CN1405873A - Electronic device measuring device and method - Google Patents
Electronic device measuring device and method Download PDFInfo
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- CN1405873A CN1405873A CN02142495A CN02142495A CN1405873A CN 1405873 A CN1405873 A CN 1405873A CN 02142495 A CN02142495 A CN 02142495A CN 02142495 A CN02142495 A CN 02142495A CN 1405873 A CN1405873 A CN 1405873A
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- measurement terminal
- electronic device
- pin
- leading section
- determinator
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2644—Adaptations of individual semiconductor devices to facilitate the testing thereof
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
Abstract
Electronic device measuring device. First and second probes 21A, 21B are made of an elastic conductive material and arranged to respectively contact a base part side and a tip side on the same face of a lead 3 of the electronic part 1. The first probe 21A protrudes the tip part contacting the lead 3 from the second probe 21B and is pressed against the lead 3 from a direction forming an obtuse angle for the base part side of the lead 3. Since the tip of the first probe 21A protrudes from that of the second probe 21B, the tip of the first probe 21A presses the lead 3 stronger than the second probe 21B and accordingly folding of the lead 3 is restrained.
Description
Technical field
The present invention relates to measure the electronic device determinator and the assay method of electronic device with Kai Erfen (Kelvin) way of contact.
Background technology
Carrying out in the electronic device determinator of characteristic electron mensuration at the thick film moulding electronic device (being designated hereinafter simply as electronic device) to IC, discrete component etc., is by electronic device being arranged on locate to go up its electrical characteristics to be measured.At this moment, measurement terminal is contacted with a plurality of pins of electronic device, simultaneously by analyzer by measurement terminal loading current or voltage, the electrical characteristics such as impedance of electronic device are measured, electronic device classified by grade and store according to its measurement result.As the mensuration mode of characteristic, have by loading and measure single way of contact that shared measurement terminal carries out and respectively by the two ways of contact that load and mensuration is carried out with measurement terminal.Usually, under the situation that does not require the high assay precision, use the former, and the next use of the situation that the requires high-precision measuring latter.
Electronic device as a kind of determination object of the Kai Erfen way of contact for example has SMD (Surface Mount Device).This SMD is a kind of grafting material that is installed in surface attachment scolding tin etc., constitutes on the graphics circuitry plate of corresponding figure, heats then, constitutes the electronic device that is electrically connected by grafting material with the graphics circuitry plate.In order to form good being electrically connected with the graphics circuitry plate, make the pin 3 formation S word shape as shown in figure 12 of SMD1 usually by grafting material.In addition,, the face that is formed with pin 3 is called the side, area greater than this side, is configured to be called interarea towards the face of installation base plate for SMD1.
As shown in FIG. 13A, the electronic device determinator has to the mensuration chute 111 of the vertical direction conveyance of relative paper as the SMD1 of determination object.Measuring chute 111 is made of following 111A of platform portion that becomes SMD1 conveyance path and the guide portion 111B that becomes the two sides of SMD1 conveyance path.Above measuring that SMD1 on the chute 111 locates, dispose being pushed the pressing component 113 that is fixed on the 111A of platform portion that measures chute 111 to the SMD1 on locating by conveyance.
Centre on locating accompanies the both sides of the 111A of platform portion that measures chute 111, is provided with 1 pair by the 1st and the 2nd measurement terminal 121A of subtend, the contactor that 121B constitutes with the interval of regulation.The 1st measurement terminal 121A constitutes by vertical base portion (vertical plate portion) with from the bend of base curve 90 degree, and has the word shape of falling L.The base portion of the 1st measurement terminal 121A is fixed on the limiting part 123, and the front end of bend is configured in the oblique upper of the pin 3 of SMD1.
The 2nd measurement terminal 121B constitutes by vertical base portion (vertical plate portion) with from the bend of base curve 90 degree, and has the word shape of falling L.The base portion of the 2nd measurement terminal 121B is fixed on the swing part 125, and the front end of bend is configured in the below of the pin 3 of SMD1.The base portion of the 2nd measurement terminal 121B is by the end in contact of contact site and the 3rd measurement terminal 121C.The base portion of the other end of the 3rd measurement terminal 121C and the 1st measurement terminal 121A is connected with the circuit of analyzer (not shown).
Below with reference to Figure 13 B the action of the electronic device determinator in the past of such formation is described.To measuring on the locating of chute 111, the 111A of platform portion by measuring chute 111 and pressing component 113 grip SMD1 then the SMD1 conveyance.Under this state, the lateral surface of limiting part 123 is applied active force to the central axis direction of the 111A of platform portion that measures chute 111.Like this, the bend side front end (hereinafter referred to as leading section) that is maintained at the 1st measurement terminal 121A on the limiting part 123 is moved to the inside, and with the upside contacts side surfaces of the pin 3 of SMD1.
2 swing parts 125 that are configured in the platform portion 111A both sides of measuring chute 111 rotate when limiting part 123 moves, form herringbone.By this action, the front end that is fixed on the 2nd measurement terminal 121B on the swing part 125 is moved upward, with the following end in contact of the pin 3 of SMD1.Its result as shown in figure 14, the pin of SMD1 3 forms by the state of each leading section clamping of the 1st and the 2nd measurement terminal 121A, 121B, and measurement terminal 121A, 121B are contacted with pin 3 forcefully.
In addition, as shown in figure 15, when the 1st measurement terminal 121A is moved to arrow direction 1., its leading section when being pressed on the pin 3, the leading section of the 1st measurement terminal 121A slides to arrow direction 2. on side above the pin 3, peels off down and is formed on pin 3 lip-deep oxidation film layers.Surface by leading section that makes measurement terminal 121A and the pin 3 of being stripped from down oxidation film layer forms strong the contact, can reduce the contact impedance that causes evaluated error.
Like this, make under pin 3 state of contact of the 1st and the 2nd measurement terminal 121A, 121B and SMD1, measuring the electrical characteristics of SMD1.After measuring end, stop swing part 125 is applied active force 127, measurement terminal 121A, 121B are separated with pin 3.At this moment, as shown in figure 15, the leading section of the 1st measurement terminal 121A slides to arrow direction 3. on the surface of pin 3, separates to arrow direction 4. then.At last, make pressing component 113 revert to the position of regulation, send and measure the SMD1 that finishes.
In addition, because swing part 125 shakes with the bigger amplitude of oscillation, so it is big to be fixed on all amount of movements of the 2nd measurement terminal 121B on the swing part 125, but by the 3rd measurement terminal 121C the 2nd measurement terminal 121B is connected to analyzer, can prevents that the 2nd measurement terminal 121B is subjected to strong bending force.
But, in above-mentioned electronic device determinator in the past, in order to reduce contact impedance, clamp the pin 3 of SMD1 powerfully, yet but exist the problem that the pin 3 of SMD1 is bent like this with 2 measurement terminal 121A, 121B.When the SMD1 that pin 3 is bent is installed on the graphics circuitry plate, will cause the loose contact of pin 3 and graphics circuitry plate.
In addition, owing to the 2nd measurement terminal 121B is connected with analyzer by the 3rd measurement terminal 121C, thus produce contact impedance at the contact site of the 2nd measurement terminal 121B and the 3rd measurement terminal 121C, thus constituted the problem that increases evaluated error.
In addition because the distance to bend of the 1st measurement terminal 121A is short, and its base portion to be limited parts 123 fixing, so the elasticity of the 1st measurement terminal 121A on moving direction is little.Therefore, suppose to misplace when the 1st measurement terminal 121A orientation (vertical direction of relative paper) at pin 3 when contacting with the pin 3 of SMD1, then the leading section of the 1st measurement terminal 121A enters between the adjacent leads 3, will cause the bending of pin 3.
In addition; after measuring end; at the 1st measurement terminal 121A when the pin 3 of SMD1 separates; as shown in figure 15; because the leading section of measurement terminal 121A is to slide to the arrow 2. opposite with arrow direction 3. on the surface of pin 3, so the oxidation film layer particle under being stripped from can be attached to the front end of measurement terminal 121A.Therefore, in the process of measuring repeatedly, on the leading section of measurement terminal 121A, will form the accumulation of oxide, will increase contact impedance with pin 3.Therefore, the measurement terminal 121A that must more renew with the short cycle.
Summary of the invention
The purpose of this invention is to provide the electronic device determinator that a kind of pin that can prevent electronic device when electronic device is carried out characteristic measurement is bent.
Other purposes of the present invention provide a kind of electronic device determinator that improves the mensuration precision of measuring electronic device characteristics.
Another purpose of the present invention provides a kind of electronic device determinator that electronic device characteristics is measured the useful life of using measurement terminal that prolongs.
To achieve the above object, the feature of electronic device determinator of the present invention is: the described the 1st and the 2nd measurement terminal is made of the rubber-like material, and, being configured to can be respectively and the base portion side and the front end side contact of the same one side of described pin, the leading section of described the 1st measurement terminal protrudes in the leading section of described the 2nd measurement terminal, and described leading section is pushed described pin from forming from the direction at the obtuse angle that described pin base portion side is looked.
Because the leading section of the 1st measurement terminal protrudes in the leading section of the 2nd measurement terminal, so that the former pushes the pressing force of pin of electronic device is stronger than the latter.If from the angle of pin side, then because the base portion side that is contacted in the 1st measurement terminal is subjected to bigger active force, the front that the 2nd measurement terminal is contacted is subjected to less action force, so can prevent the bending of pin.
In addition, about electronic device assay method of the present invention, it is characterized in that: comprise the 1st operation that the electronic device conveyance with pin is gone up to locating and grip with hold assembly; The the 1st and the 2nd measurement terminal of electronic device mensuration usefulness is pressed into the 2nd operation of the pin of described electronic device; Use the described the 1st and the 2nd measurement terminal to carry out the 3rd operation of the electrical characteristics determining of described electronic device; Releasing is by 4th operation of described hold assembly to the clamping of described electronic device; The 5th operation of separating with the pin that makes the described the 1st and the 2nd measurement terminal from described electronic device.
Separate from the pin of electronic device by after the clamping of removing electronic device, making the 1st and the 2nd measurement terminal, the leading section that can make measurement terminal can prevent at the oxidation film layer particle that adheres on the leading section of measurement terminal under being stripped from without directly separating measurement terminal in the lip-deep slip of pin.
Description of drawings
Fig. 1 is the profile of the electronic device determinator of expression the present invention 1 embodiment.
Fig. 2 is the front view of contactor shown in Figure 1.
Fig. 3 is the end view of contactor shown in Figure 1.
Fig. 4 is the vertical view of contactor shown in Figure 1.
Fig. 5 is the enlarged drawing of the V portion among Fig. 3.
Fig. 6 is the enlarged drawing of the VI portion among Fig. 4.
Fig. 7 is the vertical view of limiting part shown in Figure 2.
Fig. 8 is the block diagram that the circuit of expression electronic device determinator shown in Figure 1 constitutes.
Fig. 9 is the flow chart of the action of presentation graphs 1 and electronic device determinator shown in Figure 8.
Figure 10 A is the figure of the state when measuring of expression electronic device determinator shown in Figure 1, and Figure 10 B is the contact condition enlarged drawing of expression measurement terminal and pin.
Figure 11 is the key diagram of moving state of the leading section of the 1st measurement terminal shown in the key diagram 10B.
Figure 12 is the front view with SMD of pin.
Figure 13 A is to be the front view of the electronic device determinator in the past of determination object with SMD, and 13B is the figure that is illustrated in the state when measuring.
Figure 14 is the figure of the contact condition of the measurement terminal when measuring of presentation graphs 13B and pin.
Figure 15 is the key diagram of moving state of the leading section of explanation the 1st measurement terminal.
Embodiment
Below, with reference to accompanying drawing, the present invention is described in detail.
Fig. 1 is the view of the electronic device determinator of expression one embodiment of the invention.In Fig. 1, the length direction of the thickness direction (bending direction of measurement terminal leading section) of " X " of coordinate system expression measurement terminal base portion, the Width of " Y " expression measurement terminal, " Z " expression measurement terminal base portion.Electronic device determinator shown in Figure 1 has as the SMD1 of the determination object mensuration chute 11 to " Y " direction conveyance vertical with " XZ " face.Measuring chute 11 is made of the following 11A of platform portion that forms the SMD1 path, the guide portion 11B of two sides that forms the path of SMD1.In addition, by the friction impedance between the SMD1 of conveyance and the 11A of platform portion small degree of depth surplus is set in the path of SMD1 in order to reduce.
Electrical characteristics to SMD1 on the assigned position in the path of SMD1 are measured.Claim this assigned position for locating.Above locating, dispose pressing component, be used for being fixed on the 11A of platform portion being pushed by the interarea of the SMD1 of conveyance on locate.Constitute the clamping part that the interarea of SMD1 is clipped in the middle by pressing component 13 and the 11A of platform portion.On the both sides of the mensuration chute 11 that the 11A of platform portion is clipped in the middle on locating, a pair of contactor 20 that configuration has measurement terminal.
Below with reference to Fig. 2～Fig. 7, the formation of contactor 20 is described.As shown in Figure 2, contactor 20 has 4 pairs of measurement terminal being made of the 1st measurement terminal 21A and the 2nd measurement terminal 21B to 21.Measurement terminal is identical at the radical of the pin 3 of a side with determination object SMD1 to 21 quantity.Measurement terminal 21A, 21B isolate mutually, and alternately configuration on " Y " direction.
As shown in Figure 3, the leading section side direction directions X of measurement terminal 21A, 21B is the bending of approximate right angle.And for example shown in Figure 5, the front of the sweep of measurement terminal 21A protrudes in measurement terminal 21B a little.The length of the bend of measurement terminal 21A is longer than the bend of measurement terminal 21B a little, and the front end of measurement terminal 21A protrudes in the front end of measurement terminal 21B.
As shown in Figure 6, measurement terminal 21A, 21B to mutual region direction extension width, have the mutual subtend zone on above-below direction at leading section on the part of expansion.On the subtend zone of measurement terminal 21B, the insulating element 31 that cementation is made of pottery etc.Because insulating element 31 is measurement terminal 21A, the 21B isolation of insulating, so can prevent both short circuits.Because only insulating element 31 is arranged on regional go up (front end area among the figure) of a part of the bend of measurement terminal 21B, so, can not cause measurement terminal 21B to deform because of the weight of insulating element 31.In addition, insulating element 31 can as long as cement in a convenience of each object face of measurement terminal 21A, 21B at least.
As shown in Figure 2, the base portion of measurement terminal 21A, 21B is kept by the holding member 23 that the insulator by plastics etc. constitutes jointly.Printed base plate 25 is fixed on the downside of holding member 23, and the graphics circuitry on the substrate 25 is electrically connected with measurement terminal 12A, 21B formation.Insert the connector of analyzer at the downside of substrate 25, thereby constitute the current circuit of contactor 20 and analyzer.
4 pairs of measurement terminal 21 both sides are disposed 2 support components 27 that it highly is lower than measurement terminal 21A, 21B.The root of support component 27 and measurement terminal together are fixed on the holding member 23 21, are provided with between its leading section across measurement terminal 21 limiting part 29.Support component 27 is made of elastomeric material, has belt like shape, can form strain at its thickness direction (directions X), and can not form strain on its Width (Y direction).
As shown in Figure 7, on the limiting part 29 that is fixed on the support component 27, form 8 through hole 29A that the cross section is an essentially rectangular.Through hole 29A is corresponding 8 measurement terminal 21A, 21B and be provided with, and respectively inserts 1 measurement terminal 21A, 21B in each through hole 29A.The length of through hole 29A on Y direction (the 1st direction) and measurement terminal 21A, the 21B same length on the Y direction of inserting in the logical through hole 29A.In fact, through hole 29A is longer than measurement terminal 21A, the 21B length in the Y direction slightly in the length of Y direction, and measurement terminal 21A, 21B can carry out small moving on the direction of width in through hole 29A.
On the other hand, the length of through hole 29A on directions X (the 2nd direction) is fully greater than measurement terminal 21A, the 21B length (thickness) at directions X.For example, the former length can be greater than about 2 times of latter's length.Lead in the through hole 29A that forms like this by measurement terminal 21A, 21B are inserted, limited measurement terminal 21A, 21B moving on the Y direction on the one hand, guaranteed the degree of freedom that moves on directions X on the other hand again.In Fig. 7, represent each the slotting measurement terminal 21A in through hole 29A, section of 21B of leading to oblique line.
In addition, the situation of inserting logical 1 measurement terminal 21A, 21B in each through hole 29A respectively has been described, but also can in each through hole, have inserted logical 1 pair of measurement terminal respectively at this.In this case, constituting between measurement terminal right measurement terminal 21A, the 21B and must insulate completely.
As shown in Figure 1, the contactor hold-down screw 15 of the contactor 20 of Gou Chenging like this, its root screw 23A by passing holding member 23 is fixed on the 11A of platform portion that measures chute 11.Allocating and measuring terminal 21A, 21B make its orientation with the pin 3 of SMD1 consistent, the leading section of measurement terminal 21A, 21B are configured in the side of the pin 3 of corresponding SMD1.At this moment, the leading section of measurement terminal 21A is positioned at the base portion side of pin 3, and the leading section of measurement terminal 21B is positioned at the front of pin 3.The limiting part 29 of contactor 20 is connected with the leading section of pushing parts 17.Push parts 17 and push driving limiting part 29 to the center position of the 11A of platform portion that measures chute 11.
Fig. 8 represents that so the circuit of the electronic device determinator of formation constitutes.The control part 41 of all actions of control electronic device determinator connects with the parts drive division 17A that pushes that parts 17 are pushed in the push part drive division 13A and the driving of the analyzer 43 that is connected with contactor 20, driving pressing component 13 respectively.
Below, with reference to Fig. 9, the action of the electronic device determinator that constituted is described.At first, to measuring on the locating of chute 11, then, control part 41 control pressing component drive division 13A descend pressing component 13 the SMD1 conveyance.Thereby, SMD1 is clamped between the 11A of platform portion that measures chute 11 and the pressing component 13 (step S1).Then, drive division 17A is pushed in control part 41 control, makes its driving push parts, pushes the limiting part 29 of contactor 20 to the direction of the central shaft of the 11A of platform portion that measures chute 11.Thereby the such central axis direction to platform portion 11A of limiting part 29 shown in Figure 10 A moved.Along with moving of limiting part 29, measurement terminal is crooked gradually to 21 ( measurement terminal 21A, 21B), and each leading section forms with the same side (top) of the pin 3 of SMD1 respectively and contacts (step S2).
At this moment, because through hole 29A limits measurement terminal 21A, 21B to the moving of Y direction, so, can prevent the offset of each leading section on the Y direction of measurement terminal 21A, 21B.Even offset has taken place, owing to guaranteed the one-movement-freedom-degree on measurement terminal 21A, the 21B directions X in through hole 29A, so utilize limiting part 29 and manage between the parts 23 measurement terminal 21A, 21B the part elasticity, can prevent that each leading section from entering between the pin of adjacency the pin of bending SMD1.In addition, because measurement terminal 21A, 21B are at the width broadening of its leading section, so can prevent also that thus leading section from entering between the pin of adjacency the pin of bending SMD1.Its result can reduce the loose contact of pin 3 and graphics circuitry plate when carrying out the installation of SMD1 on moulding graphics circuitry plate.
As shown in figure 11, observe from the base portion side of pin 3, then arrow 1. the pin 3 of direction and SMD1 form obtuse angle θ, when 1. direction was pushed the leading section of measurement terminal 21A from this arrow, the leading section of measurement terminal 21A made the side of pin 3 slide to arrow direction 2. towards its root.Its result, shown in Figure 10 B, interval between the leading section of the leading section of measurement terminal 21A and measurement terminal 21B forms expansion, measurement terminal 21A, 21B respectively dividually with the base portion side and the front end side contact of pin 3.
On the other hand, because measurement terminal 21A is longer than the 2nd measurement terminal 21B at the length tip of the part that is bent, and the leading section of measurement terminal 21A protrudes in measurement terminal 21B, so measurement terminal 21A is stronger than the pressing force of measurement terminal 21B to the pressing force of the pin 3 of SMD1.If observe from pin 3 sides, then with base portion side that measurement terminal 21A contacts on be subjected to bigger power, with front that measurement terminal 21B contacts on then only be subjected to smaller power.Like this, the bending of pin 3 can be prevented, thereby the loose contact of pin 3 and graphics circuitry plate when on moulding graphics circuitry plate, carrying out the installation of SMD1 can be reduced.
Then, the pin 3 that forms with SMD1 at the leading section of measurement terminal 21A, 21B separates under the state of contact, SMD1 is carried out the electrical characteristics determining (step S3) of the Kai Erfen way of contact.At this moment, pass through pin 3 loading currents or the voltage of measurement terminal 21A from analyzer 43 to SMD1, detect the curtage that can draw its result by measurement terminal 21B, analyze by 43 pairs of these testing results of analyzer then, thereby can know the electrical characteristics of this SMD1.
Under general situation, the contact impedance that loads with measurement terminal is the reason that causes this measurement terminal leading section heating to damage, and is subjected to the influence of contact impedance little and detect with measurement terminal.Therefore, the pin 3 to SMD1 is pushed with more intense power, with the measurement terminal 21A of the contact impedance that reduces itself and pin 3 as the loading measurement terminal.And pin 3 is pushed with more weak power, with the 2nd measurement terminal 21B of the bigger contact impedance of formation as the mensuration measurement terminal.Like this, can prolong the life-span of measurement terminal.
In addition, as shown in figure 11, the leading section of measurement terminal 21A on the surface of the pin 3 of SMD1 when arrow direction is 2. slided, pin 3 surfaces are gone up the oxidation film layers that form and will be peeled off.Therefore, pin 3 surfaces of being stripped from oxidation film layer by measurement terminal 21A is contacted powerfully can reduce the contact impedance that causes evaluated error, thereby can improve the accuracy of mensuration.
In addition, though the mensuration of SMD1 is to carry out under the open state of each leading section of measurement terminal 21A, 21B, even but under the not open state of leading section, pass through the 1st measurement terminal 21A under pin 3 loading currents or voltage condition, owing between the leading section of measurement terminal 21A, 21B, be provided with insulating element 31, so can not reduce the accuracy of mensuration.
After measuring end, pressing component 13 is risen to go back original position, the 11A of platform portion of the determined chute 11 of releasing SMD1 and the state (step S4) that pressing component 13 grips.Thereby SMD1 can be gone up at above-below direction (Z direction) to be moved.Under this state, remove and push pushing of 17 pairs of limiting parts 29 of parts.Thereby make measurement terminal 21A, 21B under the effect of reaction force, revert to original state, make the leading section of measurement terminal 21A, 21B separate (step S5) with the pin 3 of SMD1.
Like this, SMD1 is formed can be after the state that above-below direction moves, by separating the leading section of measurement terminal 21A from the pin 3 of SMD1,2. the leading section of measurement terminal 21A to not sliding in the opposite direction the side with arrow, and directly separate to arrow direction 3..Therefore, on the leading section of oxidation film layer particle under can preventing to be stripped from, thereby can prolong life-span of measurement terminal 21A attached to measurement terminal 21A.
In addition, even under each leading section of the separated measurement terminal 21A that opens, 21B from the pin of SMD1 is under the state that closes up measurement terminal 21A loading current or voltage condition, owing to dispose insulating element 31 between each leading section of measurement terminal 21A, 21B, so can prevent the mensuration mistake that takes place because of the short circuit between measurement terminal 21A, the 21B.
The electronic device determinator of present embodiment is owing to making the leading section of measurement terminal 21A, 21B contact with the same side of the pin 3 of SMD1, so the amount of movement of measurement terminal 21A, 21B is littler than measurement terminal 121B in the past shown in Figure 13.Therefore, need in the way of measurement terminal 21A, 21B, contact site be set, and can reduce to cause the contact impedance of the reason of evaluated error, thereby can improve the accuracy of mensuration.
In addition, present embodiment is to be that the situation of SMD1 shown in Figure 12 is the explanation that example is carried out with determination object, but also can be other electronic devices beyond the SMD1.The pin that for example also can be subtend is for being the electronic device of Eight characters shape ground straight line expansion from its base portion.
As mentioned above, the present invention is arranged to respectively base portion side and front end side contact with the same one side of the pin of electronic device to the 1st and the 2nd measurement terminal, the leading section that contacts with pin of the 1st measurement terminal protrudes in the leading section of the 2nd measurement terminal, pushes pin from forming from the base portion side of the pin direction that forms the obtuse angle of looking.Because the leading section of the 1st measurement terminal protrudes in the leading section of the 2nd measurement terminal, so the 1st measurement terminal can be pushed the pin of electronic device with the power stronger than the 2nd measurement terminal, thereby can prevent the bending of pin.Therefore, the pin in the time of can reducing the installation of on moulding graphics circuitry plate, carrying out electronic device and the loose contact of graphics circuitry plate.In addition, use measurement terminal as loading, the 2nd measurement terminal that contact impedance is bigger is used measurement terminal as measuring, can reduce the evaluated error of electronic device, can improve the accuracy of mensuration by the 1st measurement terminal that the handle and the contact impedance of pin are smaller.
In addition, in the through hole of limiting part, make with the pin of electronic device and be longer than the length of the 1st or the 2nd measurement terminal in the 2nd direction in the length of the 2nd vertical direction of orientation (the 1st direction).Like this, the degree of freedom of the 1st and the 2nd measurement terminal on the 2nd direction in the through hole can be guaranteed, the elasticity of the 1st and the 2nd measurement terminal of part between limiting part and holding member can be utilized.Thereby,, also can prevent to enter into the bending that causes pin between 2 adjacent pins because of this leading section even the leading section of the 1st and the 2nd measurement terminal forms dislocation in the orientation of pin.
In addition, by expand the width of the 1st and the 2nd measurement terminal at leading section, even under the situation that takes place in the orientation of leading section at pin of the 1st and the 2nd measurement terminal to misplace, also can prevent to enter into the bending that causes pin between 2 adjacent pins because of this leading section.
In addition, by stopping the 1st and the 2nd measurement terminal being separated with the pin of electronic device, can make the leading section of measurement terminal not be formed on the lip-deep slip of pin, and separate measurement terminal after the gripping of electronic device.Therefore, on the leading section of particle attached to measurement terminal of the oxidation film layer under can preventing to be stripped from, thereby can prolong the life-span of measurement terminal.
Claims (8)
1. electronic device determinator, be a kind of a plurality of pins that make the 1st and the 2nd measurement terminal contact electronic device respectively, the electronic device determinator of described electronic device being measured with the Kai Erfen way of contact, it is characterized in that: the described the 1st and the 2nd measurement terminal is made of the rubber-like material, and, being configured to can be respectively and the base portion side and the front end side contact of the same one side of described pin, the leading section of described the 1st measurement terminal protrudes in the leading section of described the 2nd measurement terminal, and described leading section is pushed described pin from forming from the direction at the obtuse angle that described pin base portion side is looked.
2. electronic device determinator according to claim 1 is characterized in that: between the described the 1st and the 2nd measurement terminal insulating element is set.
3. electronic device determinator according to claim 2 is characterized in that: only on the front end area of the leading section of the 1st and the 2nd measurement terminal insulating element is set.
4. electronic device determinator according to claim 1 is characterized in that: the radial section area of described the 1st measurement terminal is greater than the radial section area of described the 2nd measurement terminal.
5. electronic device determinator according to claim 1 is characterized in that: the hold assembly with described electronic device of clamping on the locating of described electronic device.
6. electronic device determinator, be a kind of a plurality of pins that make the 1st and the 2nd measurement terminal contact electronic device respectively, electronic device determinator so that the Kai Erfen way of contact is measured described electronic device is characterized in that: comprise the holding member that keeps with each base portion of the described the 1st and the 2nd measurement terminal of described pin right angle intersection; Have to be moved freely at its thickness direction and insert logical a plurality of through holes, restriction the described the 1st and the 2nd measurement terminal and be parallel to the limiting part that moves on the 1st direction of orientation of described pin by the described the 1st and the 2nd measurement terminal; Push described limiting part, make the described the 1st and the 2nd measurement terminal to the parts of pushing that move near the direction of described pin, each leading section of the described the 1st and the 2nd measurement terminal is bent to described pin side, its front end area is in the mutual subtend of above-below direction, and the length of the through hole of described limiting part on 2nd direction vertical with the 1st direction is greater than the length of the described the 1st or the 2nd measurement terminal on the 2nd direction.
7. electronic device determinator, be a kind of a plurality of pins that make the 1st and the 2nd measurement terminal contact electronic device respectively, electronic device determinator so that the Kai Erfen way of contact is measured described electronic device is characterized in that: comprise the holding member that keeps with each base portion of the described the 1st and the 2nd measurement terminal of described pin right angle intersection; Have by the described the 1st and the 2nd measurement terminal and move the limiting part of inserting freely in logical a plurality of through holes, restriction the described the 1st and the 2nd orientation of measurement terminal that moves at its thickness direction at described pin; Push described limiting part, make the described the 1st and the 2nd measurement terminal to the parts of pushing that move near the direction of described pin, each leading section of the described the 1st and the 2nd measurement terminal is bent to described pin side, its front end area is launched in the orientation of described pin, and in the mutual subtend of above-below direction.
8. the assay method of an electronic device is characterized in that: comprises electronic device conveyance on locate with pin, and the 1st operation that grips with hold assembly; The the 1st and the 2nd measurement terminal of electronic device mensuration usefulness is pressed into the 2nd operation of the pin of described electronic device; Use the described the 1st and the 2nd measurement terminal carry out described electronic device electrical characteristics determining the 3rd operation; After the mensuration of described electronic device finishes, remove by the 4th operation of described hold assembly to the clamping of described electronic device; The 5th operation of separating with the pin that makes the described the 1st and the 2nd measurement terminal from described electronic device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001286629 | 2001-09-20 | ||
| JP2001286629A JP4024023B2 (en) | 2001-09-20 | 2001-09-20 | Electronic component measuring apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1405873A true CN1405873A (en) | 2003-03-26 |
| CN1204615C CN1204615C (en) | 2005-06-01 |
Family
ID=19109574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021424950A Expired - Lifetime CN1204615C (en) | 2001-09-20 | 2002-09-20 | Electronic device measuring device and method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4024023B2 (en) |
| KR (1) | KR100508376B1 (en) |
| CN (1) | CN1204615C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1314974C (en) * | 2004-08-06 | 2007-05-09 | 中国科学院上海微系统与信息技术研究所 | Device structure for detecting nano electronic device property and preparing method |
| CN111366811A (en) * | 2020-03-19 | 2020-07-03 | 北京广利核系统工程有限公司 | Integrated automatic inspection device and method for electronic components |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006068156A1 (en) * | 2004-12-22 | 2006-06-29 | Opto System Co., Ltd. | Kelvin probe |
| JP4831614B2 (en) * | 2006-08-15 | 2011-12-07 | 株式会社ヨコオ | Kelvin inspection jig |
| JP5144997B2 (en) * | 2007-09-21 | 2013-02-13 | 東京特殊電線株式会社 | Contact probe unit and manufacturing method thereof |
| JP5086872B2 (en) * | 2008-04-07 | 2012-11-28 | ルネサスエレクトロニクス株式会社 | Contact mechanism of electronic component measuring device and electronic component measuring device using the same |
| KR20140020892A (en) * | 2011-05-26 | 2014-02-19 | 이스메카 세미컨덕터 홀딩 에스.아. | Clamp |
| CN114325339B (en) * | 2021-12-31 | 2024-04-05 | 苏州思迈尔电子设备有限公司 | Sensor circuit board detection device and detection method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158939A (en) * | 1982-03-16 | 1983-09-21 | Nec Corp | Measurement of semiconductor wafer chip |
| JPH05144895A (en) * | 1991-11-20 | 1993-06-11 | Nec Yamagata Ltd | Probe card |
| US6121783A (en) * | 1997-04-22 | 2000-09-19 | Horner; Gregory S. | Method and apparatus for establishing electrical contact between a wafer and a chuck |
| KR19980084369A (en) * | 1997-05-23 | 1998-12-05 | 배순훈 | Kelvin Probe Tips |
| JPH1164385A (en) * | 1997-08-21 | 1999-03-05 | Hitachi Electron Eng Co Ltd | Probe for substrate for inspection |
-
2001
- 2001-09-20 JP JP2001286629A patent/JP4024023B2/en not_active Expired - Lifetime
-
2002
- 2002-09-18 KR KR10-2002-0056949A patent/KR100508376B1/en active IP Right Grant
- 2002-09-20 CN CNB021424950A patent/CN1204615C/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1314974C (en) * | 2004-08-06 | 2007-05-09 | 中国科学院上海微系统与信息技术研究所 | Device structure for detecting nano electronic device property and preparing method |
| CN111366811A (en) * | 2020-03-19 | 2020-07-03 | 北京广利核系统工程有限公司 | Integrated automatic inspection device and method for electronic components |
| CN111366811B (en) * | 2020-03-19 | 2022-06-21 | 北京广利核系统工程有限公司 | Integrated automatic inspection device and method for electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1204615C (en) | 2005-06-01 |
| KR100508376B1 (en) | 2005-08-17 |
| JP4024023B2 (en) | 2007-12-19 |
| JP2003090849A (en) | 2003-03-28 |
| KR20030025839A (en) | 2003-03-29 |
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