CN1728461A - Anisotropic conductive thin boards - Google Patents
Anisotropic conductive thin boards Download PDFInfo
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- CN1728461A CN1728461A CN 200510085345 CN200510085345A CN1728461A CN 1728461 A CN1728461 A CN 1728461A CN 200510085345 CN200510085345 CN 200510085345 CN 200510085345 A CN200510085345 A CN 200510085345A CN 1728461 A CN1728461 A CN 1728461A
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Abstract
The present invention provides a conductive sheet having wiping function. The sheet has a structure where the conductive sheet slides on the surface of the partner member thereof in pressing. In this structure, for example, the pressing force does not necessarily act only vertically to the partner surface, but a shearing stress acts between mutual surfaces of the sheet and a target electrode field. At this time, the proximity of a slidable sliding part contains rich amount of abrasive material. As such an abrasive material, carbon fiber or the like can be used.
Description
Technical field
The present invention relates to conductive sheet, particularly the anisotropic conductive thin plate that only has conductivity at thickness direction.But also relate to the conduction contact structure of having used this anisotropic conductive thin plate.
Background technology
This anisotropic conductive thin plate is preferably used as the connector in the electrical characteristics testing fixture of circuit arrangements such as printed circuit board (PCB), conductor integrated circuit device, liquid crystal indicator, and also is used in the electrical characteristics testing fixture of the circuit arrangement with this anisotropic conductive thin plate.
The anisotropic conductive elastic sheet comprises the material that only presents conductivity on thickness direction, perhaps when the material that only presents conductivity on thickness direction when pressurized at thickness direction.Use this anisotropic conductive elastic sheet, not only can not adopt welding or methods such as mechanical type connection just can realize compact electrical connection, and can absorb mechanicalness impact and deviation and realize being flexible coupling.Therefore, in fields such as electronic computer, electronic watch, Electrofax, computer keyboard for example, as be used to make circuit arrangement for example printed circuit board (PCB) realize the connector that is electrically connected each other with leaderless chip carrier seat, LCDs etc. and be widely used.
And, in the electrical characteristics of circuit arrangements such as printed circuit board (PCB), conductor integrated circuit device, liquid crystal indicator were checked, lip-deep inspection was electrically connected by the anisotropic elasticity thin plate between with electrode with circuit board with being formed on inspection being formed on the electrode that is examined as on the one side of the circuit arrangement of checking object.
In recent years, people recognize, not only the electrical characteristics inspection of conductor integrated circuit device is very important, and it is also extremely important for the electrical characteristics inspection that is installed in semiconductor chips before such as chip carrier itself, therefore, as the method that the electrical characteristics of semiconductor chip are checked, WLBI (the Wafer LevelBum-in: in test wafer-level burn), use the motion of anisotropic conductive thin plate as foil detector that a kind of electrical characteristics of carrying out semiconductor chip under wafer state are checked has been proposed.
As this anisotropic conductive elastic sheet, for example special opening the anisotropic conductive elastic sheet that constitutes by even dispersed metal particle in elastomer is disclosed in the clear 51-93393 communique; For example special open to disclose in the clear 53-147772 communique by non-uniform Distribution conductivity magnetic particle in elastomer be formed on a plurality of conductions road formation portion of extending on the thickness direction and the anisotropic conductive elastomer of the insulation division of these conduction road formation portion mutually insulateds; For example open and disclose the anisotropic conductive elastic sheet that between the surface of conduction road formation portion and insulation division, forms jump in the clear 61-250906 communique the spy.
In such anisotropic conductive thin plate, more and more higher current of the requirement of the high speed of circuit etc., thin plate is most important with the contact resistance of the other side's electrode that is contacted.The cause of this contact resistance is to have oxide-film etc. on the surface of electrode, therefore need manage to remove such (spy open the 2001-93945 communique) such as oxide-films.
But this contact resistance is not only the metal oxide because of electrode surface, but also is used as the organic substances such as aliphatic acid that dirt is handled usually because of being attached with from the teeth outwards, and therefore, these are removed also is important.
Summary of the invention
The present invention proposes in view of above-mentioned situation, purpose provides a kind of surperficial dirt to the electrode that connected and adheres to few anisotropic conductive thin plate, thus, under the situation in the electrical characteristics that for example are used in circuit arrangement are checked, even to the small electrode that is examined, also can guarantee and its being electrically connected in the positioning accuracy of the electrical characteristics testing fixture of practicality.
That is, provide a kind of anisotropic conductive thin plate that produces the surface structure of the slip that can get rid of dirt for the surface of object electrode that has.For example, have such structure, promptly when pushing this thin plate with the object electrode, slide in the surface by this pressing force at this object electrode.More specifically saying, is to have the pressing force of making not necessarily vertically to act on the object electrode surface, but produces the structure of shear stress between this thin plate and object electrode interface.At this moment, near the sliding part that forms by slip, be rich in grinding-material.As this grinding-material, for example can use sheet nickel, powdery nickel or relatively shorter carbon fiber etc.
More specifically say, following anisotropic conductive thin plate is provided.
(1) a kind of anisotropic conductive thin plate, can have conductivity at thickness direction, on the thin plate face of this conductive sheet, have near its front end, the one or more jut that its width is narrow more or thickness is thin more, described jut is outstanding and form the angle of regulation with this face from the thin plate face of this conductive sheet, from the outstanding height of basal part, more than or equal to 20% of the width of the basal part of described jut or the less in fact size in the gauge.
Here, conductive sheet comprises so-called anisotropic conductive thin plate, also can comprise the thin plate that conductivity changes corresponding to compression.Jut can comprise that from datum level on every side outstanding convex form portion or parts, the shape of observing from the top can be circle, rectangle and other shape.What is called is more near its front end, and the shape that its width is narrow more or its thickness is thin more for example comprises more near the thin more shape for lugs of leading section.Outstanding angle be from along as the so-called center of the basal surface of the thin plate face of the basal part of jut when the substantial leading section of jut draws the hypothesis line, this hypothesis line and thin plate face angulation.For example, under hemispheric situation, the center of concatenating group bottom surface (for example center of substrate circle) is approximate right angle with the relative thin plate face of hypothesis line of leading section.And, can suppose that line measures the height of this projection along this, if hemisphere, then 50% (radius of ball) as the diameter of the ball of the datum width of basal surface is equivalent to this height.Not hemisphere, but under the situation of 1/3 ball, 1/4 ball, relatively as the approximate diameter (about 95%) of the datum width of basal surface, highly be about 35%, relatively as the length (about 85%) of the approximate diameter of the datum width of basal surface, highly be about 30%, under the situation of 2/3 ball, 3/4 ball, be about 70%, 90% respectively.
(2) according to above-mentioned (1) described anisotropic conductive thin plate, the height of described jut is 3 μ m to 10 μ m.
The height of jut is preferably greater than 0.1 μ m, more preferably greater than 1 μ m, more preferably greater than 3 μ m.And the height of jut is more preferably less than 20 μ m preferably less than 100 μ m, preferably less than 10 μ m.
(3) according to above-mentioned (1) or (2) described anisotropic conductive thin plate, described jut is configured on the thin plate face of opposing side.
(4) according to any described anisotropic conductive thin plate in above-mentioned (1) to (3), the angle of described regulation is about more than or equal to 30 degree.
Though can adjust best angle by using different materials or changing its shape, the angle of general hope regulation is to make pressing force change the angle of shearing force easily into.Specifically be that employed material in jut is preferably spent greater than 30 if common rubber then wishes to be more preferably greater than 20 degree greater than 10 degree.Produce in hope under the situation of cross shear, the angle of this regulation is wished less than 80 degree, better less than 70 degree, preferably less than 60 degree.This is owing to have the possibility of the shearing composition that obtains big distribution based on power.The maximum of the angle of regulation is 90 degree in theory.And, obtaining in hope under the situation of contact shearing force, the angle of wishing regulation also has and more wishes to become the almost situation of the predetermined angular of 90 degree greater than 80 degree.
(5) according to any described anisotropic conductive thin plate in above-mentioned (1) to (3), the angle of described regulation is about more than or equal to 80 degree.
(6) according to any described anisotropic conductive thin plate in above-mentioned (1) to (5), described jut on its surface or near surface have the part that is rich in grinding-material.
Grinding-material is material or parts or the part that is used to grind off lip-deep dirt, and is preferably outstanding from thin sheet surface in fact.Its size is preferably several μ m to tens of μ m.
(7) according to above-mentioned (6) described anisotropic conductive thin plate, described grinding-material contains nickel.
(8) according to above-mentioned (6) described anisotropic conductive thin plate, described grinding-material contains carbon fibre.
Nickel can be sheet, powder shaped or other shapes, preferably has the bight that is easy to cut.Can contain nickel oxide etc., carbon fibre can comprise polyacrylonitrile (PAN) class, pitch class and other carbon fibre.
(9) according to any described anisotropic conductive thin plate in above-mentioned (1) to (8), described anisotropic conductive thin plate is made of silicone resin.
(10) according to any described anisotropic conductive thin plate in above-mentioned (1) to (8), described anisotropic conductive thin plate is made of fluororesin.
(11) a kind of conduction contact structure, constitute by described substrate and described anisotropic conductive thin plate, described substrate and described anisotropic conductive thin plate are by being clamped in any described anisotropic conductive thin plate in above-mentioned (1) to (10) between 2 plate bases, and make its 2 thin plate faces contact and constitute across this anisotropic conductive thin plate and connect, on the surface of the described substrate corresponding, be provided with projection with the contact site of at least one side's thin plate face.
Description of drawings
Figure 1A and B are the anisotropic conductive thin plate of expression embodiment of the present invention and the ideograph of the other side's lateral electrode, and both are more more approaching than Figure 1A in Figure 1B.
Fig. 2 A and B are the anisotropic conductive thin plate of expression embodiment of the present invention and the ideograph of the other side's lateral electrode, and both are more more approaching than Fig. 2 A in Fig. 2 B.
Fig. 3 A and B are the anisotropic conductive thin plate of expression embodiment of the present invention and the ideograph of the other side's lateral electrode, and both are more more approaching than Fig. 3 A in Fig. 3 B.
Fig. 4 A and B are the anisotropic conductive thin plate of expression embodiment of the present invention and the ideograph of the other side's lateral electrode, and both are more more approaching than Fig. 4 A in Fig. 4 B.
Fig. 5 A and B are the anisotropic conductive thin plate of expression embodiment of the present invention and the ideograph of the other side's lateral electrode, and both are more more approaching than Fig. 5 A in Fig. 5 B.
Fig. 6 is the figure of explanation jut shape.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are elaborated.
Figure 1A and B are the ideographs of 2 contact conditions of the expression anisotropic conductive thin plate 10 of embodiment of the present invention and the other side's lateral electrode (also can be substrate in other embodiments) 18.This anisotropic conductive thin plate 10 is the thin plates that can longitudinal direction (thickness direction) in the drawings have conductivity, towards below surface (thin plate face) upper process portion 12 angle tilt that is regulation with relative vertical line 14 extend (be left below) in this figure.This jut 12 has in the drawings and is roughly half oval-shaped profile, but is actually the outstanding baculum with three-dimensional shape.But, also can be band shape in other embodiments from the depth of the side direction nearby side prolongation of figure.
Have the relative contact site 16 ' on the contact site 16 (the 1st contact site) that is pressed against electrode 18 (not shown go out to keep substrate) at the roughly front end of jut 12, it can constitute Mechanical Contact with electrode 18 and conduct.Distance between the anisotropic conductive thin plate 10 of this moment and the datum level separately of electrode 18 is d1 (Figure 1A).On the surface of electrode 18, be D1 from the distance of vertical line 14 to the 1st contact sites 16 of the approximate centre of the basal part by jut 12 (with the connecting portion on the surface of anisotropic conductive thin plate 10).
Near the 1st contact site 16 ' of this jut 12, contain substantially and be the nickel of metallic state, not only have conductivity, but also can grind off at least a portion of the 1st contact site 16 lip-deep organic substance overlay films relative with the electrode 18 of the other side's side.The technology of the organic overlay film of this removal generally is based on the principle of grinding abrasion, so, also can suitably select the nickel metal with polishing property, pottery, carbon fiber bar and other material in addition.If pay attention to improve the function of conductivity, preferably use the grinding-material with conductivity of metal etc.
Figure 1B represents that the distance of anisotropic conductive thin plate 10 and electrode 18 further is close to the situation of d2.By making both approaching pressing forces, jut 12 further is tilted to the left, and at the contact site 20 (the 2nd contact site) of electrode 18, the relative contact site 20 ' that is pressed (the 2nd contact site) can constitute mechanicalness with electrode 18 and contact and conduct.As we know from the figure, be D2 from the distance of vertical line 14 to the 2nd contact sites 20, and D2＞D1.Therefore, if observe electrode 18, then can see contact site from the 1st contact site 16 to the 2nd contact site 20 slight distance that moved to left, be close in the process of d2 in the distance that makes anisotropic conductive thin plate 10 and electrode 18, produced slip with jut 12 surfaces.At this moment, the 1st contact site 16 ' to the 2nd contact site 20 ' of jut 12 more is positioned at the front of jut 12.But, by changing the shape and the structure of jut, the position of contact site is not changed, otherwise and also can be configured in the 2nd contact site the more front end of front.
2 kinds of contact conditions of the anisotropic conductive thin plate 10 of Fig. 2 A and other execution modes of B modal representation the present invention and the other side's lateral electrode (also can be substrate in other embodiments) 18.This anisotropic conductive thin plate 10 is the thin plates that can longitudinal direction (thickness direction) in the drawings have conductivity, towards below surface (thin plate face) on, be the angle tilt of regulation with relative vertical line 14 respectively and be roughly parallel to vertical line 24 with the jut 22 of the jut 12 of inclination identical shown in Figure 1A and the B and approximate vertical and extend.These juts 12,22 have in the drawings and are roughly half oval-shaped profile, but are actually the outstanding baculum with three-dimensional shape.But, also can be band shape in other embodiments from the depth of the side direction nearby side prolongation of figure.
Identical with Figure 1A and B, has relative contact site 16 ' on the contact site 16 (the 1st contact site) that is pressed against electrode 18 at the roughly front end of jut 12, and having relative contact site 26 ' (the 1st contact site) on the contact site 26 (the 1st contact site) that is pressed against electrode 18 at the front end of jut 22, it can constitute Mechanical Contact with electrode 18 and conduct.Distance between the anisotropic conductive thin plate 10 of this moment and the datum level separately of electrode 18 is d3 (Fig. 2 A).On the surface of electrode 18, apart from being D3, the distance between the vertical line 14 and 24 is L3 from vertical line 14 to the 1st contact sites 16 of the approximate centre of the basal part by jut 12 (with the connecting portion on the surface of anisotropic conductive thin plate 10).
The same with the embodiment among Figure 1A and the B, near the 1st contact site 16 ' of this jut 12, contain and be the nickel of metallic state substantially, not only has conductivity, but also can grind off at least a portion of the 1st contact site 16 lip-deep organic substance overlay films relative with the electrode 18 of the other side's side, also can consider to use the material beyond the nickel.
Fig. 2 B represents that the distance of anisotropic conductive thin plate 10 and electrode 18 further is close to the situation of d4.By making both approaching pressing forces, jut 12 further is tilted to the left, contact site 20 (the 2nd contact site) at electrode 18, the relative contact site 20 ' that is pressed (the 2nd contact site), and, can constitute mechanicalness with electrode 18 and contact and conduct at each identical contact site 26,26 '.As we know from the figure, be D4 from the distance of vertical line 14 to the 2nd contact sites 20 ', and D4＞D3.Therefore, if observe electrode 18, then can see contact site from the 1st contact site 16 to the 2nd contact site 20 slight distance that moved to left, be close in the process of d4 in the distance that makes anisotropic conductive thin plate 10 and electrode 18, produced slip with jut 12 surfaces.At this moment, the 1st contact site 16 ' to the 2nd contact site 20 ' of jut 12 more is positioned at the front of jut 12, and is identical with the situation of the embodiment of Figure 1A and B.
Because the contact site 26 ' of the front end of the jut 22 of anisotropic conductive thin plate 10, do not take place laterally to slide and directly bear pressing force, and contact area not very big, so contact pressure is quite high.Therefore, not to utilize the shearing force that produces because of slip to destroy overlay film, but utilize the mill effect of drawing of grinding-material to destroy overlay film.In addition, owing to the relative cross offset power that the slip of jut 12 acts on anisotropic conductive thin plate 10 and the electrode 18 is offset by this contact site 26,26 ' frictional force, so be not easy to take place lateral shift.
2 kinds of contact conditions of the anisotropic conductive thin plate 10 of Fig. 3 A and B modal representation another other execution modes of the present invention and the other side's lateral electrode (also can be substrate in other embodiments) 18.This anisotropic conductive thin plate 10 is the thin plates that can longitudinal direction (thickness direction) in the drawings have conductivity, towards below surface (thin plate face) on, with the jut 12 of inclination identical shown in Figure 1A and the B be the diagonally extending of predetermined angular in the other direction respectively with relative vertical line 14,44 to the jut 42 that tilts.These juts 12,22 have in the drawings and are roughly half oval-shaped profile, but are actually the outstanding baculum with three-dimensional shape.But, also can be band shape in other embodiments from the depth of the side direction nearby side prolongation of figure.
Identical with Figure 1A and B, has relative contact site 16 ' on the contact site 16 (the 1st contact site) that is pressed against electrode 18 at the roughly front end of jut 12, and having relative contact site 46 ' (the 1st contact site) on the contact site 46 (the 1st contact site) that is pressed against electrode 18 at the roughly front end of jut 42, it can constitute Mechanical Contact with electrode 18 and conduct.Distance between the anisotropic conductive thin plate 10 of this moment and the datum level separately of electrode 18 is d5 (Fig. 3 A).On the surface of electrode 18, distance from the vertical line 14,44 of the approximate centre of each basal part by jut 12,42 (with the connecting portion on the surface of anisotropic conductive thin plate 10) to each the 1st contact site 16,46 is respectively D5, D5 ', and the distance between the vertical line 14 and 44 is L5.
The same with the embodiment among Figure 1A and the B, near the 1st contact site 16 ', 20 ' of this jut 12,42 and near the contact site 46 ', 48 ', contain and be the nickel of metallic state substantially, not only has conductivity, but also can grind off at least a portion of 1st contact site 16, the 46 lip-deep organic substance overlay films relative with the electrode 18 of the other side's side, also can consider to use the material beyond the nickel.
Fig. 3 B represents that the distance of anisotropic conductive thin plate 10 and electrode 18 further is close to the situation of d6.By making both approaching pressing forces, jut 12 further is tilted to the left, contact site 20 (the 2nd contact site) at electrode 18, the relative contact site 20 ' that is pressed (the 2nd contact site), and jut further is tilted to the right, at the contact site 48 (the 2nd contact site) of electrode 18, the relative contact site 48 ' that is pressed (the 2nd contact site) can constitute mechanicalness with electrode 18 and contact and conduct.As we know from the figure, be respectively D6, D6 ' from vertical line the 14,44 to the 2nd contact site 20 ', 48 ' distance, and D6＞D5, D6 '＞D5 '.Therefore, if observe electrode 18, then can see contact site from the 1st contact site 16 to the 2nd contact site 20 slight distance that moved to left, and, contact site from the 1st contact site 46 to the 2nd contact site 48 slight distance that moved to right, be close in the process of d6 in the distance that makes anisotropic conductive thin plate 10 and electrode 18, produced slip with jut 12,42 surfaces.At this moment, the front that the 1st contact site 16 ' of jut 12,42,46 ' to the 2nd contact site 20 ', 48 ' more are positioned at jut 12,42 is identical with the situation of the embodiment of Figure 1A and B.
Because the relative cross offset power that the slip by jut 12 acts on anisotropic conductive thin plate 10 and the electrode 18 is opposite with the direction that slip by jut 42 acts on the relative cross offset power on anisotropic conductive thin plate 10 and the electrode 18, so cancelled out each other, thereby be not easy to take place lateral shift.
2 kinds of contact conditions of the anisotropic conductive thin plate 50 of Fig. 4 A and B modal representation another other execution modes of the present invention and the other side's lateral electrode (also can be substrate in other embodiments) 58.This anisotropic conductive thin plate 50 is the thin plates that can longitudinal direction (thickness direction) in the drawings have conductivity, towards below surface (thin plate face) on, 2 juts 52,62 are roughly parallel to vertical line 54,64 respectively and extend (in the drawings towards the below).These juts 52,62 have in the drawings and are roughly half oval-shaped profile, but are actually the outstanding baculum with three-dimensional shape.But, also can be band shape in other embodiments from the depth of the side direction nearby side prolongation of figure.
On the face relative of electrode 58, be formed with and roughly be hemispheric projection 59 with anisotropic conductive thin plate 50.At its front end roughly, have the relative contact site 56 ' 66 ' on the contact site 56,66 (the 1st contact site) of projection of being pressed against 59, it can constitute Mechanical Contact with electrode 58 and conduct.Distance between the anisotropic conductive thin plate 50 of this moment and the datum level separately of electrode 58 is d7 (Fig. 4 A).On the surface of projection 59, for very short, almost approach 0 from the distance of vertical line the 54,64 to the 1st contact site 56,66 of the approximate centre of each basal part by jut 52,62 (with the connecting portion on the surface of anisotropic conductive thin plate 50).The change that the front end shape that this distance can be by changing jut 52,62 or the surface configuration of projection 59 suit.
Near the 1st contact site 56 ', 66 ' of this jut 52,62, contain and be the nickel of metallic state substantially, not only have conductivity, but also can grind off at least a portion of 1st contact site 56, the 66 lip-deep organic substance overlay films relative with the projection 59 of the other side's side.The technology of the organic overlay film of this removal generally is based on the principle of grinding abrasion, so, also can suitably select the nickel metal with polishing property, pottery, carbon fibre and other material in addition.Also can stress to select to have the grinding-material of conductivity.
Fig. 4 B represents that the distance of anisotropic conductive thin plate 50 and electrode 58 further is close to the situation of d8.By making both approaching pressing forces, jut 52,62 further tilts to the left and right, at the contact site 60 and 70 (the 2nd contact site) of projection 59, the relative contact site 60 ' and 70 ' that is pressed (the 2nd contact site) can not only contact and conduct with projection 59 but also with electrode 58 formation mechanicalnesses.As we know from the figure, be respectively D8, D8 ' from vertical line the 54,64 to the 2nd contact site 60 ', 70 ' distance.Therefore, if observe projection 59, then can see contact site from the 1st contact site 56,66 to the 2nd contact site 60 move left and right slight distance, and, be close in the process of d8 in the distance that makes anisotropic conductive thin plate 50 and electrode 58, produced slip with jut 52,62 surfaces.At this moment, the 1st contact site 56 ' of jut 52,62,66 ' to the 2nd contact site 60 ', the 70 ' front that more is positioned at jut 52,62.But,, the position of contact site is not changed, otherwise also can be configured in more close front to the 2nd contact site by changing the shape or the structure of jut.
2 kinds of contact conditions of the anisotropic conductive thin plate 110 of Fig. 5 A and B modal representation another other execution modes of the present invention and the other side's lateral electrode (also can be substrate in other embodiments) 118.This anisotropic conductive thin plate 110 is the thin plates that can longitudinal direction (thickness direction) in the drawings have conductivity, towards below surface (thin plate face) on, jut 112 relative vertical line 114 approximate vertical are extended (in the drawings towards the below).This jut 112 has in the drawings and is the profile that is slightly less than semicircle, but is actually the hemispherical of three-dimensional shape.But, also can be band shape in other embodiments from the depth of the side direction nearby side prolongation of figure.
Roughly front end at jut 112, the relative contact site 116 ' (the 1st contact site) that is pressed against on the contact site 116 (the 1st contact site) of electrode 118 (not shown maintenance substrate) is positioned at jut 112 sides, and it can constitute Mechanical Contact with electrode 118 and conduct.Distance between the anisotropic conductive thin plate 110 of this moment and the datum level separately of electrode 118 is d9 (Fig. 5 A).On the surface of electrode 118, the vertical line 114 of the approximate centre of the basal part by jut 112 (with the connecting portion on the surface of anisotropic conductive thin plate 50) is roughly by the 1st contact site 116.
Near the 1st contact site 116 ' of this jut 112, contain substantially and be the sheet nickel of metallic state, not only have conductivity, but also can grind off at least a portion of the 1st contact site 116 lip-deep organic substance overlay films relative with the electrode 118 of the other side's side.The organic film coating technique of this removal generally is based on the principle of grinding abrasion, so, also can suitably select the nickel metal with polishing property, pottery, carbon fibre and other material in addition.If stress to improve conductivity, then preferably use metal, a part of carbon fibre etc. to have the grinding-material of conductivity.
Fig. 5 B represents that the distance of anisotropic conductive thin plate 110 and electrode 118 further is close to the situation of d10.By making both approaching pressing forces, jut 112 is crushed, expand to contact site 120 ' (the 2nd contact site) contact of relative jut 112 of the contact site 120 (the 2nd contact site) of electrode 118 with being pressed into its contact-making surface, can constitute mechanicalnesses with electrode 118 and contact and conduct.At this, note that on the right side of center line 114 same situation also takes place.As we know from the figure, the distance from vertical line 114 to the 2nd contact sites 120 is D10.Therefore, if observe electrode 118, can see that then contact site increases continuously to the 2nd contact site 120 from the 1st contact site 116.That is, be close in the process of d10 in the distance that makes anisotropic conductive thin plate 110 and electrode 118, the contact area of the surface of jut 112 and electrode 118 increases.
Below, with reference to Fig. 6 mechanism at this moment is described.On the thin plate face of anisotropic conductive thin plate 110, dispose hemispheric jut 112.In the drawings, this hemisphere is by being the center of circle with the hypothesis center C, is the circular arc that radius drew with R.X-axis 130 extends in parallel with the thin plate face in its lower section.The point corresponding with the position of the 1st contact site 116 ' of jut 112 is the point 0 on the X-axis 130.Point P is equivalent to 120 ' position, and its orthographic projection position on this X-axis 130 is some A.That is, apart from OA=R * sin θ.Yet, the distance from 116 ' to P, if measure along the outside of hemisphere 112, be equivalent on the X-axis 130 apart from OB (OB=R * θ) in theory.Since apart from OB obviously than long apart from OA, so in Fig. 5 B, roughly air line distance (being equivalent to), take in length accordingly and be circular arc line (be only limited to this figure, be actually two-dimensional surface) apart from OB apart from OA from the 1st contact site 116 ' to the 2nd contact site 120 '.This is because jut 112 is the elastomers that are made of rubber constituent, and in order to draw on the surface of the electrode 118 that is made of the higher material of spring rate, the line pressure that will become apart from the circular arc of OB contracts.On the contrary, for example in the distance of anisotropic conductive thin plate 110 and electrode 118 when d10 moves to d9, because the line that becomes compressed circular arc is reduced into original apart from OB, so the line apart from OA (being actually face) that is equivalent to the other side's side has been added shearing force.That is, the mutual lip-deep schmutzband of anisotropic conductive thin plate 11 and electrode 118 has been applied in compression and has stretched pulling force.At this moment, the corner angle of jut 112 lip-deep nickel sheets cut electrode 118 lip-deep dirts.
On the other hand, be compressed to from d9 the process of d10, be compressed, so produce shearing force owing to become the line of circular arc in the distance of anisotropic conductive thin plate 110 and electrode 118.That is, the mutual lip-deep schmutzband of anisotropic conductive thin plate 110 and electrode 118 has been applied in and has stretched pulling force and compression stress.At this moment, the corner angle of jut 112 lip-deep nickel sheets cut electrode 118 lip-deep dirts.
In addition, above-mentioned explanation is based on theoretical explanation, have and the actual different situation of situation that takes place, but in the above-described embodiment, finally, has the CONTACT WITH FRICTION function, above-mentioned structure, even mechanism is different in detail, but can effectively solving on the problem this point of the present invention and need not query.
As mentioned above, according to the present invention, have and remove the organic effect that causes contact resistance.In addition, the invention is not restricted to above-mentioned execution mode, in subject area of the present invention, can carry out various design alterations and modification.
Claims (11)
1. an anisotropic conductive thin plate can have conductivity at thickness direction, it is characterized in that, on the thin plate face of this conductive sheet, have near its front end, and the one or more jut that its width is narrow more or thickness is thin more,
Described jut is outstanding from the thin plate face of this conductive sheet, and forms the angle of stipulating with this face,
From the outstanding height of basal part, more than or equal to 20% of the width of the basal part of described jut or the less in fact size in the gauge.
2. anisotropic conductive thin plate according to claim 1 is characterized in that, the height of described jut is 3 μ m to 10 μ m.
3. anisotropic conductive thin plate according to claim 1 and 2 is characterized in that, described jut is configured on the thin plate face of opposing side.
4. anisotropic conductive thin plate according to claim 1 and 2 is characterized in that, the angle of described regulation is about more than or equal to 30 degree.
5. anisotropic conductive thin plate according to claim 1 and 2 is characterized in that, the angle of described regulation is about more than or equal to 80 degree.
6. anisotropic conductive thin plate according to claim 1 and 2 is characterized in that, described jut on its surface or near surface have the part that is rich in grinding-material.
7. anisotropic conductive thin plate according to claim 6 is characterized in that described grinding-material contains nickel.
8. anisotropic conductive thin plate according to claim 6 is characterized in that described grinding-material contains carbon fibre.
9. anisotropic conductive thin plate according to claim 1 and 2 is characterized in that, described anisotropic conductive thin plate is made of silicone resin.
10. anisotropic conductive thin plate according to claim 1 and 2 is characterized in that, described anisotropic conductive thin plate is made of fluororesin.
11. conduction contact structure, constitute by described substrate and described anisotropic conductive thin plate, described substrate and described anisotropic conductive thin plate are by being clamped in claim 1 or 2 described anisotropic conductive thin plates between 2 plate bases, and make its 2 thin plate faces contact and constitute across this anisotropic conductive thin plate and connect, it is characterized in that, on the surface of the described substrate corresponding, be provided with projection with the contact site of at least one side's thin plate face.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004223826A JP2006048939A (en) | 2004-07-30 | 2004-07-30 | Anisotropic conductive sheet |
| JPJP2004223826 | 2004-07-30 | ||
| JP2004-223826 | 2004-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1728461A true CN1728461A (en) | 2006-02-01 |
| CN100426591C CN100426591C (en) | 2008-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100853452A Expired - Fee Related CN100426591C (en) | 2004-07-30 | 2005-07-22 | Anisotropic conductive thin boards |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006048939A (en) |
| CN (1) | CN100426591C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100878673B1 (en) | 2007-07-10 | 2009-01-13 | 심재택 | Anisotropic Conductive Film and Manufacturing Method Thereof |
| JP5722076B2 (en) * | 2011-02-23 | 2015-05-20 | 日本圧着端子製造株式会社 | Jack |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3400051B2 (en) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | Anisotropic conductive film, method of manufacturing the same, and connector using the same |
| JP4288783B2 (en) * | 1999-09-24 | 2009-07-01 | Ｊｓｒ株式会社 | Anisotropic conductive sheet and electrical inspection device for circuit device |
| JP3505650B2 (en) * | 2000-08-30 | 2004-03-08 | 日本航空電子工業株式会社 | Anisotropic conductive sheet and method for producing the same |
| JP2002124319A (en) * | 2000-10-18 | 2002-04-26 | Nitto Denko Corp | Anisotropic conductive film and inspection method of semiconductor element or electronic component using same |
| JP2003059611A (en) * | 2001-08-15 | 2003-02-28 | Sumitomo Electric Ind Ltd | Anisotropic conductive sheet, and manufacturing method of the same |
-
2004
- 2004-07-30 JP JP2004223826A patent/JP2006048939A/en not_active Withdrawn
-
2005
- 2005-07-22 CN CNB2005100853452A patent/CN100426591C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100426591C (en) | 2008-10-15 |
| JP2006048939A (en) | 2006-02-16 |
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Granted publication date: 20081015 Termination date: 20110722 |