafer W.Then, after disposing, spray pure water, the surface and the wafer W of rotating disk 31 are carried out prerinse from nozzle 58 and nozzle 69b with soup.
Secondly, at the state that medial compartment 52b keeps out of the way out from lateral compartments 52a, one side makes the revolution rotation of rotating disk 31 with regulation, simultaneously sprays pure water from nozzle 56 wafer W is cleaned, and sprays pure water from nozzle 69a simultaneously, and processing is washed at the back side of rotating disk 31.Then, do not spray pure water and make rotating disk 31 rotations, get rid of attached to the pure water on rotating disk 31 and the wafer W with the revolution of stipulating, as required, with IPA, N 2Gas etc. are ejected on the wafer W, and wafer W and rotating disk 31 are carried out dried.
After dried finishes, utilize Y-axis driving mechanism 10, slip wafer whirligig 8 makes it to break away from treatment chamber 51, and rotating disk 31 is transported from treatment chamber 51.Then, make posture mapping device 9 action, wafer whirligig 8 is holded up in vertical state, make rotating disk 31 turn back to position in the face of the 26a of window portion.With keeping the position of the wafer retaining member 33 of wafer W to adjust to the appropriate position that wafer W can be transported, remove the movable lock-out state in the wafer retaining member 33, make it to keep out of the way.
For wafer W is transported from wafer retaining member 33, adopt transferring arm 21b.Transport Z axle driving mechanism 19 actions that make wafer handling device 7 for the wafer W that transferring arm 21b is finished clean, regulate the height of transferring arm 21b, 27a opens with gate, utilize the Y-axis driving mechanism that transferring arm 21b is inserted between rotating disk 31 and the wafer W, make 19 actions of Z axle driving mechanism, 21b moves up wafer W lightly by transferring arm, and then make transferring arm 21b reposition by the Y-axis driving mechanism, wafer W can be transported from the wafer retaining member 33 on the rotating disk 31.
Behind closed shutter 27a, drive the Q rotary drive mechanism of wafer handling device 7, make transferring arm 21b point to FOUP platform 2a side, when opening the 12a of window portion with opening and closing device 14a, open the lid of FOUP F, make 4 one-tenth connected states in inside and wafer handling unit of FOUP F, be adjusted to Z axle driving mechanism 19 height and can make after the specified altitude of wafer W return transferring arm 21b, with the Y-axis driving mechanism transferring arm 21b is inserted in the FOUP F, wafer W is transported into, makes transferring arm 21b turn back to original position.Like this, by transmitting uncleaned wafer W with transferring arm 21a respectively, transmit cleaned wafer W with transferring arm 21b, transferring arm 21b does not keep uncleaned wafer W, thereby can not pollute cleaned wafer W.
Then, in FOUP F, also has undressed wafer W, it is carried out under the situation of clean, make the θ rotary drive mechanism action of wafer handling device 7, make transferring arm 21a in the face of behind the 12a of window portion, the transporting of the wafer W of stipulating repeatedly with preceding method, the transmission on the rotating disk 31, clean, on FOUP F, transmit, wait a series of operation.This operation also can similarly be carried out for the processing in cleaning unit 3b, 3c.Simultaneously, if FOUP F mounting on the FOUP platform, proceed processing, and begin processing the wafer W in the FOUPF of mounting on FOUP platform 2b to the wafer W in the FOUP F of mounting on FOUP platform 2a.
Above-mentioned clean method is the situation of all carrying out identical clean at the clean unit 3a～3c of three positions configurations, but the method for carrying out clean with cleaning processing apparatus 1 is not limited to this method.For example, to the wafer W in the FOUP F of mounting on FOUP platform 2a, use the soup of regulation only to handle with clean unit 3a, on the other hand, for the wafer W in the FOUP F of mounting on FOUP platform 2b, use other soup to handle, use clean unit 3a～3c respectively, perhaps also can use respectively according to the difference of contents processing according to the kind of employed soup with clean unit 3b, 3c.
Simultaneously, in cleaning processing apparatus 1, for keeping wafer W to be arranged on the wafer retaining member 33 on the rotating disk 31, only can keep a slice wafer W, but when the form change that makes retaining member 33 makes it to keep multi-disc, about for example 2～5 wafer, do not increase much owing to remain on the weight of the wafer on the wafer retaining member 33, can change the structure of devices such as motor 32 and posture mapping device 9, to shorten the processing time.
Fig. 6 is the key diagram that the wafer retaining member 33a that keeps two wafer W is configured in the structure on the rotating disk 31.Because the transferring arm 21a of wafer handling device 7 can transmit a slice wafer W, thereby by making transferring arm 21a between rotating disk 31 and FOUP F reciprocal twice, can leave two wafer W on the wafer retaining member 33a in, otherwise, by making transferring arm 21b reciprocal twice between rotating disk 31 and FOUP F, can turn back to two wafer in the FOUP F from retaining member 33a.
Because it is long with the time that the wafer handling device transmits the multi-disc wafer W to carry out the time ratio of a clean usually in treatment chamber 51, thereby, by once the multi-disc wafer being carried out clean, can shorten the clean time.Simultaneously, as configuration a plurality of transferring arm 21a, 21b, make it with remain on rotating disk 31 respectively on the sheet number of wafer W be consistent, just can finish the transmission of wafer with reciprocal transportation, can further shorten the processing time.
Fig. 7 is similar to cutaway view shown in Figure 4, the treatment chamber 51 that it is illustrated under the situation that adopts wafer retaining member 33a, be made of lateral compartments 52a ' and medial compartment 52b ' ' form.Nozzle 56 ', 58 ' longer than nozzle 56,58, nozzle 56 ', 58 ' on respectively at four positions jet 55,57 is set.In addition, lateral compartments 52a ' and medial compartment 52b ', for the configuration nozzle 56 of portion within it ', 58 ', have longer main part than lateral compartments 52a and medial compartment 52b.Nozzle 56 ', 58 ' length and the length of the main part of lateral compartments 52a ' and medial compartment 52b ', the sheet number decision of the wafer W that can be kept according to wafer retaining member 33a, the position of vertical wall 53a, 53c is configured in suitable position to be suitable for the shape of lateral compartments 52a ' and madial wall 52b '.
Like this, even under the situation of the sheet number that increases the wafer W that wafer retaining member 33a keeps.As long as increase the sheet number of wafer within bounds, just can change the overall structure of cleaning processing apparatus 1.Simultaneously,, can add heavy load, require motor 32 that high torque is arranged, but in this case, also needn't change the overall structure of cleaning processing apparatus 1 motor 32 owing to keep more wafer W with wafer retaining member 33a.In addition, when the wafer that remains on the wafer W on the wafer retaining member 33a keeps under the narrow situation in interval, preferably increase the number of jet 55,57, but might not want extended jet nozzle 56 ', 58 ' length, in this case, also needn't the extend length of main part of lateral compartments 52a ' and medial compartment 52b '.
In addition, according to above-mentioned cleaning processing apparatus 1 of the present invention, except that using as single cleaning processing apparatus, for example, shown in also can the plane graph of image pattern 8 like that, combine with vacuum treatment portion 90 and to use as chip processing device.Vacuum treatment portion 90 for example has first load lock chamber, 91, the second load lock chambers 92, corrosion treatment chamber 93, and ashing treatment chamber 94.
Between first load lock chamber 91 and second lock 92, between second load lock chamber 92 and the corrosion treatment chamber 93, and hermetic sealing and centre install the not shown clamp gate valve that can constitute additional with opening and closing respectively between second load lock chamber 92 and ashing treatment chamber 94, in corrosion treatment chamber 93 and ashing treatment chamber 94, corrosion treatment of stipulating respectively and ashing treatment.
Like this, for example, at first, with wafer handling device 7 with the wafer W in the FOUPF be sent in the vacuum treatment portion 90, after the corrosion treatment of in corrosion treatment chamber 93, stipulating, wafer W is sent to the clean of stipulating among clean unit 3a～3c any one, it is turned back in the FOUP F then, otherwise, can clean wafer W at clean unit 3a～3c any, after the dried, wafer W is sent in the vacuum treatment portion 90 corrosion treatment of stipulating and ashing treatment.
Below, another form of implementation of liquid handling device of the present invention is described.
Fig. 9 is the perspective view of expression as the simple structure of the cleaning processing apparatus 100 of a kind of form of implementation of the liquid handling device that the multi-disc wafer W is carried out the batch type processing, and Figure 10 is its end view, and Figure 11 is its plane graph.To shown in Figure 11, cleaning processing apparatus 100 mainly is made of following each several part: mounting can be held the multi-disc wafer W with substantially horizontal state as Fig. 9, the FOUP platform 102a of 25 FOUP (storage container) F for example, 102b; Wafer W is carried out the clean unit 103 of clean, be located at FOUP platform 102a, between 102b and the clean unit, carry out the wafer handling unit 104 that wafer W transmits usefulness; The soup storage unit 105 of storage processing medication liquid etc.; And the power subsystem 106 that is used to be configured in each electric driving mechanism in the cleaning processing apparatus 100.
FOUP platform 102a, 102b is the position of mounting FOUP F, FOUP F so that be transported into, transport wafer W uses be transported into, transport actinal surface to the mode mounting of the 112a of window portion in the wall portion 111 that is located at wafer handling unit 104 (FOUP platform 102a side) 112b (FOUP platform 102b side) in FOUP platform 102a, on the 102b.
On the inboard of wall portion 111 (wafer handling unit 104 sides), configuration has the 112a with window portion, the gate that 112b opens and closes and being transported into of FOUP F transported opening and closing device 114a (FOUP platform 102a side), the 114b (FOUP platform 102b side) of the cover body opening/closing mechanism that mouth opens and closes, not FOUP F mounting in FOUP platform 102a, under the state on the 102b, for the state of closing gate.On the other hand, wafer W when FOUPF transports, when perhaps wafer W being transported in the FOUP F, by opening and closing device 114a, 114b opens the lid of gate and FOUP F.
In wafer handling unit 104, near opening and closing device 114a, 114b place is provided with detecting sensor 113a (the FOUP platform 112a side) 113b (FOUP platform 102b side) that the sheet number of the interior wafer W of metering FOUP F is used.Detecting sensor 113a, 113b adopts and the detecting sensor 13a that is used for cleaning processing apparatus 1 recited above, and 13b has the transducer of same 26S Proteasome Structure and Function.
In wafer handling unit 104, in FOUP platform 102a, the wafer handling device 107 that wafer W is transmitted with substantially horizontal state is set between FOUP F on the 102b and the rotatable parts 131 in mounting.Wafer handling device 107 has: transmit the transferring arm 121a that undressed wafer W is used; The transferring arm 121b that the wafer that the transmission liquid handling finishes is used, the transferring arm maintaining part 122 that keeps transferring arm 121a, 121b, the platform 123 of transferring arm 122 is installed, move the X-axis driving mechanism 198 and the guide rail 197 of usefulness to directions X, and adjusting transferring arm 121a, the Z axle driving mechanism 199 of the height of 121b.
Transferring arm 121a, a 121b transmit a slice wafer W, and, in order can once the 25 wafer W that leave in the FOUPF to be transmitted, respectively dispose 25 transferring arms respectively substantially parallelly.Keep adorning not shown Y-axis driving mechanism in these transmission wall maintaining parts 122 that amount to 50 transferring arm 121a, 121b, simultaneously, this maintaining part 122 can be slided in the Y direction along guiding mechanisms 124 such as being located at slot part on the platform 123 or guide rail.
Transferring arm 122 can carry out the rotation of θ direction in X-Y plane.Carry out the not shown θ rotary drive mechanism of the rotation of this θ direction, can in be contained in the transferring arm maintaining part 122, simultaneously, be designed to can with Z axle driving mechanism 199 and ventilate 123 simultaneously the rotation structures.
Transferring arm 121a, 121b interval to each other equates with depositing at interval of wafer W in the FOUP F, but the transferring arm interval adjusting mechanism of the interval variation that makes transferring arm 121a, 121b also can be set.In this case, for example, depositing at interval of wafer W in making transferring arm 121a interval to each other and FOUP F match, from FOUP F, wafer W transported after, can carry out the space changing of transferring arm 121a is become half, wafer W is left in the Lower Half of rotatable parts 131 or the action on the first half.
Transferring arm 121a, 121b and transferring arm maintaining part 122 and platform 123 can move along Z direction (vertical direction) by Z axle driving mechanism 199.This Z axle driving mechanism 199, for example, transferring arm 121a, 121b are used for wafer W is transported from FOUP F or rotatable parts 131, perhaps will remain on when wafer W on transferring arm 121a, the 121b is transported in FOUP F or the rotatable parts 131 to use.
For example, when wafer W is transported from FPUP F, at first, utilize Z axle driving mechanism 199 to adjust the downside that height is in each transferring arm 121a each wafer W in the FOUP F, then, utilize the Y-axis driving mechanism that transferring arm 121a is inserted in the FOUP F, next remains on wafer W on the transferring arm 121a with the height that Z axle driving mechanism 199 rises to transferring arm 121a regulation, by the Y-axis driving mechanism transferring arm 121a is returned to its original position in this state always, wafer W can be transported in FOUP F.
Transferring arm 121a, 121b and transferring arm maintaining part 122 and platform 123 also can move at directions X along guide rail 197 by X-axis driving mechanism 198, and wafer handling device 107 can touch in the FOUP F of mounting on FOUP platform 102a, 102b any one.
By with this Y-axis driving mechanism and θ rotary drive mechanism, X-axis driving mechanism 198, Z axle driving mechanism 199, be sent on the rotatable parts 131 that are configured on the clean unit 103 from mounting in the FOUP F on FOUP platform 102a, the 102b with untreated wafer W by transferring arm 121a, otherwise, can be sent in the FOUP F by the wafer W that transferring arm 121b will handle from the rotatable parts 131.In addition, preferably, replace Y to drive mechanism,, make transferring arm 121a, 121b have the form of multi-joint arm retractable, make the form that can transmit wafer W perhaps with the Y driving mechanism.
Top in wafer handling unit 104, configurating filtered fan unit 128a will blow in wafer handling unit 104 except that the air of degranulation etc.Simultaneously, in the wall portion 125 on the border that forms wafer handling unit 104 and clean unit 103, the window portion 126 that formation can utilize gate 127 to open and close is so that can transmit wafer W between wafer handling device 107 and rotatable parts 131.Gate 127 is configured in wafer handling unit 104 sides, and the wafer handling unit 104 and the atmosphere of clean unit 103 are separated.Gate 127 can be located at cleaning unit 103 sides.
On the top section of clean unit 103, configurating filtered fan 128b will blow in clean unit 103 except that air such as degranulations.Simultaneously, clean unit 103 has rotatable parts rotating mechanism 108, and this rotating parts 108 will be installed to for the motor (driving mechanism) 132 that makes wafer W carry out the face inward turning then rotatable parts 131 are rotated on the rotatable parts 131 that can keep wafer W with the interval of regulation through pivot 137 by the centre and constitute.
Figure 12 is the key diagram of the structure of expression rotatable parts 131.Rotatable parts 131 have pair of discs 133a, the 133b in the configuration of the interval of regulation, are located at fixed component 131a and retainer 131b between disk 133a, the 133b, and are set in the retainer locking bolt 131c on the disk 133a.
On fixed component 131a, the groove that formation maintenance wafer W is used etc., fixed component 131a is fixed on disk 133a, the 133b simultaneously.Retainer 131b is to be opened/closed, and form the same with fixed component 131a keeps groove that wafer W uses etc.When two retainer 131b were in closed condition, the interval between the retainer 131b was preferably the interval that transferring arm 121a, 121b can be inserted therebetween.
The on-off action of retainer 131b, state by retainer locking bolt 131c limits, for example, when utilizing retainer 131c that retainer 131b is locked, retainer 131b becomes and keeps wafer and closed state, under the state that does not lock, can utilize retainer rotating cylindrical body 134 with retainer 131b closure, so that the maintenance wafer W perhaps can open it so that make wafer W can be transported into, transport.
For example, under the situation that retainer 131b opens, be to remove retainer 131b institute lock-out state, retainer is discharged cylinder 135 descend, make it to remain on the state that is pressed on the retainer locking bolt 131c that is formed on the disk 133a from the top of rotatable parts 131.Like this, retainer 131b is disengaged lock-out state, becoming can free-moving state, for example, be engaged to retainer rotating cylindrical body 134 on the joint portion of disk 133b and retainer 131b from disk 133b side, retainer rotating cylindrical body 134 when prescribed direction is rotated, can be opened retainer 131b.
When closing retainer 131b, under the state that makes 134 reverse rotations of retainer rotating cylindrical body, rise by making retainer discharge cylinder 135, can by retainer locking bolt 131c retainer 131b be locked in closure state naturally.
The pivot 137 that connects rotatable parts 131 and motor 132 connects the central part of the other disk 138 that is configured in disk 133b side.Disk 138 is the member of insertion mouth 153 usefulness of closing treatment chamber 151 of rotatable parts 131 when treatment chamber 151 (lateral compartments 151a) is inserted, and can not rotate.Pivot 137 connects the part of disk 138, the hermetically-sealed construction that adopts cleaning fluid can not leak out from treatment chamber 151.
Rotatable parts rotating mechanism 108 is installed in remaining on wafer W on the rotatable parts 131 on the posture mapping device 109 that alters one's posture between the state of substantially horizontal state and perpendicular.Posture mapping device 109 has: be installed in the support member 136 of supporting rotatable parts rotating mechanism 108 on the disk 138; Rotating shaft 136a; Shank 136b; And rotating driving devices such as not shown motor and actuator.
Posture mapping device 109 can make rotatable parts rotating mechanism 108 rotate the angle of regulation in the Z-X plane around rotating shaft 136a by rotating driving device.Support member 136 also plays a part the lid as pivot 137.The shape of support member 136, be not limited to the shape shown in the figure, for example, also can take the form that pivot 137 and motor 132 all are surrounded, in this case, can be suppressed at the particles that produce in the motor 132 etc. and worsen atmosphere in the clean unit 103.
The shank 136b of posture mapping device 109, being configured in can be on the X-axis driving mechanism 110 that guide rail 139 upper edge directions Xs move, and whereby, rotatable parts rotary drive mechanism 108 also can move along directions X in clean unit 103.Utilize this X-axis driving mechanism 110, can the part with the rotatable parts 131 in the rotatable parts rotating mechanism 108 of the posture conversion that substantially perpendicularly keeps wafer W be inserted in the treatment chamber 151.
In the lower space 194 of guide rail 139, for example, can hold rotatable parts rotating mechanism 108, posture mapping device, X-axis driving mechanism 110 equal controllers.Simultaneously, from Fig. 9 to Figure 11, do not illustrate, between the space of the space of arrangement guide rail 139 and configuration process chamber 151, gate to be opened/closed is set, make atmosphere in the treatment chamber 151 and can not be diffused into structure in the whole clean unit 103.
Figure 13 and Figure 14 are the cutaway views that rotatable parts 131 is inserted a kind of form of the state in the treatment chamber 151.Here, in Figure 13 and Figure 14, omitted posture switching mechanism 109 and Y-axis driving mechanism 110,, expressed the dual structure that has by the cross section is essentially the lateral compartments 151a of trapezoidal tubular form and the medial compartment 151b that can axially slide constitutes among the figure for treatment chamber 151.In addition, lateral compartments 151a slidably keeps out of the way to the position of medial compartment 151b shown in Figure 13 when keeping in repair.
The expression medial compartment 151b that sends as an envoy to keeps out of the way right side among the figure among Figure 13, carries out the state of liquid handling with lateral compartments 151a, and Figure 14 represents medial compartment 151b is contained in the state that carries out liquid handling in the lateral compartments 151a, with medial compartment 151b.As shown in figure 13, clean in lateral compartments 151a, by vertical wall 152a, form rotatable parts and insert mouthfuls 153 vertical wall 152b, and rotatable parts are inserted in the process chamber 195 that the disk 138 of mouthful 153 rotatable parts rotating mechanisms 108 of closing forms carry out.
Top at vertical wall 152b is provided with the exhaust pathway that is made of valve 165 and blast pipe 167, can regulate the atmosphere in the process chamber 195.Simultaneously,, form the discharge opeing path (discharge opeing path) that constitutes by tapping valve 161 and common tube 163, used cleaning fluid in the process chamber 195 is discharged in the bottom of vertical wall 152b.
Be used for lateral compartments 151a, the external diameter of the end face of its vertical wall 152b side is greater than the external diameter of vertical wall 152b side end face, used cleaning fluid on the main part lower wall of lateral compartments 151a, forms simultaneously, so can be discharged by discharging tube 163 from tapping valve at an easy rate to the inclined plane of vertical wall 152b side direction reverse inclination.
On the upper wall of the main part of lateral compartments 151a, the nozzle 155 with a plurality of jets 154 is housed, jet 154 along continuous straight runs are installed side by side.Can eject pure water, IPA and the N that supplies from soup storage unit 105 interior sources of supply by jet 154 2Gas etc.Preferably, pure water is ejected into mode on the wafer W with large tracts of land, for example is roughly conical mode and sprays pure water etc. to be extended to from jet 154.
On vertical wall 152a, 152b, configuration remover liquid nozzle 174a, 174b are used for cleaning and disk 133a each vertical wall 152a of 133b, the face of 152b subtend.These nozzles 174a, 174b mainly are after handling with various soups, with pure water to disk 133a, use when 133b cleans.Preferably, be ejected into mode on disk 133a, the 133b with large tracts of land such as pure water, for example, be roughly conical mode and spray pure water etc. to be extended to from nozzle 174a, 174b.In addition, in Figure 13 and Figure 14, express a nozzle 55, but also a plurality of nozzles can be set.
Medial compartment 151b has the form that is roughly trapezoidal tubular in the cross section littler than the diameter of lateral compartments 151a, can move (slip) along directions X between position shown in Figure 13 and position shown in Figure 14.Simultaneously, medial compartment chamber 151b has the annular component 158a on the end face of annular component 158b on the end face of its smaller diameter side and larger diameter side.
In the time of on the processing position in the medial compartment 151b configuration lateral compartments 151a, be close on the vertical wall 152a by annular component 158a, annular component 158b is close on the vertical wall 152b simultaneously, forms process chamber 196.Simultaneously, when medial compartment 151b is withdrawed from lateral compartments 151a, annular component 158b is close on the vertical wall 152a, and annular component 158a is close on the vertical wall 152c isolation of the atmosphere in the atmosphere of the process chamber 195 of Xing Chenging and the medial compartment 151b whereby.
Nozzle 157 with a plurality of jets 156 is installed to the top of medial compartment 151b in jet 156 along continuous straight runs mode arranged side by side.From jet 156, spray the various soups supplied in the source of supply in the soup storage unit 105, pure water, IPA etc.Preferably, in a concentrated manner soup etc. is ejected on the wafer W by jet 156, for example, to be extended to fan-shaped spray soup that is essentially plane etc.In this case, particularly preferably, the sheet that disposes and remain on the wafer on the rotatable parts 131 is counted the jet 156 of the surface to wafer W of similar number (forming the face of semiconductor device).
For cleaning on disk 133a, 133b the face with the wafer W subtend, on the main part upper wall of medial compartment 151b, not shown remover liquid nozzle is set, can spray pure water etc.As this remover liquid nozzle, preferably, to modes such as the last injection of disk 133a, 133b pure water, for example, be extended to fan-shaped mode and spray pure water etc. to be essentially plane with the concentrated area.In addition, in Figure 13 and Figure 14, only express a nozzle 157, but also a plurality of nozzles can be set.
On the top of annular component 158a, the exhaust pathway that is made of vent valve 166 and blast pipe 168 is set, can regulate the atmosphere in the medial compartment 151b that atmosphere in the process chamber 196 or adjustment be in retreating position.Simultaneously, on the bottom of annular component 158a, form cleaning fluid outlet 146, and dispose the discharge opeing guiding elements 147 that is communicated with this cleaning fluid outlet 146.
Medial compartment 151b as the smaller diameter side of motor 132 sides, forms the inclined plane at its downside simultaneously.Therefore, because cleaning fluid outlet 146 is formed at the below on the inclined plane that the downside of medial compartment 151b forms, so used cleaning fluid can flow in the discharge opeing leader 147 from cleaning fluid outlet 146 at an easy rate in medial compartment 151b.
Discharge opeing guiding elements 147 constitutes in the mode of extending downwards, its leading section 148 points to horizontal direction.On the other hand, the independent discharging tube 149 of configuration below vertical wall 152a at the front end of discharging tube 149, forms the cover portion 150 as leading section.
When medial compartment 151b is in retreating position, the leading section 148 and the cover portion 150 of discharge opeing guiding elements 147 are in isolation, and when being contained in medial compartment 151b among the lateral compartments 151a, leading section 148 is coupled in the cover portion 150, become gas-tight seal, whereby, discharge opeing guiding elements 147 is communicated with discharging tube 149, becomes the structure that to carry out the cleaning fluid discharge opeing.On the other hand, when use medial compartment 151b to wafer W dispose, when medial compartment keeps out of the way out from lateral compartments 151a, leading section 148 is isolated with cover portion 150.
Below, with the FOUP F of mounting on FOUP platform 102 as F1, the FOUP F of mounting on FOUP platform 102b is as F2, holding these two FOUP F1, F2 to wafer W is example with the situation that cleaning processing apparatus 100 carries out clean in batches, its clean technology is described.In addition, among Fig. 9～Figure 11, FOUP F is not indicated FOUP F1, F2 respectively.
At first, spaced and parallel is in accordance with regulations deposited FOUP F1, the F2 of 25 wafer W, in being transported into of the discrepancy of carrying out wafer W on FOUP F1, F2, the exit face mode to the 112a of window portion, 112b, mounting is on each FOUP platform 102a, 102b.
Be initially the wafer W that transmits in the FOUP F1, with the gate of the 112a of window portion that closes and close the opening of lid of being transported into of FOUP F1, port closing, make the inside of FOUP F1 become connected state with the inside of wafer handling unit 104 with opening and closing device 114a.Then, detecting sensor 113a along the Z scanning direction, is confirmed wafer and storage configuration in the FOUP F1.Here, detecting when unusual, Interrupt Process, perhaps transfer to the action that transports wafer W from FOUP F2, perhaps from problems such as production managements, under the prerequisite that FOUP F1, F2 are handled by the gross as a batch, FOUP F1, F2 are withdrawn from from FOUP platform 102a, 102b, transfer to the clean of other batch.
Wafer W in the FOUP F1 is not being detected under the unusual situation, make each transferring arm 121a be positioned at each wafer W downside locational mode, utilize Z axle front end mechanism 199 to adjust to transmit the height of wall 121a after, the Y-axis driving mechanism action that wafer handling device 107 is had, to transmit wall 121a is inserted in the FOUP F1, make Z axle driving mechanism 199 rise to specified altitude, a slice wafer W is remained on the transferring arm 121a, make the action of Y-axis driving mechanism once more, transferring arm 121a is turned back to original position.Make opening and closing device 114a action, the 112a of window portion is closed the lid of FOUP F1, finish whole 25 operations that wafer W transports from FOUP F1.Wafer W with in FOUP F1, deposit at interval that identical distance remains on the transferring arm 121a.
Remain on the wafer W on the transferring arm 121a,, make θ rotary drive mechanism Rotate 180 that wafer handling device 107 had ° in the mode of tube portion 126 when being formed at the wall portion 125 that constitutes wafer handling unit 104 and the border of clean unit 103.Simultaneously, open the gate 127 of closing window portion 126, make the Y-axis driving mechanism action of wafer handling device 107, in the rotatable parts 131 of the position standby of in clean unit 103, facing window portion 126, insert the transferring arm 121a that maintains wafer W.
At this moment, rotatable parts 131 are in a kind of like this state, that is, retainer locking bolt 131c is held device release cylinder 135 and compresses, make retainer 131b be in movable state, retainer 131b becomes by retainer rotating cylindrical body 134 and opens laterally, wafer W can be transported into the state that transports.Simultaneously, the height and position of wafer W being adjusted to the wafer W that can be received on the formation wafer W fixed component 131a keeps with interior positions such as slot parts.
Under the state that transferring arm 121a is inserted in the rotatable parts 131, retainer 131b is closed locking, makes Z axle driving mechanism 199 actions that wafer handling device 107 had, the position of transferring arm 121a is descended, and then, make the action of Y-axis driving mechanism, make transferring arm 121a turn back to the origin-location, close letter 127.Finish to leave in the transmission of wafer W on rotatable parts 131 in the FOUP F1 by above-mentioned operation.
Secondly,, make transferring arm 121a be in FOUP platform 102a, 102b side once more, make the θ rotary drive mechanism action of wafer handling device 107 in order further the wafer W that leaves in the FOUP F2 to be transmitted on rotatable parts 131.Simultaneously, make 198 actions of X-axis driving mechanism, mobile wafer handling device 107 is until make the position of transferring arm 121a in the face of the 112b of window portion.Then,, in FOUP F2, transport wafer W, make θ rotary drive mechanism and 198 actions of X-axis driving mechanism, will keep the transferring arm 121a of wafer W to move in the face of the position in the window portion 126 with the same from the aforementioned situation that transports wafer W in the FOUP F1.
The wafer W of FOUP F2 is inserted earlier between the wafer W among the FOUP F1 that is contained in the rotatable parts 131.That is, wafer W is deposited with half the interval of depositing in FOUP F1, F2 at interval in rotatable parts 131.Therefore, the height and position of transferring arm 121a, it is the height and position of wafer W, by making 199 actions of Z axle driving mechanism, at interval half of maintenance of moving wafer W up or down at interval, then, utilize and the wafer W of above-mentioned FOUP 1 be transported into the identical step of step, wafer W is remained on the rotatable parts 131, and finishing FOUP F1, F2 is wafer W transporting on rotatable parts 131.Wafer W transporting after the end on rotatable parts 131, utilize retainer locking bolt 131c to make retainer 131b become the state that can not freely rotate.
Utilize posture mapping device 109,, rotatable parts rotating mechanism 108 is tilted 90 °, rotatable parts rotating mechanism 108 is remained on level for making rotatable parts 131 towards treatment chamber 151 sides.At this moment, wafer W is maintained at plumbness.Then, rotatable parts 131 are received in the lateral compartments 151a, simultaneously,, close, rotatable parts rotating mechanism 108 is slided for the rotatable parts with lateral compartments 151a insert mouth 153 by disk 138 with X-axis driving mechanism 110.
In treatment chamber 151, for example, in medial compartment 151b, with the processing that soup is removed polymer etc., when in lateral compartments 151a, using the processing of pure water and subsequent dried, initial, medial compartment 151b is contained in the lateral compartments 151a, one side makes rotatable parts 131 rotate with the revolution of regulation with motor 132, and one side is sprayed the soup aiming wafer W of regulation from the jet 156 of nozzle 157, wafer W is carried out soup handle.Then for wash off attached among wafer W and disk 133a, the 133b with wafer W subtend face on soup, with nozzle 157 be located at remover liquid nozzle on the main part upper wall of medial compartment 151b to wafer W and disk 133a, 133b last supply pure water or IPA.Next, medial compartment 151b is withdrawed from from lateral compartments 151a, one side makes rotatable parts 131 revolution rotation in accordance with regulations, and one side is sprayed pure water from the jet 154 of nozzle 155 to wafer W.At this moment, also can be simultaneously by nozzle 174a, 174b sprays pure water, and the 152a of vertical wall separately of disk 133a, 133b, the subtend face of 152b are cleaned.Then,, make rotatable parts revolution rotation in accordance with regulations, get rid of, as required, can on wafer W, spray N attached to the pure water on rotatable parts 131 and the wafer W not to wafer W supply pure water 2Gas etc. carry out dried.
After liquid handling and dried end, for rotatable parts 131 are transported from treatment chamber 151, with X-axis driving mechanism 110,108 slips of rotatable parts rotating mechanism are made it to leave treatment chamber 151, then make 109 actions of posture mapping device, for making wafer W be maintained at level rotatable parts rotating mechanism 108 is holded up, made rotatable parts 131 turn back to position in the face of window portion 126.Simultaneously, carrying out the position adjustment for rotatable parts 131 makes being transported into when opening retainer 131b, exit face to window portion 126.
Wafer W is carried out liquid handling etc. during in, for wafer handling device 107, make the rotary drive mechanism action, make transferring arm 121b be in state in the face of window portion 126.Simultaneously, for example, in the ban when leaving wafer W in the FOUP F2 in and turn back in the FOUP F2, for transferring arm 121b can be transported this wafer W, make 199 actions of Z axle driving mechanism, regulate the height and position of transferring arm 121b, open the sluices 127, utilize the Y-axis driving mechanism that transferring arm 121b is inserted in the rotatable parts 131.
Then, make retainer discharge cylinder 135 and descend, be pressed on the retainer locking bolt 131c, make retainer 131b be in the state of unlocking, utilize retainer rotating cylindrical body 134 to make retainer 131b rotation, open retainer 131b in the mode that wafer can be transported.Make 199 actions of Z axle driving mechanism, the wafer W that moves up, and then utilize the Y-axis driving mechanism to make transferring arm 121b return initial position, make and can in rotatable parts 131, this wafer W be transported.
For making transferring arm 121b point to FOUP platform 102a, the 102b side drives the θ rotary drive mechanism, utilizes X-axis driving mechanism 198 to move wafer handling device 107 simultaneously so that make transferring arm 121b in the face of the 112b of window portion.Utilize opening and closing device 114b when opening the 112b of window portion, to open the lid of FOUP F2, make 104 one-tenth connected states in inside and wafer handling unit of FOUP F2, utilize Z axle driving mechanism 199 to regulate after the whole height of transferring arm 121b, with the Y-axis driving mechanism transferring arm 121b is inserted in the FOUP F2, wafer W is transported into, and makes transferring arm 121b return initial position.When lid of closing FOUP F2 and the 112b of window portion, wafer W is deposited end in FOUP F2.
Profit uses the same method, make transferring arm 121b turn back to position in the face of window portion 126 after, take out the wafer W that remains on the rotatable parts 131, in FOUP F1, deposit.When FOUP F1, F2 from FOUP platform 102a, when 102b removes, can begin next FOUP F and handle.
The following describes another form of implementation of cleaning processing apparatus.Figure 15 is the end view of cleaning processing apparatus 101, and Figure 16 is its plane graph.Cleaning processing apparatus 101 has the clean unit 103a of different structure except that the clean unit 103 that has with aforementioned cleaning processing apparatus 100, and other parts adopt and cleaning processing apparatus 100 has the structure of same unit.Thereby, below, to the structure of clean unit 103a and in clean unit 103a the processing mode to wafer W describe.
Be configured in rotatable parts transmission mechanism 180 among the clean unit 103a by rotatable parts 181, posture mapping device 109a, X-axis driving mechanism 110a constitutes.Rotatable parts 181 can and be attached between the connecting elements 182a on the posture mapping device 109a at disk 133b and constitute with loading and unloading, simultaneously the connecting elements 182b that rotatable parts 181 is connected on rotatable parts transmission/rotary drive mechanism 190 and this connection is removed are being installed on the disk 133a.In addition, the same with rotatable parts 131 on rotatable parts 181, between disk 133a, 133b, have mesh component 131a, retainer 131b disposes not shown retainer locking bolt 131c on disk 133a.
Preferably, posture mapping device 109a has for making wafer W is transported into being transported into of retainer 131b of usefulness, exit face carries out position adjustment usefulness to window portion 126 position adjusting mechanism.The action of posture mapping device 109a and X-axis driving mechanism 110a, the same with the posture mapping device 109 of cleaning processing apparatus 100 described above with the action of X-axis driving mechanism 110.
In addition, in clean unit 103a, be provided with rotatable parts transmission/rotary drive mechanism 190 and treatment chamber 151.The cross-section illustration of a kind of form of the state of expression transmission/rotary drive mechanism 190 maintenance rotatable parts 181 is in Figure 17.Rotatable parts transmission/rotary drive mechanism 190 is made of pivot 183 and motor 132a.The end of pivot 183 has removably structure, can make rotatable parts 181 rotations by the rotation of motor 132a.
The treatment chamber 151 that is configured in the treatment chamber 151 among the clean unit 103a and is configured in the clean unit 103 of cleaning processing apparatus 100 is same, has the dual structure that is made of lateral compartments 151a and medial compartment 151b.Thereby and the situation of cleaning processing apparatus 100 is same, the clean that can use the clean in lateral compartments 151a respectively and carry out in medial compartment 151b according to the position of medial compartment 151b.Rotatable parts at lateral compartments 151a insert on the mouth 153, and gate 153a is installed, and when rotatable parts 181 are transported into, transport lateral compartments 151a, open this gate 153a, and making it in the clean process is closed condition.
Regard to down that the cleaning method to wafer W describes in clean unit 103a.Wafer W being transported between wafer handling device 107 and rotatable parts 181, transport and the situation of cleaning device 100 same, be under the horizontal state in wafer W and carry out.In the time of in wafer W is installed into rotatable parts 181, make posture mapping device 109a action, rotatable parts 181 are altered one's posture make wafer W be maintained at the state of setting, for example be maintained at plumbness, make 110 actions of X-axis driving mechanism then, rotatable parts 181 are inserted mouth 153 from rotatable parts be inserted in the lateral compartments 151a.
Make X-axis driving mechanism 110a, up to connecting elements 182b is connected on the pivot 183, after connecting elements 182b and pivot 183 couple together, remove being connected between disk 133b and the connecting elements 182a.Like this, by rotatable parts transmission/rotary drive mechanism 190, make rotatable parts 181 become the state that can rotate by rotatable parts transmission/rotary drive mechanism 190.Then, make X-axis driving mechanism 110a action up to making connecting elements 182a arrive the outer fix place of lateral compartments 151a, 153a closes with gate.
Form the form of process chamber 195,196 and what variation is the situation of cleaning processing apparatus 100 do not have by lateral compartments 151a and medial compartment 151b, simultaneously, because rotatable parts 181 rotations when motor 132a is rotated, for example, under state shown in Figure 17, can carry out clean by lateral compartments 151a.
After a series of clean finished, the 153a that opens the sluices made the action of X-axis driving mechanism, on the disk 133b that connecting elements 182a is connected to rotatable parts 181 after, releasing pivot 183 is connected with connecting elements 182b's.Then, make X-axis driving mechanism 110a and posture mapping device 109a action, rotatable parts 181 are turned back to make wafer W and tube 126 positions of facing, open retainer 131b then, the wafer W in the rotatable parts 181 is transported with wafer handling device 107.
For above-mentioned batch type cleaning processing apparatus 100,101, can further change over various forms.
The first, the device that for example, can be installed between cleaning processing apparatus 100 and other processing unit etc., carry out FOUP F transmission on the top of cleaning processing apparatus 100.At this moment, the clean air from the top-direction supply of purge chamber that cleaning processing apparatus 100 is set flows downward may not can strike mounting on the FOUP F on FOUP platform 102a, the 102b.In this case, can cause particle etc. easily attached to the problem on the wafer W.
Therefore, can be shown in Figure 18 A, adopt following structure, promptly, the rake of regulation is set above the wall portion 111 of wafer handling unit 104, simultaneously, filter 129a is installed in wall portion 111, and the clean air that will come from filtration fan unit (FFU) 128a that is configured on the wafer handling unit 104 strikes on the FOUP F.
Simultaneously, also can adopt the structure shown in Figure 18 B, that is,, constitute gate,, also can flow to FOUP F from filtering the next clean air of fan unit (FFU) 128a even under the state of closed shutter with filter 129b as opening and closing device 114a, 114b.Thereby can prevent that particle etc. from adhering on wafer W.
Second, rotation formula about rotatable parts, rotatable parts 131,181 are carried out a situation that the state of supporting is rotated in the mode of so-called cantilever to be illustrated, but, for example, if the connecting elements 182a shown in Figure 17 can be rotated as bearing etc. with posture mapping device 109a, also can when handling, disk 133b be connected with connecting elements 182a, make rotatable parts 181 be in the form of two surface bearings.Simultaneously, in cleaning processing apparatus 100, also can be by the rotatable connecting elements that is connected with disk 133a from medial compartment 151b side configuration etc., realization keeps rotatable parts 131 in the mode of two surface bearings form.
Below, another form of implementation of liquid handling device of the present invention is described.
Figure 19 is the perspective view of expression as the simple structure of the cleaning processing apparatus 200 of further a kind of form of implementation of the liquid handling device that the multi-disc wafer W is carried out the batch type processing.As shown in figure 19, cleaning processing apparatus 200 is mainly by constituting with the lower part: be provided with mounting and can hold the FOUP of FOUP platform 202a～202c that the FOUP of multi-disc wafer W (storage container) F uses and be transported into, transport portion 202; Wafer W is carried out the clean unit 203 of clean; Be arranged on the wafer handling unit 204 that FOUP is transported into, transports between portion 202 and the clean unit 203, wafer W is transmitted; Store the soup storage unit 205 of clean with soup etc.
Top in clean unit 203, be provided for being configured in the power supply box of various electric driving mechanisms in the cleaning processing apparatus 200 and electronic-controlled installation and each unit that constitutes cleaning processing apparatus 200 carried out the temperature-controlled cabinet of temperature control usefulness, top in wafer handling unit 204 is provided with the show case 209 that the various display floaters of being located on the cleaning processing apparatus 200 are controlled and holds the wafer handling device 216 be located in the wafer handling unit 204 (with reference to the connecting gear control cabinet 210 of the control device of Figure 20 of back～Figure 22).Simultaneously, on the top of soup storage unit 205, the discharging hot gas case 208 that the hot gas of discharging is put together is set from above-mentioned each case.
Figure 20 represents the simple plane graph of cleaning processing apparatus 200, and Figure 21 represents the schematic side view of cleaning processing apparatus 200, and Figure 22 is illustrated in the schematic side view of Figure 21 the schematic side view with the state of a part of drive mechanism.Here, in Figure 20～Figure 22, only express FOUP and be transported into, transported portion 202, clean unit 203, wafer handling unit 204, soup storage unit 205 does not illustrate the various case of the power supply box 206 that is configured in clean unit 203, wafer handling unit 204, soup storage unit 205 tops and other portion among the figure.Simultaneously, as hereinafter described, clean unit 203 is divided into transport unit 203a and cleaning part 203b, in Figure 21 and Figure 22, expresses the simple structure of transport unit 203a.
The FOUP F of mounting on FOUP platform 202a～202c can be with the interval of regulation, become the mode of level to hold multi-disc with interarea, and 25 wafer for example on the side of FOUP F, are provided with and are transported into, transport the wafer that wafer W uses and be transported into, transport mouth.FOUP F has the lid 211 that the switching wafer was transported into, transported mouth, and this lid 211 can load and unload on the FOUP F by the described cover body opening/closing mechanism 115a～115c in back.
On wafer handling unit 204 and wafer are transported into, transport boundary wall 212 between the portion 202, the 212a～212c of window portion is set.As shown in figure 22, wafer on the formation FOUP F is transported into, transports the peripheral part of mouth the 212a～212c of window portion is closed, simultaneously, making lid 211 become removably state by cover body opening/closing mechanism 215a～215, with FOUP F mounting on FOUP platform 202a～202c.
Be arranged on the cover body opening/closing mechanism 215a～215c of each position of the 212a～212c of window portion of boundary wall 212 inboards (wafer handling unit 204 sides), have gate 213a～213c that opens and closes the window 212a～212c of portion and the elevating mechanism 214a～214c that makes gate 213a～213c lifting.Cover body opening/closing mechanism 215a～215c has not shown lid fixtures such as absorption layer, can make the lid 211 and gate 213a～213c one lifting of FOUP F whereby.
Mounting is when FOUP platform 202a～202c is not last as FOUP F, and gate 213a～213c is in the 212a of window portion～212c closing state, prevents that particle etc. from entering in the wafer handling unit 204 from the outside.On the other hand, when wafer W being transported in FOUPF or is transported into wafer W in it, for transferring arm 217a, the 217b that makes the described wafer handling device 216 in back can touch FOUP F, utilize cover body opening/closing mechanism 215a～215c that the lid 211 of gate 213a～213c and FOUP F is descended, the 212a～212c of window portion is opening-wide state.
In wafer handling unit 204, near the position of cover body opening/closing mechanism 215a～215c, be provided for measuring the wafer inspection mechanism 310 of the sheet number of the wafer W in the FOUP F respectively.This wafer inspection mechanism 310, for example, the reflective optical sensor 311 that one side utilizes motor 313 to have to adopt the emission part of infrared laser and acceptance division along guide rail 312 in (aluminium Nogata to) scanning aspect the Z, one side receives the light that reflects from the end face of wafer W, the sheet number and the storage configuration of the wafer W in the FOUP F left in inspection in, for example, wafer W whether in accordance with regulations interval is stored substantially parallelly blocks ofly, whether two wafer are deposited superimposedly, whether wafer W is uneven is skewed being stored with staggering, and whether wafer W breaks away from the assigned position in the FOUPF etc.
In addition, if wafer inspection mechanism 310 is installed on the wafer handling device 216, the structure that wafer inspection mechanism 310 can be moved simultaneously with wafer handling device 216 then can be only in a position configuration detection mechanism 310.Simultaneously, for example, the transducer that the affirmation wafer is deposited the transducer of number and checked the wafer W storage configuration can be set respectively also.And then, also can be arranged on wafer inspection mechanism 310 on cover body opening/closing mechanism 215a～215c.
In wafer handling unit 204, be provided with in its top in wafer handling unit 204, blow filtration fan unit (FFU) 224a of usefulness of clean air, the clean air flow that blows downwards that comes from this filtration fan unit (FFU) 224a is discharged from the not shown exhaust outlet of the bottom that is located at wafer handling unit 204.Simultaneously, the state that opens wide at the 212a～212c of window portion flows in the FOUP F from a part of filtering the clean air flow that flows downward that fan unit (FFU) 224a comes, and prevents that particle etc. is attached in the FOUP F.In addition, unshowned electro-dissociator in the bottom allocation plan that filters fan unit (FFU) 224a can remove static to wafer W.
Wafer handling device 216 is configured in the wafer handling unit 204, wafer handling device 216 has: the linear driving mechanism 219 that possesses the guide rail that extends at directions X, the transferring arm 217a that keeps wafer W, 217b, keep transferring arm 217a respectively, the maintaining part 218a of 217b, 218b, dispose transferring arm 217a on it respectively, 217b and maintaining part 218a, the slide mechanism 220a of 218b, 220b, configuration slide mechanism 220a on it, the platform that rotates freely 221 of 220b, make the rotating mechanism 222 of platform 221 rotations, and, make the elevating mechanism 223 of the top part lifting that is positioned at rotating mechanism 222.
By dual system transferring arm 217a, 217b are set in wafer handling device 216, for example, available transferring arm 217a transmits untreated wafer W, transmits the wafer W that clean is crossed with transferring arm 217b.Descend this, for example, compare, can prevent effectively attached to particle on the undressed wafer W etc. attached to after on the transferring arm, more further attached on the wafer W of having handled well with the situation of the transferring arm that only disposes single system.Simultaneously, by the dual system transferring arm is set, after the wafer W after can in clean unit 203, accepting to dispose, transmit the undressed wafer W of next group immediately.
A transferring arm 217a transmits a slice wafer W, in order can once 25 wafer W to be sent in the FOUP F, interval with regulation remains on 25 transferring arm 217a on the maintaining part 218a substantially parallelly, also 25 transferring arm 217b is remained on the maintaining part 218b with the interval of regulation substantially parallelly simultaneously.When transmitting wafer W between the described rotatable parts 234 of FOUP F or back and transferring arm 217a, 217b, be necessary to make the distance that transferring arm 217a, 217b rise, decline is stipulated, the lifting action of this transferring arm 217a, 217b utilizes elevating mechanism 223 to carry out.Simultaneously, also the elevating mechanism that makes transferring arm 217a, 217b rise and fall can be set in addition on maintaining part 218a, 218b.
Transferring arm 217a, 217b can slide along the length direction of transferring arm 217a, 217b with maintaining part 218a, 218b by slide mechanism 220a, 220b, and platform 221 can rotate (θ direction shown in Figure 20) by rotating mechanism 222 in horizontal plane.Simultaneously, the height of transferring arm 217a, 217b can be regulated by elevating mechanism 223, and transferring arm 217a, 217b can move along directions X by linear driving mechanism 219 with elevating mechanism 223 etc.Thereby, transferring arm 217a, 217b can touch mounting on FOUP platform 202a～202c any one FOUP F and be arranged on rotatable parts 234 in the clean unit 203, wafer handling device 216 can transmit wafer W between FOUP F on FOUP platform 202a～202c and rotatable parts 234 in mounting with horizontal state.
Thereby, for example, transferring arm 217a is used to transmit untreated wafer W, simultaneously in the occasion that transmits from the rotatable parts 234 of FOUP F in being configured in clean unit 203 that are loaded on the FOUP platform 202b, initial in order to make transferring arm 217a can enter the FOUP F of mounting on FOUP platform 202b, drive linear driving mechanism 219, transferring arm 217a is moved along directions X.Secondly, drive elevating mechanism 223, regulate after the height of transferring arm 217a, make slide mechanism 220a action, transferring arm 217a and maintaining part 218a are slided into FOUP platform 202b side.Go up transferring arm 217a and maintaining part 218a reposition by wafer W being remained on transferring arm 217a, become the state that wafer W is transported in the FOUP F.
Secondly, make rotating mechanism 222 actions, one side is rotated 180 ° with platform 221, and one side drives linear driving mechanism 219 makes transferring arm 217a become the state that can touch rotatable parts 234.Transferring arm 217a and maintaining part 218a are slided into rotatable parts 234 sides, wafer W is delivered to (referring to Figure 22) on the rotatable parts 234, again transferring arm 217a and maintaining part 218a are turned back to original position, the transmission of wafer W on rotatable parts 234 finished.
In addition, Figure 22 represents, makes slide mechanism 220a action, and transferring arm 217a and maintaining part 218a are slided into rotatable parts 234 sides, and wafer W is delivered to state on the rotatable parts 234.Simultaneously, consistent by the height and position that makes the wafer W in the FOUP F with the height and position of maintenance wafer W in rotatable parts 234, can omit and utilize the operation of elevating mechanism 223 the Height Adjustment alignment of transferring arm 217a, 217b.
In the described in the above wafer handling device 216, because transferring arm 217a, 217b are configured in point-symmetric position with respect to the pivot of platform 221, so, when not extending slide mechanism 220a, under the state of 220b during rotating platform 221, even keep at transferring arm 217a, 217b under the state of wafer W, the track scope of being passed through in the time of also can making transferring arm 217a, 217b rotation becomes narrow.Thereby, in cleaning processing apparatus 200, can make wafer handling unit 204 save the space.
On the boundary wall 225 that wafer handling unit 204 and clean unit 203 are separated, form and transmit the 225a of window portion that wafer W is used, but the 225a of this window portion utilizes the gate 226a by elevating mechanism 226b free lifting to open and close.In cleaning processing apparatus 200, gate 226a is arranged on wafer handling unit 204 sides, but also can be located at clean unit 203 sides.The transmission of wafer W between wafer handling unit 204 and clean unit 203, carry out via the 225a of this window portion the centre.
Owing to can the atmosphere of wafer handling unit 204 with clean unit 203 be separated by gate 226a, for example, even in clean unit 203 cleaning fluid splash or the situations such as diffusion of vapor of cleaning fluid under, also can prevent to make to pollute and expand in the wafer handling unit 204.
Clean unit 203 is made of transport unit 203a and cleaning part 203b, at the configurating filtered fan unit in the top of transport unit 203a (FFU) 224b, will blow in transport unit 203a except that the clean air of degranulation.Simultaneously, unshowned ion generator in the bottom allocation plan that filters fan unit (FFU) 224b can remove static to wafer W.
As Figure 20～shown in Figure 22, on transport unit 203a, be provided with: rotatable parts rotating mechanism 227; The posture mapping device 228 of the posture of control rotatable parts rotating mechanism 227; The Z axle driving mechanism 229 that rotatable parts rotating mechanism 227 and posture mapping device 228 are moved in the vertical direction; The X-axis driving mechanism 230 that Z axle driving mechanism 229 along continuous straight runs are moved; Prevent the particle that produces from posture mapping device 228 and Z axle driving mechanism 229 to rotatable parts rotating mechanism 227 sides splash, attached to the lid 245 of the first-class usefulness of wafer W; Prevent the particle that produces by X-axis driving mechanism 230 to rotatable parts rotating mechanism 227 sides splash, attached to the lid 246 of the first-class usefulness of wafer W.The retainer switching mechanism 280 that the retainer 236b that opens and closes the rotatable parts 234 that rotatable parts rotating mechanism 227 had uses is set on transport unit 203a simultaneously.
On cleaning part 203b, the treatment chamber 270 that configuration is made of lateral compartments 271a and medial compartment 271b, and clean the wiper mechanism 290 that medial compartment 271b uses, go back the slide mechanism of unshowned medial compartment 271b slide mechanism in the allocation plan and cleaning mechanism 290 simultaneously.
Figure 23 A is the cutaway view of the simple structure of expression rotatable parts rotating mechanism 227, and Figure 23 B is the front view that expression is inserted into rotatable parts rotating mechanism 227 state in the lateral compartments 271b.In addition, Figure 24 and Figure 25 are the cutaway views that expression is inserted into rotatable parts 234 state in the treatment chamber 270 that is configured on the cleaning part 203b.Here, the state when Figure 24 represents that medial compartment 271b is withdrawn into the position in the outside of lateral compartments 271a, Figure 25 represents medial compartment 271b is contained in the state of the processing position among the lateral compartments 271a.
Rotatable parts rotating mechanism 227 has: the rotatable parts 234 that can keep wafer W with predetermined distance; So that remain on the motor 231a that mode that the wafer W on the rotatable parts 234 rotates is rotated rotatable parts 234 in face; The pivot 250 that connects motor 231a and rotatable parts 234; The motor connecting portion 231b of motor 231a and pivot 250; Pivot cover 232 around pivot 250; And, be transported into, transport the lid 233 that mouthful 262c closes rotatable parts 234 being inserted into the rotatable parts that will be formed among the lateral compartments 271a on the lateral compartments 271a; On pivot 232, be equipped with when inserting rotatable parts 234 among the lateral compartments 271a be configured in lateral compartments 271a in clamp lever 276a, clamping bearing 275a, the 275b that 276b cooperates.
Lateral compartments 271a has: cylindrical body 261a; Be configured in annular construction member 262a, 262b on the end face of cylindrical body 261a; Be configured in sealing mechanism 263a, 263b on the inner peripheral surface of annular construction member 262a, 262b; Be arranged on clamp lever 276a, 276b on the annular construction member 262a; A plurality of cleaning fluid jets 254 that along continuous straight runs forms, be installed on the nozzle 253 on the cylindrical body 261a; The nozzle box 257 that holds nozzle 253; Be located at the bottom of lateral compartments 271a, the exhaust/discharging tube 265a that discharges cleaning fluid, also can carry out exhaust simultaneously; And, the side long pass sensor 262f (with reference to Figure 27 B shown in the back) of the distance of measurement and rotatable parts 234.On annular construction member 262a, the inner peripheral surface of configuration sealing mechanism 263a, the rotatable parts that formation rotatable parts 234 entered/withdrawed from usefulness are transported into, transport a mouthful 262c.
Medial compartment 271b has: cylindrical body 261b; Be provided in annular construction member 266a, 266b on the end face of cylindrical body 261b; The interior week that is configured in annular construction member 266a, 266b is gone up sealing mechanism 267a, the 267b that disposes respectively at two positions; Along continuous straight runs forms a plurality of cleaning fluid jets 256, is installed to the nozzle 255 on the cylindrical body 261b; The nozzle box 258 that holds nozzle 255; And, be located at the bottom of medial compartment 271b, the exhaust/discharging tube 265b that when discharging cleaning fluid, can carry out exhaust.On annular construction member 266a, the inner peripheral surface of configuration sealing mechanism 267a on it is in when handling the position at medial compartment 271b, becomes the rotatable parts that rotatable parts 234 entered/withdrawed from usefulness and is transported into, transports a mouthful 266c.
Annular construction member 290 has: cylindrical body 291; Be installed to the disk 292a of an end face of cylindrical body 291; Be installed to the annular construction member 292b on another end face of cylindrical body 291; And be installed to gas supply nozzle 293 and blast pipe 294 on the cylindrical body 291; Nozzle 273a and blast pipe 273c are set on disk 292a simultaneously.
At first, the structure member to transport unit 203a describes.As shown in figure 22, rotatable parts rotating mechanism 227, when wafer W is transmitted between rotatable parts 234 and conveyer 216, maintenance keeps wafer W with level posture (vertically posture), simultaneously, as Figure 23 B and Figure 24, shown in Figure 25, when carrying out clean, be transformed into the posture (laterally posture) that wafer is kept with plumbness and keep.The posture conversion of this rotatable parts rotating mechanism 227 is carried out with posture mapping device 228, Z axle driving mechanism 229, X-axis driving mechanism 230.
The posture mapping device 228 of the posture of control rotatable parts rotating mechanism 227 has rotating mechanism 242 and the pivot 241 that is installed on the rotating mechanism 242, and pivot 241 is fixed on the pivot cover 232 of rotatable parts rotating mechanism 227.Simultaneously, Z axle driving mechanism 229 has: motor 243; The power transfering part 244 that the rotary driving force and the displacement of motor 243 passed to posture mapping device 228; Guide rail 247; And the supporter 248 of supporting guide 247.Posture mapping device 228 is being coupled to along the mode that guide rail 247 moves on the guide rail 247, when making motor 243 rotations, warp in the middle of this rotary driving force and the displacement is passed to posture mapping device 228 at power transfering part 244, and posture mapping device 228 can move the distance of regulation with rotatable parts rotary drive mechanism 227 in Z direction (vertical direction) along guide rail 247.
As Z axle driving mechanism 229, be not limited to the swing offset of motor 243 is transformed into the mapping device of straight-line displacement, for example, replace motor 243, also can adopt the direct driving mechanisms that produces linear displacement such as making engine.
X-axis driving mechanism 230 comprises: guide rail 249; Not shown motor; Be connected to the snap bolt 239a on the motor; Be engaged to the mesh component 239b on the round end double-screw bolt 239a; The connecting elements 238 that is coupled on the guide rail 249, mesh component 239b and supporter 248 are coupled together.Make snap bolt 239a action by turning motor, along with the action of snap bolt 239a, mesh component 239b moves along directions X.At this moment, owing to connecting elements 238 is connected mesh component 239b with supporter 248, so connecting elements 238 and supporter 248 also move along directions X together with mesh component 239b.That is, when directions X moved, rotatable parts rotating mechanism 227 and posture mapping device 228 and Z axle driving mechanism 229 moved along directions X simultaneously at mesh component 239b.In order not make rotatable parts rotating mechanism 229 can not enter cleaning part 203b side.Than the farther position of assigned position, on the guide rail 249 of X-axis linear moving mechanism 230, not shown block is set.
Figure 26 A～Figure 26 E, it is the key diagram of an example of the form of expression when rotatable parts rotating mechanism 227 being moved with posture mapping device 228 and Z axle driving mechanism 229 and X-axis driving mechanism 230, Figure 26 A is illustrated in the motion track of the tie point P of the pivot 241 of pivot cover 232 and posture mapping device 228 in the rotatable parts 227, and Figure 26 B～Figure 26 E represents the state (posture) of the rotatable parts rotation status 227 of tie point P when each position P1～P4.And then Figure 27 A is illustrated in the rotatable parts rotating mechanism 227 of the P1～P4 of the position shown in Figure 26 B～Figure 26 E once more, is used to illustrate the mobile required space of rotatable parts rotating mechanism 227.
For the rotatable parts 234 that will keep wafer W are inserted in the lateral compartments 271a, is that example describe from position P1 to the situation that position P4 moves when rotatable parts rotating mechanism 227 is moved with pivot cover 232, at first, tie point P is when the P1 of position, rotatable parts rotating mechanism 227 is in the position that can transmit wafer W between rotatable parts 234 and wafer handling device 216, at this moment, rotatable parts rotating mechanism 227 is in the state of vertical posture.After wafer W being received in the rotatable parts 234, beginning makes 229 actions of Z axle driving mechanism, and rotatable parts rotating mechanism 227 and posture mapping device 228 are risen in the mode that tie point P moves to position P2.At position P2 place, make 228 actions of posture mapping device, wafer W becomes from horizontal hold mode and vertically becomes state, rotatable parts rotating mechanism 227 whole half-twists, rotatable parts rotating mechanism 227 integral body become the state of horizontal posture.
Then, the rotatable parts rotating mechanism 227 whole states of horizontal posture that keep are constant, move to position P3 for making tie point P, make 229 actions of Z axle driving mechanism once more, and rotatable parts rotating mechanism 227 is risen.Like this, by at the position P1 of the starting point when rotatable parts rotating mechanism 227 is risen with as the intermediate location P2 place of the position P3 of terminal point rotatable parts rotating mechanism 227 being carried out the posture conversion, guarantee space 278,279, this space 279 is medium to be used effectively by various control device etc. are contained in, and can dwindle the size of cleaning processing apparatus 200 integral body.
That is, carry out at position P1 place can not guaranteeing space 278 under the situation of posture conversion of rotatable parts rotating mechanism 227 that simultaneously, for space 279, its volume also is limited in the narrow part of treatment chamber 270 sides.On the other hand, carry out at position P3 place under the situation of posture of rotatable parts rotating mechanism 227, must increase the position that the top of filtering fan unit (FFU) 224b is installed, cleaning processing apparatus is maximized, but by carry out the posture conversion of rotatable parts rotating mechanism 227 at position P2 place, can address this is that, the volume that transport unit 203a is occupied diminishes, and can constitute the integral body of cleaning processing apparatus 200 compactly.
Secondly, after tie point P in-position P3, make 230 actions of X-axis driving mechanism, the position of tie point P is moved horizontally to position P4.When tie point P was in position P4, rotatable parts 234 were inserted into lateral compartments 271a, can carry out clean, like this, rotatable parts 234 can be moved to the clean position from the transmission position of wafer handling device 216.
In the position that makes tie point P from position P3 to position P4 move horizontally, when rotatable parts 234 are inserted into lateral compartments 271a, utilization is configured in length measurement sensor 262f on the annular construction member 262a and measures rotatable parts and be transported into, transport distance between disk 235a, the 235b that mouthful 262c and rotatable parts 234 are possessed, so that rotatable parts 234 are not bumped with annular construction member 262a.Length measurement sensor 262f for example, shown in the front view of Figure 27 B, can equally spaced be configured in three positions along the periphery of annular construction member 262a.
The using method of length measurement sensor 262f, for example, as described below.At first, when disk 235a is moved horizontally to the subtend position of length measurement sensor 262f, temporarily stop the action of X-axis driving mechanism 230, utilize length measurement sensor 262f to measure the position of disk 235a.Judge by resulting measured value whether disk 235a can be transported into, transport a mouthful 262c by rotatable parts, when be judged as can not by the time, make rotatable parts rotating mechanism 227 return original position, stop the running of cleaning processing apparatus, keep in repair.
On the other hand, when being judged as disk 235a can be transported into, transport mouthful 262c by rotatable parts the time, begin to drive X-axis driving mechanism 230 once more, when disk 235b is moved horizontally to position in the face of length measurement sensor 262f, temporarily stop the action of X-axis driving mechanism 230 once more, utilize length measurement sensor 262f to measure the position of disk 235b.Judge that by resulting measured value can disk 235b be transported into, transport a mouthful 262c by rotatable parts, be judged as can not the time, termination is with rotatable parts 234 being transported in the chamber 271a laterally, make rotatable parts rotating mechanism 227 return original position, stop the running of cleaning processing apparatus 200, keep in repair.Simultaneously, judging that disk 235b drives X-axis driving mechanism 230 in the time of can being transported into, transporting mouthful 263c by rotatable parts once more, is transported into rotatable parts 234 in the lateral compartments 271a.
In addition, tie point P is in position P4, rotatable parts 234 insert the interior state of lateral compartments 271a, is at length represented by Figure 24, Figure 25.Simultaneously, after the wafer W clean finishes, for making tie point P move to position P1 from position P4, make the mobile route counter-rotating of such rotation parts rotating mechanism 227, rotatable parts rotating mechanism 227 is moved to the position that the wafer W in the rotatable parts 234 can be able to be delivered on the wafer handling device 216.
Below, the structure member of rotatable parts rotating mechanism 227 is described.Figure 28 is the perspective view of the structure of expression rotatable parts 234, and rotatable parts 234 comprise: at pair of discs 235a, the 235b of the arranged spaced of stipulating; The fixed component 236a that form to keep groove that wafer W uses etc. with predetermined distance; Similarly form groove etc., retainer 236b to be opened/closed with fixed component 236a; And the switching row of control retainer 236b and not all right locking bolt 236c.Fixed component 236a can be fixed between disk 235a, the 235b with screw clamp etc. from the outside of disk 235a, 235b, and wafer W is accommodated among groove of fixed component 236a and retainer 236b etc.Disk 235b fixing on pivot 250, for example, available screw 235c carries out.
The retainer switching mechanism 280 that retainer 236b is opened and closed is located at the transport unit 203a side of boundary wall 225, and (referring to Figure 21, Figure 22), retainer switching mechanism 280 comprises that locking bolt compresses cylinder 281, and retainer opens and closes cylinder 282.Retainer switching mechanism 280, at rotatable parts 234 and transferring arm 217a, 217b, between carry out the transmission position of wafer W, compress cylinder 281 and retainer with locking bolt and open and close the mode that cylinder 282 can touch locking bolt 236c and retainer 236b respectively, can between retreating position shown in Figure 21 and processing position shown in Figure 22, rotate freely.At boundary wall 225 places, on the part that retainer switching mechanism 280 is set, be provided with and cover 240, wafer handling unit 204 and clean unit 203 are isolated.
Locking bolt 236c for example is in the state that is projected into the disk 235a outside in the normal state, can not carry out the on-off action of retainer 236b at this state.On the other hand, locking bolt compresses cylinder 281 and has the hold-down mechanism that locking bolt 236c can be pressed into the inside of rotatable parts 234 when handling the position, simultaneously, retainer opens and closes cylinder 282 can touch retainer 236b in the outside of disk 235a, and retainer 236b is carried out on-off action.Thereby, when retainer switching mechanism 280 touches rotatable parts 234, when the thrust that compresses cylinder 281 by locking bolt becomes locking bolt 236c to state that the inboard of rotatable parts 234 is pressed into, retainer 236b becomes the state that can open and close cylinder 282 freely openables by retainer.
When retainer 236b is in the state of opening, wafer W can be transmitted between rotatable parts 234 and transferring arm 217a, 217b, on the other hand, in retainer 236b closing state, the wafer W in the rotatable parts 234 are maintained at the state that can not come off to the outside to rotatable parts 234.
According to above-mentioned retainer 236b, locking bolt 236c, the state of retainer switching mechanism 280, under the situation that retainer 236b opens, for example, the retainer switching mechanism 280 that will be in retreating position at first moves to handles the position, near rotatable parts 234, utilizes locking bolt to compress the state that cylinder 281 remains on locking bolt 236c the inside that is pressed into rotatable parts 234.In this state, make retainer open and close cylinder 282 actions, open retainer 236b.Thereby, being transported into of wafer W, transporting and become possibility, being transported into of wafer W, transport the end of job after, make after retainer 236b is in closed condition, remove the thrust that locking bolt compresses cylinder 281, locking bolt 236c turns back to the outstanding state from disk 235a, that is, and and the state that retainer 236b is locked.Secondly, if make retainer switching mechanism 280 turn back to retreating position, can turn to processing to wafer W.
Be arranged on the lid 233 on the rotatable parts rotating mechanism 227 integrally, be at medial compartment 271b shown in Figure 24 under the situation of retreating position, when rotatable parts 234 are inserted among the lateral compartments 271a, the rotatable parts of lateral compartments 271a are transported into, transport a mouthful 262c close, the clearance portion that the side and the rotatable parts of lid 233 are transported into, transport between mouthful 262c is sealed by sealing mechanism 263a.Simultaneously, as shown in figure 25, when medial compartment 271b was in the processing position, the side of lid 233 was further closed mouthful 266c that is transported into, transports of medial compartment 271b, and the side of lid 233 and the clearance portion that is transported into, transports between mouthful 266c seal with sealing mechanism 267a.Thereby can prevent from treatment chamber 270 to the transport unit 203a cleaning fluid that splashes.The rotatable parts that are formed on the ring element 262a of lateral compartments 271a are transported into, transport a mouthful 262c, as shown in figure 20, and can be by lid 262d freely openable.
The side of lid 233 made does not have the cylindric of ladder difference and inclination, simultaneously, has identical diameter by making rotatable parts be transported into, transport a mouthful 262c, 266c, for example, even when inserting in the medial compartment 271b misoperation takes place to rotatable parts rotating mechanism 227, also can avoid the collision of lid 233 and ring element 266a.Simultaneously, when carrying out liquid handling,, leak into transport unit 203a side so can prevent the atmosphere in the medial compartment 271b effectively because lid 233 usefulness sealing mechanism 263a, 267a seal with medial compartment 271b.
As sealing mechanism 263a, 267a, when not sealing, have the cross section shown in Figure 29 A and be roughly the M font, when sealing, shown in Figure 29 B, by the air etc. of supply authorized pressure, the mountain font that becomes the recess of central authorities to protrude, simultaneously, preferably use by its apex portion and not shown lid 233 etc. being adjacent to the pipe 285 of the rubber system that produces sealing function.Sealing mechanism 263a, 267a are transported into, transport a mouthful 262c, 266c respectively in the formation at two positions with respect to the rotatable parts of ring element 262a, 266a, can further guarantee its sealing.
The pipe 285 of rubber system is coupled in the slot part 286 that is formed on ring element 262a, the 266a, causes under the out of use situation of rubber tube in deterioration that causes because of soup and timeliness deterioration, as long as change rubber tube 285.Also can be formed in the last other ring element cooperate with rubber tube 285 of installing of ring element 262a, 266a, the structure that rubber tube 285 and this other ring element are changed together.
Utilize this occasion of utilizing the mechanism that air pressure seals of sealing mechanism 263a, 267a in employing, be supplied to the air pressure of rubber tube 285 by increasing, even under the high situation of the processing pressure in lateral compartments 271a and medial compartment 271b, also can guarantee good sealing property.Sealing mechanism shown in Figure 29 A, the 29B also is the same with respect to sealing mechanism 263b, 267b.In addition, also can adopt rubber ring that does not use air pressure etc., but be difficult to regulate the power of sealing in this case.
In the motor 231a of lid 233 side, configuration ring-type liquid container 233a carries out discharge opeing to the cleaning fluid that flow in the liquid container 233a with compulsory method.After wafer W is cleaned end, the side of lid 233 and with the subtend face of the disk 235b of lid 233 on adhere under the situation of cleaning fluid, this cleaning fluid that adheres to, for make rotatable parts 34 from lateral compartments 271a withdraw from, make rotatable parts rotating mechanism 227 along continuous straight runs to slide so that rotatable parts rotating mechanism 227 when horizontal posture transforms to vertical posture, become the drop of the side that is delivered to lid 233, the danger of the bottom surface that drops to clean unit 203 is arranged, but by liquid container 233a being set, the whereabouts that can prevent this cleaning fluid drop.
On lid 233, nozzle 273b is set, can be from nozzle 273b to spraying pure water and gas with subtend opposite disk 235b and lid 233.Owing to the pure water and the N that eject from the nozzle 253 that is located on the lateral compartments 271a 2Gas etc., be difficult to directly impact on the subtend face of disk 235b and lid 233, so in the prior art, exist the problem that is difficult to be rinsed at the used soup of preliminary stage, but by nozzle 273b is set, combine with the clean technology of wafer W, can wash and drying disk 235b.
In cleaning processing apparatus 200, adopt rotatable parts rotating mechanism 227 with rotatable parts 234 and lid 233 and motor 231a formation in aggregates, owing to can carry out conversion and mobile to the posture of rotatable parts rotating mechanism 227, thereby between wafer handling device 216 and rotatable parts rotating mechanism 227, there is no need to be provided with the mechanism of the posture of conversion wafer W, can simplify the transfer system of wafer W, the floor space of dwindling cleaning processing apparatus 100 whereby.Simultaneously, owing to can easily control rotatable parts 234 and enter, withdraw from lateral compartments 271a, the number of times with transmission wafer W is few, thereby also can suppress pollution such as adhering to of the damage of wafer W and particle etc.And then, because rotatable parts 234 constitute integrally with lid 233, thereby can will can set narrowlyer apart from d between the upper surface of rotatable parts 234 and lid 233, thereby dwindle the volume of lateral compartments 271a and medial compartment 271b, so can make treatment chamber 270 miniaturizations and improve the uniformity of liquid handling.
In rotatable parts rotating mechanism 227, at pivot 250 and around between the pivot cover 232 of pivot 250, configuration can make the bearing 232a of pivot 250 rotations, and pivot 250 connects the part of lid 233, adopts to prevent to enter pivot 250 hermetically-sealed construction on every side from the soup of treatment chamber 270.Simultaneously,, thereby partial exhaust gas mechanism is set, particle etc. can not be diffused in the transport unit 203a because the friction part of pivot 250 and pivot cover 232 and motor 231a constitute the generation source of particle etc.
On pivot cover 232, be point-symmetric basically position, center in axle with length direction, configuration anchor clamps bearing 275a, 275b.On the other hand, on the ring element 262a of lateral compartments 271a, configuration clamp lever 276a, 276b, clamp lever 276a, 276b can be in Figure 23 B rotate the angle of regulation between the retreating position shown in the operating position shown in the solid line and the dotted line, in the operating position place can be coupled to anchor clamps bearing 275a, 275b, clamping pivot cover 232.
By clamp lever 276a, 276b being remained on operating position, clamping pivot cover 232, for example, when drive motor 231a makes rotatable parts 234 rotations, particularly, when when beginning rotation and rotation stop, when rotary speed is switched, make under the situation such as direction of rotation when counter-rotating, when rotatable parts 234 are added big acceleration, can be suppressed at the vibration and the swing that are produced on the pivot 50, rotatable parts stably are rotated.Simultaneously, even under the situation that rotatable parts 234 are rotated, also can make the slow-roll stabilization of pivot 250.And then the vibration by suppressing to be taken place when rotatable parts 234 rotate can reduce the stress on the structure member that is added in rotatable parts rotating mechanism 227, prolongs the life-span of parts.
As previously described, because pivot cover 232 is connected with posture mapping device 228, posture mapping device 228 cooperates with Z axle driving mechanism 229, Z axle driving mechanism 229 cooperates with X-axis driving mechanism 230, thereby rotatable parts rotating mechanism 227 is kept by X-axis driving mechanism 230, but by utilizing clamp lever 276a, 276b the rotatable parts rotating mechanism 227 that carries out liquid handling can be fixed among the lateral compartments 271a reliably.
Structure member to cleaning part 203b describes below.Supply pure water, IPA, N from the cleaning fluid source of supply of soup storage unit 205 grades to the nozzle of being located on the tubular attitude 261a that constitutes lateral compartments 271a 253 2Gas etc. can spray pure water etc. to the wafer W that remains on the rotatable parts 234 from cleaning jet 254.Preferably, pure water etc. is struck the mode on the wafer W in large area, for example, spray pure water etc. from cleaning fluid jet 254 to be extended to conical mode.
In Figure 24 and Figure 25, only express a nozzle 253, but also configurable a plurality of nozzles, also not necessarily must be arranged on cylindrical body 261a directly over.For nozzle 255 situations also is the same.
In cylindrical body 261a, make the external diameter of the external diameter of annular component 262b side greater than annular component 262a side, cylindrical body 261a is so that annular component 262a is provided with rake than the low mode in position of annular component 262b side.Thereby, the various cleaning fluids that spray to wafer W from cleaning fluid jet 254, naturally on the bottom surface of cylindrical body 261a from annular component 262a side direction annular component 262b side flow, by exhaust/discharging tube 265a, be discharged to apocenosis passage (outside).
In order to prevent when rotatable parts rotating mechanism 227 is transported, to be transported into, to transport a mouthful 262c leakage liquid attached to the rotatable parts such as cleaning fluid on lid 233 and the sealing mechanism 263a etc., outer lower portion at annular component 262a, liquid container 262e is set, the cleaning that can keep whereby, cleaning part 203b.
Constitute the cylindrical body 261b of medial compartment 271b, different with the cylindrical body 261a of lateral compartments 271a, annular component 266a side and annular component 266b side are have same outer diameter as cylindric, and horizontal arrangement.In order to make cleaning fluid can easily be discharged to the outside, form the slot part 269 of the outstanding gradient of shape body 261b that conforms to the principle of simplicity in the bottom of cylindrical body 261b with regulation.Thereby when medial compartment 271b was positioned at the processing position, the cleaning fluid from nozzle 255 sprays to wafer W flow through slot part 269, is discharged in the apocenosis passage by exhaust/discharging tube 265b.
From the cleaning fluid source of supply of soup storage unit 205 grades to the various cleaning fluids of nozzle 255 supplies, can be from cleaning fluid jet 256 to remaining on wafer W jet cleaning liquid on the rotatable parts 234 etc.
Preferably, impinge upon mode on the wafer W with the cleaning fluid concentrated area from cleaning fluid jet 256, for example, to be extended to the fan-shaped spray cleaning fluid that is essentially plane.In this case, particularly strike the lip-deep mode of wafer W, preferably to dispose cleaning fluid jet 256 with the same number of number that remains on the wafer W on the rotatable parts 234 with cleaning fluid.Drive X-axis driving mechanism 230 and adjust the slippage of rotatable parts rotating mechanism 227 when directions X slides, by the position of rotatable parts 234 of fine setting in medial compartment 271b, the cleaning fluid that ejects from cleaning fluid jet 256 is penetrated on wafer W.
Simultaneously, when cleaning medial compartment 271b, can spray pure water and N from cleaning fluid jet 256 with wiper mechanism 290 2Gas etc.
Be positioned under the situation of handling the position at medial compartment 271b, as shown in figure 25, seal by sealing mechanism 267a between annular construction member 266a and the lid 233, simultaneously, seal by sealing mechanism 263b between annular component 266b and the annular construction member 262b, and, seal by sealing mechanism 267b between annular construction member 266b and the disk 292a.Thereby, when medial compartment 271b is in the processing position, by cylindrical body 261b, annular construction member 266a, 266b, disk 292a, lid 233 forms process chambers 252.
Be at medial compartment 271b under the state of retreating position, seal by sealing mechanism 263b between annular construction member 266a and the annular construction member 262b, and, seal by sealing mechanism 267a between annular construction member 266a and the disk 292a.Simultaneously, because when being inserted into rotatable parts 234 in the lateral compartments 271a, seal by sealing mechanism 263a between lid 233 and the annular construction member 262a, thereby, when medial compartment 271b is in retreating position, as shown in figure 24, by cylindrical body 261a, annular construction member 262a, 262b, disk 292a, the annular construction member 266a of medial compartment 271b, the lid 233 of rotatable parts rotating mechanism 227 forms the process chamber 251 that is undertaken by lateral compartments 271a.
Be at medial compartment 271b under the state of retreating position, as mentioned above, when lateral compartments 271a side forms process chamber 251, between annular construction member 266a and disk 292a, seal with sealing mechanism 267a, with sealing mechanism 267b sealing, formation is roughly the cleaning process room 272 of tubular between the interior week of the periphery of cylindrical body 291 and cylindrical body 261b between annular construction member 266b and annular construction member 292b.Can spray N to cleaning process room 272 from the gas supply nozzle 293 at a plurality of positions of being arranged on cylindrical body 291 2Dry gas such as gas and air.Simultaneously, the dry gas that is sprayed can be discharged from blast pipe 294.
Handle the position, carry out after soup handles to the soup of wafer W supply regulation in process chamber 252 in that medial compartment 271b is moved to, if medial compartment 271b is moved to the position of keeping out of the way, available dry gas carries out dried.On the other hand, in purge chamber 272, in cleaning process room 272, spray pure water from nozzle 255, then, by from gas supply nozzle 293 jet drying gas in cleaning process room 272, clean the inside of medial compartment 271b and can prepare next wafer W is carried out the soup processing.From gas supply nozzle 293 jet drying gases the time, also can whereby, can carry out drying from nozzle 255 jet drying air to nozzle 255.
Simultaneously, insert the state of lateral compartments 271a at rotatable parts 234, the face of disk 235a and disk 292a subtend and the same with the face of disk 235b and lid 233 subtends, be difficult to and be directly injected on these faces from pure water and the dry gas that nozzle 255 ejects, so for clean, dry disk 235a, can spray pure water and dry air from the nozzle 273a that is located on the disk 292a.Adopt nozzle 273a and aforesaid nozzle 273b,, can spray for example oxygen (O for the gas atmosphere that makes process chamber 251,252 have regulation 2) and carbon dioxide (CO 2) gas etc.Be supplied to the gas of process chamber 251,252, not only can but also can from the blast pipe 273c on being located at disk 292a, discharge gas from exhaust/discharging tube 265a, 265b.
Below, with in cleaning processing apparatus 200, with the FOUP F of mounting on FOUP platform 202a as FOUP F1, the FOUP F of mounting on FOUP platform 202b is as FOUP F2, in that to carry out the situation of clean be example to being contained in wafer W in these two FOUP F1, F2, its clean technology is described.At first, will hold FOUP F1, the F2 of 25 wafer W with the spaced and parallel ground of regulation, make in FOUP F1, F2 that wafer W comes in and goes out be transported into, transport actinal surface to the mode mounting of the 212a of window portion, 212b on FOUP platform 202a, 202b.
At first,, open the 212a of window portion, make the inside of FOUP F1 become the state that is communicated with the inside of wafer handling unit 204 in order to transmit the wafer W that is contained in the FOUP F1.Then, check the sheet number and the storage configuration of wafer W in the FOUP F1 with wafer inspection mechanism 310.Here, when the storage configuration of checking out wafer W is unusual, interrupt processing, for example, transfer to leaving the processing of the wafer W in the FOUP F2 in to the wafer W of FOUP F1.
When the storage configuration of the wafer W in not checking out FOUP F1 is unusual, whole wafer W that 216 actions of wafer handling device will be left in the FOUP F1 are transplanted on the transferring arm 217a, make linear driving mechanism 219 and rotatable parts 222 actions, wafer handling device 216 is moved to the position that transferring arm 217a can touch rotatable parts 234.Utilize elevating mechanism 223 to regulate the height and position of transferring arm 217a, make the 225a of window portion be the state of opening, to keep the transferring arm 217a of wafer W to be inserted in the rotatable parts 234, operate retainer 236b etc., wafer W will be transferred on the rotatable parts 234 with retainer switching mechanism 280.
After wafer W being remained on the rotatable parts 234, elder generation is according to the move mode of the rotatable parts 227 shown in Figure 26 A～Figure 26 E, rotatable parts 234 are inserted in the lateral compartments 271a, simultaneously, be transported into, transport a mouthful 262c place for making lid 233 be positioned at rotatable parts, drive Z axle driving mechanism 229 and posture mapping device 228 and X-axis driving mechanism 230, mobile rotatable parts 227.After the rotatable parts rotating mechanism is moved to the position of regulation, clamp lever 276a, 276b are moved to operating position from retreating position, clamping fixture bearing 275a, 275b keep pivot 232.
Then, make sealing mechanism 263a action, the side and the rotatable parts of lid 233 are transported into, transport clearance seal between mouthful 263c, inboard process chamber 271b is moved to the processing position, make sealing mechanism 267a action with the side of lid 233 and the clearance portion sealing of rotatable parts 266c, simultaneously, make sealing mechanism 263b, 263b action, with each clearance portion sealing of annular construction member 262b and annular construction member 266b and disk 292a, form process chamber 252 respectively.In addition, medial compartment 271b is moved to handle the position in advance, rotatable parts 234 are inserted in the medial compartment 271b, make sealing mechanism 263a, 267a action the side and the rotatable parts of lid 233 are transported into, transport the clearance portion sealing of a mouthful 262c, 266c.
If formed process chamber 252,,, carry out soup and handle from the soup of cleaning fluid jet 256 to wafer W supply regulation by the rotation that drive motor 231a stipulates rotatable parts 234.At this moment, because pivot cover 232 keeps by clamp lever 276a, 276b, so for example, even when carrying out speed change rotation and reverse rotation etc., can prevent the vibration of pivot 250.
After the soup processing finished, for sealing mechanism 263b, 267a except that sealing mechanism 263a, 267b removed action, and 271b moves to retreating position with medial compartment.After this, make sealing mechanism 263b, 267a, 267b action respectively, respectively annular component 262b and annular component 266a and disk 292a are sealed between separately, simultaneously, the clearance portion between annular component 266b and the disk 292b is sealed.In the cleaning process room 272 that forms like this, utilize the washing to medial compartment 271b, the dried of wiper mechanism 290, for the processing of next group wafer W is prepared.On the other hand, in the process chamber 251 that utilizes lateral compartments 271a to form, one side is rotated wafer W, and one side is washed processing from nozzle 253 and nozzle 273a, 273b injection pure water, then, for example uses N 2Gas carries out dried.
During the processing of carrying out wafer W like this with clean unit 203, in wafer handling unit 204, the wafer handling device 216 that is in the state that does not keep wafer W can be moved in the mode that transferring arm 217a can touch the FOUP F2 on the mounting FOUP platform 202b, with the identical method of method that from FOUP F1, transports wafer W, the wafer W that is contained in the FOUP F2 is transferred on the transferring arm 217a, keep at transferring arm 217a under the state of untreated wafer W, mobile wafer handling device 216 moves to middle position through the window 225a of portion contact vibration parts 234 with the transferring arm 217b that does not keep wafer W.
In clean unit 203, after clean finishes, the action of the 263a of depressurization mechanism, make clamp lever 276a, 276b move to retreating position simultaneously, the maintenance of removing pivot cover 232 drives X-axis driving mechanism 230 grades makes the rotatable parts rotating mechanism 227 that keeps wafer W, but turns back to the position of transmission wafer W between transferring arm 217a, 217b and the rotatable parts 234.
Conservator switching mechanism 280 is moved to handle the position, open the 225a of window portion, then, make at first after transferring arm 217b becomes the state that can touch rotatable parts 234, open retainer 236b, the wafer W that remains on the rotatable parts 234 is transferred on the transferring arm 217b, then make rotary drive mechanism 222 actions so that make transferring arm 217a can touch rotatable parts 234, make platform 221 Rotate 180s °, the untreated wafer W that remains on the transferring arm 217a is shifted on rotatable parts 234.
For the untreated wafer W that remains on the FOUP F2 on the rotatable parts 234, by with the foregoing identical technology of clean that is contained in the wafer W among the FOUP F1, carry out clean, then wafer W is moved to the position that between transferring arm 217a, 217b, to shift.During this period, for wafer handling device 216, transferring arm 217b is moved in the mode that can touch FOUP F1, the wafer W that clean finishes is transferred in the FOUP F1, the state that wafer handling device 216 is become make transferring arm 217b can touch rotatable parts 234.
Like this, transferring arm 217b accepts the wafer W of the FOUP F2 that disposes from rotatable parts 234, if this wafer W is contained in the FOUP F2, the clean that is contained in the wafer W in FOUP F1, the F2 is finished.Here, for example, for occasion at FOUP platform 202c configuration FOUP F3, after the processing of the wafer W of FOUP F1 finishes, to be contained in wafer transfer in the FOUP F3 to transferring arm 217a, after the wafer W of the FOUP F2 that clean is finished transports from rotatable parts 234, transfer on the rotatable parts 234 clean of stipulating serially by the wafer W that will remain on the transferring arm 217a.
Above, to the form of implementation of liquid handling device of the present invention, cleaning processing apparatus 1,100,101,200 is illustrated, but the present invention is not limited to above-mentioned form of implementation, can carry out various distortion.
The first, for cleaning processing apparatus 1,100,101,200, express the state that keeps wafer W in mode with perpendicular, one side is rotated the form that wafer W is simultaneously cleaned, but, the surface and the horizontal direction structure of wafer W are had a certain degree, kept for example arbitrarily angled the making under the wafer W heeling condition of this angle in 45 °～90 ° scope, one side is rotated simultaneously and cleans under this state.
With cleaning processing apparatus 100 is example, sets the angle of inclination of posture mapping device 109 arbitrarily, and wafer W is contained in the treatment chamber 151, can carry out liquid handling.The state of this regulation for example, can consistently tilt by the configuration status of treatment chamber 151 and rotatable parts being inserted mouthfuls 153 the state and the angle of inclination of wafer W.Perhaps pivot 137 vertically runs through disk 138 in cleaning processing apparatus 100, realizes but change pivot 137 runs through the angle of disk 138.
The second, as treatment chamber the situation with the dual structure that is made of lateral compartments and medial compartment is illustrated, but treatment chamber also can be more than three, also can be one.Lateral compartments and medial compartment for example, also can be used for one of them cleaning, and wherein another only is used for drying.
Three, represented the allocation position that wafer W moves to treatment chamber is carried out the form of clean, but for the rotating disk 31 and the rotatable parts 131,234 that keep wafer W, the slide mechanism that slides to horizontal direction also can be set, but make treatment chamber carry out clean to rotating disk that keeps wafer W and the slip of rotatable parts 131,234 sides.
Figure 30 is the simple structural plan figure of expression with the cleaning processing apparatus 201 after the structural change of cleaning processing apparatus 200.In cleaning processing apparatus 201, the X-axis driving mechanism 230 that cleaning processing apparatus 200 is had is not set, rotatable parts rotating mechanism 227 can not move along directions X.Replace this X-axis driving mechanism 230, first slide mechanism 351 is installed on lateral compartments 271a, simultaneously, second slide mechanism 352 is installed on medial compartment 271b, the 3rd slide mechanism 353 is installed on wiper mechanism 290, and lateral compartments 271a and medial compartment 271b and wiper mechanism 290 become the structure that can be free to slide along directions X.
In Figure 30, the position that 290 pairs of wafer W of lateral compartments 271a and medial compartment 271b and wiper mechanism are carried out clean dots, and the retreating position that wafer W is carried out clean is not represented with solid line.
In this cleaning processing apparatus 201, utilize Z axle driving mechanism 229 that the rotatable parts rotating mechanism 227 that utilizes posture mapping device 228 to remain on horizontal posture is remained on the state that is lifted to specified altitude, make lateral compartments 271a and medial compartment 271b and wiper mechanism 290 together to rotatable parts 234 side shiftings, the rotatable parts 234 that remain static are contained in the lateral compartments 271a.
By further only driving second slide mechanism 352 from this state, medial compartment 271b is contained in the lateral compartments 271a, available medial compartment 271b carries out the liquid handling of wafer W.
Undertaken driving second slide mechanism 352 after liquid handling finishes by medial compartment 271b, medial compartment 271b is withdrawed from from lateral compartments 271a, for medial compartment 271b, wash dried by cleaning mechanism 290, for lateral compartments, carry out washing, the dried of wafer W.
Thereby, after the clean of wafer W finishes, drive first slide mechanism 351～the 3rd mechanism 353, make lateral compartments 271a with medial compartment 271b and cleaning mechanism 290 repositions simultaneously, for rotatable parts 227, be transformed into vertical posture, and remain on wafer W to position that wafer handling device 216 shifts.
The 4th, in above-mentioned form of implementation, the situation that liquid handling device of the present invention is used for clean has been described, but has been not limited to this, also applicable coating processing unit and the corrosion treatment device that the coating fluid of regulation is coated with of liquid handling device of the present invention.Simultaneously, enumerate semiconductor as substrate and be illustrated as an example, but be not limited thereto, the present invention also is applicable to the liquid handling of handling with other substrates such as substrates such as liquid crystal indicator (LCD).
Above illustrated form of implementation, all be for technology contents of the present invention is set forth from start to finish, can not be interpreted as that the present invention only is confined to these concrete examples, in purport of the present invention and the described scope of claim, can carry out various changes and be implemented.

Claims (13)

1, liquid handling device has in the liquid handling device of liquid handling in that the supply substrate treat liquid is carried out:
The maintaining body that keeps substrate,
Make the rotating mechanism of aforementioned maintaining body rotation,
Have make that aforementioned maintaining body enters/withdraw from usefulness be transported into, transport mouth, hold aforementioned maintaining body, and the treatment chamber of the liquid handling that the substrate that remains on the aforementioned maintaining body is stipulated,
Under the state in aforementioned maintaining body is contained in the aforementioned processing chamber, be transported into, transport a mouth lid of closing on the aforementioned processing chamber with being formed at,
Wherein, aforementioned maintaining body and aforementioned rotating mechanism and aforementioned lid have overall structure.
2, liquid handling device according to claim 1 is characterized in that, aforementioned maintaining body to be contained in substrate in the aforementioned processing chamber with keeping plumbness.
3, liquid handling device according to claim 1, it is characterized in that the aforementioned processing chamber has the dual structure that is made of fixing lateral compartments and the processing position in aforementioned lateral compartments and the medial compartment that can slide between the retreating position outside the aforementioned lateral compartments.
4, liquid handling device according to claim 3, it is characterized in that, aforementioned lateral compartments has and is used to make aforementioned maintaining body to enter/withdraw from first of aforementioned lateral compartments to be transported into, transport mouth and be configured in aforementioned first and be transported into, transport first sealing mechanism on the mouth, and, aforementioned medial compartment has makes aforementioned maintaining body enter/withdraw from that aforementioned medial compartment uses second is transported into, transport mouth and dispose aforementioned second and be transported into, transport second sealing mechanism on the mouth, in the time of in aforementioned maintaining body is accommodated in aforementioned medial compartment, aforementioned lid and aforementioned first is transported into, transport between the mouth by aforementioned first sealing mechanism sealing, and aforementioned lid and aforementioned second is transported into, transport between the mouth by aforementioned second sealing mechanism sealing.
5, liquid handling device according to claim 4 is characterized in that, the internal diameter that aforementioned first internal diameter and aforementioned second that is transported into, transports mouth was transported into, transported mouth is identical.
6, liquid handling device according to claim 1, it is characterized in that, liquid handling device further possesses the pivot that connects aforementioned maintaining body and aforementioned rotating mechanism is arranged, around the pivot cover of aforementioned pivot, under the state in aforementioned maintaining body is accommodated in the aforementioned processing chamber, connect aforementioned pivot cover and aforementioned processing chamber, suppress the vibration suppressing mechanism of the runout formula vibration of aforementioned pivot.
7, liquid handling device according to claim 6, it is characterized in that, aforementioned vibration suppressing mechanism has to be installed to and can rotate the clamp lever of predetermined angular on the aforementioned processing chamber and be installed to the auxiliary section that cooperates with the aforementioned clamped handle on the aforementioned pivot cover, and aforementioned clamped handle and aforementioned auxiliary section are arranged on two positions with respect to the axle central point of aforesaid pivoted respectively.
8, liquid handling device according to claim 1 is characterized in that, aforementioned lid has the liquid container of recovery attached to the treatment fluid on the aforementioned lid.
9, liquid handling device according to claim 1 is characterized in that, aforementioned lid has to the cleaning fluid of aforementioned maintaining body supply regulation or the organization of supply of gas.
10, liquid handling device according to claim 1, it is characterized in that, liquid handling device further is equipped with: the container that holds a plurality of substrates with level is transported into, the container that transports transports, be transported into portion, be transported in aforementioned container in mounting, transport the base plate transfer device that transmits substrate between the container of portion and the aforementioned maintaining body with horizontal state, between aforesaid base plate conveyer and aforementioned maintaining body, carry out the substrate transferring position of the transfer of substrate, and carry out the maintaining body travel mechanism that moves aforementioned maintaining body between the processing position of liquid handling remaining on substrate on the aforementioned maintaining body.
11, according at the described liquid handling device of claim 10, it is characterized in that, aforementioned maintaining body travel mechanism, have: for make the cover plate that remains on the aforementioned maintaining body be level or for vertical, aforementioned maintaining body is carried out the posture mapping device of posture conversion, along the elevating mechanism that short transverse moves, aforementioned maintaining body and aforementioned posture mapping device and aforementioned elevating mechanism along continuous straight runs are moved aforementioned maintaining body and aforementioned posture mapping device, under vertically remaining on state on the aforementioned maintaining body, substrate make aforementioned maintaining body enter/withdraw from the horizontal mobile mechanism of usefulness with respect to the aforementioned processing chamber.
12,, it is characterized in that the aforementioned processing chamber has and detects the pass through position-detection sensor of aforementioned maintaining body by aforementioned position when being transported into, transporting mouthful according at the described liquid handling device of claim 11.
13, basis is at the described liquid handling device of claim 12, it is characterized in that, aforementionedly detecting aforementioned maintaining body not by aforementionedly being transported into, transporting mouthful, during position when collision dangerous being arranged, stopping the action of aforementioned levels travel mechanism with the aforementioned processing chamber by position-detection sensor.
CNB2005101084715A 2000-06-30 2001-06-30 Liquid processing apparatus Expired - Fee Related CN100411129C (en)

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JP2000198645A JP4505563B2 (en) 2000-06-30 2000-06-30 Liquid processing equipment
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CN101266916B (en) * 2006-07-20 2010-09-22 三星电子株式会社 Processing apparatus for substrate
CN102725826A (en) * 2010-04-30 2012-10-10 应用材料公司 Disk-brush cleaner module with fluid jet
CN113078089A (en) * 2021-06-07 2021-07-06 北京北方华创微电子装备有限公司 Wafer transfer device, semiconductor process equipment and wafer transfer control method

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JP4486649B2 (en) * 2004-10-28 2010-06-23 東京エレクトロン株式会社 Liquid processing equipment
JP4602750B2 (en) * 2004-12-13 2010-12-22 東京エレクトロン株式会社 Processing apparatus and processing method
KR102081706B1 (en) * 2018-07-18 2020-02-27 세메스 주식회사 Method for treating a substrate and an apparatus for treating a substrate

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US5055036A (en) * 1991-02-26 1991-10-08 Tokyo Electron Sagami Limited Method of loading and unloading wafer boat
US5317778A (en) * 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
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JP3627132B2 (en) * 1997-11-18 2005-03-09 東京エレクトロン株式会社 Substrate drying processing apparatus and substrate drying processing method
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Publication number Priority date Publication date Assignee Title
CN101266916B (en) * 2006-07-20 2010-09-22 三星电子株式会社 Processing apparatus for substrate
CN102725826A (en) * 2010-04-30 2012-10-10 应用材料公司 Disk-brush cleaner module with fluid jet
CN102725826B (en) * 2010-04-30 2016-05-04 应用材料公司 There is the disk brush cleaner module of fluid ejector
US9646859B2 (en) 2010-04-30 2017-05-09 Applied Materials, Inc. Disk-brush cleaner module with fluid jet
CN113078089A (en) * 2021-06-07 2021-07-06 北京北方华创微电子装备有限公司 Wafer transfer device, semiconductor process equipment and wafer transfer control method

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