CN1730693A - Sn-Zn-Cr alloy lead-free solder preparation method - Google Patents
Sn-Zn-Cr alloy lead-free solder preparation method Download PDFInfo
- Publication number
- CN1730693A CN1730693A CN 200510028446 CN200510028446A CN1730693A CN 1730693 A CN1730693 A CN 1730693A CN 200510028446 CN200510028446 CN 200510028446 CN 200510028446 A CN200510028446 A CN 200510028446A CN 1730693 A CN1730693 A CN 1730693A
- Authority
- CN
- China
- Prior art keywords
- preparation
- alloy
- alloy lead
- free solder
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Powder Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Disclosed is a Sn-Zn-Cr alloy lead-free solder preparation method which comprises, (1) preparation of Sn-Cr intermediate alloy, which consists of mixing Cr 0.005-1.5%, Zn 3-12%, and balancing Sn, elevating temperature to above the fusion point of the metal Cr, melting and thermally insulating, fully stirring, charging the residue Sn raw material into the furnace, waiting for dissolution, cooling down, thermally insulating, continuing stirring simultaneously, (2) smelting of Sn-Zn-Cr alloy, which consists of charging the Zn raw material into melting Sn-Cr intermediate alloy, waiting for complete dissolution, fully stirring, thermally insulating, cooling down, thermally insulating while agitating continuously, finally cooling down to room temperature or casting as requirement.
Description
Technical field
That the present invention relates to is a kind of preparation method of welding technology field, specifically, is a kind of preparation method of Sn-Zn-Cr alloy lead-free solder.
Background technology
At present, the lead-free solder that can use mainly contains Sn-Ag system and Sn-Zn is or the ternary or the quad alloy welding flux alloy scolder that derive from as base with these two kinds of alloys, as Sn-Ag-Cu, Sn-Zn-Bi etc.But Sn-Ag is a scolder with traditional leaded Sn-Pb is that scolder is compared, and fusing point exceeds nearly 40 ℃, and price improves 2 times, and with the poor compatibility of existing installation, technology, exist many shortcomings that self are difficult to overcome.In contrast to this, the Sn-Zn series lead-free solder, because its fusing point is a scolder near Sn-Pb, can compatible existing processes, equipment, and high strength, aboundresources, lower-price characteristic and get most of the attention, but since this to be Zn element reaction activity in the scolder bigger, selective oxidation easily takes place, make the Sn-Zn series lead-free solder have problems such as easy oxidation, corrosion-resistant, and then influenced the wettability and the work-ing life of this kind scolder, application is restricted.
Through the retrieval of existing document is also found, Ren Xiaoxue, Li Ming, hair stands in " alloying element is to the influence of Sn-Zn base leadless solder high-temperature oxidation resistance " (electronic devices and components and material greatly, Vol.23, No.11,2004, P40-44) reported once in the literary composition that the Cr element that adds 0.24 quality % in the Sn-9Zn alloy can improve the oxidation-resistance of this series lead-free solder.But the Sn-Zn-Cr preparation method who mentions in this article has adopted to add Cr metal, the preparation method of melting in 800 ℃ of protective atmospheres in the Sn-Zn alloy.Because Cr is a refractory metal, 800 ℃ of following meltings,, also be difficult to dissolve fully even use the Cr powder, be difficult for obtaining to form uniform alloy.And the Cr powder is when too tiny, very easily oxidation, and oxidation in a large number before the melting, purity is very poor.Therefore adopt this method, only can be used as research purpose, in actual industrial production, can't adopt.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art part, a kind of preparation method of Sn-Zn-Cr alloy lead-free solder is provided, make the chemical constitution and the metallographic structure of its scolder more even, can bring into play the good characteristic of Sn-Zn-Cr solder to greatest extent.
The present invention is achieved by the following technical solutions, the present invention includes following steps:
(1) preparation of master alloy Sn-Cr
1. be 0.005-1.5% according to Cr, Zn is 3-12%, surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn earlier takes by weighing bulk, granular or powdered pure Metal Cr and Sn respectively, and at room temperature, carries out thorough mixing with whole Cr raw materials with the Sn raw material of Cr raw material equivalent weight.
2. in vacuum or have under argon gas, the hydrogen shield atmospheric condition, temperature is risen to more than the fusing point of Metal Cr, promptly be controlled in the 1857-2100 ℃ of scope, fusing back insulation 30 minutes, and fully stir.This method adopts in vacuum or melting under argon gas, the hydrogen shield atmospheric condition is arranged, and its objective is more effectively to prevent the oxidization burning loss of metal in fusion process.
3. remaining Sn raw material is added in the stove, after waiting to dissolve, is cooled to 800 ℃, be incubated 60 minutes, continue simultaneously to stir.Arrive this, melting is finished in the middle of the Sn-Cr, can carry out the melting of next step final alloy.
(2) Sn-Zn-Cr alloy melting
1. be 0.005-1.5% according to above-mentioned Cr, Zn is 3-12%, and surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn takes by weighing bulk, granular or powdered pure Metal Zn respectively.Above-mentioned Zn raw material is put into 800 ℃ of fused Sn-Cr master alloys, treat fully to stir after the off-bottom, and be incubated 30 minutes.
2. temperature is reduced to 250 ℃, under continuous agitation condition, is incubated 2 hours.The purpose of this step is further to make the chemical constitution of material and metallographic structure more even.Because at high temperature the volatilization of Zn is very fast,, finish this step at low temperatures so after waiting formation quaternary low melting point alloy, should reduce temperature as far as possible.
3. be cooled to room temperature or be cast into as required and decide.
Why the present invention selects for use the Sn-Cr alloy to prepare the Sn-Zn-Cr solder as master alloy is because the fusing point of Zn is about 420 ℃, but boiling point has only 907 ℃, and the fusing point of Cr is up to 1857 ℃, the boiling point that is higher than Zn far away, at high temperature do not wait Cr to dissolve, Zn has become gaseous state, is difficult to make the Zn-Cr master alloy.If produce the Sn-Zn master alloy, add Cr equally after because the existence of Zn, can't reach the temperature of fusion of Cr, be difficult to obtain uniform Sn-Zn-Cr alloy.In contrast to this, though the fusing point of Sn has only 231 ℃, its boiling point exceeds the fusing point of Cr far away up to 2603 ℃, when producing the Sn-Cr master alloy, even smelting temperature surpasses the fusing point of Cr, the phenomenon of a large amount of gasifications of Sn can not take place yet.Therefore, the method for taking the Sn-Cr master alloy to prepare the Sn-Zn-Cr solder is a kind of selection of the best.
By the Sn-Zn-Cr alloy lead-free solder of the present invention's preparation, its chemical constitution and metallographic structure are even, can bring into play the good characteristic of Sn-Zn-Cr alloy lead-free solder to greatest extent.The present invention is by adding a spot of Cr element in the Sn-Zn alloy, the Zn element in Cr and the scolder forms stable Zn
13Cr, Zn
7The Cr phase, to reduce the chemical reactivity of Zn, the disperse of these intermetallic compounds in alloy simultaneously exists, can stop the generation of thick foliated lamellar Zn eutectic phase again, form fine grained texture, make scolder when keeping the original low melting point of Sn-Zn alloy, good tensile strength, overcome the shortcoming that former Sn-Zn solder is difficult to overcome self, make oxidation-resistance, erosion resistance improve 1 to twice, ductility raising 5-50%, wetting time shortens to 1-4 second by average 8 seconds of Sn-Zn solder, shows good wettability.
Embodiment
Embodiment 1
The component of material of the present invention and mass percent thereof are: Cr is 0.005%, and Zn is 3%, and surplus is Sn.
(1) preparation of master alloy Sn-Cr
1. be 0.005% according to Cr, Zn is 3%, surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn earlier takes by weighing bulk, granular or powdered pure Metal Cr and Sn respectively, and at room temperature, carries out thorough mixing with whole Cr raw materials with the Sn raw material of Cr raw material equivalent weight.
2. under the hydrogen shield atmospheric condition, temperature is risen to more than the fusing point of Metal Cr, promptly be controlled in 1857 ℃ of scopes, fusing back insulation 30 minutes, and fully stir.This method adopts in vacuum or melting under the protective atmosphere condition such as argon gas is arranged, and its objective is more effectively to prevent the oxidization burning loss of metal in fusion process.
3. remaining Sn raw material is added in the stove, after waiting to dissolve, is cooled to 800 ℃, be incubated 60 minutes, continue simultaneously to stir.Arrive this, melting is finished in the middle of the Sn-Cr, can carry out the melting of next step final alloy.
(2) Sn-Zn-Cr alloy melting
1. be 0.005% according to above-mentioned Cr, Zn is 3%, and surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn takes by weighing bulk, granular or powdered pure Metal Zn respectively.Above-mentioned Zn raw material is put into 800 ℃ of fused Sn-Cr master alloys, treat fully to stir after the off-bottom, and be incubated 30 minutes.
2. temperature is reduced to 250 ℃, under continuous agitation condition, is incubated 2 hours.
3. be cooled to room temperature or be cast into as required and decide.
Implementation result: observe and the ICP chemical composition analysis through metallographic structure: the metallographic structure of gained solder is even, the chemical constitution unanimity of the upper, middle and lower of ingot casting, and identical with the batching composition substantially, various performances satisfy the scolder requirement.
Embodiment 2
The component of material of the present invention and mass percent thereof are: Cr is 0.75%, and Zn is 9%, and surplus is Sn.
(1) preparation of master alloy Sn-Cr
1. be 0.75% according to Cr, Zn is 9%, surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn earlier takes by weighing bulk, granular or powdered pure Metal Cr and Sn respectively, and at room temperature, carries out thorough mixing with whole Cr raw materials with the Sn raw material of Cr raw material equivalent weight.
2. under the argon shield atmospheric condition, temperature is risen to more than the fusing point of Metal Cr, promptly be controlled in 2100 ℃ of scopes, fusing back insulation 30 minutes, and fully stir.This method adopts in vacuum or melting under the protective atmosphere condition such as argon gas is arranged, and its objective is more effectively to prevent the oxidization burning loss of metal in fusion process.
3. remaining Sn raw material is added in the stove, after waiting to dissolve, is cooled to 800 ℃, be incubated 60 minutes, continue simultaneously to stir.Arrive this, melting is finished in the middle of the Sn-Cr, can carry out the melting of next step final alloy.
(2) Sn-Zn-Cr alloy melting
1. be 0.75% according to above-mentioned Cr, Zn is 9%, and surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn takes by weighing bulk, granular or powdered pure Metal Zn respectively.Above-mentioned Zn raw material is put into 800 ℃ of fused Sn-Cr master alloys, treat fully to stir after the off-bottom, and be incubated 30 minutes.
2. temperature is reduced to 250 ℃, under continuous agitation condition, is incubated 2 hours.
3. be cooled to room temperature or be cast into as required and decide.
Implementation result: observe and the ICP chemical composition analysis through metallographic structure: the metallographic structure of gained solder is even, the chemical constitution unanimity of the upper, middle and lower of ingot casting, and identical with the batching composition substantially, various performances satisfy the scolder requirement.
Embodiment 3
The component of material of the present invention and mass percent thereof are: Cr is 1.5%, and Zn is 12%, and surplus is Sn.
(1) preparation of master alloy Sn-Cr
1. be 1.5% according to Cr, Zn is 12%, surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn earlier takes by weighing bulk, granular or powdered pure Metal Cr and Sn respectively, and at room temperature, carries out thorough mixing with whole Cr raw materials with the Sn raw material of Cr raw material equivalent weight.
2. under vacuum condition, temperature is risen to more than the fusing point of Metal Cr, promptly be controlled in 1957 ℃ of scopes, fusing back insulation 30 minutes, and fully stir.This method adopts in vacuum or melting under the protective atmosphere condition such as argon gas is arranged, and its objective is more effectively to prevent the oxidization burning loss of metal in fusion process.
3. remaining Sn raw material is added in the stove, after waiting to dissolve, is cooled to 800 ℃, be incubated 60 minutes, continue simultaneously to stir.Arrive this, melting is finished in the middle of the Sn-Cr, can carry out the melting of next step final alloy.
(2) Sn-Zn-Cr alloy melting
1. be 1.5% according to above-mentioned Cr, Zn is 12%, and surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn takes by weighing bulk, granular or powdered pure Metal Zn respectively.Above-mentioned Zn raw material is put into 800 ℃ of fused Sn-Cr master alloys, treat fully to stir after the off-bottom, and be incubated 30 minutes.
2. temperature is reduced to 250 ℃, under continuous agitation condition, is incubated 2 hours.
3. be cooled to room temperature or be cast into as required and decide.
Implementation result: observe and the ICP chemical composition analysis through metallographic structure: the metallographic structure of gained solder is even, the chemical constitution unanimity of the upper, middle and lower of ingot casting, and identical with the batching composition substantially, various performances satisfy the scolder requirement.
Embodiment 4
The component of material of the present invention and mass percent thereof are: Cr is 0.15%, and Zn is 9%, and surplus is Sn.
(1) preparation of master alloy Sn-Cr
1. be 0.15% according to Cr, Zn is 9%, surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn earlier takes by weighing bulk, granular or powdered pure Metal Cr and Sn respectively, and at room temperature, carries out thorough mixing with whole Cr raw materials with the Sn raw material of Cr raw material equivalent weight.
2. under vacuum condition, temperature is risen to more than the fusing point of Metal Cr, promptly be controlled in 2100 ℃ of scopes, fusing back insulation 30 minutes, and fully stir.This method adopts in vacuum or melting under the protective atmosphere condition such as argon gas is arranged, and its objective is more effectively to prevent the oxidization burning loss of metal in fusion process.
3. remaining Sn raw material is added in the stove, after waiting to dissolve, is cooled to 800 ℃, be incubated 60 minutes, continue simultaneously to stir.Arrive this, melting is finished in the middle of the Sn-Cr, can carry out the melting of next step final alloy.
(2) Sn-Zn-Cr alloy melting
1. be 0.15% according to above-mentioned Cr, Zn is 9%, and surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn takes by weighing bulk, granular or powdered pure Metal Zn respectively.Above-mentioned Zn raw material is put into 800 ℃ of fused Sn-Cr master alloys, treat fully to stir after the off-bottom, and be incubated 30 minutes.
2. temperature is reduced to 250 ℃, under continuous agitation condition, is incubated 2 hours.
3. be cooled to room temperature or be cast into as required and decide.
Implementation result: observe and the ICP chemical composition analysis through metallographic structure: the metallographic structure of gained solder is even, the chemical constitution unanimity of the upper, middle and lower of ingot casting, and identical with the batching composition substantially, various performances satisfy the scolder requirement.
Claims (10)
1. the preparation method of a Sn-Zn-Cr alloy lead-free solder is characterized in that, may further comprise the steps:
(1) preparation of master alloy Sn-Cr
1. be 0.005-1.5% according to Cr, Zn is 3-12%, surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn earlier takes by weighing bulk, granular or powdered pure Metal Cr and Sn respectively, and at room temperature, carries out thorough mixing with whole Cr raw materials with the Sn raw material of Cr raw material equivalent weight;
2. in vacuum or have under the protective atmosphere condition, temperature is risen to more than the fusing point of Metal Cr, the insulation of fusing back, and fully stir;
3. remaining Sn raw material is added in the stove, after waiting to dissolve, cooling, insulation continues to stir simultaneously;
(2) Sn-Zn-Cr alloy melting
1. be 0.005-1.5% according to above-mentioned Cr, Zn is 3-12%, and surplus is that the composition requirement of the Sn-Zn-Cr solder of Sn takes by weighing bulk, granular or powdered pure Metal Zn respectively, and above-mentioned Zn raw material is put into fused Sn-Cr master alloy, treat fully to stir after the off-bottom, and insulation;
2. cooling, under continuous agitation condition, insulation;
3. be cooled to room temperature or be cast into as required and decide.
2. the preparation method of Sn-Zn-Cr alloy lead-free solder according to claim 1 is characterized in that, described temperature rises to more than the fusing point of Metal Cr, is meant: be controlled in the 1857-2100 ℃ of scope.
3. the preparation method of Sn-Zn-Cr alloy lead-free solder according to claim 1 is characterized in that, the step in the described step (1) 2. is incubated 30 minutes.
4. the preparation method of Sn-Zn-Cr alloy lead-free solder according to claim 1 is characterized in that, the step in the described step (1) 3., cooling is 800 ℃.
5. according to the preparation method of claim 1 or 4 described Sn-Zn-Cr alloy lead-free solders, it is characterized in that, the step in the described step (1) 3., insulation is 60 minutes.
6. the preparation method of Sn-Zn-Cr alloy lead-free solder according to claim 1 is characterized in that, the step in the described step (2) 1., melt temperature is 800 ℃.
7. according to the preparation method of claim 1 or 6 described Sn-Zn-Cr alloy lead-free solders, it is characterized in that, the step in the described step (2) 1., insulation is 30 minutes.
8. the preparation method of Sn-Zn-Cr alloy lead-free solder according to claim 1 is characterized in that, the step in the described step (2) 2., cooling is 250 ℃.
9. according to the preparation method of claim 1 or 8 described Sn-Zn-Cr alloy lead-free solders, it is characterized in that, the step in the described step (2) 2., insulation is 2 hours.
10. the preparation method of Sn-Zn-Cr alloy lead-free solder according to claim 1 is characterized in that, described protective atmosphere is argon gas, hydrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100284466A CN100387741C (en) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr alloy lead-free solder preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100284466A CN100387741C (en) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr alloy lead-free solder preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1730693A true CN1730693A (en) | 2006-02-08 |
| CN100387741C CN100387741C (en) | 2008-05-14 |
Family
ID=35963114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100284466A Expired - Fee Related CN100387741C (en) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr alloy lead-free solder preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100387741C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100510181C (en) * | 2007-05-17 | 2009-07-08 | 戴国水 | Metal spraying material of tin, zinc, cupper, and chrome without lead |
| CN101985959A (en) * | 2010-10-27 | 2011-03-16 | 江苏迪邦三星轴承有限公司 | Novel bearing retainer and manufacturing method thereof |
| CN106676321A (en) * | 2016-12-07 | 2017-05-17 | 北京态金科技有限公司 | Low-melting-point metal and preparation method and application thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103789569B (en) * | 2014-02-13 | 2016-02-10 | 江苏迪邦三星轴承有限公司 | Bearing holder material and manufacture method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
| CN1175956C (en) * | 2002-05-10 | 2004-11-17 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| CN1555960A (en) * | 2004-01-10 | 2004-12-22 | 大连理工大学 | Tin zinc copper leadless solder alloy |
-
2005
- 2005-08-04 CN CNB2005100284466A patent/CN100387741C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100510181C (en) * | 2007-05-17 | 2009-07-08 | 戴国水 | Metal spraying material of tin, zinc, cupper, and chrome without lead |
| CN101985959A (en) * | 2010-10-27 | 2011-03-16 | 江苏迪邦三星轴承有限公司 | Novel bearing retainer and manufacturing method thereof |
| CN106676321A (en) * | 2016-12-07 | 2017-05-17 | 北京态金科技有限公司 | Low-melting-point metal and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100387741C (en) | 2008-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100335666C (en) | High-strength cast Mg alloy containing rare-earth and preparing process thereof | |
| CN101380700B (en) | Tin bismuth cuprum series leadless solder and preparation method thereof | |
| CN101780607B (en) | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof | |
| WO2011035652A1 (en) | High-strength heat-proof aluminum alloy material containing lithium and rare earth and producing method thereof | |
| CN101643871B (en) | Super-high-plasticity high-strength cast magnesium alloy and preparation method thereof | |
| CN108385006A (en) | High-strength anti-flaming diecast magnesium alloy and preparation method thereof | |
| CN101928845A (en) | Preparation method of lithium-contained alloy material | |
| CN112518170A (en) | Al-Cu alloy wire for additive manufacturing and preparation method and application thereof | |
| CN101050127A (en) | High temperature solder in use for braze welding ceramics of silicon nitride and composite materials based on ceramics of silicon nitride | |
| CN1730693A (en) | Sn-Zn-Cr alloy lead-free solder preparation method | |
| CN1730694A (en) | Sn-Zn-Bi-Cr alloy lead-free solder preparation method | |
| CN115430949B (en) | Five-membered eutectic high-toughness low-Wen Xibi-series solder and preparation method thereof | |
| CN107400813A (en) | Mg Li Si magnesium lithium alloys and its processing technology with anti-flammability | |
| CN1730695A (en) | Sn-Ag-Cu-Cr alloy lead-free solder preparation method | |
| CN101067177A (en) | High performance deformed magnesium alloy | |
| CN1169988C (en) | Low cost heat-resistant magnesium alloy | |
| CN109161767A (en) | A kind of creep-resistant property magnesium alloy of the phase containing W and preparation method thereof | |
| CN115418535A (en) | Aluminum alloy material, preparation method and application thereof, and aluminum alloy product | |
| CN100478115C (en) | Lead-free solder | |
| CN1128037C (en) | Rare earth contained tin base lead-less solder and its preparation method | |
| CN112894195A (en) | Low-silver lead-free solder alloy for brazing and preparation method thereof | |
| CN101058133A (en) | SnAgCuNi series leadless soldering tin alloy | |
| CN109763040A (en) | A kind of aluminum alloy materials and its method of preparation | |
| CN115781100B (en) | Magnesium alloy welding wire and preparation method and application thereof | |
| CN109943751A (en) | A kind of low-temperature lead-free solder and its gravity casting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shanghai Xinyang Semiconductor Material Co., Ltd. Assignor: Shanghai Jiao Tong University Contract fulfillment period: 2008.6.28 to 2013.6.27 contract change Contract record no.: 2009310000170 Denomination of invention: Method for preparing Sn-Zn-Cr alloy leadless solder Granted publication date: 20080514 License type: Exclusive license Record date: 2009.8.19 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.6.28 TO 2013.6.27; CHANGE OF CONTRACT Name of requester: SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD Effective date: 20090819 |
|
| EM01 | Change of recordation of patent licensing contract |
Change date: 20100915 Contract record no.: 2009310000170 Assignee after: Shanghai Xinyang Semiconductor Material Co., Ltd. Assignee before: Shanghai Xinyang Semiconductor Material Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080514 Termination date: 20130804 |