CN2779408Y - Electrical connection structure of wafer probe card - Google Patents
Electrical connection structure of wafer probe card Download PDFInfo
- Publication number
- CN2779408Y CN2779408Y CN 200520002196 CN200520002196U CN2779408Y CN 2779408 Y CN2779408 Y CN 2779408Y CN 200520002196 CN200520002196 CN 200520002196 CN 200520002196 U CN200520002196 U CN 200520002196U CN 2779408 Y CN2779408 Y CN 2779408Y
- Authority
- CN
- China
- Prior art keywords
- wafer probe
- substrate
- engagement plate
- probe cards
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to an electrical connection structure of a wafer probe card, which comprises a base plate in which an inner linking circuit is arranged, and a connection plate electrically connected with a micro electromechanical rigid probe of the wafer probe card, wherein the connection of the base plate and the connection plate is not used by a conducting wire; an electrical conduction mechanism with functions of electrical connection and buffering is arranged between the base plate and the connection plate; the electrical conduction mechanism forms the electrical connection structure between the base plate and the connection plate as well as forms a buffering mechanism of the wafer probe card. In addition, the electrical conduction mechanism can prompt the connection plate to do horizontal and slight adjustment to obtain goal of correcting and slightly adjusting the planarity of the micro electromechanical rigid probe.
Description
Technical field
The utility model relates to a kind of electric connection structure of wafer probe cards, be particularly related to a kind of electric connection structure, make wafer probe cards to use the micro electronmechanical rigid probe of wafer probe cards is carried out WidFin and correction with electricity connection function and buffering function.
Background technology
Be provided with the wafer probe cards of buffer gear at present, its structure is to be arranged on by a substrate 10, an engagement plate 11, that this substrate 10 is arranged at these engagement plate 11 belows with elastic washer 12, in the middle of this engagement plate 11 and one group of surface level vernier adjustment knob 15 common combination being provided with the detecting head 13 of some micro electronmechanical rigid probe 14 and being used for proofreading and correct and finely tune micro electronmechanical rigid probe 14 flatnesses constitute as shown in Figure 1.
Because this wafer probe cards constitutes its buffer gear with elastic washer 12, so when this wafer probe is stuck in when carrying out wafer sort, as long as the micro electronmechanical rigid probe 14 1 of detecting head 13 is subjected to pressure at right angle, will be crushed the immediately distortion and absorb the suffered pressure of this micro electronmechanical rigid probe 14 of the elastic washer 12 of this wafer probe cards.Therefore, this wafer probe is stuck in can alleviate the pressure that micro electronmechanical rigid probe 14 is born when carrying out wafer sort, and can prevent to cause crystal grain to damage by this.
In addition, because the elastic washer 12 of this wafer probe cards has pooling feature, so allow via rotating surface level vernier adjustment knob 15 to move up and down engagement plate 11 a little, and can reach the flatness of proofreading and correct and finely tuning the micro electronmechanical rigid probe 14 of this wafer probe cards by this.
Electric connection structure as for this wafer probe cards, be to be provided with interconnect circuit and the 14 formation electric connections of micro electronmechanical rigid probe in the inside of detecting head 13, and link to each other by corresponding pad 18 between detecting head 13 and the engagement plate 11, facilitate micro electronmechanical rigid probe 14 and engagement plate 11 to constitute again and electrically connect; This engagement plate 11 is provided with upper contact 17 again and links to each other with substrate 10 via lead 16, and facilitates micro electronmechanical rigid probe 14 and substrate 10 to constitute electric connection by this.
But the electric connection structure of this wafer probe cards has following shortcoming:
1. because be to link to each other between the engagement plate 11 of this wafer probe cards and the substrate 10 with lead 16, this electric connection structure carries out the loaded down with trivial details bonding wire engineering except needing in the manufacture process of wafer probe cards, the puzzlement that when carrying out the bonding wire engineering, has construction to be difficult for again, especially be stuck in when carrying out wafer sort when this wafer probe, lead 16 length of being welded cause high-frequency signals to disturb easily, and the result causes the whole electrical performance of this wafer probe cards not good again.
2. when in a single day the micro electronmechanical rigid probe 14 of this wafer probe cards damages necessary the replacing, at first must be the lead 16 whole tip-ofves that welded, after by the time micro electronmechanical rigid probe 14, detecting head 13 and engagement plate 11 are changed, again must be with all welding again of lead 16.So the maintenance process of this wafer probe cards was both loaded down with trivial details and cause substrate 10 to damage easily or electric leakage etc.
Summary of the invention
Based on above-mentioned electric connection structure above many shortcomings are arranged with wafer probe cards of buffer gear, the utility model promptly proposes to have the electric connection structure improvement of the wafer probe cards of buffer gear at above-mentioned shortcoming, its purpose is to make the manufacturing process of wafer probe cards of tool buffer gear easier, and be applicable to the wafer probe cards of higher pin number, especially can be easier aspect maintain and replace, and, can be better and more stable aspect electrical performance.
Therefore, fundamental purpose of the present utility model is to provide a kind of electric connection structure of wafer probe cards, especially substrate and the electric connection structure between the engagement plate to wafer probe cards proposes improvement, link to each other with lead to impel wafer probe cards can give up use, that is to say, the utility model is to constitute the substrate of wafer probe cards and the electric connection structure between the engagement plate with the conductive mechanism with electricity connection function and buffering function, this conductive mechanism is except constituting the electric connection structure between substrate and the engagement plate, also constitute the buffer gear of wafer probe cards, allow and reach the purpose of proofreading and correct and finely tuning micro electronmechanical rigid probe flatness via rotating the surface level vernier adjustment knob by having spring function.
Secondary objective of the present utility model is to provide a kind of electric connection structure of wafer probe cards, especially constitute the substrate of wafer probe cards and the conductive mechanism between the engagement plate with conducting resinl with electricity connection function and buffering function, except the buffer gear that constitutes wafer probe cards, also can improve with lead as the shortcoming that electrically connects.
Another purpose of the present utility model is to provide a kind of electric connection structure of wafer probe cards, especially constitute the substrate of wafer probe cards and the conductive mechanism between the engagement plate with spring needle with electricity connection function and buffering function, except the buffer gear that constitutes wafer probe cards, also can improve with lead as the shortcoming that electrically connects.
A purpose more of the present utility model is to provide a kind of electric connection structure of wafer probe cards, especially constitute the substrate of wafer probe cards and the conductive mechanism between the engagement plate with the socket that electrically conducts with electricity connection function and buffering function, except the buffer gear that constitutes wafer probe cards, also can improve with lead as the shortcoming that electrically connects.
The electric connection structure of wafer probe cards of the present utility model, comprise an inside be provided with the interconnect circuit substrate and one and the micro electronmechanical rigid probe of wafer probe cards constitute the engagement plate that electrically connects, it is characterized in that: the centre of described substrate and this engagement plate is provided with a conductive mechanism, and constitute electric connection with described conductive mechanism between described substrate and the described engagement plate, and described conductive mechanism is to make described engagement plate can do the buffer gear of the wafer probe cards of WidFin.
The electric connection structure of wafer probe cards of the present utility model is characterized in that: described conductive mechanism is a conducting resinl.
The electric connection structure of wafer probe cards of the present utility model is characterized in that: described conductive mechanism is a spring needle.
The electric connection structure of wafer probe cards of the present utility model is characterized in that: described conductive mechanism is the socket that electrically conducts.
The above-mentioned socket that electrically conducts comprises: a slot and a pin, and described slot is the following contact that constitutes substrate, and constitute with the interconnect circuit of substrate inside and to electrically connect, described pin then constitutes the upper contact of engagement plate.
The above-mentioned socket that electrically conducts comprises: a slot and a pin, and described pin is the following contact that constitutes substrate, and constitute with the interconnect circuit of substrate inside and to electrically connect, described slot then constitutes the upper contact of engagement plate.
Description of drawings
Fig. 1 is a kind of structural representation of knowing wafer probe cards with buffer gear;
Fig. 2 is that the wafer probe cards shown in the utility model constitutes the substrate of wafer probe cards and the synoptic diagram of the electric connection structure between the engagement plate with the conducting resinl that has electricity connection function and pooling feature concurrently;
Fig. 3 is the a-quadrant enlarged drawing of Fig. 2, is used for illustrating that conducting resinl must constitute the synoptic diagram of electric connection;
Fig. 4 is that the wafer probe cards shown in the utility model constitutes the substrate of wafer probe cards and the synoptic diagram of the electric connection structure between the engagement plate with the spring needle that has electricity connection function and pooling feature concurrently;
Fig. 5 is that the wafer probe cards shown in the utility model constitutes the substrate of wafer probe cards and the synoptic diagram of the electric connection structure between the engagement plate with the socket that electrically conducts that has electricity connection function and pooling feature concurrently.
The simple declaration of assembly conventional letter
10, substrate 11, engagement plate
12, elastic washer 13, detecting head
14, micro electronmechanical rigid probe 15, surface level vernier adjustment knob
16, lead 17, upper contact
18, pad 20, wafer probe cards
21, substrate 22, following contact
30, conducting resinl B, metallics
35, spring needle 40, socket electrically conducts
41, slot 42, pin
Embodiment
Please refer to Fig. 2, Fig. 4 and Fig. 5, do not use lead to link to each other between the substrate 21 of the wafer probe cards 20 shown in the utility model and the engagement plate 11, be to constitute the substrate 21 of wafer probe cards 20 and the electric connection structure between the engagement plate 11 with a kind of conductive mechanism that has electricity connection function and pooling feature concurrently, this conductive mechanism also constitutes the buffer gear of wafer probe cards 20 because having elasticity or Telescopic except constituting the electric connection structure between substrate 21 and the engagement plate 11.Therefore, can move up and down engagement plate 11 slightly via rotating surface level vernier adjustment knob 15, and can reach the purpose of proofreading and correct and finely tuning micro electronmechanical rigid probe 14 flatnesses by this.
The conductive mechanism that has electricity connection function and pooling feature concurrently shown in the utility model has three kinds of specific embodiments basically.First kind of specific embodiment is to constitute the substrate 21 of wafer probe cards 20 and the electric connection structure between the engagement plate 11 with conducting resinl 30 as shown in Figure 2.
That is to say that this wafer probe cards 20 is to be arranged on by a substrate 21, an engagement plate 11, that this substrate 21 is arranged at these engagement plate 11 belows with conducting resinl 30, in the middle of this engagement plate 11 and one group of surface level vernier adjustment knob 15 common combination being provided with the detecting head 13 of some micro electronmechanical rigid probe 14 and being used for proofreading and correct and finely tune micro electronmechanical rigid probe 14 flatnesses constitute.
Wherein, link to each other by corresponding pad 18 between detecting head 13 and the engagement plate 11, and facilitate micro electronmechanical rigid probe 14 to constitute electrically connecting with engagement plate 11; The inside of substrate 21 is provided with interconnect circuit (figure do not paint) and this substrate 21 set following contacts 22 and constitutes and electrically connect, and this engagement plate 11 is provided with upper contact 17 and link to each other with the following contact 22 of this substrate 21 with conducting resinl 30 in the middle of this engagement plate 11 via being arranged on this substrate 21, and facilitates micro electronmechanical rigid probe 14 and substrate 21 to constitute electric connections by this.
Please refer to Fig. 2 and Fig. 3, because the material of conducting resinl 30 has little plasticity and the structure of conducting is up and down formed by many metallics B in inside, therefore, conducting resinl 30 has little plasticity when being squeezed, especially when conducting resinl 30 is subjected to upper contact 17 extruding of the following contact 22 of substrate 21 and engagement plate 11, the metallics B that the following contact 22 of substrate 21 and the upper contact 17 of engagement plate 11 promptly see through conducting resinl 30 forms conducting state, and impels substrate 21 and engagement plate 11 to constitute electric connection.So wafer probe cards 20 has electricity connection function really with the electric connection structure that conducting resinl 30 constitutes between substrate 21 and the engagement plate 11,
In addition, because conducting resinl 30 has little plasticity when being squeezed, so can constitute the buffer gear of wafer probe cards 20.Therefore, utilize little plasticity of conducting resinl 30 to impel and to do depth of parallelism fine setting between substrate 20 and the engagement plate 11, and can reach the purpose of proofreading and correct and finely tuning micro electronmechanical rigid probe 14 flatnesses by this.
Second kind of specific embodiment of the conductive mechanism shown in the utility model is to constitute the substrate 21 of wafer probe cards 20 and the electric connection structure between the engagement plate 11 with spring needle 35 as shown in Figure 4.
This wafer probe cards 20 is to be arranged on by a substrate 21, an engagement plate 11, that this substrate 21 is arranged at these engagement plate 11 belows with spring needle 35, in the middle of this engagement plate 11 and one group of surface level vernier adjustment knob 15 common combination being provided with the detecting head 13 of some micro electronmechanical rigid probe 14 and being used for proofreading and correct and finely tune micro electronmechanical rigid probe 14 flatnesses constitute.
Wherein, link to each other by corresponding pad 18 between detecting head 13 and the engagement plate 11, and facilitate micro electronmechanical rigid probe 14 to constitute electrically connecting with engagement plate 11; The inside of substrate 21 is provided with interconnect circuit (figure do not paint) and this substrate 21 set following contacts 22 and constitutes and electrically connect, and this engagement plate 11 is provided with upper contact 17 and link to each other with the following contact 22 of this substrate 21 with spring needle 35 in the middle of this engagement plate 11 via being arranged on this substrate 21, and facilitates micro electronmechanical rigid probe 14 and substrate 21 to constitute electric connections by this.
In addition,, spring needle 35 can uphold and compress, so can constitute the buffer gear of wafer probe cards 20 because having elasticity.Therefore, utilize the flexible damping characteristics of spring needle 35 to impel and to do depth of parallelism fine setting between substrate 20 and the engagement plate 11, and can reach the purpose of proofreading and correct and finely tuning micro electronmechanical rigid probe 14 flatnesses by this.
The third specific embodiment of conductive mechanism shown in the utility model is to constitute the substrate 21 of wafer probe cards 20 and the electric connection structure between the engagement plate 11 with the socket 40 that electrically conducts as shown in Figure 5.
This wafer probe cards 20 is to be arranged on by a substrate 21, an engagement plate 11, that this substrate 21 is arranged at these engagement plate 11 belows with the socket 40, that electrically conducts in the middle of this engagement plate 11 and one group of surface level vernier adjustment knob 15 common combination being provided with the detecting head 13 of some micro electronmechanical rigid probe 14 and being used for proofreading and correct and finely tune micro electronmechanical rigid probe 14 flatnesses constitute.
Wherein, the socket 40 that electrically conducts is constituted by a slot 41 and a pin 42, and the slot 41 of the socket 40 that electrically conducts is the following contacts that constitute substrate 21, and the pin 42 of the socket 40 that electrically conducts is the upper contacts that constitute engagement plate 11; Perhaps, also the pin 42 of the socket 40 that electrically conducts can be set as the following contact of substrate 21, and 41 upper contacts that are set as engagement plate 11 of the slot of the socket 40 that electrically conducts.
Then link to each other between detecting head 13 and the engagement plate 11, and facilitate micro electronmechanical rigid probe 14 to constitute electrically connecting with engagement plate 11 by corresponding pad 18; The inside of substrate 21 is provided with interconnect circuit (figure do not paint) and this substrate 21 set slots 41 and constitutes and electrically connect, and the set pin 42 of this engagement plate 11 via insert be presented to slot 41 inside of this substrate 21 after, promptly impel engagement plate 11 to constitute and electrically connect, and also can facilitate micro electronmechanical rigid probe 14 and substrate 21 formations to electrically connect by this with substrate 21.
In addition, slot 41 degree of depth of socket 40 are to be set as to be enough to allow pin 42 insert fully because electrically conduct, and after the pin 42 of the socket 40 that electrically conducts is inserted into the slot 41 inner formation electric connections of the socket 40 that electrically conducts, as long as the micro electronmechanical rigid probe 14 1 of detecting head 13 is subjected to pressure at right angle, engagement plate 11 set pins 42 will continue to be inserted into the inside of the set slot 41 of substrate 21, to alleviate the pressure at right angle that micro electronmechanical rigid probe 14 is afforded.Therefore, be located at the substrate 21 of wafer probe cards 20 and the buffer gear that the socket 40 that electrically conducts between the engagement plate 11 also constitutes wafer probe cards 20.Simultaneously, utilize the pooling feature of the socket 40 that electrically conducts to impel and to do depth of parallelism fine setting between substrate 20 and the engagement plate 11, and can reach the purpose of proofreading and correct and finely tuning micro electronmechanical rigid probe 14 flatnesses by this.
By above-mentioned description, the related work personnel can carry out various change and modification fully in the scope that does not depart from the utility model technological thought.
Therefore, technical scope of the present utility model is not limited to the content on the instructions, must determine its technical scope according to interest field.
Claims (6)
1, a kind of electric connection structure of wafer probe cards, comprise an inside be provided with the interconnect circuit substrate and one and the micro electronmechanical rigid probe of wafer probe cards constitute the engagement plate that electrically connects, it is characterized in that: the centre of described substrate and this engagement plate is provided with a conductive mechanism, and constitute electric connection with described conductive mechanism between described substrate and the described engagement plate, and described conductive mechanism is to make described engagement plate can do the buffer gear of the wafer probe cards of WidFin.
2, the electric connection structure of wafer probe cards as claimed in claim 1 is characterized in that: described conductive mechanism is a conducting resinl.
3, the electric connection structure of wafer probe cards as claimed in claim 1 is characterized in that: described conductive mechanism is a spring needle.
4, the electric connection structure of wafer probe cards as claimed in claim 1 is characterized in that: described conductive mechanism is the socket that electrically conducts.
5, the electric connection structure of wafer probe cards as claimed in claim 4, it is characterized in that: the described socket that electrically conducts comprises: a slot and a pin, and described slot is the following contact that constitutes substrate, and constitute with the interconnect circuit of substrate inside and to electrically connect, described pin then constitutes the upper contact of engagement plate.
6, the electric connection structure of wafer probe cards as claimed in claim 4, it is characterized in that: the described socket that electrically conducts comprises: a slot and a pin, and described pin is the following contact that constitutes substrate, and constitute with the interconnect circuit of substrate inside and to electrically connect, described slot then constitutes the upper contact of engagement plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520002196 CN2779408Y (en) | 2005-02-07 | 2005-02-07 | Electrical connection structure of wafer probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520002196 CN2779408Y (en) | 2005-02-07 | 2005-02-07 | Electrical connection structure of wafer probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2779408Y true CN2779408Y (en) | 2006-05-10 |
Family
ID=36753497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520002196 Expired - Fee Related CN2779408Y (en) | 2005-02-07 | 2005-02-07 | Electrical connection structure of wafer probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2779408Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303371B (en) * | 2007-05-11 | 2011-09-21 | 韩商·Amst有限公司 | Probe card and method for fabricating the same |
| CN102313826A (en) * | 2010-07-06 | 2012-01-11 | 美商豪威科技股份有限公司 | Probe card |
| CN111687788A (en) * | 2019-03-15 | 2020-09-22 | 日月光半导体制造股份有限公司 | Apparatus for assembling optical device |
-
2005
- 2005-02-07 CN CN 200520002196 patent/CN2779408Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303371B (en) * | 2007-05-11 | 2011-09-21 | 韩商·Amst有限公司 | Probe card and method for fabricating the same |
| CN102313826A (en) * | 2010-07-06 | 2012-01-11 | 美商豪威科技股份有限公司 | Probe card |
| CN111687788A (en) * | 2019-03-15 | 2020-09-22 | 日月光半导体制造股份有限公司 | Apparatus for assembling optical device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1645589A (en) | Probe guard | |
| CN1305181C (en) | Connecting component and its assembling mechanism | |
| CN1661376A (en) | Probe card | |
| CN1264255C (en) | Contactor device | |
| CN1957262A (en) | Probe card configuration for low mechanical flexural strength electrical routing substrates | |
| CN1126214C (en) | IC socket | |
| CN2779408Y (en) | Electrical connection structure of wafer probe card | |
| CN1862884A (en) | Printed circuit board, connector, and electronic device | |
| CN1668931A (en) | Probe card for testing integrated circuits | |
| CN1646922A (en) | Conductive contact | |
| CN1896749A (en) | Inspection device for display panel and interface used therein | |
| CN1809757A (en) | Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object | |
| CN1808130A (en) | Probe board for semiconductor chip detecting and its producing method | |
| CN1922850A (en) | Card-type mobile telephone | |
| CN1826713A (en) | Socket and test apparatus | |
| CN100351633C (en) | Method and apparatus for testing electronic devices | |
| CN1217197C (en) | Probe card for LCD detection | |
| CN1657949A (en) | Integral probe card and assembling mode | |
| CN1752761A (en) | Testing method of liquid crystal module manufacturing line and switching flexible printed circuit board | |
| CN2826902Y (en) | Single plate and its handle bar | |
| CN101044407A (en) | Contact unit and inspection system using it | |
| CN1283532C (en) | Conveying band for bar shape parts | |
| CN1949603A (en) | Battery power connecting apparatus and mobile terminal having it | |
| CN200965966Y (en) | Electrical signal connecting head and connecting socket for electronic device | |
| CN1522480A (en) | Pressure contact connector of cell phone and connection structure of the connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |