CN101063606A - Measurement method, measurement system and measurement module for heat conducting paste thickness - Google Patents
Measurement method, measurement system and measurement module for heat conducting paste thickness Download PDFInfo
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- CN101063606A CN101063606A CN 200610076525 CN200610076525A CN101063606A CN 101063606 A CN101063606 A CN 101063606A CN 200610076525 CN200610076525 CN 200610076525 CN 200610076525 A CN200610076525 A CN 200610076525A CN 101063606 A CN101063606 A CN 101063606A
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Abstract
This invention relates to one heat conductive cream thickness measurement method, which comprises the following steps: firstly providing one dissipation module for one chip dissipation with one surface with one chip combination area coated with heat conductive cream; then selecting one first test point besides the bonding area to select one second test point; then providing one non-contact measurement device; then setting the measurement device on the cream through non-contact measurement device to test second test point to get one first test value; then comparing first and second test values to get the cream thickness.
Description
Technical field
The invention relates to a kind of method that measures the size of flexible material, and particularly relevant for a kind of method that measures heat-conducting glue thickness.
Background technology
(Integrated Circuit, IC) integration of the intraware of chip (integration) and thermal value are constantly soaring along with integrated circuit.Generally speaking, the central processing unit of personal computer, drawing chip and chipset etc. have the electronic package of chip, can produce heat energy when working at high speed, thereby improve the temperature of electronic package itself.In order to allow the chip of electronic package still can keep long-term normal operation under the state of working at high speed, the heat energy that the chip of these electronic packages is produced under working at high speed must remove rapidly chip temperature is maintained in the temperature range of being scheduled to.If the speed that heat is removed from chip is lower than chip when producing the speed of heat, chip just might be because of overheated and lost efficacy, and then cause computer system to work as machine.The heat that is produced in order promptly to remove chip, the fabricator usually can be with the surface configuration of a radiating module on the back side of chip.
Generally speaking, chip can be configured on the loading end of an encapsulating carrier plate usually, and electrically connects with encapsulating carrier plate.Encapsulating carrier plate then is disposed on the motherboard of personal computer, and electrically connects with motherboard.For example, chip can be via it with respect to a plurality of projections on the active surface at the back side, and come to electrically connect with encapsulating carrier plate via the chip bonding processing procedure.Encapsulating carrier plate can electrically connect with motherboard with respect to a plurality of soldered balls on the bottom surface of loading end are next via it.
Because the relation of the precision (such as the tolerance of soldered ball, the warpage of encapsulating carrier plate or the like variable) of manufacturing technology, therefore for motherboard, the loading end of encapsulating carrier plate can produce inclination usually.If when directly being disposed at radiating module on the chip, tend to produce the gap between the back side of chip and the surface of radiating module, and then the heat that causes chip to produce can't be got rid of to radiating module successfully.
In order to address this problem, known technology is disposed at one deck heat-conducting cream on the back side of chip via screen printing technology, afterwards again with the surface pressure of the radiating module back side to chip.Because heat-conducting cream has the characteristic of high heat-conduction coefficient and fluid, therefore when the surface of radiating module during towards the pressing of the back side of chip, crack between heat-conducting cream can fill up between the back side of the surface of radiating module and chip, and can be apace the heat of chip be conducted to radiating module.
It should be noted that, because the thickness of heat-conducting cream needs to surpass a particular value usually, just can fill up the gap between the back side of the surface of radiating module and chip, so the thickness of heat-conducting cream is whether radiating module can bring into play one of principal element of its due radiating effect.The thickness that how to measure heat-conducting cream just becomes urgent problem.
Summary of the invention
The object of the present invention is to provide a kind of method for measurement, measurement system and measurement module of heat conducting paste thickness.
For achieving the above object, the method for measurement of heat conducting paste thickness provided by the invention, it comprises:
One radiating module is provided, and it is suitable for a chip is dispelled the heat, and this radiating module has a surface, and this surface has a chip bonding area, and is coated with one deck heat-conducting cream on this chip bonding area;
Selected one first tested point in zone beyond this surperficial chip bonding area, and on this heat-conducting cream, select one second tested point;
One non-contact measurement device is provided;
This non-contact measurement device is disposed at the top of this radiating module, and, this first tested point and this second tested point is measured, to obtain one first measuring value and one second measuring value respectively via this non-contact measurement device; And
Relatively this first measuring value and this second measuring value are to obtain the thickness of this heat-conducting cream.
The method for measurement of described heat conducting paste thickness, wherein this non-contact measurement device is the optical measurement device, is suitable for emission and receives laser beam.
The method for measurement of described heat conducting paste thickness, wherein this optical measurement device is to this first tested point emission of lasering beam, and induction is from this first tested point laser light reflected bundle, to obtain this first measuring value.
The method for measurement of described heat conducting paste thickness, wherein this optical measurement device is to this second tested point emission of lasering beam, and induction is from this second tested point laser light reflected bundle, to obtain this second measuring value.
Heat conducting paste thickness measurement system provided by the invention comprises:
Has a heat-conducting cream on one radiating module; And
One non-contact measurement device is positioned at this radiating module top, and this non-contact measurement device is suitable for measuring the thickness of this heat-conducting cream.
Described heat conducting paste thickness measurement system, wherein this radiating module has a carrying platform in order to move this radiating module.
Described heat conducting paste thickness measurement system, wherein this non-contact measurement device is the optical measurement device, is suitable for emission and receives laser beam.
Described heat conducting paste thickness measurement system, wherein this non-contact measurement device has a shifting axle in order to move this non-contact measurement device.
Heat conducting paste thickness provided by the invention measures module, is suitable for measuring the thickness of the heat-conducting cream on the radiating module, and wherein this radiating module has a chip bonding area, and this heat-conducting cream is to be positioned at this chip bonding area, and this heat conducting paste thickness measures module and comprises:
One carrying platform, this radiating module are suitable for being disposed on this carrying platform; And
One non-contact measurement device, be positioned at this carrying platform top, this non-contact measurement device is suitable for measuring one first tested point that is positioned at beyond this chip bonding area, to obtain one first measuring value, and be suitable for measuring one second tested point that is positioned on this heat-conducting cream, obtaining one second measuring value, and be suitable for relatively this first measuring value and this second measuring value to obtain the thickness of this heat-conducting cream.
Described heat conducting paste thickness measures module, and wherein this non-contact measurement device is the optical measurement device, is suitable for emission and receives laser beam.
In other words, the method for measurement of heat conducting paste thickness provided by the invention is that a radiating module is provided earlier.This radiating module is suitable for a chip is dispelled the heat, and wherein radiating module has a surface, and this surface has a chip bonding area, and is coated with one deck heat-conducting cream on this chip bonding area.Then one first tested point is selected in the zone beyond this surperficial chip bonding area, and selectes one second tested point on heat-conducting cream.One non-contact measurement device is provided then.Then non-contact measurement device is disposed at the top of heat-conducting cream, and, first tested point and second gauge point are measured, to obtain one first measuring value respectively via non-contact measurement device.Compare first measuring value and second measuring value then, to obtain the thickness of heat-conducting cream.
According to the method for measurement of the described heat conducting paste thickness of one embodiment of the invention, wherein non-contact measurement device is the optical measurement device.This optical measurement device is suitable for emission and receives laser beam.
According to the method for measurement of the described heat conducting paste thickness of one embodiment of the invention, wherein when non-contact measurement device was the optical measurement device, the optical measurement device was suitable for emission and receives laser beam.
Method for measurement according to the described heat conducting paste thickness of one embodiment of the invention, wherein when non-contact measurement device is the optical measurement device, the optical measurement device is to the first tested point emission of lasering beam, and induction is from the first tested point laser light reflected bundle, to obtain first measuring value.
Method for measurement according to the described heat conducting paste thickness of one embodiment of the invention, wherein when non-contact measurement device is the optical measurement device, the optical measurement device is to the second tested point emission of lasering beam, and induction is from the second tested point laser light reflected bundle, to obtain second measuring value.
The present invention also proposes a kind of heat conducting paste thickness measurement system, and it comprises a radiating module and a non-contact measurement device.Has a heat-conducting cream on the radiating module.Non-contact measurement device is positioned at the radiating module top.Non-contact measurement device is suitable for measuring the thickness of heat-conducting cream.
According to the described heat conducting paste thickness measurement system of one embodiment of the invention, radiating module also has a carrying platform in order to move this radiating module.
According to the described heat conducting paste thickness measurement system of one embodiment of the invention, non-contact measurement device is the optical measurement device, is suitable for emission and receives laser beam.
According to the described heat conducting paste thickness measurement system of one embodiment of the invention, non-contact measurement device also has a shifting axle in order to mobile non-contact measurement device.
The present invention also proposes a kind of heat conducting paste thickness and measures module, and it is suitable for measuring the thickness of the heat-conducting cream on the radiating module.This radiating module has a chip bonding area.Heat-conducting cream is to be positioned at chip bonding area.This heat conducting paste thickness measures module and comprises a carrying platform and a non-contact measurement device.Radiating module is suitable for being disposed on the carrying platform.Non-contact measurement device is positioned at this carrying platform top.This non-contact measurement device is suitable for measuring one first tested point beyond this chip bonding area, obtaining one first measuring value, and is suitable for measuring and is positioned at second tested point of 1 on the heat-conducting cream, to obtain one second measuring value.In addition, this non-contact measurement device also is suitable for comparison first measuring value and second measuring value to obtain the thickness of heat-conducting cream.
Measure module according to the described heat conducting paste thickness of one embodiment of the invention, wherein non-contact measurement device is the optical measurement device.This optical measurement device is suitable for emission and receives laser beam.
Because the present invention adopts contactless mode that the thickness that carries out heat-conducting cream is measured, so the present invention can measure the thickness of heat-conducting cream exactly.
Description of drawings
Fig. 1 is the synoptic diagram of method of the measurement heat-conducting glue thickness of one embodiment of the invention.
Fig. 2 is the synoptic diagram that the heat conducting paste thickness of one embodiment of the invention measures module.
Fig. 3 is the synoptic diagram of the heat conducting paste thickness measurement system of one embodiment of the invention.
Embodiment
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Fig. 1 is the synoptic diagram of method of the measurement heat-conducting glue thickness of one embodiment of the invention.Please refer to Fig. 1, at first shown in step S110, provide a radiating module.Radiating module has a surface.This surface has a chip bonding area.Be coated with one deck heat-conducting cream in this chip bonding area, wherein this layer heat-conducting cream for example is applied in chip bonding area via the step of a screen painting.Then shown in step S120, select one first tested point and one second tested point on the surface of radiating module, wherein first tested point is to be positioned at chip bonding area zone in addition, and second tested point is that the position is on heat-conducting cream.
Then, shown in step S130, one non-contact measurement device is provided, and wherein this non-contact measurement device for example is that radioactivity measures device, ultrasonic measuring equipment, capacitor induction type measuring equipment, optical profile type measuring equipment or other can measure heat conducting paste thickness under the condition of thermal contact conductance cream not measuring equipment.Then non-contact measurement device is disposed at the top of heat-conducting cream, and, first tested point and second tested point are measured, to obtain one first measuring value and one second measuring value respectively via non-contact measurement device.
Then, shown in step 140, relatively first measuring value and second measuring value are to obtain the thickness of heat-conducting cream.
Based on said method, present embodiment also proposes a heat conducting paste thickness and measures module.Please refer to Fig. 2, heat conducting paste thickness measures module 200 and comprises a carrying platform 210 and a non-contact measurement device 220.Carrying platform 210 is suitable for carrying a radiating module 310.Radiating module 310 has 312 and one back side 314, a surface respect to one another, and surface 312 has a chip bonding area 312a.Be coated with one deck heat-conducting cream 320 on the surface 312, wherein heat-conducting cream 320 is positioned at chip bonding area 312a.When carrying platform 210 carrying radiating modules 310, the back side 314 of radiating module 310 is towards carrying platform 210 and is disposed on the carrying platform.
Below will measure the thickness how module 200 to measure heat-conducting cream 320 to heat conducting paste thickness is described in detail.After the radiating module 310 that will be coated with heat-conducting cream 320 is disposed at carrying platform 210, the selected one first tested point P in the zone beyond the chip bonding area 312a on surface 312.Then via non-contact measurement device 220, to the first tested point P emission of lasering beam, and induction is from the first tested point P laser light reflected bundle, to obtain first measuring value.
On a upper surface 322 of heat-conducting cream 320, select one second tested point Q then.The back non-contact measurement device 220 that makes move along direction D, and via 220 couples first tested point P of non-contact measurement device emission of lasering beam, and induction is from the first tested point P laser light reflected bundle, to obtain second measuring value.It should be noted that all those who are familiar with this art should recognize easily that non-contact measurement device 220 can move with respect to carrying platform 210 via multiple mode.For example, non-contact measurement device 220 can be via a connected shifting axle S to move along direction D.Certainly, in other embodiments, carrying platform 210 can also move with respect to non-contact measurement device 220, with the relative position of the radiating module 310 on the adjustment carrying platform 210 with non-contact measurement device 220.Then, compare first measuring value and second measuring value, to obtain the thickness of heat-conducting cream 320.
Certainly, present embodiment can also be selected a plurality of first gauge point P and a plurality of second gauge point Q, and these the first gauge point P and the second gauge point Q are measured,, give unnecessary details morely this just no longer doing in the hope of the average thickness of heat-conducting cream 320 or the thickness at each position of heat-conducting cream 320.
In addition, more can directly measure in other embodiments of the invention the heat-conducting cream on the radiating module 310 320.Please refer to Fig. 3, heat conducting paste thickness measurement system 400 mainly comprises a radiating module 310 and a non-contact measurement device 220, and wherein non-contact measurement device 220 is positioned at radiating module 310 tops.Non-contact measurement device 220 is suitable for moving with respect to carrying platform 210.For example, non-contact measurement device 220 can be via a connected shifting axle S to move along direction D.Thus, non-contact measurement device 220 just can measure the thickness of heat-conducting cream 320 according to above-mentioned mode.
In sum, because the method for measurement of heat conducting paste thickness proposed by the invention and heat conducting paste thickness measure module can measure heat-conducting cream under the condition of thermal contact conductance cream not thickness, therefore the present invention can measure the thickness of the heat-conducting cream on the radiating module exactly under the condition of the external form of not destroying heat-conducting cream.
Though the present invention with the preferred embodiment explanation as above; right its is not in order to limit the present invention; anyly have the knack of this technician; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the content that claim defines.
Claims (10)
1. the method for measurement of a heat conducting paste thickness, it comprises:
One radiating module is provided, and it is suitable for a chip is dispelled the heat, and this radiating module has a surface, and this surface has a chip bonding area, and is coated with one deck heat-conducting cream on this chip bonding area;
Selected one first tested point in zone beyond this surperficial chip bonding area, and on this heat-conducting cream, select one second tested point;
One non-contact measurement device is provided;
This non-contact measurement device is disposed at the top of this radiating module, and, this first tested point and this second tested point is measured, to obtain one first measuring value and one second measuring value respectively via this non-contact measurement device; And
Relatively this first measuring value and this second measuring value are to obtain the thickness of this heat-conducting cream.
2. the method for measurement of heat conducting paste thickness as claimed in claim 1, wherein this non-contact measurement device is the optical measurement device, is suitable for emission and receives laser beam.
3. the method for measurement of heat conducting paste thickness as claimed in claim 2, wherein this optical measurement device is to this first tested point emission of lasering beam, and induction is from this first tested point laser light reflected bundle, to obtain this first measuring value.
4. the method for measurement of heat conducting paste thickness as claimed in claim 2, wherein this optical measurement device is to this second tested point emission of lasering beam, and induction is from this second tested point laser light reflected bundle, to obtain this second measuring value.
5. heat conducting paste thickness measurement system comprises:
Has a heat-conducting cream on one radiating module; And
One non-contact measurement device is positioned at this radiating module top, and this non-contact measurement device is suitable for measuring the thickness of this heat-conducting cream.
6. heat conducting paste thickness measurement system as claimed in claim 5, wherein this radiating module has a carrying platform in order to move this radiating module.
7. heat conducting paste thickness measurement system as claimed in claim 5, wherein this non-contact measurement device is the optical measurement device, is suitable for emission and receives laser beam.
8. heat conducting paste thickness measurement system as claimed in claim 6, wherein this non-contact measurement device has a shifting axle in order to move this non-contact measurement device.
9. a heat conducting paste thickness measures module, is suitable for measuring the thickness of the heat-conducting cream on the radiating module, and wherein this radiating module has a chip bonding area, and this heat-conducting cream is to be positioned at this chip bonding area, and this heat conducting paste thickness measures module and comprises:
One carrying platform, this radiating module are suitable for being disposed on this carrying platform; And
One non-contact measurement device, be positioned at this carrying platform top, this non-contact measurement device is suitable for measuring one first tested point that is positioned at beyond this chip bonding area, to obtain one first measuring value, and be suitable for measuring one second tested point that is positioned on this heat-conducting cream, obtaining one second measuring value, and be suitable for relatively this first measuring value and this second measuring value to obtain the thickness of this heat-conducting cream.
10. heat conducting paste thickness as claimed in claim 9 measures module, and wherein this non-contact measurement device is the optical measurement device, is suitable for emission and receives laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610076525 CN101063606A (en) | 2006-04-28 | 2006-04-28 | Measurement method, measurement system and measurement module for heat conducting paste thickness |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200610076525 CN101063606A (en) | 2006-04-28 | 2006-04-28 | Measurement method, measurement system and measurement module for heat conducting paste thickness |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308017B (en) * | 2008-05-30 | 2010-09-01 | 哈尔滨工业大学 | Batteries plate thickness on-line measurement method utilizing baseband thickness for self-calibration |
| CN104395693A (en) * | 2012-03-27 | 2015-03-04 | Msc&Sgcc公司 | Method and installation for measuring the glass distribution in containers |
| CN105416699A (en) * | 2015-11-25 | 2016-03-23 | 龙岩烟草工业有限责任公司 | Device and method for detecting gluing thickness |
| CN105910567A (en) * | 2016-05-30 | 2016-08-31 | 成都飞机工业（集团）有限责任公司 | Composite material part thickness detection method |
| CN110160456A (en) * | 2019-06-24 | 2019-08-23 | 中国航空无线电电子研究所 | A kind of equipment for realizing small fit-up gap rapid survey |
-
2006
- 2006-04-28 CN CN 200610076525 patent/CN101063606A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308017B (en) * | 2008-05-30 | 2010-09-01 | 哈尔滨工业大学 | Batteries plate thickness on-line measurement method utilizing baseband thickness for self-calibration |
| CN104395693A (en) * | 2012-03-27 | 2015-03-04 | Msc&Sgcc公司 | Method and installation for measuring the glass distribution in containers |
| CN104395693B (en) * | 2012-03-27 | 2017-10-17 | Msc & Sgcc公司 | The method and apparatus for measuring the glass distribution in container |
| CN105416699A (en) * | 2015-11-25 | 2016-03-23 | 龙岩烟草工业有限责任公司 | Device and method for detecting gluing thickness |
| CN105416699B (en) * | 2015-11-25 | 2017-12-05 | 龙岩烟草工业有限责任公司 | Glue thickness detection apparatus and method |
| CN105910567A (en) * | 2016-05-30 | 2016-08-31 | 成都飞机工业（集团）有限责任公司 | Composite material part thickness detection method |
| CN110160456A (en) * | 2019-06-24 | 2019-08-23 | 中国航空无线电电子研究所 | A kind of equipment for realizing small fit-up gap rapid survey |
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