CN109943751A - A kind of low-temperature lead-free solder and its gravity casting method - Google Patents
A kind of low-temperature lead-free solder and its gravity casting method Download PDFInfo
- Publication number
- CN109943751A CN109943751A CN201910288417.5A CN201910288417A CN109943751A CN 109943751 A CN109943751 A CN 109943751A CN 201910288417 A CN201910288417 A CN 201910288417A CN 109943751 A CN109943751 A CN 109943751A
- Authority
- CN
- China
- Prior art keywords
- free solder
- low temperature
- alloy
- solder alloy
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The present invention provides a kind of low-temperature lead-free solder and its gravity casting methods, the alloy is made by the constituent of following mass percent: Zn7% ~ 11%, Bi 4.5% ~ 10%, In 2% ~ 8%, Ag 0.1% ~ 1.5%, Cu 0.05% ~ 0.5%, M 0.01% ~ 2%, raw metal total weight 0.1 ~ 0.5% refining agent, surplus is Sn and inevitable impurity, wherein, the mass percent of Sn is at least one of RE or Ni, Al, Ga, Ge element not less than 67%, M；Low-temperature alloy solder produced by the present invention has excellent wettability and good mechanical property, the reliability of solder joint is all improved, and it is low in cost, it can be applied to the welding of the unsuitable high electronic component of heating temperature, meet the needs of electronic product lightening development.
Description
Technical field
The present invention relates to a kind of high-intensitive, high-reliability lead-free solder alloy and its gravitational casting preparation methods, belong to electricity
Sub- product connecting material field.
Background technique
With the continuous development and innovation of electronic manufacturing technology, electronic product is more and more small to more and more frivolous
Trend development.It is short and small due to substrate, cause spot pitch more and more narrow, the requirement to Electronic Encapsulating Technology also just gradually mentions
Height, the reliability of solder joint seem most important, and people also more pay close attention to high performance Electronic Encapsulating Technology.It is produced in manufacture electronics
During product, the method for connecting component and substrate is exactly to be brazed, and the quality of soldering directly affects the good of welding quality
It is bad, it is a highly important link.But lead and its compound be it is toxic, the health of environment and the mankind can be caused to damage
It is bad, therefore various countries make laws limit the use of lead one after another, promote the unleaded development of electronic product.
Although Sn-Zn series lead-free solder Japan oneself through there is many companies to start development & production, in other states
Family, Sn-Zn series lead-free solder is rarely used, very easy to oxidize because Sn-Zn series lead-free solder is due to the activity of Zn,
Worsened wettability can not only be made, also result in soldering reliability decline, while after being made into soldering paste, being difficult to be saved.Middle promulgated by the State Council
Bright patent CN106041353A discloses a kind of Sn-Zn-Bi series lead-free solder alloy and preparation method thereof.Its method is will to weigh up
Sn be put into smelting furnace, and be passed through high pure nitrogen, the elements such as Zn, Bi be added after Sn is completely melt.The alloy of this method preparation
Ingredient is Zn:6-8%, Bi:1-3%, Ti:0.2-1%, Al:0.02-0.15%, B:0.001-0.005%, remaining is Sn.Middle promulgated by the State Council
Bright patent CN105436738A discloses a kind of low-temperature solder alloy and its preparation method and application.Its method is to weigh in proportion
Sn, Mg, Zn, Al, Cu elemental materials carry out mixing, then carry out melting under vacuum conditions.The alloy composition of this method preparation
Are as follows: Sn:75-80%, Mg:2.3-5.8%, Zn:16.6-20%, Al:0.6-3.5%, Cu:0.1-0.3%.Above-mentioned two patent is adopted
Method can reduce oxidation of the alloy in fusion process, improve the performance of solder, but whether be protected using inert gas
Shield or vacuum melting can all be such that equipment cost increases, and increase technology difficulty.Therefore the development and popularization of Sn-Zn series lead-free solder
Further effort is also needed, a inexpensive, high reliability solder of exploitation, which is that the art is urgently to be resolved, asks
Topic.
Summary of the invention
For the defects in the prior art, the present invention provides a kind of high-intensitive, high reliability low temperature leadless welding alloy, with
It solves the above problems.
The present invention is achieved by the following technical solutions:
The present invention provides a kind of high-intensitive, high reliability low temperature leadless welding alloys, by forming for following mass percent
Object is made: Zn7% ~ 11%, Bi 4.5% ~ 10%, In 2% ~ 8%, Ag 0.1% ~ 1.5%, Cu 0.05% ~ 0.5%, M 0.01% ~ 2%, gold
Belong to the refining agent of raw material gross weight 0.1 ~ 0.5%, surplus is Sn and inevitable impurity, wherein the mass percent of Sn is not low
In 67%, M be at least one of RE or Ni, Al, Ga, Ge element.
RE is selected from least one of Gd, La, Y, Ce.
Based on all total compositions in low temperature lead-free solder alloy, the mass fraction of Ni is 0 ~ 0.5%, Al's
The mass fraction that the mass fraction that mass fraction is 0 ~ 0.5%, Ga is 0 ~ 0.5%, Ge is 0 ~ 0.5%.
The refining agent constituent and mass percent be calcium carbonate be 50 ~ 70 %, sodium chloride be 10 ~ 30 %, potassium chloride
It is 10 ~ 30%.
Another object of the present invention there is provided above-mentioned high-intensitive, high reliability low temperature leadless welding alloy preparation method,
It includes the following steps:
(1) after Sn, Zn, Bi, In, Ag, Cu, M being removed removing oxide layer, drying is preheated to 40 DEG C；
(2) after taking a part of Sn to be first fused into molten bath at 240 ~ 250 DEG C, remaining Sn is added；
(3) after Sn all fusing, 270 DEG C are warming up to, Bi, In, Ag, Cu, M are divided respectively in 2 ~ 4 Sn that fusing is added,
Between maintain the temperature at 250 ~ 270 DEG C, after being all added to all alloys 270 DEG C keep the temperature 5 ~ 10 minutes；To all alloy members
Zn is added in element when melt temperature being maintained at 275 DEG C after all melting, after stirring is dissolved, refining is added at 260 ~ 270 DEG C
Agent is stirred refining, stands 10 ~ 20 minutes after refining, skims surface scum at 270 DEG C, obtain molten tin alloy；At 270 DEG C
Under to the molten tin alloy carry out gravitational casting, obtain lead-free solder tin alloy casting.
The Sn first melted in the step (2) accounts for the 20 ~ 40% of Sn gross mass.
The temperature of the stirring refining is no more than 270 DEG C, and mixing time is no more than 10min.
The gravitational casting is to be poured into molten tin alloy at 270 DEG C to be preheated to 100 ~ 120 DEG C of metal type dies
In, natural cooling in air.
The present invention mainly improves tin-base alloy solder by improvement solder smelt surface tension and raising easily oxidizable
Wetability it is bad the problems such as, the addition of bismuth additions reduces the surface tension of the melt of tin-base alloy solder containing zinc, simultaneously
The addition of alloying element In and trace rare-earth element can also promote the wetability of solder alloy, furthermore micro- conjunction such as Cu, Ni, Al, Ga
The addition of gold element also ensures the reliability with excellent mechanical property and solder joint of alloy, in gravitational casting production process
In, huge process equipment is not needed, complex-shaped part can be poured into, metal is saved, reduce cost and reduces work
When etc., the market competitiveness of new solder alloy is improved, is suitble to be generalized in scale industrial production.
Compared with prior art, the present invention have it is following the utility model has the advantages that
1, alloy raw material is pure metal, from a wealth of sources, (infiltration that can effectively prevent objectionable impurities elements) whole preparation process
Free from admixture element penetrates into, and the low temperature lead-free solder alloy impurity content of preparation is extremely low；
2, the use of refining agent can effectively remove impurity component oxidizable in alloy in casting process, and effectively improve low temperature
The mechanical property of leadless welding alloy；
3, suitable RE is the effective element for improving solder wettability, and these elements can improve solder inoxidizability.It is dilute simultaneously
The elements such as Sn, Al in soil and alloy form rare earth compound, can be obviously improved the mechanical property of alloy；
4, the alloy material of this method preparation has high tensile strength, yield strength and high elongation percentage, and the profit having had
The features such as moist and inoxidizability, while the solder joint microstructure of postwelding is uniform, has preferable heat fatigue and croop property, and
And it is low in cost, it can be applied to the welding of the unsuitable high electronic component of heating temperature, meet the lightening development of electronic product
Demand.
Detailed description of the invention
Fig. 1 is that low-temperature solder alloy as-cast metallographic structure figure is prepared in embodiment 1；
Fig. 2 is that low-temperature solder alloy as-cast metallographic structure figure is prepared in embodiment 2；
Fig. 3 is that low-temperature solder alloy as-cast metallographic structure figure is prepared in embodiment 3.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.Following embodiment will be helpful to the technology of this field
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill of this field
For personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made.These belong to the present invention
Protection scope.
Embodiment 1: this high intensity, high reliability low temperature leadless welding alloy by following mass percent constituent system
: Zn9%, Bi 7%, In5%, Ag 0.8%, Cu 0.3%, 0.3 %, Al 0.3% of Ni, Ga 0.3%, Ge 0.3%, raw metal
The refining agent (calcium carbonate 50%, sodium chloride are 30 %, potassium chloride 20%) of total weight 0.2%, surplus is for Sn and inevitably
Impurity；
The preparation method of above-mentioned low temperature lead-free solder alloy be (1) by industrial pure tin (Sn:99.95wt%), technical pure bismuth (Bi:
99.95wt%) 320 mesh sand paper are used respectively with industrial-purity zinc (Zn:99.9wt%) and indium, silver, copper, nickel, aluminium, germanium, gallium metal
Removing oxide layer is removed in polishing, is respectively put into air dry oven (40 DEG C) and carries out drying preheating；(2) it is closed using stainless steel crucible
Gold casting removes impurity using surface cleans such as preceding crucible, Slag Tool, bell jars, then is placed in baking in 40 DEG C of baking ovens and removes moisture
After could use, resistance-heated furnace temperature gradient is warming up to 250 DEG C, the pure tin of pure tin gross mass 30% will be accounted for and melted at 245 DEG C
After being melted into molten bath, remaining pure tin is added；After pure tin all fusing, it is warming up to 270 DEG C；(3) successively by bismuth, indium, silver, copper,
Nickel, aluminium, germanium, gallium metal are added three times respectively, therebetween and keep temperature constant at 260 DEG C, after being all added to all metals
7 minutes are kept the temperature at 270 DEG C；(4) industry is added when melt temperature being maintained at 275 DEG C after all alloying elements all melt
Pure zinc, using in bell jar indentation molten tin alloy when addition, stirring melts it sufficiently；(5) all to all alloying components
After being completely melt, refining agent and the stirring refining 8min at 265 DEG C are added at 265 DEG C, with bell jar by refining agent pressure when refining
Enter horizontal turning movement in aluminium alloy, stand 15 minutes after refining, surface scum is skimmed at 270 DEG C, obtains molten tin alloy；
(6) gravitational casting is carried out to the molten tin alloy at 270 DEG C, casting process is to be poured into molten tin alloy at 270 DEG C
It is preheated in 110 DEG C of metal type dies, in air natural cooling, obtains tin alloy casting.
The solidus temperature of low-temperature solder alloy is 172.5 DEG C in this example, and as cast condition room temperature tensile intensity is 96.9MPa,
Elongation percentage 34.7%, postwelding solder joint shear strength are 38.5MPa, in addition, maximum in the test of solder alloy solderability in this example moisten
Wet power is 0.7372mN.
High intensity made from the present embodiment, high-reliability lead-free solder alloy material ingredient be accurate, without distinguishable crackle,
Analysis on Microstructure shows alloy pore-free and obvious shortcoming, as shown in Figure 1；It therefore follows that the tin alloy material that the present invention obtains
Expect that Tissue distribution is uniform, non-oxidation be mingled with component segregation phenomenon, and there is preferable wetability and mechanical property, while postwelding
Solder joint microstructure it is uniform, have preferable heat fatigue and croop property, meet high reliability request.
Embodiment 2: this high intensity, high reliability low temperature leadless welding alloy by following mass percent constituent system
: Zn7%, Bi 4.5%, In 2%, Ag 0.1%, Cu 0.05%, 0.01 % of Ni, raw metal total weight 0.1% refining agent
(calcium carbonate 60%, sodium chloride are 20 %, potassium chloride 20%), surplus are Sn and inevitable impurity；
The preparation method of above-mentioned low temperature lead-free solder alloy be (1) by industrial pure tin (Sn:99.95wt%), technical pure bismuth (Bi:
99.95wt%) polishing of 320 mesh sand paper is used to go deoxygenation respectively with industrial-purity zinc (Zn:99.9wt%) and indium, silver, copper, nickel metal
Change layer, is respectively put into air dry oven (40 DEG C) and carries out drying preheating；(2) alloy casting is carried out using stainless steel crucible, made
Impurity is removed with surface cleans such as preceding crucible, Slag Tool, bell jars, then be placed in baking in 40 DEG C of baking ovens can just make after removing moisture
With resistance-heated furnace temperature gradient is warming up to 250 DEG C, the pure tin for accounting for pure tin gross mass 20% is fused into molten bath at 240 DEG C
Afterwards, remaining pure tin is added；After pure tin all fusing, it is warming up to 270 DEG C；(3) successively by bismuth, indium, silver, copper, nickel metal point
Other point of 2 addition therebetween and keeps temperature constant at 250 DEG C, keeps the temperature 5 minutes at 270 DEG C after being all added to all metals；
(4) it is added industrial-purity zinc when melt temperature being maintained at 270 DEG C after all alloying elements all melt, when addition uses clock
In cover indentation molten tin alloy, stirring melts it sufficiently；(5) after all alloying components are all completely melt, at 260 DEG C
When refining agent and stirring refining 9 minutes at 260 DEG C are added, refining agent is pressed into horizontal detour in aluminium alloy with bell jar when refining
Movement, stands 10 minutes after refining, and surface scum is skimmed at 270 DEG C, obtains molten tin alloy；(6) tin is closed at 270 DEG C
Golden melt carries out gravitational casting, and casting process is to be poured into molten tin alloy at 270 DEG C to be preheated to 100 DEG C of metal pattern die
In tool, natural cooling, obtains tin alloy casting in air.
The solidus temperature of low-temperature solder alloy is 176.4 DEG C in this example, and as cast condition room temperature tensile intensity is 91.1MPa,
Elongation percentage 31.7%, postwelding solder joint shear strength are 35.2MPa, in addition, maximum in the test of solder alloy solderability in this example moisten
Wet power is 0.6591mN.
High intensity made from the present embodiment, high-reliability lead-free solder alloy material ingredient be accurate, without distinguishable crackle,
Analysis on Microstructure shows alloy pore-free and obvious shortcoming, as shown in Figure 2；It therefore follows that the tin alloy material that the present invention obtains
Expect that Tissue distribution is uniform, non-oxidation be mingled with component segregation phenomenon, and there is preferable wetability and mechanical property, while postwelding
Solder joint microstructure it is uniform, have preferable heat fatigue and croop property, meet high reliability request.
Embodiment 3: this high intensity, high reliability low temperature leadless welding alloy by following mass percent constituent system
: Zn11%, Bi 10%, In8%, Ag 1.5%, Cu 0.5%, Ni 0.5%, Al 0.5%, Ga0.5%, Ge 0.5%, raw metal
The refining agent (calcium carbonate 70%, sodium chloride 15%, potassium chloride 15%) of total weight 0.5%, surplus is for Sn and inevitably
Impurity；
The preparation method of above-mentioned low temperature lead-free solder alloy be (1) by industrial pure tin (Sn:99.95wt%), technical pure bismuth (Bi:
99.95wt%) 320 mesh sand paper are used respectively with industrial-purity zinc (Zn:99.9wt%) and indium, silver, copper, nickel, aluminium, gallium, germanium metal
Removing oxide layer is removed in polishing, is respectively put into air dry oven (40 DEG C) and carries out drying preheating；(2) it is closed using stainless steel crucible
Gold casting removes impurity using surface cleans such as preceding crucible, Slag Tool, bell jars, then is placed in baking in 40 DEG C of baking ovens and removes moisture
After could use, resistance-heated furnace temperature gradient is warming up to 250 DEG C, the pure tin of pure tin gross mass 40% will be accounted for and melted at 250 DEG C
After being melted into molten bath, remaining pure tin is added；After pure tin all fusing, it is warming up to 270 DEG C；(3) successively by bismuth, indium, silver, copper,
Nickel, aluminium, gallium, germanium metal divide 4 additions respectively, therebetween and keep temperature constant at 270 DEG C, after being all added to all metals
10 minutes are kept the temperature at 270 DEG C；(4) work is added when melt temperature being maintained at 270 DEG C after all alloying elements all melt
The pure zinc of industry, using in bell jar indentation molten tin alloy when addition, stirring melts it sufficiently；(5) to all alloying components
After being all completely melt, be added at 270 DEG C refining agent and in 265 DEG C of stirrings refining 7 minutes, refining with bell jar by refining agent pressure
Enter horizontal turning movement in aluminium alloy, stand 20 minutes after refining, surface scum is skimmed at 270 DEG C, obtains molten tin alloy；
(6) gravitational casting is carried out to the molten tin alloy at 270 DEG C, casting process is to be poured into molten tin alloy at 270 DEG C
It is preheated in 120 DEG C of metal type dies, in air natural cooling, obtains tin alloy casting.
The solidus temperature of low-temperature solder alloy is 169.2 DEG C in this example, and as cast condition room temperature tensile intensity is 68.93MPa,
Elongation percentage 20.4%, postwelding solder joint shear strength are 34.3MPa, in addition, maximum in the test of solder alloy solderability in this example moisten
Wet power is 0.7642mN.
High intensity made from the present embodiment, high-reliability lead-free solder alloy material ingredient be accurate, without distinguishable crackle,
Analysis on Microstructure shows alloy pore-free and obvious shortcoming, as shown in Figure 3；It therefore follows that the tin alloy material that the present invention obtains
Expect that Tissue distribution is uniform, non-oxidation be mingled with component segregation phenomenon, and there is preferable wetability and mechanical property, while postwelding
Solder joint microstructure it is uniform, have preferable heat fatigue and croop property, meet high reliability request.
Embodiment 4: this high intensity, high reliability low temperature leadless welding alloy by following mass percent constituent system
: the refining of Zn7%, Bi 4.5%, In3%, Ag0.5%, Cu 0.2%, Gd 0.1%, La 0.1%, raw metal total weight 0.3%
Agent (calcium carbonate 65%, sodium chloride 10%, potassium chloride 25%), surplus are Sn and inevitable impurity；
The preparation method of above-mentioned low temperature lead-free solder alloy be (1) by industrial pure tin (Sn:99.95wt%), technical pure bismuth (Bi:
99.95wt%) polishing of 320 mesh sand paper is used to go respectively with industrial-purity zinc (Zn:99.9wt%) and indium, silver, copper, gadolinium, lanthanum
Removing oxide layer is respectively put into air dry oven (40 DEG C) and carries out drying preheating；(2) alloy casting is carried out using stainless steel crucible
It makes, removes impurity using surface cleans such as preceding crucible, Slag Tool, bell jars, then be placed in baking in 40 DEG C of baking ovens and remove ability after moisture
It can use, resistance-heated furnace temperature gradient is warming up to 250 DEG C, the pure tin for accounting for pure tin gross mass 20% is fused at 240 DEG C
Behind molten bath, remaining pure tin is added；After pure tin all fusing, it is warming up to 270 DEG C；(3) successively by bismuth, indium, silver, copper, gadolinium, lanthanum
Metal divides 2 additions respectively, therebetween and keeps temperature constant at 250 DEG C, keeps the temperature after being all added to all metals at 270 DEG C
6 minutes；(4) industrial-purity zinc is added when melt temperature being maintained at 270 DEG C after all alloying elements all melt, when addition
Using in bell jar indentation molten tin alloy, stirring melts it sufficiently；(5) after all alloying components are all completely melt,
Refining agent is added at 260 DEG C and is refined 6 minutes in 260 DEG C of stirrings, with bell jar by water in refining agent indentation aluminium alloy when refining
Flat turning movement stands 10 minutes after refining, and surface scum is skimmed at 270 DEG C, obtains molten tin alloy；(6) at 270 DEG C to institute
It states molten tin alloy and carries out gravitational casting, casting process is to be poured into molten tin alloy at 270 DEG C to be preheated to 100 DEG C of gold
In genotype mold, natural cooling, obtains tin alloy casting in air.
The solidus temperature of low-temperature solder alloy is 170.2 DEG C in this example, and as cast condition room temperature tensile intensity is 90.2MPa,
Elongation percentage 32.9%, postwelding solder joint shear strength are 32.2MPa, in addition, maximum in the test of solder alloy solderability in this example moisten
Wet power is 0.6605mN.
High intensity made from the present embodiment, high-reliability lead-free solder alloy material ingredient be accurate, without distinguishable crackle,
Analysis on Microstructure shows alloy pore-free and obvious shortcoming.It therefore follows that the tin alloy material Tissue distribution that the present invention obtains
Uniformly, non-oxidation be mingled with component segregation phenomenon, and there is preferable wetability and mechanical property, while the solder joint of postwelding is microcosmic
Even tissue has preferable heat fatigue and croop property, meets high reliability request.
Embodiment 5: this high intensity, high reliability low temperature leadless welding alloy by following mass percent constituent system
: Zn10%, Bi 9%, In7%, Ag1.2%, Cu 0.3%, Gd 0.5%, La 0.5%, Y 0.5%, Ce 0.5%, raw metal are total
The refining agent (calcium carbonate 55%, sodium chloride 30%, potassium chloride 15%) of weight 0.4%, surplus be Sn and inevitably it is miscellaneous
Matter；
The preparation method of above-mentioned low temperature lead-free solder alloy be (1) by industrial pure tin (Sn:99.95wt%), technical pure bismuth (Bi:
99.95wt%) 320 mesh sand paper are used respectively with industrial-purity zinc (Zn:99.9wt%) and indium, silver, copper, gadolinium, lanthanum, yttrium, ce metal
Removing oxide layer is removed in polishing, is respectively put into air dry oven (40 DEG C) and carries out drying preheating；(2) it is closed using stainless steel crucible
Gold casting removes impurity using surface cleans such as preceding crucible, Slag Tool, bell jars, then is placed in baking in 40 DEG C of baking ovens and removes moisture
After could use, resistance-heated furnace temperature gradient is warming up to 250 DEG C, the pure tin of pure tin gross mass 40% will be accounted for and melted at 250 DEG C
After being melted into molten bath, remaining pure tin is added；After pure tin all fusing, it is warming up to 270 DEG C；(3) successively by bismuth, indium, silver, copper,
Gadolinium, lanthanum, yttrium, ce metal divide 4 additions respectively, therebetween and keep temperature constant at 270 DEG C, after being all added to all metals
10 minutes are kept the temperature at 270 DEG C；(4) work is added when melt temperature being maintained at 270 DEG C after all alloying elements all melt
The pure zinc of industry, using in bell jar indentation molten tin alloy when addition, stirring melts it sufficiently；(5) to all alloying components
After being all completely melt, be added at 270 DEG C refining agent and in 265 DEG C of stirrings refining 8 minutes, refining with bell jar by refining agent pressure
Enter horizontal turning movement in aluminium alloy, stand 20 minutes after refining, surface scum is skimmed at 270 DEG C, obtains molten tin alloy；
(6) gravitational casting is carried out to the molten tin alloy at 270 DEG C, casting process is to be poured into molten tin alloy at 270 DEG C
It is preheated in 120 DEG C of metal type dies, in air natural cooling, obtains tin alloy casting.
The solidus temperature of low-temperature solder alloy is 175.3 DEG C in this example, and as cast condition room temperature tensile intensity is 72.99MPa,
Elongation percentage 22.92%, postwelding solder joint shear strength are 34.2MPa, in addition, maximum in the test of solder alloy solderability in this example
Wetting power is 0.7789mN.
High intensity made from the present embodiment, high-reliability lead-free solder alloy material ingredient be accurate, without distinguishable crackle,
Analysis on Microstructure shows alloy pore-free and obvious shortcoming.It therefore follows that the tin alloy material Tissue distribution that the present invention obtains
Uniformly, non-oxidation be mingled with component segregation phenomenon, and there is preferable wetability and mechanical property, while the solder joint of postwelding is microcosmic
Even tissue has preferable heat fatigue and croop property, meets high reliability request.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring substantive content of the invention.
Claims (8)
1. a kind of low temperature lead-free solder alloy, which is characterized in that be made by the constituent of following mass percent: Zn7% ~ 11%,
Bi 4.5% ~ 10%, In 2% ~ 8%, Ag 0.1% ~ 1.5%, Cu 0.05% ~ 0.5%, M 0.01% ~ 2%, raw metal total weight 0.1 ~
0.5% refining agent, surplus be Sn and inevitable impurity, wherein the mass percent of Sn not less than 67%, M be RE or Ni,
At least one of Al, Ga, Ge element.
2. low temperature lead-free solder alloy according to claim 1, it is characterised in that: RE in Gd, La, Y, Ce at least
It is a kind of.
3. low temperature lead-free solder alloy according to claim 1, it is characterised in that: by the institute in low temperature lead-free solder alloy
There is a total composition meter, the mass fraction that the mass fraction that the mass fraction of Ni is 0 ~ 0.5%, Al is 0 ~ 0.5%, Ga is 0 ~
0.5%, the mass fraction of Ge is 0 ~ 0.5%.
4. low temperature lead-free solder alloy according to claim 1, it is characterised in that: refining agent constituent and mass percent
It is 50 ~ 70 % for calcium carbonate, sodium chloride is 10 ~ 30 %, potassium chloride is 10 ~ 30%.
5. the gravity casting method of low temperature lead-free solder alloy of any of claims 1-3, which is characterized in that including
Following steps:
(1) after Sn, Zn, Bi, In, Ag, Cu, M being removed removing oxide layer, drying is preheated to 40 DEG C；
(2) after taking a part of Sn to be first fused into molten bath at 240 ~ 250 DEG C, remaining Sn is added；
(3) after Sn all fusing, 270 DEG C are warming up to, Zn, Bi, In, Ag, Cu, M are divided to 2 ~ 4 Sn that fusing is added respectively
In, 250 ~ 270 DEG C are maintained the temperature at therebetween, keep the temperature 5 ~ 10 minutes at 270 DEG C after being all added to all alloys；To all conjunctions
Zn is added in gold element when melt temperature being maintained at 270-275 DEG C after all melting, after stirring is dissolved, at 260 ~ 270 DEG C
Refining agent is added and is stirred refining, stands 10 ~ 20 minutes after refining, skims surface scum at 270 DEG C, it is molten to obtain tin alloy
Body；Gravitational casting is carried out to the molten tin alloy at 270 DEG C, obtains lead-free solder tin alloy casting.
6. the gravity casting method of low temperature lead-free solder alloy according to claim 5, it is characterised in that: in step (2)
The Sn first melted accounts for the 20 ~ 40% of Sn gross mass.
7. the gravity casting method of low temperature lead-free solder alloy according to claim 4, it is characterised in that: stir refining
Temperature is no more than 270 DEG C, and mixing time is no more than 10min.
8. the gravity casting method of low temperature lead-free solder alloy according to claim 4, it is characterised in that: gravitational casting is
Molten tin alloy is poured into the metal type dies for being preheated to 100 ~ 120 DEG C at 270 DEG C, in air natural cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910288417.5A CN109943751B (en) | 2019-05-10 | 2019-05-10 | Low-temperature lead-free solder and gravity casting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910288417.5A CN109943751B (en) | 2019-05-10 | 2019-05-10 | Low-temperature lead-free solder and gravity casting method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109943751A true CN109943751A (en) | 2019-06-28 |
| CN109943751B CN109943751B (en) | 2021-03-12 |
Family
ID=67014660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910288417.5A Active CN109943751B (en) | 2019-05-10 | 2019-05-10 | Low-temperature lead-free solder and gravity casting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109943751B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117548897A (en) * | 2023-11-27 | 2024-02-13 | 北京理工大学 | Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139607A (en) * | 1995-06-30 | 1997-01-08 | 三星电机株式会社 | Non-lead solder with fine mechanical property |
| CN1730695A (en) * | 2005-08-04 | 2006-02-08 | 上海交通大学 | Sn-Ag-Cu-Cr alloy lead-free solder preparation method |
| JP4613823B2 (en) * | 2003-04-01 | 2011-01-19 | 千住金属工業株式会社 | Solder paste and printed circuit board |
| CN102489892A (en) * | 2010-12-31 | 2012-06-13 | 广东中实金属有限公司 | SnZn-based lead-free brazing filler metal containing Cr |
| CN107984110A (en) * | 2017-11-08 | 2018-05-04 | 昆明理工大学 | A kind of low temperature lead-free solder alloy |
-
2019
- 2019-05-10 CN CN201910288417.5A patent/CN109943751B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139607A (en) * | 1995-06-30 | 1997-01-08 | 三星电机株式会社 | Non-lead solder with fine mechanical property |
| JP4613823B2 (en) * | 2003-04-01 | 2011-01-19 | 千住金属工業株式会社 | Solder paste and printed circuit board |
| CN1730695A (en) * | 2005-08-04 | 2006-02-08 | 上海交通大学 | Sn-Ag-Cu-Cr alloy lead-free solder preparation method |
| CN102489892A (en) * | 2010-12-31 | 2012-06-13 | 广东中实金属有限公司 | SnZn-based lead-free brazing filler metal containing Cr |
| CN107984110A (en) * | 2017-11-08 | 2018-05-04 | 昆明理工大学 | A kind of low temperature lead-free solder alloy |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117548897A (en) * | 2023-11-27 | 2024-02-13 | 北京理工大学 | Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109943751B (en) | 2021-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101380700B (en) | Tin bismuth cuprum series leadless solder and preparation method thereof | |
| CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
| CN101780607B (en) | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof | |
| CN101417375A (en) | Leadless welding alloy for welding electronic elements | |
| CN100558499C (en) | A kind of manufacture method of cadmium-free silver brazing alloy | |
| CN110587178B (en) | Self-protection flux-cored wire for welding aluminum and stainless steel and preparation method thereof | |
| JP2012121053A (en) | Lead free soldering alloy containing zinc as principal component | |
| CN101716703A (en) | Low-silver SnAgCuBi series lead-free solder alloy and preparation method thereof | |
| CN102615447A (en) | Tin-based lead-free solder and preparation method thereof | |
| CN101157162A (en) | SnAgCu leadless brazing filler metal with antioxygenic performance | |
| CN110238557B (en) | ZnSn-based high-temperature lead-free solder and preparation method thereof | |
| CN101988165B (en) | High-temperature oxidation resistant lead-free tin-coated alloy | |
| CN103243234A (en) | Serial low-silver and lead-free solder for electronic packaging soft soldering and preparation method thereof | |
| CN114932337A (en) | SnAgCuBiIn series lead-free solder alloy, and design method and preparation method thereof | |
| CN114293066A (en) | Lead-free low-temperature solder alloy material containing Ni and preparation method thereof | |
| CN109926750B (en) | Low-temperature lead-free solder alloy and vacuum casting method thereof | |
| CN109943751A (en) | A kind of low-temperature lead-free solder and its gravity casting method | |
| CN100387741C (en) | Sn-Zn-Cr alloy lead-free solder preparation method | |
| CN109093282B (en) | Sn-Pb-Bi corrosion-resistant solder containing Al for photovoltaic solder strip and preparation method thereof | |
| WO2023103289A1 (en) | Lead-free solder alloy, preparation method therefor and use thereof | |
| CN1325679C (en) | Sn-Zn-Bi-Cr alloy lead-free solder preparation method | |
| CN101804527A (en) | Sn-Zn based unleaded brazing material with low Zn | |
| CN109465562A (en) | A kind of lead-free brazing and its with applying scaling powder | |
| CN108274148A (en) | A kind of photovoltaic welding belt tin-zinc-based leadless solder alloy and preparation method thereof | |
| CN1128037C (en) | Rare earth contained tin base lead-less solder and its preparation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |