JP5144997B2 - Contact probe unit and manufacturing method thereof - Google Patents

Description

  The present invention relates to a contact probe unit for inspection mainly used for continuity inspection of electronic components and substrates, and a method for manufacturing the same. More specifically, in an inspection unit that measures the electrical characteristics by bringing the tip of the contact probe attached to the contact probe unit into contact with the object to be measured, the contact probe can be easily attached, and troubles during attachment can be reduced as much as possible. The present invention relates to a contact probe unit having a structure and a manufacturing method thereof.

  In recent years, various circuit boards such as high-density mounting boards used for mobile phones and the like, IC package boards such as BGA (Ball Grid Array) and CSP (Chip Size Package) incorporated in personal computers, etc., are often used. Yes. Such a circuit board is subjected to, for example, a measurement of a direct current resistance value or a continuity test in the processes before and after mounting, and the electrical characteristics of the circuit board are inspected. The inspection of the electrical characteristics is performed using an inspection apparatus jig (hereinafter referred to as “contact probe unit”) connected to an inspection apparatus for measuring the electrical characteristics. For example, the inspection apparatus is mounted on the contact probe unit. This is performed by bringing the tip of a pin-shaped probe (referred to as “contact probe” in this application) into contact with an electrode (hereinafter also referred to as “measurement object”) of the circuit board (see, for example, Patent Document 1). ).

  FIG. 4 is a schematic view showing an example of a conventional contact probe unit. A contact probe unit 110 shown in FIG. 4 includes a plurality of to several thousand contact probes 101a and 101b, and guide plates 130 (131a and 131b) with guide holes 131 (131a and 131b) for guiding the lead wires 150 of the contact probes 101a and 101b. 130a and 130b) and the guide holes 121 (121a) for guiding the electrode sides of the contact probes 101a and 101b so that the end portions 102a of the contact probes 101a and 101b are in contact with the electrode (measurement object) 111 formed on the printed circuit board 112. , 121b) with a guide plate 120. The contact probes 101a and 101b used are a body portion in which a linear metal conductor 102 having a spring property is covered with an insulating film 103, and both end portions where the metal conductor 102 is exposed after the insulating film 103 is peeled off. It consists of and. Both ends of the contact probes 101a and 101b are composed of an end portion 102a in contact with the electrode 111 on the printed circuit board 112 and an end portion 102b in contact with the lead wire 150 on the inspection apparatus side.

  In the inspection of the electrical characteristics, the contact probe unit 110 and the electrode 111 on the printed circuit board 112 are relatively moved up and down, and a predetermined pressure is applied to the electrode 111 using the elastic force generated by the bending of the spring contact probes 101a and 101b. It is done by pressing with. At this time, the contact probes 101a and 101b are deflected by the force pressed against the electrode 111, and the end 102b is in strong contact with the lead wire 150, and an electrical signal from the electrode 111 passes through the lead wire 150 and the inspection device ( (Not shown). In FIG. 4, the guide plate 130 is constituted by two guide plates 130a and 130b, the guide plate 120 is constituted by one piece, and the reference numeral 140 is a holding plate for holding the lead wires. .

  In the contact probe unit 110, the guide hole 131 provided in the guide plate 130 is formed larger than the diameter of the body part of the contact probes 101a and 101b, while the guide hole 121 provided in the guide plate 120 is The contact probes 101 a and 101 b are formed with a diameter smaller than the diameter of the body portion and larger than the diameter of the metal conductor 102. Accordingly, the setting of the contact probes 101a and 101b to the contact probe unit 110 is performed by inserting the contact probes 101a and 101b into the guide holes 131 (131a and 131b) provided in the guide plate 130, and then the tip side thereof. When the end surface 103a of the insulating coating 103 is hooked on the edge of the guide hole 121 (121a, 121b) of the guide plate 120, the contact probes 101a, 101b are held and prevented from falling.

By the way, when accurately inspecting the continuity of the wiring produced on the printed circuit board, it is preferable to perform the four-terminal method measurement. Measurement is required. If such a four-terminal method measurement is to be performed with the contact probes 101a and 101b, as shown in FIG. 4, a pair of contact probes 101a and 101b must be brought into contact with the electrode 111 such as a solder bump at the same time. For this purpose, it is necessary to shorten the interval between the two contact probes 101a and 101b. In such a contact probe unit 110, if the lengths (widths) of the bridges 132 and 122 between the guide holes 131 and 121 respectively provided in the upper and lower guide plates 130 and 120 are shortened, two contacts are provided. The interval between the probes 101a and 101b can be shortened.
JP 2002-131334 A

  However, when the length of the bridges 132 and 122 between the guide holes 131 and 121 is shortened, the following problem occurs.

  That is, when the contact probes 101a and 101b are attached to the contact probe unit 110, first, the first contact probe 101a is inserted into the guide hole 131a of the guide plate 130a disposed above, and then another guide plate is continuously provided. It is inserted into the guide hole 131a of 130b. Thus, the first contact probe 101a is directed toward the guide hole 121a of the guide plate 120 disposed below. However, since the length of the bridge 122 between the two guide holes 121a and 121b is shortened as described above, when the contact probe 101a is inserted into the lower guide hole 121a, the end portion 102a of the contact probe 101a. However, it will enter the guide hole 121b adjacent to the guide hole 121a to be inserted. When such a phenomenon occurs, the second contact probe 101b inserted into the guide hole 131b cannot enter the guide hole 121b to be inserted, and the first contact probe 101a is obstructed and vacant. It cannot be inserted into the guide hole 121a.

  Such defects make the manufacture of the contact probe unit 110 extremely cumbersome and inefficient. In particular, when the contact probes 101a and 101b are bent even slightly, there is a high possibility that such erroneous insertion will occur.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an inspection unit that measures the electrical characteristics by bringing the tip of the contact probe attached to the contact probe unit into contact with the object to be measured. It is an object of the present invention to provide a contact probe unit having a structure in which a contact probe can be easily mounted and troubles during mounting can be reduced as much as possible. Another object of the present invention is to provide a method for manufacturing such a contact probe unit.

The contact probe unit of the present invention for solving the above-described problem has a body portion having an insulating coating on the outer periphery of a pin-shaped metal conductor, and end portions having no insulating coating on both ends of the metal conductor, A pair of contact probes having different outer diameters of the metal conductor and the body portion, and at least two guide plates each having a guide hole for guiding each of the contact probes having different outer diameters having different diameters; A contact probe unit of a type for measuring electrical characteristics by bringing the tip of each contact probe inserted into a guide hole of the guide plate into contact with a measured object,
The at least two guide plates are fixed at a fixed distance, and a guide hole provided in one of the guide plates guides through the body portions of the contact probes having different outer diameters. The guide hole provided in the other guide plate guides only the metal conductor exposed at the tip of each of the contact probes having different outer diameters, and has a small diameter. The hole is formed in a size that does not allow the metal conductor of the contact probe having a large outer diameter to pass therethrough.

  According to the present invention, in the guide plate in which the guide hole for allowing only the metal conductor to pass is formed, the guide hole formed with a small diameter is formed with a size that does not allow the metal conductor of the contact probe having a large outer diameter to pass. Therefore, the metal conductor of the contact probe having a large outer diameter does not enter the guide hole. As a result, if a contact probe is inserted in the procedure of inserting a contact probe having a large outer diameter into at least two guide plates and then inserting a contact probe having a small outer diameter into at least two guide plates, the first insertion is performed. The metal conductor at the tip of the contact probe having a large outer diameter does not enter the wrong guide hole and can be securely inserted into the guide hole to be inserted. Therefore, there is no problem that the contact probe cannot be inserted into the guide hole to be inserted, and the contact probe cannot be inserted into the empty guide hole. Therefore, according to the present invention, the contact probe unit can be manufactured very efficiently because it has the above-described structure. Further, even if the contact probe is slightly bent, there is a possibility of erroneous insertion. Absent.

  As a preferred embodiment of the contact probe unit of the present invention, the bridge length between the guide holes for guiding the contact probes having different outer diameters is in a range of 15 μm or more and 100 μm or less, and the contact probes having different outer diameters are guided. The difference in the hole diameters of the guide holes is in the range of 13 μm or more and 50 μm or less.

  According to this invention, if the difference between the bridge length between the guide holes and the hole diameter of both guide holes is within the above range, the contact probe can be prevented from entering the wrong guide hole.

  As a preferred embodiment of the contact probe unit of the present invention, the contact probe tip on the side in contact with the measurement object is configured to be flat or substantially hemispherical.

  According to this invention, when the tip of the contact probe is a flat shape or a substantially hemispherical shape, even if the tip of the contact probe faces the wrong guide hole, it does not fit into the wrong guide hole. Therefore, it is particularly preferable.

A method of manufacturing a contact probe unit according to the present invention for solving the above-described problems includes a body portion having an insulating coating on the outer periphery of a pin-shaped metal conductor and end portions having no insulating coating on both ends of the metal conductor. A pair of contact probes having different outer diameters of the metal conductor and the body portion, and at least two guide plates each having a guide hole for guiding each of the contact probes having different outer diameters with different hole diameters; A contact probe unit manufacturing method for measuring electrical characteristics by bringing the tip of each contact probe inserted into a guide hole of the guide plate into contact with a measured object,
In the step of inserting each of the contact probes having different outer diameters into the guide holes, at least one guide plate having the guide holes is disposed on the upper side and at least one guide plate is disposed on the lower side. Is inserted into a large-diameter guide hole provided in the lower at least one guide plate, and then inserted into a large-diameter guide hole provided in the lower at least one guide plate. After the contact probe having the smaller outer diameter is inserted into a small diameter guide hole provided in at least one upper guide plate, the outer diameter is increased by being provided in at least one lower guide plate. It is characterized by being inserted into a guide hole having a small diameter that does not allow the metal conductor of one of the contact probes to pass through.

  According to the present invention, since at least one guide plate below is provided with a small diameter guide hole that does not allow the metal conductor of the contact probe with the larger outer diameter to pass therethrough, the contact with the larger outer diameter is provided. The probe can be inserted into a predetermined guide hole provided in the upper and lower guide plates. As a result, a contact probe with a small outer diameter to be subsequently inserted into the guide hole can also be inserted into a predetermined guide hole provided in the upper and lower guide plates. According to the present invention, since contact probes having different outer diameters can be inserted into the predetermined guide holes without error, the contact probe unit can be manufactured extremely efficiently, and the contact probes Even if it is bent, there is no possibility of erroneous insertion.

  As a preferred aspect of the method for manufacturing the contact probe unit of the present invention, when the contact probe having the larger outer diameter is inserted into the guide hole of the guide plate disposed below, the guide plate is vibrated. .

  According to the present invention, if the contact probe having the larger outer diameter is inserted into the guide hole of the guide plate disposed below while the guide plate is vibrated, the tip of the contact probe becomes an incorrect guide hole. Even when it is faced, its tip can move on the guide plate by vibration to enter a predetermined guide hole. As a result, even if the contact probe is slightly bent and does not immediately enter the predetermined guide hole, the contact probe unit can be easily inserted into the predetermined guide hole by vibration. Can be done automatically.

  As a preferred aspect of the method for manufacturing the contact probe unit of the present invention, the contact probe tip on the side in contact with the object to be measured is configured to have a flat shape or a substantially hemispherical shape.

  According to the present invention, as described above, even when the tip of the contact probe faces the wrong guide hole, it does not fit into the wrong guide hole.

  According to the contact probe unit of the present invention, since the metal conductor of the contact probe having a large outer diameter does not enter the guide hole formed with a small diameter, the contact probe having the large outer diameter is at least provided. If you insert the contact probe in the procedure of inserting the contact probe with a small outer diameter into at least two guide plates after inserting into the two guide plates, the metal conductor at the tip of the contact probe with the large outer diameter that was inserted first Can be reliably inserted into the guide hole to be inserted without entering the wrong guide hole. As a result, the conventional problem, that is, the problem that the second contact probe cannot be inserted into the guide hole to be inserted and cannot be inserted into the empty guide hole, does not occur. Therefore, according to the present invention, even when a slightly bent contact probe is used, the contact probe unit can be manufactured very efficiently without erroneous insertion.

  According to the method for manufacturing a contact probe unit of the present invention, the contact probe with the larger outer diameter can be inserted into a predetermined guide hole provided in the upper and lower guide plates, and then inserted into the guide hole. A contact probe having a small outer diameter can also be inserted into a predetermined guide hole provided in the upper and lower guide plates. As a result, the contact probe unit can be manufactured very efficiently without erroneous insertion.

  Hereinafter, a contact probe unit and a manufacturing method thereof according to the present invention will be described with reference to the drawings. In addition, this invention is not limited to the following embodiment.

[Contact probe unit]
FIG. 1 is a configuration diagram showing an example of a contact probe unit of the present invention. FIG. 2 is a plan view (A) and an AA ′ sectional view (B) showing an example of a guide hole formed in the guide plate. FIG. 3 is a cross-sectional view showing a preferred example of the tip shape of the contact probe attached to the contact probe unit of the present invention.

  As shown in FIG. 1, the contact probe unit of the present invention (hereinafter abbreviated as “probe unit 10”) has a pair of contact probes (hereinafter referred to as “probe 1a”) having different outer diameters of the metal conductor 2 and the body portion A. , 1b ") and at least two guide plates 20, 30 provided with different diameters in the guide holes 21, 31 (21a, 21b, 31a, 31b). This is a probe unit that measures electrical characteristics by bringing the tip 2a of each of the probes 1a and 1b inserted into the guide holes 21 and 31 into contact with the measured object 11.

  In the probe unit 10 of the present invention, the at least two guide plates 20 and 30 are fixed at a certain distance, and one of the guide plates 20 and 30 (the upper side or the lead wire side in FIG. 1). The guide holes 31a and 31b provided in the guide plate 30 (30a and 30b) of the contact probe 1a and 1b having different outer diameters are guided through the body portions A, respectively. Guide holes 21a and 21b provided in the guide plate 20 (also referred to as the lower side or the measured object side in FIG. 1) are metal conductors exposed at the distal ends B of the contact probes 1a and 1b having different outer diameters. The guide hole formed with a small diameter is 21b from the large outer diameter. It is formed in a size that does not pass through the metal conductor 2 of the contact probe 1a that. Hereinafter, the configuration of the present invention will be described in detail.

(Contact probe)
As shown in FIG. 1, the probe 1 has a body portion A having an insulating coating 3 on the outer periphery of a pin-shaped metal conductor 2, and an end B having no insulating coating 3 at both ends of the metal conductor 2, It is a set of probes in which the outer diameters of the metal conductor 2 and the body part A are different. Then, by applying a weight to both ends of the probe 1 and deflecting it, it is possible to obtain a contact pressure with respect to the measured object 11 and measure the electrical characteristics. In FIG. 1, the lower end 2a of the metal conductor 2 is an end in contact with the electrode 11 formed on the printed circuit board 12, and the upper end 2b of the metal conductor 2 is on the inspection device side. It is an end that is arranged and contacts the lead wire 50 of the inspection device (not shown). The peeling end surface 3a of the insulating coating 3 is a processed end surface of the insulating coating 3 on the lower end portion 2a side and hits the guide holes 21a and 21b of the guide plate 20 arranged on the lower side of FIG. Acts so as not to fall out of the guide holes 21a and 21b.

  As the metal conductor 2, a metal wire (also referred to as “metal spring wire”) having high conductivity and high elastic modulus is used. Examples of the metal used for the metal conductor 2 include a metal having a wide elastic range. For example, a copper alloy such as beryllium copper, tungsten, rhenium tungsten, steel (for example, high speed steel: SKH) or the like is preferably used. it can. Such a metal conductor 2 can be usually obtained by performing plastic working such as cold or hot wire drawing until the metal becomes a linear conductor having a predetermined diameter.

  In the present invention, since the metal conductor 2 and the body portion A have two pairs of probes 1a and 1b having different outer diameters, each metal conductor 2 constituting the pair of probes 1 has a large outer diameter. A metal conductor and a metal conductor with a thin outer diameter are used. Since the pair of probes 1a and 1b are simultaneously in contact with the electrode 11 as the object to be measured, the outer diameter of each metal conductor 2 is selected in consideration of the size of the electrode 11, and is usually 20 μm or more and 400 μm or less, preferably Can be selected from the range of 25 μm to 200 μm, particularly preferably 25 μm to 100 μm. Two metal conductors 2 having different outer diameters within such a range can be inserted into guide holes 21a and 21b having different diameters provided in a lower guide plate 20 described later with a predetermined clearance. In addition to being adjusted, the thicker metal conductor 2 is adjusted so as not to enter the guide hole 21b having a smaller diameter.

  More specifically, the clearance between the diameter of the guide holes 21a and 21b provided in the lower guide plate 20 and the outer diameter of the metal conductor 2 entering each guide hole is not particularly limited, but is usually around 10 μm, For example, it is set in the range of about 8 μm to 15 μm. It goes without saying that the clearance range becomes smaller as the absolute value of the diameter is smaller, but if the value is too small, the insertion becomes hard, and if the value is too large, rattling tends to occur. It is preferable to set an optimum value within the above range by an absolute value.

  In consideration of such clearance and taking into consideration that a processing error of about ± 3 μm, for example, may occur in the processing of the guide holes 21a and 21b, in order to prevent the thicker metal conductor 2 from entering the small guide hole 21b. The difference in the outer diameter of the two metal conductors 2 is usually 13 μm or more, preferably 15 μm or more. The upper limit of the difference in outer diameter is not particularly limited. However, if the difference is too large, the contact pressure with respect to the electrode 11 that is the object to be measured has a problem that the metal conductors 2 greatly differ. Is preferably about 50 μm, for example.

  Examples of the shape of the end portion 2a on the electrode 11 side of the metal conductor 2 include a flat shape, a substantially hemispherical shape, a conical shape, a bell shape, a trapezoidal shape, and the like, but as shown in FIG. The end surface is preferably flat or substantially hemispherical. Such a metal conductor 2 having a flat or substantially hemispherical end face is such that the tip enters the guide holes 21a and 21b and is unlikely to come out like other conical, bell-shaped, or trapezoidal end faces. Even when the tip of the tip faces the wrong guide hole, it is particularly preferable because it does not fit into the wrong guide hole. Such end faces are formed by, for example, grinding using emery paper or grinding using a diamond wheel. Here, the substantially hemispherical shape includes an accurate hemisphere or a substantially hemisphere, and also includes a so-called rounded end surface (an end surface formed with a predetermined radius of curvature). As for the rounded end surface, the tip shape only needs to be processed with a radius that is equal to or larger than the radius of the metal conductor 2, and as the radius becomes large, the tip shape of the metal conductor 2 approaches the flat shape. It is preferable from the above to a flat shape.

  From the viewpoint of facilitating insertion of the probes 1a, 1b without being caught in the guide holes 21a, 21b, 31a, 31b of the guide plates 20, 30, it is preferable that the metal conductor 2 has high straightness. The straightness of the curvature radius R is preferably 1000 mm or more. The metal conductor 2 with high straightness is subjected to straightening treatment before the insulating coating 3 is provided, or by straightening the long metal conductor 2 provided with the insulating coating 3 as described later. Can be obtained. The straightening process here is performed, for example, by a rotary die type straightening apparatus or the like.

  The metal conductor 2 exposed from both ends of the probes 1a and 1b may be provided with a plating layer in order to suppress an increase in contact resistance between the metal conductor 2 and the electrode 11 or the lead wire 50. . Examples of the metal forming the plating layer include metals such as nickel, gold, and rhodium, and alloys such as gold alloys. The plating layer may be a single layer or a multilayer. Preferred examples of the multi-layered plating layer include those in which a gold plating layer is formed on a nickel plating layer. Further, the plating layer may be provided only on the exposed metal conductor 2 or may be formed on the entire metal conductor 2 including under the insulating coating 3.

  The insulating coating 3 is provided on the metal conductor 2 and acts to prevent short circuits by preventing the probes from contacting each other when inspecting the electrical characteristics of the measured object 11. The insulating coating 3 may be provided on the metal conductor 2, that is, on the outer periphery of the metal conductor 2 in the longitudinal direction, and may be provided directly or via another layer. Also good.

  The insulating coating 3 is not particularly limited as long as it is an insulating coating, but any one or two selected from polyurethane resins, nylon resins, polyester resins, epoxy resins, polyesterimide resins, polyamide resins and polyamideimide resins. The above is preferable. Usually, it is formed of one kind of resin. Since the insulating film made of these resins has different heat resistance, it can be arbitrarily selected in consideration of the heat generated during the inspection. For example, when more heat resistance is required, the insulating coating 3 is preferably formed of a polyesterimide resin, a polyamideimide resin, or the like.

  The thickness of the insulating coating 3 is (1) that the electrical insulation is ensured, and (2) the end surface 3a on the electrode 11 side contacts the guide holes 21a and 21b of the lower guide plate 20. It is set on condition that the probes 1a and 1b are so thick that they do not fall through the guide holes 21a and 21b. In addition, when forming the insulating coating 3 by the continuous application method mentioned later, it is related also to the diameter of the metal conductor 2. FIG. Such a thickness is appropriately set within a range of, for example, 5 μm or more and 30 μm or less. For example, when the diameter of the metal conductor 2 is in the range of 40 μm to 100 μm, the thickness is preferably in the range of 5 μm to 20 μm. .

  The body portion A of the contact probes 1a and 1b on which the insulating coating 3 is formed has an outer diameter after the insulating coating 3 having the above thickness is formed on the outer periphery of the metal conductor 2 having the above diameter. When measuring the electrode 11 as a measurement object, the outer diameter is preferably 40 μm or more and 140 μm or less.

  The means for forming the insulating coating 3 is not particularly limited, but it is preferably formed as a baked enamel coating by a continuous coating method. Since the baking enamel coating is formed in a continuous process by repeated application of coating and baking, the productivity is good, the adhesion to the metal conductor 2 is high, and the coating strength can be made higher.

  Such contact probes 1a and 1b are formed by forming an insulating film 3 on a long metal conductor 2 processed to a predetermined diameter by a continuous baking method or the like and then cutting it to a predetermined length. 3 can be obtained by peeling treatment. Examples of the peeling process at both ends include a peeling process by laser irradiation and a mechanical peeling process using a stripper, etc., but there is little damage to the metal conductor 2 and the peeling end surface is caught in the guide holes 21a and 21b. From the viewpoint of being able to “stand” so as to be easy, peeling of the insulating coating 3 by excimer laser irradiation is preferable. Then, the contact probes 1a and 1b constituting the present invention are manufactured by grinding both ends into the end face shape. In addition, you may perform a grinding process between a cutting process and a peeling process. The removal of the insulating coating 3 may be performed before or after grinding both ends. Further, when the insulating coating 3 is removed after the end face is ground, the insulating coating 3 may be removed before or after the plating step.

  The length of the contact probes 1a and 1b is not particularly limited, but is usually in the range of 10 mm to 40 mm. The length of the metal conductor 2 exposed at the end portions 2a and 2b of the contact probes 1a and 1b is preferably about 1 mm to 4 mm, for example, on the electrode 11 side (lower side). The (upper side) length is preferably about 0.05 mm to 2 mm, for example. In particular, the electrode 11 side (lower side) needs to have a length that penetrates the guide plate 20 disposed on the lower side and further contacts the electrode 11.

(Guide plate)
Next, the guide plates 20 and 30 will be described. As shown in FIG. 1, the guide plates 20 and 30 are composed of at least two plates, and the guide plates 20 and 30 have guide holes 21 for guiding the probes 1a and 1b having different outer diameters. , 31 (21a, 21b, 31a, 31b). The guide holes 21, 31 (21a, 21b, 31a, 31b) are provided with different diameters (R ₁ , R ₂ ).

  The guide plates 20 and 30 may be composed of a total of two guide plates, one on the lead wire side (upper side) and one on the electrode 11 side (lower side), for example as shown in FIG. In this way, two sheets may be arranged on the lead wire side (upper side) and one sheet may be arranged on the electrode 11 side (lower side), or more than that. Each guide plate 20, 30 is fixed at a certain distance. The “fixed distance” means that, for example, the distance between the three guide plates shown in FIG. 1 is not equal, but the three guide plates are parallel to each other. As an example of the distance between the guide plates 20 and 30 that are parallel to each other, for example, a distance between the upper guide plates 30a and 30b shown in FIG. Further, the distance between the upper guide plate 30b and the lower guide plate 20 shown in FIG. 1 is related to the length of the contact probes 1a and 1b. For example, the length of the contact probes 1a and 1b is described later. When it is 20 mm as in the embodiment, about 15 mm can be exemplified.

  The guide plate 30 provided on the lead wire side (upper side) guides the contact probes 1a and 1b to contact the predetermined electrode 11 in cooperation with the guide plate 20 provided on the electrode 11 side (lower side). 1 or 2 or more, but as shown in FIG. 1, two are preferable, and it is preferable to arrange the two guide plates 30a and 30b at an interval of 2 mm, for example. .

Each guide plate 30a, 30b is provided with guide holes 31a, 31b having different diameters (R ₁ , R ₂ ), and each guide hole 31a, 31b has an outer diameter corresponding to the guide hole 31a, 31b. The contact probes 1a and 1b are inserted. That is, since the contact holes 1a and 31b are inserted into the guide holes 31a and 31b, the diameters (R ₁ and R ₂ ) of the guide holes 31a and 31b are the same as those of the body portion A of the contact probes 1a and 1b. Greater than diameter. Specifically, the guide holes 31a and 31b are formed with a diameter obtained by adding a predetermined clearance to the outer diameter of the contact probes 1a and 1b. The clearance is usually set in the range of about 10 μm, for example, about 8 μm to 15 μm, as described in the column of the contact probes 1a and 1b.

Of the guide holes 31a and 31b, the guide hole 31a having a large diameter (R ₁ ) allows the contact probe 1a having a large diameter to pass therethrough, while the guide hole 31b having a small diameter (R ₂ ) has a small diameter. The contact probe 1b is passed therethrough. Therefore, the diameters (R ₁ , R ₂ ) of the guide holes 31a, 31b are formed by adding the clearance to the outer diameter of the contact probes 1a, 1b, for example, in the range of 50 μm to 150 μm. Yes. As described above, the outer diameters of the thicker metal conductor 2 and the thinner metal conductor 2 are usually within the range of 20 μm to 400 μm, preferably 25 μm to 200 μm, particularly preferably 25 μm to 100 μm. Since the difference between the selected outer diameters is usually 13 μm or more, and preferably 15 μm or more, the diameters (R ₁ , R ₂ ) of the _two guide holes 31 a and 31 b are insulated from the metal conductor 2. It becomes a value obtained by adding the clearance to the outer diameter of the body portion A to which the film thickness is added, and the difference in diameter (R ₁ −R ₂ ) between the two guide holes 31a and 31b is usually 13 μm or more, preferably 15 μm or more. If the bridge length W between the guide holes and the difference (R ₁ -R ₂ ) between the diameters of the guide holes 31a and 31b are within the above range, the contact probes 1a and 1b are placed in the wrong guide holes. It can be prevented from entering.

  On the other hand, the guide plate 20 provided on the electrode side (lower side) also contacts the contact probe 1a, 1b with the predetermined electrode 11 in cooperation with the guide plate 30 provided on the lead wire side (upper side). Although one sheet or two or more sheets may be used, one sheet is preferable as shown in FIG.

The guide plate 20 is provided with guide holes 21a and 21b having different diameters (R ₁ and R ₂ ). Each guide hole 21a and 21b has an outer diameter corresponding to the guide hole 21a and 21b. Contact probes 1a and 1b are inserted. That is, since only the metal conductor 2 is inserted into the guide holes 21a and 21b, the diameters (R ₁ and R ₂ ) of the guide holes 21a and 21b are the diameters of the end portions B of the contact probes 1a and 1b. Bigger than. Specifically, the guide holes 21a and 21b are formed with a diameter obtained by adding a predetermined clearance to the outer diameter of the metal conductor 2 constituting the contact probes 1a and 1b. The clearance is usually set in the range of about 10 μm, for example, about 8 μm to 15 μm, as described in the column of the contact probes 1a and 1b.

Of the guide holes 21a and 21b, the guide hole 21a having a large diameter (R ₁ ) allows the metal conductor 2 having a large diameter to pass therethrough, while the guide hole 21b having a small diameter (R ₂ ) has a large diameter. The metal conductor 2 cannot pass, and only the metal conductor 2 having a small diameter is allowed to pass therethrough. Therefore, the diameters (R ₁ , R ₂ ) of the guide holes 21a, 21b are formed by adding the above clearance to the outer diameters of the respective metal conductors 2 having different outer diameters, for example, in the range of 40 μm to 120 μm. It is formed with. As described above, the outer diameters of the thicker metal conductor 2 and the thinner metal conductor 2 are usually within the range of 20 μm to 400 μm, preferably 25 μm to 200 μm, particularly preferably 25 μm to 100 μm. The difference between the selected outer diameters is usually 13 μm or more, and preferably 15 μm or more. Therefore, the diameters of the two guide holes 21 a and 21 b are obtained by adding the clearance to the outer diameter of the metal conductor 2. The difference between the diameters of the two guide holes 21a and 21b (R ₁ −R ₂ ) is usually 13 μm or more, and preferably 15 μm or more. If the bridge length W between the guide holes and the difference (R ₁ -R ₂ ) between the diameters of the guide holes 21a and 21b are within the above range, the contact probes 1a and 1b are placed in the wrong guide holes. It can be prevented from entering.

FIG. 2 shows an example of the guide plates 20 and 30 in which guide holes having different diameters are formed. As shown in FIG. 2, the two guide holes 21a, 21b, 31a, 31b having different diameters (R ₁ , R ₂ ) formed in the respective guide plates 20, 30 are formed by the bridges 22, 32 between the guide holes. They are provided adjacent to each other so that the length W is in the range of 15 μm to 100 μm. If the length W of the bridges 22 and 32 is less than 15 μm, the distance between them is too small to make drilling. On the other hand, if the length W of the bridges 22 and 32 exceeds 100 μm, the distance between them may be too large to allow the contact probes 1a and 1b to be brought into contact with one electrode 11 at the same time.

  Strictly speaking, the length W of the bridge 32 in the upper guide plate 30 is not the same as the length of the bridge 22 in the lower guide plate 20, that is, the guide hole 31a formed in the upper guide plate 30. , 31b have the same center coordinates as the guide holes 21a, 21b formed in the lower guide plate 20 and the body portion A of the contact probe is inserted into the bridge 32, rather than the lower guide plate 20. The length of is small. Therefore, the lower limit value 15 μm of the length W of the bridge 22 of the lower guide plate 20 is mainly set in consideration of the drilling of the guide holes 31 a and 31 b formed in the upper guide plate 30.

  In addition, as shown in FIG. 2, in the guide plates 20 and 30, it is preferable that portions where adjacent guide holes are opened have a counterbore shape. The counterbore shape can be obtained by counterbore processing in a depth range of 0.1 mm to 2 mm from the upper surface of the guide plates 20 and 30. The counterbore depth is set according to the diameter of the guide hole to be formed. For example, when drilling with a drill or the like, the thickness of the guide plate 20 is preferably within 10 times the hole diameter of the guide holes 21a, 21b, 31a, 31b. It is preferable to set the depth.

  The size of the counterbore shape is not particularly limited, but is preferably formed to be about 1.3 times the total length of the diameter of the two guide holes and the length W of the bridge. This counterbore shape reduces the thickness of the guide plate 20 at the portion where the guide hole is to be made, so that drilling by a drill or the like can be particularly facilitated. Further, when the contact probes 1a and 1b are to be inserted into the predetermined guide holes, there is an effect that the contact probes 1a and 1b can easily enter the counterbore portion where the predetermined guide holes are formed.

  The probe unit of the present invention is preferably provided with a vibration device (not shown) that vibrates the lower guide plate 20. This vibration device is operated when the contact probe 1a having the larger outer diameter is inserted into the guide hole 21a of the lower guide plate 20. If the contact probe 1a having a larger outer diameter is inserted into the guide hole 21a while the guide plate 20 is vibrated, the end 2a of the contact probe 1a faces the wrong guide hole 21b. Even if it exists, the edge part 2a can move on the guide plate 20 by vibration, and can enter the predetermined guide hole 21a. As a result, even if the contact probe 1a is slightly bent and does not immediately enter the predetermined guide hole 21a, the probe unit can be manufactured very efficiently. In addition, as a vibration apparatus, Shinko Electric Co., Ltd. vibratory repacker VP-4D etc. can be mentioned as an example.

  Further, the probe unit 10 of the present invention has a large number of the above-mentioned two pairs of contact probes (also referred to as contact probe sets). The number of contact probe sets is not particularly limited, but the number and position are determined according to the arrangement of electrodes on the printed circuit board to be measured.

  According to the contact probe unit 10 of the present invention, which is composed of the contact probes 1a, 1b and the guide plates 20, 30 described above, guides in which guide holes 21a, 21b, 31a, 31b through which only the metal conductor 2 passes are formed. In the plates 20 and 30, the guide holes 21b and 31b formed with a small diameter are formed with a size that does not allow the metal conductor 2 of the contact probe 1a having a large outer diameter to pass through. Does not receive the metal conductor 2 of the contact probe 1a having a large outer diameter. As a result, two contact probes 1a having a large outer diameter are inserted into at least two guide plates 20 and 30 and then two probe probes 1b having a small outer diameter are inserted into at least two guide plates 20 and 30. When the contact probes 1a and 1b are attached, the metal conductor 2 at the tip of the contact probe 1a having a large outer diameter inserted first does not enter the wrong guide holes 21b and 31b, and the guide hole 21a to be inserted is not inserted. , 31a can be securely inserted, so that the conventional problem, that is, the second contact probe 1b cannot be inserted into the guide holes 21b and 31b to be inserted, and is inserted into the empty guide holes. The problem of not being able to do not arise. Therefore, according to the present invention, the contact probe unit 10 can be manufactured very efficiently, and even if the contact probes 1a and 1b are slightly bent, there is no possibility of erroneous insertion.

[Production method]
Next, a method for manufacturing the probe unit 10 of the present invention by inserting the contact probes 1a and 1b into the guide plates 20 and 30 will be described. The method for manufacturing the probe unit 10 according to the present invention is a method for manufacturing the probe unit 10 according to the present invention described above, and the guide plate having guide holes in the step of inserting the contact probes 1a and 1b having different outer diameters into the guide holes. 20 and 30 are arranged at the top and at least one at the bottom, and then the contact probe 1a having the larger outer diameter is placed on the at least one guide plate 30 on the upper side with a large diameter. After being inserted into the guide hole 31a, it is inserted into a guide hole 21a having a larger diameter provided in at least one guide plate 20 below, and then the contact probe 1b having a smaller outer diameter is inserted into at least one upper guide probe 21b. After being inserted into the guide hole 31b with a small diameter provided in the guide plate 30, at least one sheet below Provided in the guide plate 20 is inserted into the guide hole 21b of the small diameter outer diameter does not pass the metal conductor 2 of the thicker contact probe 1a.

  Since the manufacturing method of the present invention is performed in such a procedure, the contact probe 1a having a larger outer diameter can be inserted into the predetermined guide holes 21a and 31a provided in the upper and lower guide plates 20 and 30. As a result, the contact probe 1b having a small outer diameter to be subsequently inserted into the guide hole can also be inserted into the predetermined guide holes 21b and 31b provided in the upper and lower guide plates 20 and 30. According to the present invention, since the contact probes 1a and 1b having different outer diameters can be inserted into the predetermined guide holes without error, the probe unit 10 can be manufactured very efficiently, and further, the contact Even if the probes 1a and 1b are slightly bent, there is no possibility of erroneous insertion.

  Further, as described above, when a vibration device (not shown) that vibrates the lower guide plate 20 is provided, the contact probe 1a having a larger outer diameter is inserted into the guide hole 21a of the lower guide plate 20. When the vibration device is operated to give vibration when inserted, even if the end 2a of the contact probe 1a faces the wrong guide hole 21b, the end 2a is moved on the guide plate 20 by vibration. It can move and enter a predetermined guide hole 21a. As a result, even if the contact probe 1a is slightly bent and does not immediately enter the predetermined guide hole 21a, the probe unit can be manufactured very efficiently.

  Even when the end 2a of the contact probe 1a with the larger outer diameter faces the wrong guide hole 21b, if the contact probe tip is configured to be flat or substantially hemispherical, It does not fit into the wrong guide hole 21b.

[Inspection method of electrical characteristics using contact probe unit]
Next, a method for inspecting electrical characteristics using the above-described probe unit 10 of the present invention will be described.

  The probe unit 10 of the present invention is used for checking the quality of electrical characteristics of a measured object such as a printed circuit board. The probe unit 10 includes a plurality of to several thousand contact probe groups, and guide plates 20 that guide the contact probe groups to the lead wires 50 of the inspection apparatus and to contact the electrodes 11 such as solder bumps. 30.

  The position of the probe unit 10 and the electrode 11 is controlled so that the contact probes 1a and 1b correspond to the electrode 11 when inspecting electrical characteristics. The inspection of the electrical characteristics is performed by moving the probe unit 10 up and down and pressing the tip (end 2a) of the contact probe against the electrode 11 with a predetermined pressure using the elastic force of the contact probes 1a and 1b. At this time, the contact probe has its rear end (end 2b) in contact with the lead wire 50, and an electrical signal from the electrode 11 passes through the lead wire 50 and is sent to an inspection device (not shown). In FIG. 1, reference numeral 40 denotes a lead wire holding plate.

  Hereinafter, the present invention will be described based on examples. Note that the present invention is not limited thereby.

Example 1
As the thicker contact probe 1a, a metal probe 2 having a diameter of 0.055 mm, an outer diameter of the body portion A after forming the insulating coating 3 of 0.070 mm, and a length of 20 mm was prepared. In addition, as the narrower contact probe 1b, a metal conductor 2 having a diameter of 0.040 mm, an outer diameter of the body portion A after forming the insulating coating 3 is 0.055 mm, and a length of 20 mm is prepared. did. In either case, the shape of the metal conductor tip on the electrode side was a flat shape.

  Next, as the guide plate 30a into which the contact probes 1a and 1b are first inserted, there are two guide holes 31a and 31b having a hole diameter of 0.080 mm and 0.065 mm, and between the guide holes 31a and 31b. 1 mm thickness processed so that the length W of the bridge 32 is 50 μm is prepared, and a guide plate 30b having the same structure is arranged in parallel under the gap with a gap of 2 mm. did. The guide plate 20 into which the contact probes 1a and 1b are inserted following the two guide plates 30a and 30b has two guide holes 21a and 21b with hole diameters of 0.065 mm and 0.050 mm. A material having a thickness of 1 mm was prepared so that the length W of the bridge 22 between the guide holes 21a and 21b was 65 μm.

  Such a pair of contact probes 1a, 1b was inserted into the guide plates 20, 30a, 30b to manufacture the probe unit 10. In this probe unit 10, the outer diameter of the metal conductor 2 of the thicker contact probe 1 b is 0.055 mm. Therefore, when the metal conductor 2 is inserted into the guide hole of the guide plate 20, the metal conductor 2 has a hole diameter. Since it does not enter the 0.050 mm guide hole 21b but only enters the guide hole 21a having a hole diameter of 0.065 mm, there will be no accident of accidentally entering the adjacent guide hole 21b. Subsequently, since the outer diameter of the metal conductor 2 of the narrower contact probe 1b is 0.040 mm, when the metal conductor 2 is inserted into the guide hole of the guide plate 20, the guide having the hole diameter of 0.065 mm is already present. Since the hole 21a is closed, the metal conductor 2 enters only the guide hole 21b having a hole diameter of 0.050 mm, and the conventional problem does not occur.

(Example 2)
In Example 1, a probe unit 10 similar to that in Example 1 was produced, except that a vibratory repacker VP-4D manufactured by Shinko Electric Co., Ltd., which is a vibration device, was provided on the lower guide plate 20. In the production of the probe unit 10, when the contact probes 1a and 1b are inserted into the lower guide plate 20, the particularly thick contact probe 1a can be quickly inserted.

(Example 3)
In Example 1, the metal conductor tip on the electrode side was formed with the same radius as the radius of each metal conductor. Other than that, the probe unit 10 similar to Example 1 was produced. The probe unit 10 could be produced without any problem as in the case of Example 1.

(Comparative Example 1)
As shown in FIG. 4, as the contact probes 101a and 101b, the diameter of the metal conductor 102 is 0.055 mm, the outer diameter of the body part A after forming the insulating coating 103 is 0.070 mm, and the length is 20 mm. I prepared something. In either case, the shape of the metal conductor tip on the electrode side was a flat shape.

  Next, as the guide plate 130a into which the contact probes 101a and 101b are first inserted, there are two guide holes 131a and 131b having a hole diameter of 0.080 mm, and the bridge 132 between the guide holes 131a and 131b is provided. A plate having a thickness of 1 mm processed to have a length W of 50 μm was prepared, and a guide plate 130b having the same structure was disposed in parallel below the guide plate 130b with a gap of 2 mm. The guide plate 120 into which the contact probes 101a and 101b are inserted following the two guide plates 130a and 130b has two guide holes 121a and 121b with a hole diameter of 0.065 mm. A bridge having a thickness of 1 mm was prepared so that the length W of the bridge 22 between 121b was 65 μm.

  Such a pair of contact probes 101a, 101b was inserted into the guide plates 120, 130a, 130b to manufacture the probe unit 110. In the probe unit 110, when the metal conductor 102 of one contact probe 101a is inserted into the guide hole 121a of the guide plate 120, the metal conductor 102 does not necessarily enter the guide hole 121a having a hole diameter of 0.065 mm. In some cases, the adjacent guide hole 121b having a hole diameter of 0.065 mm was entered, and an accident occurred in which the adjacent guide hole 121b was accidentally entered. Subsequently, when the metal conductor 102 of another contact probe 101b is inserted into the guide hole 120b of the guide plate 120, the guide hole 121b having a hole diameter of 0.070 mm may already be blocked, and further open. Even if it is going to be inserted into the guide hole 121a, the contact probe 101a that has been inserted by mistake will not be able to be inserted due to obstruction.

It is a block diagram which shows an example of the contact probe unit of this invention. It is the top view and sectional drawing which show an example of the guide hole formed in the guide plate. It is sectional drawing which shows the preferable example of the front-end | tip shape of the contact probe with which the contact probe unit of this invention is mounted | worn. It is the schematic which shows the example of the conventional contact probe unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a, 1b Contact probe 2 Metal conductor 2a, 2b End part 3 Insulating film 3a End surface of insulating film 10 Probe unit 11 Electrode 12 Printed circuit board 20 Measuring object side (lower side) guide plate 21a, 21b Guide hole 22 Bridge 30, 30a 30b Lead wire side (upper) guide plate 31a, 31b Guide hole 32 Bridge 40 Lead wire holding plate 50 Lead wire A Body B End R1, R2 Guide hole diameter W Bridge length

Claims (6)

A pair of contacts having a body portion having an insulating coating on the outer periphery of a pin-shaped metal conductor and ends having no insulating coating on both ends of the metal conductor, and the metal conductor and the body portion having different outer diameters A probe,
At least two guide plates each having a guide hole with a different diameter for guiding each of the contact probes having different outer diameters,
A contact probe unit of a type for measuring electrical characteristics by bringing the tip of each of the contact probes inserted into the guide holes of the guide plate into contact with a measured object,
The at least two guide plates are fixed at a certain distance, and among the guide plates,
A guide hole provided in one guide plate guides the body part of each contact probe having a different outer diameter,
The guide hole provided in the other guide plate guides only the metal conductor exposed at the tip of each contact probe having a different outer diameter, and the guide hole formed with a small diameter is large. A contact probe unit having a size that prevents a metal conductor of a contact probe having an outer diameter from passing therethrough. A bridge length between guide holes for guiding the contact probes having different outer diameters is in a range of 15 μm or more and 100 μm or less;
The contact probe unit according to claim 1, wherein a difference in hole diameters of guide holes for guiding the contact probes having different outer diameters is in a range of 13 μm to 50 μm.   3. The contact probe unit according to claim 1, wherein a shape of a tip of the contact probe on a side in contact with the measurement object is a flat shape or a substantially hemispherical shape. A pair of contact probes having a body portion having an insulating coating on the outer periphery of a pin-shaped metal conductor and ends having no insulating coating on both ends of the metal conductor, and the metal conductor and the body portion having different outer diameters Each of the contact probes inserted into the guide holes of the guide plate, and at least two guide plates each having a guide hole for guiding each of the contact probes having different outer diameters. A method of manufacturing a contact probe unit that measures electrical characteristics by bringing the tip of the electrode into contact with an object to be measured,
In the step of inserting each contact probe having a different outer diameter into the guide hole,
At least one guide plate having the guide holes is disposed at the top and at least one guide plate at the bottom;
After the contact probe having the larger outer diameter is inserted into a large-diameter guide hole provided in at least one upper guide plate, a large-diameter guide hole provided in at least one lower guide plate And then
After the contact probe having the smaller outer diameter is inserted into a small diameter guide hole provided in at least one upper guide plate, the outer diameter is increased by being provided in at least one lower guide plate. Insert into the guide hole with a small diameter that does not allow the metal conductor of the contact probe to pass through,
A method for manufacturing a contact probe unit.   The method of manufacturing a contact probe unit according to claim 4, wherein when the contact probe having a larger outer diameter is inserted into a guide hole of a guide plate disposed below, vibration is applied to the guide plate.   The method of manufacturing a contact probe unit according to claim 4 or 5, wherein a shape of a tip of the contact probe on a side in contact with the measurement object is a flat shape or a substantially hemispherical shape.

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