CN1734796A - LED with bonding layer and making method thereof - Google Patents
LED with bonding layer and making method thereof Download PDFInfo
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- CN1734796A CN1734796A CNA2004100556536A CN200410055653A CN1734796A CN 1734796 A CN1734796 A CN 1734796A CN A2004100556536 A CNA2004100556536 A CN A2004100556536A CN 200410055653 A CN200410055653 A CN 200410055653A CN 1734796 A CN1734796 A CN 1734796A
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- 239000010410 layer Substances 0.000 claims description 170
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- 239000000463 material Substances 0.000 claims description 89
- 238000004026 adhesive bonding Methods 0.000 claims description 88
- 238000003475 lamination Methods 0.000 claims description 40
- 239000000470 constituent Substances 0.000 claims description 38
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 32
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- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910002804 graphite Inorganic materials 0.000 claims description 14
- 239000010439 graphite Substances 0.000 claims description 14
- 229910002704 AlGaN Inorganic materials 0.000 claims description 10
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical group O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 9
- 239000011787 zinc oxide Substances 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 229910004205 SiNX Inorganic materials 0.000 claims description 6
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- 229910003437 indium oxide Inorganic materials 0.000 claims description 6
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
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- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
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- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 4
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- 101150071746 Pbsn gene Proteins 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
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- CSBHIHQQSASAFO-UHFFFAOYSA-N [Cd].[Sn] Chemical compound [Cd].[Sn] CSBHIHQQSASAFO-UHFFFAOYSA-N 0.000 claims description 3
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims description 3
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- 230000017525 heat dissipation Effects 0.000 description 3
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- 239000004575 stone Substances 0.000 description 3
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- 229910002601 GaN Inorganic materials 0.000 description 2
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- VIRZZYBEAHUHST-UHFFFAOYSA-N bicyclo[4.2.0]octa-1,3,5-triene Chemical compound C1CC=2C1=CC=CC2.C2CC=1C2=CC=CC1 VIRZZYBEAHUHST-UHFFFAOYSA-N 0.000 description 1
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Abstract
The preparation method for LED with adhesive layer comprises, using adhesive layer with thickness of 0.1mum- 1mum to link the light stack and base plate of high heat dispersion with thermal conduction coefficient not less than 100W/mk and increase heat dispersion effect and improve stability and efficiency; the said LED at least comprises, a said heat dispersion plate, a LED stack and the said adhesive layer.
Description
Technical field
The present invention relates to a kind of light-emitting diode and method for making thereof, especially about a kind of high-radiating light-emitting diode and method for making thereof with gluing layer with gluing layer.
Background technology
The application of light-emitting diode is rather extensive, for example, can be applicable to optical display, traffic sign, data memory device, communication device, lighting device and medical treatment device.How improving the brightness of light-emitting diode, is the important topic in the manufacturing of light-emitting diode.
A kind of led configurations and method for making thereof are disclosed in No. 550834 invention of Taiwan patent announcement, one light-emitting diode epitaxial structure is grown up on an extinction first substrate, utilize the soft dielectric gluing layer of a macromolecular material that this light-emitting diode brilliant surperficial doing with a high thermal conductivity coefficient second substrate of heap of stone engaged again, to increase the chip cooling effect, increase lumination of light emitting diode efficient.In foregoing invention patent case, epitaxial layer is grown up on this extinction first substrate, adopt gluing layer that epitaxial layer and high thermal conductivity coefficient second substrate are linked back removal extinction first substrate to reduce thermal resistance, increase heat sinking function, to increase luminous efficiency again; Yet it is relevant that the thermal resistance of a light-emitting diode is respectively formed thickness and respectively formed thermal conductivity coefficient with it, and its thermal resistance relational expression is:
This light emitting diode construction thermal resistance is equivalent to the summation of epitaxial layer thermal resistance, soft dielectric gluing layer thermal resistance and substrate thermal resistance in the above-mentioned patent case, and its thermal resistance relational expression is:
Element thermal resistance=epitaxial layer thermal resistance+gluing layer thermal resistance+second substrate the thermal resistance
The former growth is equivalent to the summation of epitaxial layer thermal resistance and substrate thermal resistance in the light-emitting diode thermal resistance of first substrate, its thermal resistance relational expression is:
The former element thermal resistance=epitaxial layer thermal resistance+first substrate thermal resistance
Learn by relational expression (two) and relational expression (three), even use the high thermal conductivity coefficient substrate, when gluing layer thermal resistance and high thermal conductivity coefficient second substrate the common thermal resistance that produces if greater than the original first substrate thermal resistance that adopts, then this light-emitting diode still can't be given full play to the heat dissipation characteristics of high thermal conductance substrate, has the shortcoming of poor heat radiation.
Summary of the invention
The shortcoming that has poor heat radiation in view of foregoing invention, the technical problem that the present invention mainly will solve is the heat dissipation problem of light-emitting diode, another technical problem that the present invention will solve is the heat dissipation characteristics that makes full use of the high thermal conductivity coefficient substrate, the another technical problem that the present invention will solve is to define the thickness of employing high thermal conductivity coefficient second substrate and preferred gluing layer to reduce the element thermal resistance, effectively increases thermal diffusivity.
One existing traditional light emitting diode construction, it comprises one first substrate, is formed at the epitaxial layer on this first substrate, and this first substrate comprises at least a material that is selected from the constituent material group of GaAs, Ge institute.Suppose that the element area is A, the thermal conductivity coefficient of this first substrate is k1 (W/mk), its thickness x1 μ m, and the about k2 of this epitaxial layer thermal resistivity (W/mk), its thickness x2 μ m, then the former element thermal resistance value of this first substrate is
Adopt the soft dielectric gluing layer of macromolecular material that surperficial the doing with high thermal conductivity coefficient second substrate of light-emitting diode epitaxial layer engaged to replace the light emitting diode construction of first substrate, it comprises second substrate with high thermal conductivity coefficient, soft dielectric gluing layer and epitaxial layer in order to the macromolecular material that engages this epitaxial layer, suppose that the element area is A, the about k2 of this epitaxial layer thermal resistivity (W/mk), its thickness x2 μ m, the thermal conductivity coefficient of this gluing layer is k3 (W/Mk), its thickness is x3 μ m, the thermal conductivity coefficient of this second substrate is k4 (W/mK), its thickness x4 μ m, then this element thermal resistance is
Adopt gluing layer bonding epitaxy layer and high thermal conductivity coefficient substrate to replace first substrate, represent that above-mentioned Rth2 should be littler than Rth1 to reduce thermal resistance, to increase radiating efficiency.
Example according to notion of the present invention, second substrate with high thermal conductivity coefficient is to replace first substrate, gluing layer benzocyclobutane (BCB) and epitaxial layer in order to the bonding epitaxy layer, suppose that the element area is A, about 6 (W/mk) of this epitaxial layer thermal conductivity coefficient, its thickness 3 μ m, the thermal conductivity coefficient of this gluing layer benzocyclobutane (BCB) is 0.2 (W/mK), its thickness is x2 μ m, the thermal conductivity coefficient of this second substrate is k3 (W/mK), its thickness 170 μ m, this first substrate material adopts GaAs, and the GaAs thermal conductivity coefficient is 50 (W/mK), and the thermal conductivity coefficient of above-mentioned light-emitting diode common used material and organic material is referring to table one and table two:
Table one: the thermal conductivity coefficient table of comparisons of light-emitting diode common used material
| Title material | Thermal conductivity coefficient (W/mk) Thermal Conductivity |
| GaAs | 44-58 |
| Al 0.5Ga 0.5As | 11 |
| (Al
0.5Ga
0.5)In
0.5 | 6 |
| Ga
0.5In
0.5 | 5 |
| GaP | 75-100 |
| Sapphire (Sspphire) | 35-40 |
| GaN | a.130 b.170 |
| Si | 125-150 |
| | 270 |
| Copper (Copper) | 393 |
| Silver (Silver) | 418 |
| Gold (Gold) | 297 |
| Aluminium (Aluminum) | 240 |
| Au-Sn(80-20) | 57 |
| In | 81.8-86 |
| Aluminium nitride (Aluminum Nitride) | a.170-200 b.285 |
| SiO 2 | 1.5 |
| Glass (Glass) | 0.8 |
| Al 2O 3 | 10-35 |
Data source:
(1)R.R.Tummala and E.J.Rymaszewski：″Microelectronics PackagingHandbook″(van Nostrand Reinhold，1988)
(2)G.Slack，J.Phys.Chem.Solids 34，321(1973)
(3)P.D.Maycock，Thermal Conductivity of Silicon，Germanium，III-VCompounds and III-V Alloys，Solid-State Electronics，vol.10.pp161-168，1967
(4)http：//hyperphysics.phy-astr.gsu.edu/hbase/mecref.html#c1
Table two: the thermal conductivity coefficient table of comparisons of organic material
| Title material | Thermal conductivity coefficient (W/mk) Thermal conductivity |
| Epoxy-Kevlar (x-y) (60%) | 0.2 |
| Polyimides-quartz (x axle) | 0.35 |
| Polyimides (Polyimide) | 0.2 |
| Fr-4 (x-y plane) | 0.2 |
| Benzocyclobutane (Benzocyclobutene) | 0.2 |
| Polytetrafluoroethylene (E.I.Du Pont Company) | 0.1 |
Data source:
(1)R.R.Tummala and E.J.Rymaszewski：″Microelectronics PackagingHandbook″(van Nostrand Reinhold，1988)
Adopting high thermal conductivity coefficient second substrate to replace first substrate is the thermal resistance value Rth1 that above-mentioned Rth2 is GaAs less than former first substrate with the condition that increases heat radiation, and its relational expression is
The former element of Rth2 element-Rth1＜0
Obtain
For adopting various high thermal conductivity coefficient substrates to replace its best gluing layer thickness of element with the first substrate GaAs, wherein the gluing layer material adopts benzocyclobutane (BCB) shown in the table three
Table three
| Second substrate material | Second substrate thermal conductivity coefficient (K4) the Thermal Conductivity (W/mk) | Gluing layer (BCB) thickness (μ m) (x3) |
| Sapphire | 35 | ＜0 |
| | 100 | ＜0.34 |
| GaN | 130 | ＜0.418 |
| | 150 | ＜0.453 |
| Aluminium (Al) | 240 | ＜0.538 |
| | 270 | ＜0.554 |
| Gold | 297 | ＜0.556 |
| Copper (Cu) | 393 | ＜0.593 |
| Silver (Ag) | 418 | ＜0.599 |
Adopt gluing layer that light-emitting diode brilliant surface of heap of stone is done with high thermal conductivity coefficient second substrate and engage to replace the light emitting diode construction of first substrate, the thermal conductivity coefficient of its employed second substrate and used gluing layer thickness relationship figure are referring to Fig. 1; By among Fig. 1 as can be known, adopting this high thermal conductivity coefficient second substrate to replace this first substrate is that the thickness that engages the gluing layer of this epitaxial layer and this high thermal conductivity coefficient second substrate is less than 0.5 μ m with the condition that increases heat sinking function, but because of this epitaxial layer surface smoothness differs, its difference of height is at micron order, referring to Fig. 2 and Fig. 3, use benzocyclobutane (BCB) to come bonding epitaxy layer and high thermal conductivity coefficient Si substrate to replace the GaAs substrate of former extinction on the practice as gluing layer, this layer gluing layer is smaller or equal to 1 μ m, just can reach better radiating effect and the luminous efficiency of light-emitting diode that adopts the GaAs substrate than tradition, when this gluing layer benzocyclobutane (BCB) thickness during less than 0.1 μ m, qualification rate when engaging is very low, so best gluing layer thickness is between 0.1 μ m and 1 μ m, in addition, also can form active force that a conversion zone coheres face with enhancing on the surface that joins of this gluing layer and this epitaxial layer and this high thermal conductivity coefficient second substrate can increase and engage qualification rate.
The method for making of the light-emitting diode of said structure, be with gluing layer with light-emitting diode surface of heap of stone brilliant and high thermal conductivity coefficient substrate do engage after, be placed between two graphite cakes, heat pressurization a period of time in the graphite cake both sides to increase adhesive effect power, utilize the heat conduction of graphite well to reach the quality soft characteristic simultaneously, the energy Homogeneouslly-radiating is to form the uniform gluing layer of a thickness in manufacture process.
This case inventor obtains inventive concept identical result therewith in experiment, learn according to experimental data, the thermal conductivity coefficient of the high thermal conductivity coefficient that uses second substrate greater than 100W/mk, benzocyclobutane (BCB) thickness is smaller or equal to 1 μ m, can obtain the radiating effect better than GaAs substrate, use benzocyclobutane (BCB) bonding epitaxy layer in the experiment on different substrate, and this benzocyclobutane (BCB) thickness is situated between at 0.5 μ m approximately between the 0.8 μ m, obtains experimental result such as table four; In another experiment, use identical Si substrate, and form different benzocyclobutane (BCB) thickness, obtain experimental result such as table five.
Table four
| Light emitting diode construction | Substrate thermal conductivity coefficient (W/mk) Thermal Conductivity | 12mil light-emitting diode saturation current (mA) |
| EPI/GaAs | 44-58 | 160～180 |
| EPI/BCB/Si | 125-150 | 180～200 |
| EPI/BCB/ | 270 | 180～220 |
| The EPI/BCB/ sapphire | 35-40 | 100～120 |
| EPI/BCB/ glass | 0.8 | 50～60 |
Table five
| Light emitting diode construction | Benzocyclobutane (BCB) thickness (μ m) | 12mil light-emitting diode saturation current (mA) |
| EPI/BCB/ | 10 | 60～80 |
| 5 | ～120 | |
| 3 | ～140 | |
| 1 | ～180 | |
| 0.5 | ～200 |
Description of drawings
Fig. 1 is a graph of a relation, the thermal conductivity coefficient of display base plate and gluing layer thickness relationship;
Fig. 2 and Fig. 3 are a stereogram, show the epitaxial layer surface smoothness;
Fig. 4 is a schematic diagram, shows a kind of led configurations according to one embodiment of the present invention;
Fig. 5 is a schematic diagram, shows to make in the light-emitting diode program shown in Figure 4 first stromatolithic structure before cohering according to method for making of the present invention;
Fig. 6 is a schematic diagram, shows to make in the light-emitting diode program shown in Figure 4 according to method for making of the present invention, form thickness evenly between 0.1 μ m to the gluing layer method for making between the 1 μ m;
Fig. 7 is a schematic diagram, shows to make in the light-emitting diode program shown in Figure 4 according to method for making of the present invention, after cohering first lamination and high thermal conductivity coefficient second substrate, but does not remove the second preceding stromatolithic structure of first substrate as yet;
Fig. 8 is a schematic diagram, shows to make in the light-emitting diode program shown in Figure 4 according to method for making of the present invention the 3rd lamination structure after removing first substrate;
Fig. 9 is a schematic diagram, shows a kind of led configurations according to another preferred embodiment of the present invention;
Figure 10 is a schematic diagram, shows to make in the light-emitting diode program shown in Figure 9 the 4th stromatolithic structure before cohering according to method for making of the present invention;
Figure 11 is a schematic diagram, shows to make in the light-emitting diode program shown in Figure 9 the 5th stromatolithic structure before cohering according to method for making of the present invention;
Figure 12 is a schematic diagram, shows that method for making of the present invention makes in the light-emitting diode program shown in Figure 9, after cohering the 4th lamination and the 5th lamination, but does not remove the 6th stromatolithic structure before first substrate as yet;
Figure 13 is a schematic diagram, shows that method for making of the present invention makes in the light-emitting diode program shown in Figure 9 the 7th stromatolithic structure after removing first substrate;
Figure 14 is a schematic diagram, shows a kind of led configurations according to the another preferred embodiment of the present invention.
Description of reference numerals
1a light-emitting diode 2a first lamination
The 3a second lamination 4a the 3rd lamination
5a light-emitting diode 6a the 4th lamination
7a the 5th lamination 8a the 6th lamination
9a the 7th lamination 10a light-emitting diode
5 first graphite cakes, 6 second graphite cakes
8 second link electrodes, 9 first link electrodes
10 high thermal conductivity coefficients, second substrate
11 thickness are between the gluing layer of 0.1 μ m to 1 μ m
12 first protective layers, 13 reflector
14 second protective layers, 15 first contact layers
16 first bond courses, 17 luminescent layers
18 second bond courses, 19 second contact layers
20 etch stop layers, 21 first substrates
110 high thermal conductivity coefficients, second substrate, 111 reflector
112 first conversion zones
113 thickness are between the gluing layer of 0.1 μ m to 1 μ m
114 second conversion zones, 115 transparency conducting layers
116 first contact layers, 117 first bond courses
118 luminescent layers, 119 second bond courses
120 second contact layers, 121 first substrates
122 transparency conducting layers
Embodiment
Embodiment 1
See also Fig. 4; the light-emitting diode 1a that has gluing layer according to one embodiment of the present invention; comprise a high thermal conductivity coefficient second substrate 10; be formed at a thickness on this high thermal conductivity coefficient second substrate between the gluing layer 11 of 0.1 μ m to 1 μ m; be formed at one first protective layer 12 on this gluing layer; be formed at the reflector 13 on this first protective layer; be formed at one second protective layer 14 on this reflector; be formed at one first contact layer 15 on this second protective layer; wherein, the upper surface of this first contact layer comprises a first surface zone and a second surface zone; be formed at one first bond course 16 on this first surface zone; be formed at the luminescent layer 17 on this first bond course; be formed at second bond course 18 on this luminescent layer; be formed at one second contact layer 19 on this second bond course; be formed at one first link electrode 9 on this second contact layer; and be formed at one second link electrode 8 on this second surface zone.
See also Fig. 4, Fig. 5, reach Fig. 6, the method for making of light-emitting diode 1a comprises the following step: form an etch stop layer 20, one second contact layer 19, one second bond course 18, a luminescent layer 17, one first bond course 16, one first contact layer 15, one second protective layer 14, a reflector 13, one first protective layer 12 on one first substrate 21 successively, constitute the first lamination 2a, as shown in Figure 5; Select a gluing layer 11, combine with protective layer 12 surfaces and a high thermal conductivity coefficient second substrate 10 first surfaces of this gluing layer this first lamination 2a, put first graphite cake 5, put second graphite cake 6 in first substrate, 21 outsides of this first lamination 2a, as shown in Figure 6 in this high thermal conductivity coefficient second substrate 10 second surfaces outside; Heat in this first graphite cake and this second graphite cake outside a period of time with form a thickness evenly between 0.1 μ m to the gluing layer 11 between the 1 μ m and form one second lamination 3a, as shown in Figure 7; Remove this first substrate and etch stop layer, constitute one the 3rd lamination 4a, as shown in Figure 8; The 3rd lamination 4a suitably is etched to this first contact layer 15, forms one first contact layer, 15 exposed surface area; And on this second contact layer 19 and these first contact layer, 15 exposed surface area, form first link electrode 9 and second link electrode 8 respectively.
See also Fig. 9, has the light-emitting diode 5a that coheres the reflector according to another preferred embodiment of the present invention, comprise a high thermal conductivity coefficient second substrate 110, be formed at the reflector 111 on this high thermal conductivity coefficient second substrate, be formed at one first conversion zone 112 on this reflector, be formed at a thickness on this first conversion zone between the gluing layer 113 of 0.1 μ m to 1 μ m, be formed at this thickness between one second conversion zone 114 of 0.1 μ m to the gluing layer of 1 μ m, be formed at the transparency conducting layer 115 on this second conversion zone, wherein, the upper surface of this transparency conducting layer comprises a first surface zone and a second surface zone, be formed at one first contact layer 116 on this first surface zone, be formed at first bond course 117 on this first contact layer, be formed at the luminescent layer 118 on this first bond course, be formed at second bond course 119 on this luminescent layer, be formed at one second contact layer 120 on this second bond course, be formed at one first link electrode 9 on this second contact layer, and be formed at one second link electrode 8 on this second surface zone.
See also Fig. 9, Figure 10, reach Figure 11, the method for making of light-emitting diode 5a comprises the following step: form one second contact layer 120, one second bond course 119, a luminescent layer 118, one first bond course 117, one first contact layer 116, a transparency conducting layer 115, one second conversion zone 114 on one first substrate 121 successively, constitute one the 4th lamination 6a, as shown in figure 10; On a high thermal conductivity coefficient second substrate 110, form a reflector 111, on this reflector, form one first conversion zone 112, constitute one the 5th lamination 7a, as shown in figure 11; Select a gluing layer 113, with this gluing layer together with second conversion zone 114 surface of the 4th lamination 6a and the 5th lamination 7a first conversion zone 112 surface combination, the process of cohering is with above-mentioned preferred embodiment, as shown in Figure 6, wherein replace lamination 2a, replace 11, replace 10, constitute one the 6th lamination 8a to the gluing layer between the 1 μ m 113 between 0.1 μ m with lamination 7a with thickness with lamination 6a; Remove this first substrate 121, constitute one the 7th lamination 9a, as shown in figure 13; The 7th lamination 9a suitably is etched to this transparency conducting layer 115, forms a transparency conducting layer 115 exposed surface area; And on this second contact layer 120 and these transparency conducting layer 115 exposed surface area, form first link electrode 9 and second link electrode 8 respectively.
See also Figure 14, has the light-emitting diode 10a that coheres the reflector according to the another preferred embodiment of the present invention, its structure is similar to last preferred embodiment light-emitting diode 5a to method for making, and its difference is in and forms a transparency conducting layer 122 on second contact layer 120, to promote CURRENT DISTRIBUTION efficient.
Aforementioned first substrate is to comprise at least a material that is selected from GaAs, Ge and the Sapphire institute constituent material cohort; Aforementioned high thermal conductivity coefficient second substrate comprises and is selected from thermal conductivity coefficient greater than at least a material or other replaceable material in GaP, silicon (Si), SiC, copper chip (Cu) and aluminium chip (Al) the institute constituent material cohort of 100W/mk; Aforementioned gluing layer comprises and is selected from polyimides (PI), benzocyclobutane (BCB) and crosses at least a material in fluorine cyclobutane (PFCB) the institute constituent material cohort, thickness between 0.1 μ m between the 1 μ m; Aforementioned first contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort; Aforementioned first bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlGaInN institute constituent material cohort; Aforementioned light emission layer comprises at least a material that is selected from AlGaInP, InGaP, GaN, AlGaN, InGaN and the AlGaInN institute constituent material cohort; Aforementioned second bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlGaInN institute constituent material cohort; Aforementioned second contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort; Aforementioned reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort; Aforementioned first protective layer comprises at least a material that is selected from silica, silicon dioxide, aluminium oxide, magnesium oxide, zinc oxide, tin oxide, indium oxide and the tin indium oxide institute constituent material cohort; Aforementioned second protective layer comprises at least a material that is selected from silica, silicon dioxide, aluminium oxide, magnesium oxide, zinc oxide, tin oxide, indium oxide and the tin indium oxide institute constituent material cohort; Aforementioned first conversion zone comprises at least a material that is selected from SiNx, Ti and the Cr institute constituent material cohort; Aforementioned second conversion zone comprises at least a material that is selected from SiNx, Ti and the Cr institute constituent material cohort; Aforementioned transparency conducting layer comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide and the zinc-tin oxide institute constituent material cohort.
Above-mentioned only is that scope of the present invention is not limited to these preferred embodiments in order to the preferred embodiment of explanation notion of the present invention, and all changes of doing according to notion of the present invention all belong to the scope of the present patent application patent.
Claims (33)
1. light-emitting diode with gluing layer comprises at least:
One thermal conductivity coefficient is more than or equal to the high heat-radiating substrate of 100W/mk;
One LED lamination; And
One between this high heat-radiating substrate and this LED lamination and thickness between the gluing layer of 0.1 μ m to 1 μ m.
2. light-emitting diode with gluing layer comprises at least:
One thermal conductivity coefficient is more than or equal to the high heat-radiating substrate of 100W/mk;
One reflector is formed on this high heat-radiating substrate;
One first conversion zone is formed on this reflector;
One thickness is between the gluing layer of 0.1 μ m to 1 μ m;
One second conversion zone is formed on this gluing layer; And
One LED lamination is on second conversion zone.
3. the light-emitting diode with gluing layer as claimed in claim 2 wherein, is contained in and forms a transparency conducting layer between this second conversion zone and this LED lamination.
4. the light-emitting diode with gluing layer as claimed in claim 2 wherein, also is contained in this LED lamination top and forms a transparency conducting layer.
5. the light-emitting diode with gluing layer as claimed in claim 1 or 2, wherein, this high heat-radiating substrate comprises and is selected from thermal conductivity coefficient greater than at least a material or other replaceable material in GaP, Si, SiC, Cu and the Al institute constituent material cohort of 100W/mk.
6. the light-emitting diode with gluing layer as claimed in claim 1 or 2, wherein, this gluing layer comprises at least a material that is selected from polyimides (PI), benzocyclobutane (BCB) and mistake fluorine cyclobutane (PFCB) the institute constituent material cohort.
7. as claim 3 or 4 described light-emitting diodes with gluing layer, wherein, this transparency conducting layer comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide and the zinc-tin oxide institute constituent material cohort.
8. the light-emitting diode with gluing layer as claimed in claim 2, wherein, this reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort.
9. the light-emitting diode with gluing layer as claimed in claim 2, wherein, this first conversion zone comprises at least a material that is selected from SiNx, Ti and the Cr institute constituent material cohort.
10. the light-emitting diode with gluing layer as claimed in claim 2, wherein, this second conversion zone comprises at least a material that is selected from SiNx, Ti and the Cr institute constituent material cohort.
11. the light-emitting diode with gluing layer as claimed in claim 1 wherein, is contained in and forms one first protective layer, a reflector between this gluing layer and this LED lamination in regular turn, reaches one second protective layer.
12. the light-emitting diode with gluing layer as claimed in claim 11; wherein, this first protective layer is selected from least a material in silicon nitride, silicon dioxide, aluminium oxide, magnesium oxide, zinc oxide, tin oxide, indium oxide and the tin indium oxide institute constituent material cohort.
13. the light-emitting diode with gluing layer as claimed in claim 11, wherein, this reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort.
14. the light-emitting diode with gluing layer as claimed in claim 11; wherein, this second protective layer is selected from least a material in silicon nitride, silicon dioxide, aluminium oxide, magnesium oxide, zinc oxide, tin oxide, indium oxide and the tin indium oxide institute constituent material cohort.
15. the light-emitting diode with gluing layer as claimed in claim 1 or 2, wherein, this LED lamination comprises:
One first contact layer;
One first bond course is formed on this first contact layer;
One luminescent layer is formed on this first bond course;
One second bond course is formed on this luminescent layer; And
One second contact layer is formed on this second bond course.
16. the light-emitting diode with gluing layer as claimed in claim 15, wherein, this first contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort.
17. the light-emitting diode with gluing layer as claimed in claim 15, wherein, this first bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlGaInN institute constituent material cohort.
18. the light-emitting diode with gluing layer as claimed in claim 15, wherein, this luminescent layer comprises at least a material that is selected from AlGaInP, InGaP, GaN, AlGaN, InGaN and the AlGaInN institute constituent material cohort.
19. the light-emitting diode with gluing layer as claimed in claim 15, wherein, this second bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlGaInN institute constituent material cohort.
20. the light-emitting diode with gluing layer as claimed in claim 15, wherein, this second contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort.
21. the method for making with light-emitting diode of gluing layer comprises the following step at least:
Select one first substrate;
Forming a LED is stacked on this first substrate;
Form one second protective layer on this LED lamination;
Form a reflector on this second protective layer;
Form one first protective layer on this reflector;
Select a thermal conductivity coefficient more than or equal to the height of 100W/mk second substrate that dispels the heat; And
Utilize a thickness to the gluing layer of 1 μ m this thermal conductivity coefficient to be combined more than or equal to dispel the heat second substrate and this first protective layer of the height of 100W/mk between 0.1 μ m.
22. the method for making with light-emitting diode of gluing layer comprises the following step at least:
Select one first substrate;
Forming a LED is stacked on this first substrate;
Form one second conversion zone on this LED lamination;
Select a thermal conductivity coefficient more than or equal to the height of 100W/mk second substrate that dispels the heat;
Form a reflector on this height dispels the heat second substrate;
Form one first conversion zone on this reflector; And
Utilize a thickness to the gluing layer of 1 μ m this first conversion zone and this second conversion zone to be combined between 0.1 μ m.
23. as claim 21 or 22 described method for makings with light-emitting diode of gluing layer, wherein, this thickness comprises the following step between the method for making of 0.1 μ m to the gluing layer of 1 μ m:
Select one first graphite cake;
On graphite cake, put with gluing layer with this thermal conductivity coefficient more than or equal to the height of 100W/mk dispel the heat second substrate and this first protective layer combination lamination or put with the lamination of gluing layer this first conversion zone and this second conversion zone combination;
Select one second graphite cake to be placed in above-mentioned lamination top; And
Above first graphite cake below and second graphite cake, heat pressurization a period of time.
24. as claim 21 or 22 described method for makings with light-emitting diode of gluing layer, wherein, this first substrate comprises at least a material that is selected from GaAs, Ge and the sapphire institute constituent material cohort.
25. as claim 21 or 22 described method for makings with light-emitting diode of gluing layer, wherein, this height second substrate that dispels the heat comprises and is selected from thermal conductivity coefficient greater than at least a material or other replaceable material in GaP, Si, SiC, Cu and the Al institute constituent material cohort of 100W/mk.
26. as claim 21 or 22 described method for makings with light-emitting diode of gluing layer, wherein, this reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort.
27. as claim 21 or 22 described method for makings with light-emitting diode of gluing layer, wherein, this gluing layer comprises at least a material that is selected from polyimides (PI), benzocyclobutane (BCB) and mistake fluorine cyclobutane (PFCB) the institute constituent material cohort.
28. the method for making with light-emitting diode of gluing layer as claimed in claim 21; wherein, this first protective layer is selected from least a material in silicon nitride, silicon dioxide, aluminium oxide, magnesium oxide, zinc oxide, tin oxide, indium oxide and the tin indium oxide institute constituent material cohort.
29. the method for making with light-emitting diode of gluing layer as claimed in claim 21; wherein, this second protective layer is selected from least a material in silicon nitride, silicon dioxide, aluminium oxide, magnesium oxide, zinc oxide, tin oxide, indium oxide and the tin indium oxide institute constituent material cohort.
30. the method for making with light-emitting diode of gluing layer as claimed in claim 22 wherein, is contained in and forms a transparency conducting layer between this second conversion zone and this LED lamination.
31. the method for making with light-emitting diode of gluing layer as claimed in claim 30, wherein, this transparency conducting layer comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide and the zinc-tin oxide institute constituent material cohort.
32. the method for making with light-emitting diode of gluing layer as claimed in claim 21, wherein, this first conversion zone comprises at least a material that is selected from SiNx, Ti and the Cr institute constituent material cohort.
33. the method for making with light-emitting diode of gluing layer as claimed in claim 21, wherein, this second conversion zone comprises at least a material that is selected from SiNx, Ti and the Cr institute constituent material cohort.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101783377B (en) * | 2009-01-20 | 2011-09-28 | 晶元光电股份有限公司 | Grain grade packaging structure of light-emitting diode |
| CN103765616A (en) * | 2011-08-31 | 2014-04-30 | 奥斯兰姆奥普托半导体有限责任公司 | Light-emitting diode chip |
| CN104617086A (en) * | 2015-02-06 | 2015-05-13 | 扬州乾照光电有限公司 | Parallel structural integrated LED chip and production method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3785820B2 (en) * | 1998-08-03 | 2006-06-14 | 豊田合成株式会社 | Light emitting device |
| TW550834B (en) * | 2002-02-15 | 2003-09-01 | United Epitaxy Co Ltd | Light emitting diode and its manufacturing method |
| JP3620498B2 (en) * | 2001-12-07 | 2005-02-16 | 日亜化学工業株式会社 | Nitride semiconductor laser device |
| TWI239606B (en) * | 2002-11-07 | 2005-09-11 | Kobe Steel Ltd | Heat spreader and semiconductor device and package using the same |
| CN1266779C (en) * | 2003-01-10 | 2006-07-26 | 晶元光电股份有限公司 | Light-emitting diode with adhered reflecting layer and its making method |
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2004
- 2004-08-02 CN CNB2004100556536A patent/CN100373640C/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101783377B (en) * | 2009-01-20 | 2011-09-28 | 晶元光电股份有限公司 | Grain grade packaging structure of light-emitting diode |
| CN103765616A (en) * | 2011-08-31 | 2014-04-30 | 奥斯兰姆奥普托半导体有限责任公司 | Light-emitting diode chip |
| US9577165B2 (en) | 2011-08-31 | 2017-02-21 | Osram Opto Semiconductor Gmbh | Light emitting diode chip |
| US10043958B2 (en) | 2011-08-31 | 2018-08-07 | Osram Opto Semiconductors Gmbh | Light emitting diode chip |
| CN104617086A (en) * | 2015-02-06 | 2015-05-13 | 扬州乾照光电有限公司 | Parallel structural integrated LED chip and production method thereof |
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| CN100373640C (en) | 2008-03-05 |
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