CN1721957A - Liquid crystal display panel and method for producing the same - Google Patents

Liquid crystal display panel and method for producing the same Download PDF

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Publication number
CN1721957A
CN1721957A CN 200510083633 CN200510083633A CN1721957A CN 1721957 A CN1721957 A CN 1721957A CN 200510083633 CN200510083633 CN 200510083633 CN 200510083633 A CN200510083633 A CN 200510083633A CN 1721957 A CN1721957 A CN 1721957A
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substrate
liquid crystal
sealant
light transmission
shielding layer
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CN100456112C (en
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山田直
山口英彦
津幡俊英
黑住幸生
辻雅之
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Sharp Corp
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Sharp Corp
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Abstract

The method of the present invetion includes the steps of: (A) providing a first substrate, and a second substrate, wherein the first substrate includes a first light shielding layer provided within a non-display region, the first light shielding layer including a light-transmitting portion provided near an outer boundary of the first light shielding layer, the light-transmitting portion comprising a recess or an opening; (B) drawing a seal pattern with a sealant, the seal pattern being drawn outside the first light shielding layer so as to surround the display region, comprising the substeps of: (B1) beginning application of the sealant near the light-transmitting portion, (B2) applying the sealant along an outer periphery of the first light shielding layer, and (B3) forming a junction with the sealant having been applied near the light-transmitting portion; (C) applying a liquid crystal material within the display region surrounded by the sealant; (D) attaching the first substrate and the second substrate; and (E) performing light irradiation from the first substrate side to cure the sealant.

Description

Liquid crystal display panel and production method thereof
Technical field
The method that the present invention relates to a kind of liquid crystal display panel and be used to produce this liquid crystal display panel.The invention particularly relates to by the utilization formula of dripping and inject the method that (ODF) technology is produced liquid crystal display panel, and the liquid crystal display panel that is suitable for this production method.
Background technology
In recent years, along with the LCDs board size becomes bigger, the airless injection technology that replaces tradition to use adopts the so-called formula implantttion technique of dripping just becoming more common as the method that forms liquid crystal layer between a pair of substrate.
The process of utilizing the airless injection technology to produce liquid crystal display panel comprises following step.
(a1), form the sealant of predetermined pattern at one of a pair of substrate that is used to constitute liquid crystal display panel (they are colour filtering chip basic board and TFT substrate typically).Then, this links together to substrate, and sealant cures, obtains liquid crystal cells thus.Form the sealant pattern, will be formed on zone (noticing that the viewing area is enclosed in this zone) wherein and limit injection inlet to limit the liquid crystal layer back.
(a2) at the emptying liquid crystal cells with after producing vacuum therein, by utilizing the pressure differential between liquid crystal cells inside and outside and utilizing capillarity, liquid crystal material is injected into, and keeps liquid crystal material to contact with injection inlet simultaneously.
(a3) afterwards, enter the mouth by the sealant sealing injection.
On the other hand, the formula implantttion technique of dripping comprises following step.
(b1) on of a pair of substrate, form the sealant pattern, with around the zone that wherein will form liquid crystal layer, and liquid crystal material is splashed into by in the sealant pattern region surrounded then.
(b2) then, this substrate is connected to another substrate in fact, and sealant cures afterwards.
In the formula implantttion technique of dripping, the sealant pattern needs complete closed wherein to form the zone of liquid crystal layer.Thereby when the sealant pattern is drawn by divider, at least one junction will always form.
The characteristics of the seal pattern that uses in the formula implantttion technique of dripping are described with reference to figure below.
Figure 21 has described the example that four display panels will be formed by mother substrate.Color filter mother substrate 20 comprises four colour filtering chip basic boards.In the viewing area 24 of the colour filtering chip basic board of each generation, color filter is set, this color filter is arranged as corresponding to pixel and counter electrode (not shown).Each colour filtering chip basic board also comprises the light shielding layer (black array) 22 around the viewing area, thereby light shielding layer 22 limits the periphery of viewing area 24.Although Fig. 21 has only described the TFT substrate 10 corresponding to the separation of each display panels, but will be understood that, comprise that the mother substrate (to be similar to the mode of color filter mother substrate 20) of four undivided TFT substrates 10 will be connected to mother substrate 20 before cutting.In each viewing area 14 of four TFT substrates 10, form the necessary circuit element, for example, TFT, pixel electrode, grid bus and source bus line.Each TFT substrate and each colour filtering chip basic board link together by hermetic unit 32.Hermetic unit 32 is formed on the outside of optical screen parietal layer 22.
The part that is positioned at the liquid crystal display panel in 14 outsides, viewing area is called as " non-display area " or " frame area ", wishes that this non-display area or frame area are narrow as far as possible.Optical screen parietal layer 22 and hermetic unit 32 are arranged in the non-display area.
On the other hand, enter in the viewing area 14 in order to prevent unwanted light, light shielding layer 22 need have certain thickness.If light shield is insufficient, the black display degrading quality, thus influence picture quality in fact.In order to satisfy this two kinds of requirements, need light shielding layer 22 peripheries closely near accurately form hermetic unit 22.
Yet when hermetic unit 32 forms by rendering technique, at least one coupling part 32b will form inevitably.It is thicker than the main 32a of stretching, extension of sealing that the part that is tightly connected 32b is tending towards becoming.As used herein the same, sealing is main stretches the part that 32a refers to not comprise the hermetic unit with essence constant width 32 of coupling part 32b.Main stretching, extension 32a is the part of seal pattern, seal pattern forms with sealant, the sealing agent is discharged when carrying out relative motion in the planes at substrate such as nozzle of divider, and therefore main stretching, extension 32a depends on the discharge rate of sealant and the translational speed of nozzle.Thus, main stretching, extension 32a has the width of quite stable.On the other hand, coupling part 32b comprises the part (i.e. the beginning part that sealing is drawn) that sealant at first applies.Initial sealed dose of adding depends on the sealed dose in the end existence of nozzle.The sealed dose that exists at the end of nozzle owing to be used to locate the nozzle cost time span fluctuation (comprising) along the short transverse location and fluctuate in the fluctuation of the residual sealed dose of the end point that seals drafting nozzle end when substrate rises when nozzle.Therefore, because the sealed dose of starting point of drawing in sealing and end point coating is inconsistent, it is wideer that the width of coupling part 32b is tending towards the width that becomes than the main 32a of stretching, extension.
Figure 22 A and 22B describe near the zoomed-in view of part that is tightly connected.Figure 22 A is a planimetric map, and Figure 22 B is a cut-open view.
As mentioned above, if seal pattern has wideer width at coupling part 32b, its part can overlap with light shielding layer 22.Because photocurable resin (comprise and also allow the auxiliary light-cured resin that uses those types of thermosetting) is widely used as sealant, therefore if carry out optical radiation (typically ultraviolet ray (UV) radiation) from the side of colour filtering chip basic board 20, the part 32 of the sealant that overlaps with light shielding layer 22 ' can not fully solidify.Thus, the uncured components of photocurable resin can elution in liquid crystal material, cause the deterioration of reliability thus, for example, the reduction of the voltage retention of the liquid crystal display panel that causes mainly due to ion component, and cause the generation of direction deflection.
Perhaps can carry out optical radiation from the side of TFT substrate 10.Yet, as hereinafter described,, need to adopt some to prevent that TFT is by the device of UV radiation (for example, must be used to shield TFT and avoid light-struck mask) if the UV radiation is carried out from the side of TFT substrate 10.On the other hand, if carry out the UV radiation from the side of colour filtering chip basic board 20, advantage is can save this device under color filter fully absorbs the situation of UV.At least can reduce damage amount to TFT.
In order to prevent that part overlaps between coupling part 32b and light shielding layer 22, the open No.2002-122870 of Japan's publication has disclosed a kind of method, this method relates to the seal pattern of drawing the outside that extends to liquid crystal display panel, with the coupling part 32d that forms the liquid crystal display panel outside, as shown in Figure 23.In addition, as shown in Figure 24, the open No.2002-122870 of Japanese publication has disclosed a kind of method, and this method relates to beginning or the end point 32e that is formed on the sealing of drawing in the liquid crystal display panel outside.
The open No.8-240807 of Japan's publication has disclosed a kind of method, this method relates in the bight and forms the part that is tightly connected, utilize hermetic unit and the light shield space between dividing in the bight of liquid crystal display panel than will be larger about 11.4 times of these advantages along its any side.Yet, in case the width of the part that is tightly connected surpasses about 1.4 times of above-mentioned value, the open No.2002-122870 of same as Japanese publication, this method can not be handled the problems referred to above.
If use the method for describing among the open No.2002-122870 of Japanese publication, no longer need in liquid crystal display panel, form coupling part 32b.Yet as shown in Figure 25 A, this method only can be used for following situation: after TFT substrate (TFT mother substrate) 10 was connected to colour filtering chip basic board (CF mother substrate) 20, mother substrate 10 all cut along identical line CL with 20.Also have another situation, promptly as shown in Figure 25 B, TFT mother substrate 10 is along line of cut CL1 cutting, and CF mother substrate 20 thus, provides signal to show terminal part (driver mounting portion) on TFT substrate 10 along the line of cut CL2 cutting that is different from line of cut CL1.In this case, have following problem, hermetic unit 32t will be retained on the TFT mother substrate 10, and mother substrate 10 will bond to the fragment of the CF mother substrate 20 that will be removed, thereby make and can not remove this fragment.Attention is in order to suppress the signal delay relevant with the size of the increase of display panel etc., in the structure that the signal wire part is provided with along three or four limits of liquid crystal display panel, can not adopt the seal pattern as shown in Figure 25 A.Although the pattern shown in Figure 25 A signal wire terminal part therein need can cause the cutting failure with mother substrate 10 and 20 while cutting sealing parts 32 along adopting under the situation of the both sides setting of liquid crystal display panel.
In addition, the method for describing among the open No.2002-122870 of Japanese publication will need a kind of device, and this device can be plotted to seal pattern the outside of liquid crystal display panel, and the coupling part was formed before leaving display panel.This seal pattern drawing apparatus will size be big inevitably, and has increased the production cost of display panel thus.
The research of carrying out according to the present inventor, the method of describing among the open No.8-240807 of Japan's publication not only has the problem of mentioning among the open No.2002-122870 of Japanese publication, and has another problem, promptly as among Figure 26 A and the 26B schematically shown in, the width of the part that is tightly connected can surpass 1.4 times value occasionally in the bight, even do not form the coupling part.In this case, the sealant 32c that appears at the part that overlaps with light shielding layer 22 can not fully solidify.
Except be tightly connected part and bight, similarly method also can occur at any transition portion (for example public transition portion) that is used to set up the electrical connection between the substrate of upper and lower.
Summary of the invention
In order to overcome the problems referred to above, a kind of be used for effectively the producing method of liquid crystal display panel and the liquid crystal display panel that provides by this production method are provided preferred implementation of the present invention, be formed in the liquid crystal display panel even will cause having the part (part or transition portion for example are tightly connected) of the seal pattern of thicker width under traditional production method, the reliability of this liquid crystal display panel can not reduce yet.
LCDs plate producing process according to the present invention is a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprises first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, said method comprising the steps of: first substrate (A) is provided or comprises first mother substrate of first substrate, with second substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer; (B) utilize the sealant that comprises photocurable resin to draw seal pattern, described seal pattern is plotted in the first light shielding layer outside of first substrate, to center on the viewing area, draw seal pattern and comprise following substep: (B1) begin the coating of sealant in the light transmission part near first substrate, (B2) periphery along first light shielding layer of first substrate applies sealant; (B3) form coupling part with the sealant that has applied near the light transmission part; (C) in the viewing area that centers on by sealant, apply liquid crystal material; (D) first substrate and second substrate are linked together, and liquid crystal material places between them; And (E) afterwards, carry out optical radiation from first substrate-side, with curing sealant in step (D).
In one embodiment, first substrate has rectangular shape; Described at least one light transmission part comprises at least the light transmission part that is provided with along the limit of rectangular shape; And described coupling part is formed on the office, transmittance section that is provided with along the described limit of rectangular shape.
In one embodiment, described at least one light transmission part comprises two or more light transmission parts that are provided with along the described limit of rectangular shape; And described coupling part is formed on two or more offices, transmittance section that are provided with along the described limit of rectangular shape.
In one embodiment, described at least one light transmission part also comprises the light transmission part in the bight that is arranged on rectangular shape.
In one embodiment, first mother substrate comprises a plurality of first substrates, described method comprises: first plot step, wherein by coating near one in two or more light transmission parts of first substrate beginning sealant, periphery along first light shielding layer applies sealant, and finish the coating of sealant near in two or more light transmission parts another, and draw seal pattern in a plurality of first substrates one; Second plot step, wherein by coating near one in two or more light transmission parts of first substrate beginning sealant, periphery along first light shielding layer applies sealant, and finish the coating of sealant near in two or more light transmission parts another, and on another of a plurality of first substrates, draw seal pattern; The 3rd plot step, wherein after first plot step, by the coating of beginning sealant,, thereby on described one first substrate, draw seal pattern so that form coupling part with the sealant that has applied near a light transmission part or another light transmission part of first substrate; And the 4th plot step: after second plot step, coating by the beginning sealant, so that form the coupling part with the sealant that has applied near a light transmission part or another light transmission part of first substrate, thereby on described another first substrate, draw seal pattern.
Another kind of LCDs plate producing process according to the present invention is a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprises first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, said method comprising the steps of: first substrate (A) is provided or comprises first mother substrate of first substrate, and second substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer; (B) utilize the sealant that comprises photocurable resin to draw seal pattern, to be arranged in the zone of the first light shielding layer outside of first substrate at second substrate when second substrate is connected to first substrate, draw described seal pattern, and seal pattern is plotted as around the viewing area, described drafting seal pattern comprises following substep: (B1) beginning the coating of sealant near the position corresponding to the light transmission part of first substrate, (B2) applying sealant along the zone corresponding to the periphery of first light shielding layer of first substrate; (B3) form coupling part with the sealant that has applied near position corresponding to the light transmission part; (C) in the viewing area that sealant centers on, apply liquid crystal material; (D) first substrate and second substrate are linked together, and liquid crystal material places between them; And (E) afterwards, carry out optical radiation from first substrate-side, with curing sealant in step (D).
In one embodiment, first substrate has rectangular shape; Described at least one light transmission part comprises at least the light transmission part that is provided with along the limit of rectangular shape; And described coupling part is formed on the position of the light transmission part that is provided with corresponding to the described limit along rectangular shape.
In one embodiment, described at least one light transmission part comprises two or more light transmission parts that are provided with along the limit of rectangular shape; And described coupling part is formed on each the position in two or more light transmission parts that form corresponding to the described limit along rectangular shape.
In one embodiment, described at least one light transmission part also comprises the light transmission part in the bight that is arranged on rectangular shape.
In one embodiment, second mother substrate comprises a plurality of second substrates, described method comprises: first plot step, wherein begin the coating of sealant corresponding to one position in two or more light transmission parts of first substrate by approaching, the edge applies sealant corresponding to the zone of the periphery of first light shielding layer, and near the coating that finishes sealant corresponding to another the position in two or more light transmission parts, and draw seal pattern in a plurality of second substrates one; Second plot step, wherein begin the coating of sealant corresponding to one position in two or more light transmission parts of first substrate by approaching, the edge applies sealant corresponding to the zone of the periphery of first light shielding layer, and near the coating that finishes sealant corresponding to another the position in two or more light transmission parts, and on another of a plurality of second substrates, draw seal pattern; The 3rd plot step: after first plot step, coating by the beginning sealant, so that form with near the coupling part of the sealant that applies corresponding to the position of a light transmission part of first substrate or corresponding to the position of another light transmission part, thereby on described one second substrate, draw seal pattern; And the 4th plot step, wherein after second plot step, coating by the beginning sealant, so that form with near the coupling part of the sealant that applies corresponding to the position of a light transmission part of first substrate or corresponding to the position of another light transmission part, thereby on described another second substrate, draw seal pattern.
In one embodiment, liquid crystal display panel has the broad gap zone in non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, and described broad gap zone is included in the depression in the surface of first substrate or second substrate; And described at least one light transmission part comprises the light transmission part that is provided with near the broad gap zone.
In one embodiment, described LCDs plate producing process comprises the steps: that also the material for transfer that will comprise photocurable resin is coated to first substrate or second substrate, be formed for setting up the transfer part that is electrically connected between first substrate and second substrate, wherein material for transfer is coated in the described depression.
In one embodiment, described LCDs plate producing process comprises the steps: that also the material for transfer that will comprise photocurable resin is coated to first substrate or second substrate, be formed between first substrate and second substrate, setting up the transfer part that is electrically connected, wherein material for transfer be coated on first substrate, near the position of at least one light transmission part, or near the position on second substrate, corresponding to the light transmission part of first substrate.
In one embodiment, step (E) comprises the substep that solidifies material for transfer by optical radiation.
In one embodiment, the transfer portion branch forms at least partly and overlaps with seal pattern.
In one embodiment, second substrate comprises at least one second light shielding layer in non-display area, and described at least one second light shielding layer is arranged in the zone corresponding to described at least one light transmission part of first substrate.
In one embodiment, second substrate comprises source bus line and grid bus; And described at least one second light shielding layer comprises the conductive layer identical with the conductive layer of source bus line or grid bus.
In one embodiment, described at least one light transmission part comprises a plurality of recesses or opening, described second light shielding layer also comprises the light transmission part corresponding to the neighborhood setting of the gap between described a plurality of recesses or the opening or a plurality of recess or opening, described method also comprises: in step (D) afterwards, carry out the step of optical radiation from second substrate-side.
Another LCDs plate producing process according to the present invention is a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprises first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area, non-display area around the viewing area, and the broad gap zone in the non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, described broad gap zone is included in the depression in the surface of first substrate or second substrate, said method comprising the steps of: first substrate (A) is provided or comprises first mother substrate of first substrate, and second substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area; (B) utilize the sealant that comprises photocurable resin to draw seal pattern, described seal pattern is plotted in the first light shielding layer outside of first substrate with depression, or described seal pattern is plotted in the zone of second substrate of the first light shielding layer outside that will be positioned at first substrate when second substrate with depression is connected to first substrate, described seal pattern is plotted as around the viewing area, draw seal pattern and comprise following substep: (B1) depression near first substrate or second substrate begins the coating of sealant, (B2) along the periphery of first light shielding layer of first substrate, or along applying sealant corresponding to the zone on second substrate of the first light shielding layer periphery of first substrate; And the coupling part of the sealant that (B3) forms and applied near caving in; (C) in the viewing area that sealant centers on, apply liquid crystal material; (D) first substrate and second substrate are linked together, and liquid crystal material places between them; And (E) afterwards, carry out optical radiation, with curing sealant in step (D).
Another LCDs plate producing process according to the present invention is a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprises first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area, non-display area around the viewing area, and the broad gap zone in non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, described broad gap zone is included in the depression in the surface of first substrate or second substrate, said method comprising the steps of: first substrate (A) is provided or comprises first mother substrate of first substrate, and second substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area; (B) utilize the sealant that comprises photocurable resin to draw seal pattern, described seal pattern is plotted in the first light shielding layer outside of first substrate with depression, or described seal pattern is plotted in the zone of second substrate of the first light shielding layer outside that will be positioned at first substrate when second substrate with depression is connected to first substrate, and described seal pattern is plotted as around the viewing area; The material for transfer that (B ') will comprise photocurable resin is coated to first substrate or second substrate, is formed for setting up the transfer part that is electrically connected between first substrate and second substrate, and material for transfer is coated in the depression; (C) in the viewing area that sealant centers on, apply liquid crystal material; (D) first substrate and second substrate are linked together, and liquid crystal material places between them; And (E) afterwards, carry out optical radiation, with curing sealant in step (D).
In one embodiment, step (B) comprises substep (B1): apply sealant since the depression of first substrate or second substrate.
In one embodiment, described LCDs plate producing process also comprises the step that forms depression, and the step that wherein forms depression comprises substep: form through hole or hole in the photosensitive resin layer of eurymeric or minus.
In one embodiment, described LCDs plate producing process also comprises the step that forms depression, and the step that wherein forms depression comprises substep: form the hole by utilizing half exposure technique in photosensitive resin layer.
In one embodiment, first substrate comprises the color filter in the viewing area.
A kind of liquid crystal display panel according to the present invention is a kind of liquid crystal display panel, comprise first substrate, second substrate, place the liquid crystal layer between first substrate and second substrate, and the hermetic unit that centers on liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein, first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer; And hermetic unit has the width of widening in described at least one office, transmittance section.
Another kind of liquid crystal display panel according to the present invention is a kind of liquid crystal display panel, comprise first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, hermetic unit around liquid crystal layer, and the transfer part that is used between first substrate and second substrate, setting up electrical connection, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein, first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer; At least a part that shifts part is arranged in described at least one light transmission part.
In one embodiment, first substrate is included in the color filter in the viewing area.
In one embodiment, second substrate is included at least one second light shielding layer in the non-display area, and described at least one second light shielding layer is arranged in the zone corresponding at least one light transmission part of described first substrate.
In one embodiment, second substrate comprises source bus line and grid bus; And described at least one second light shielding layer comprises the conductive layer identical with the conductive layer of source bus line or grid bus.
In one embodiment, described at least one light transmission part comprises the recess or the opening of slit-shaped; And described at least one second light shielding layer comprises a plurality of light shield parts, and described a plurality of light shield branches are set to relative with slit-shaped recess or opening.
Another liquid crystal display panel according to the present invention is a kind of liquid crystal display panel, comprise first substrate, second substrate, place the liquid crystal layer between first substrate and second substrate, hermetic unit around liquid crystal layer, and the transfer part that is used between first substrate and second substrate, setting up electrical connection, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein, described liquid crystal display panel is included in the broad gap zone in the non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, and described broad gap zone is included in the depression in the surface of first substrate or second substrate; The transfer portion branch is arranged in the depression.
Another liquid crystal display panel according to the present invention is a kind of liquid crystal display panel, comprise first substrate, second substrate, place the liquid crystal layer between first substrate and second substrate, and the hermetic unit that centers on liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein, described liquid crystal display panel is included in the broad gap zone in the non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, and described broad gap zone is included in the depression in the surface of first substrate or second substrate; And the part of hermetic unit is arranged in the depression.
In one embodiment, depression comprises through hole or hole in the photosensitive resin layer that is formed on eurymeric or minus.
According to LCDs plate producing process of the present invention, use the substrate that comprises light shielding layer, described substrate has in the light transmission part of the position of the coupling part that becomes sealant (recess or opening), and carries out optical radiation from the side of this substrate.As a result, prevent inadequate sealant cures in the coupling part.In addition, the bight or the transfer part (for example public transfer part) that may broaden by the width at sealant provide the light transmission part, also can prevent to lose efficacy in the sealant cures of this bight or transport zone.Therefore, because the light transmission part only is arranged in the part that width light shielding layer, seal pattern expection broadens, so the width of non-display area can keep narrower.In addition,, will can not damage the original applications of light shielding layer, prevent that promptly light from revealing by providing light shielding layer (being arranged on relative position, position on first substrate) on another substrate with the light transmission part.
Owing to needn't form hermetic unit in the outside of liquid crystal display panel, therefore prevent the inefficacy during the mother substrate cutting.In addition, by two or more coupling parts are provided in liquid crystal display panel, obtained the degree of freedom that increases with respect to the drawing order of hermetic unit, and/or can utilize a plurality of dividers to carry out simultaneously to draw, can reduce sealing thus and draw the production quiescent interval of handling.By two or more coupling parts are provided in seal pattern, can utilize relatively little seal pattern drawing apparatus on the large-sized liquid crystal display plate, to carry out the drafting of seal pattern, can suppress the increase of production cost thus.
By colour filtering chip basic board is used as aforesaid substrate, can reduce because the damage that UV produces for TFT.In addition, can save the mask that is used for handling protection TFT in optical radiation.By also carrying out optical radiation, can reduce and solidify needed radiated time from the TFT substrate-side.
According to LCDs plate producing process of the present invention, the part place that depression is arranged in the surface of substrate, the sealing expection has the width of widening (for example, the part that is tightly connected or transfer part), depression defines the zone with the gap between the bigger substrate.As a result, the increase of seal pattern width can self be suppressed.By adopting this depression, can obtain two kinds of effects with above-mentioned light transmission part.
Further feature of the present invention, element, process, step, characteristics and advantage from below in conjunction with accompanying drawing to the detailed description of the preferred embodiments of the present invention and become clearer.
Description of drawings
Figure 1A, 1B, 1C and 1D are the synoptic diagram of describing according to the structure of the part that is tightly connected in the liquid crystal display panel of the embodiment of the invention.
Fig. 2 is the synoptic diagram that is used to describe the sealing drawing process of the CF mother substrate that obtains six colour filtering chip basic boards.
Fig. 3 A and 3B are the synoptic diagram that is described in according to the structure of the sealing in the bight of the liquid crystal display panel of the embodiment of the invention.
Fig. 4 is a planimetric map of describing typical liquid crystal display panel.
Fig. 5 A to 5C be described in along on it not the limit of signalization line terminals part the synoptic diagram of the exemplary configurations of the light shielding layer under the situation of light transmission part is set.Fig. 5 A is a planimetric map; Fig. 5 B is the cut-open view along the line 5B-5B ' among Fig. 5 A; And Fig. 5 C is the cut-open view along the line 5C-5C ' among Fig. 5 A.
Fig. 6 A to 6C be described in along on it not the limit of signalization line terminals part the synoptic diagram of another exemplary configurations of the light shielding layer under the situation of light transmission part is set.Fig. 6 A is a planimetric map; Fig. 6 B is the cut-open view along the line 6B-6B ' among Fig. 6 A; And Fig. 6 C is the cut-open view along the line 6C-6C ' among Fig. 6 A.
Fig. 7 A to 7C be described in along on it not the limit of signalization line terminals part the synoptic diagram of the another exemplary configurations of the light shielding layer under the situation of light transmission part is set.Fig. 7 A is a planimetric map; Fig. 7 B is the cut-open view along the line 7B-7B ' among Fig. 7 A; And Fig. 7 C is the cut-open view along the line 7C-7C ' among Fig. 7 A.
Fig. 8 A to 8D is described in the synoptic diagram that the exemplary configurations of the light shielding layer under the situation of light transmission part is set in the zone corresponding to grid bus terminal part GB1 along the minor face SE1 of liquid crystal display panel.Fig. 8 A is a planimetric map; Fig. 8 B is the cut-open view along the line 8B-8B ' among Fig. 8 A; Fig. 8 C is the cut-open view along the line 8C-8C ' among Fig. 8 A; And Fig. 8 D is the cut-open view along the line 8D-8D ' among Fig. 8 A;
Fig. 9 A to 9D is described in the synoptic diagram that another exemplary configurations of the light shielding layer under the situation of light transmission part is set in the zone corresponding to grid bus terminal part GB1 along the minor face SE1 of liquid crystal display panel.Fig. 9 A is a planimetric map; Fig. 9 B is the cut-open view along the line 9B-9B ' among Fig. 9 A; Fig. 9 C is the cut-open view along the line 9C-9C ' among Fig. 9 A; And Fig. 9 D is the cut-open view along the line 9D-9D ' among Fig. 9 A.
Figure 10 A to 10C is described in the synoptic diagram that the another exemplary configurations of the light shielding layer under the situation of light transmission part is set in the zone corresponding to grid bus terminal part GB1 along the minor face SE1 of liquid crystal display panel.Figure 10 A is a planimetric map; Figure 10 B is the cut-open view along the line 10B-10B ' among Figure 10 A; Figure 10 C is the cut-open view along the line 10C-10C ' among Figure 10 A.
Figure 11 A to 11D is described in the synoptic diagram that the exemplary configurations of the light shielding layer under the situation of light transmission part is set in the zone corresponding to source bus line terminal part SB1 along the long limit LE1 of liquid crystal display panel.Figure 11 A is a planimetric map; Figure 11 B is the cut-open view along the line 11B-11B ' among Figure 11 A; Figure 11 C is the cut-open view along the line 11C-11C ' among Figure 11 A; And Figure 11 D is the cut-open view along the line 11D-11D ' among Figure 11 A.
Figure 12 A to 12D is described in the synoptic diagram that another exemplary configurations of the light shielding layer under the situation of light transmission part is set in the zone corresponding to source bus line terminal part SB1 along the long limit LE1 of liquid crystal display panel.Figure 12 A is a planimetric map; Figure 12 B is the cut-open view along the line 12B-12B ' among Figure 12 A; Figure 12 C is the cut-open view along the line 12C-12C ' among Figure 12 A; And Figure 12 D is the cut-open view along the line 12D-12D ' among Figure 12 A.
Figure 13 A to 13C is described in the synoptic diagram that the another exemplary configurations of the light shielding layer under the situation of light transmission part is set in the zone corresponding to source bus line terminal part SB1 along the long limit LE1 of liquid crystal display panel.Figure 13 A is a planimetric map; Figure 13 B is the cut-open view along the line 13B-13B ' among Figure 13 A; Figure 13 C is the cut-open view along the line 13C-13C ' among Figure 13 A.
Figure 14 is described in according to hermetic unit in the liquid crystal display panel of the embodiment of the invention 32 and the synoptic diagram that comprises the light shielding layer 22 of recess 22a.
Figure 15 A and 15B are used to describe the schematic plan view that the liquid crystal display panel of common employing is arranged.
Figure 16 A, 16B, 16C and 16D describe traditional shared schematic plan view that shifts the structure of part.
Figure 17 A and 17B are the shared schematic plan views of describing according in the liquid crystal display panel of the embodiment of the invention that shifts the structure of part.
Figure 18 A, 18B, 18C and 18D are that each is all described according to the shared synoptic diagram that shifts the structure of part in the liquid crystal display panel of the embodiment of the invention.
Figure 19 A, 19B, 19C and 19D are that each all describes the shared synoptic diagram that shifts the structure of part in the liquid crystal display panel according to another embodiment of the present invention.
Figure 20 is the curve of describing the thickness (degree of depth of through hole 61a) of resin bed 61 and reducing the relation between the effect of width of hermetic unit 32.
Figure 21 is the synoptic diagram of characteristic of describing the seal pattern of the formula implantttion technique that is used for dripping.
Figure 22 A and 22B are near the zoomed-in views of describing the part that is tightly connected.Figure 22 A is a planimetric map, and Figure 22 B is a cut-open view.
Figure 23 is a synoptic diagram of describing the example of conventional seals pattern.
Figure 24 is a synoptic diagram of describing another example of conventional seals pattern.
Figure 25 A and 25B are the synoptic diagram that is used to illustrate the problem of conventional seals pattern.
Figure 26 A and 26B are the synoptic diagram that is used to illustrate another problem of conventional seals pattern.
Embodiment
Describe below with reference to accompanying drawings according to the liquid crystal display panel of the embodiment of the invention and the method for producing this liquid crystal display panel.
As shown in Figure 1A and 1B, the liquid crystal display panel according to the embodiment of the invention comprises: TFT substrate 10, colour filtering chip basic board 20 is arranged on the liquid crystal layer 40 between TFT substrate 10 and the colour filtering chip basic board 20, and the hermetic unit 32 that centers on liquid crystal layer 40.Liquid crystal display panel has the viewing area and centers on the non-display area of display part.Colour filtering chip basic board 20 has the first light shielding layer 22A, and this first light shielding layer 22A is arranged in the non-display area in the end near the viewing area more.The first light shielding layer 22A has recess (light transmission part) 22a that is provided with near outward flange.The recess 22a that the width of hermetic unit 32 is allowed at light shielding layer 22A becomes wideer.The recess 22a that supposes light shielding layer 22A has sufficient width and length, if coupling part 32b is formed in the recess 22a, even the width coupling part 32b that has an increase as coupling part 32b does not overlap with light shield 22A yet.Therefore, as shown in Figure 1B, also can fully solidify even carry out UV radiation sealant from the back side of colour filtering chip basic board 20.
Noticing that sealant is not limited to the resin of UV-curable, can be the resin that the light (for example visible light) with any wavelength solidifies, and various photocurable resin be applicable.Here the photocurable resin that uses refers to that its radiation in response to the light of predetermined wavelength is cured any resin of reaction, and is included in any resin that photocuring can further carry out heat fixation afterwards to it.By the auxiliary use of this heat fixation, the physical characteristics of solidified material (for example consistency and elasticity modulus) is enhanced usually.In addition, the particle (filling material) that is used for scattering power is given sealant can be mixed together sealant with photocurable resin.Particle dispersion sealant wherein will cause scattering of light or diffuse reflection, therefore allow the broader area of light transmission sealant.
The light shielding layer 22A of the colour filtering chip basic board 20 shown in Figure 1A is shown as has the single recess 22a that extends in the whole length of coupling part 32b.Replace this recess 22a,, can use any other recess as long as recess allows sealant to use up abundant radiation.For example, the example of the light shielding layer 22B as shown in Fig. 1 C, a plurality of small recess 22b can be with the band shape setting.As selection, the example of the light shielding layer 22C as shown in Fig. 1 D can be provided with a plurality of minute openings (hole) 22c.According to recess or opening, the light transmission part that is used to allow sealant to accept optical radiation does not need to be formed with constant width, but can have the width of variation, with the width of the expansion of holding coupling part 32 as required.Under the situation that recess 22b as Fig. 1 C or 1D as shown in or opening 22c are set, sealant more is difficult to accept optical radiation than the situation of the recess 22a shown in employing Figure 1A.Therefore, in this case, optimal way is to adopt not only to allow light to incide substrate but also can introduce the light irradiation apparatus of the type of certain radiation angle by catoptron etc. with the right angle, or adopts the sealant with scattering power (diffusing characteristic diffuser).
In last liquid crystal display panel, display quality may be owing to the light that passes the recess 22a that is arranged among the light shielding layer 22A is demoted.Therefore, optimal way is in the position relative with recess 22a another light shielding layer to be set.Although may be in the outside of color filter 20 (promptly more near observer's a side) connect light shield band etc., but this set is not preferred, because will increase the quantity of production stage, orientation problem may take place, and may take place in liquid crystal display panel is installed in housing the time highly different.Therefore, will be as the back described in the object lesson, optimal way is that position corresponding on TFT substrate 10 is provided with light shielding layer.In this case, form light shielding layer, can form light shielding layer and not increase step number by utilizing the conductive layer identical with the conductive layer of source bus line that on the TFT substrate, is provided with and/or grid bus.
By adopting said structure, also can allow sealant fully to solidify in the liquid crystal display panel even the part that is tightly connected is formed on, and can not make the production stage complexity.Also can prevent the light transmission part leakage of light from the light shielding layer that is arranged on colour filtering chip basic board effectively.Because optical radiation is carried out from the colour filtering chip basic board side, therefore at least when through color filter the light of radiation TFT weakened, thereby can reduce the damage that causes by the optical radiation that is used for TFT.Under the situation that can only obtain fully to weaken with color filter, needn't adopt to be used to prevent that TFT is subjected to the mask of optical radiation, further improved production efficiency thus.
Secondly, the liquid crystal display panel of the embodiment of method produced according to the invention is described with reference to Fig. 2.
Fig. 2 is used to describe the synoptic diagram of sealing drawing process that obtains the CF mother substrate 20 of six colour filtering chip basic boards from it.As described below, an advantage of the liquid crystal display panel of embodiment in accordance with the present production process is: by utilizing a plurality of coupling parts, utilize the divider that himself has narrow relatively mobile range, can obtain large-sized liquid crystal display panel.Another advantage is, by two or more coupling parts are set in liquid crystal display panel, obtain the degree of freedom of increase with respect to the drawing order of seal pattern, and/maybe can draw seal pattern simultaneously by adopting a plurality of dividers, can reduce the production quiescent interval of sealing drawing process thus.
For one (for example, the A1 among Fig. 2) six colour filtering chip basic boards 20 (A1 to A3 and B1 to B3) that obtain from CF mother substrate 20, sealant can be for example from a S1.Therefore, some S1 is as the starting point of seal pattern.Near the point S1 selection recess 22a of color filter 20 (noticing that Fig. 2 has only schematically described recess 22a).Draw after a S1 begins in sealing, sealant is along periphery (along the solid line among Fig. 2) coating of the light shielding layer 22 of colour filtering chip basic board 20, and sealant is coated near (some S2) end of another recess 22a.Point S2 is as the end point of seal pattern.
Then, with respect to colour filtering chip basic board A1, sealant applies from starting point S1 once more, and along the dotted line among Fig. 2, seals drafting, up to reaching end point S2.Therefore, can form hermetic unit around the viewing area.
Thus, by adopting the structure that a plurality of coupling parts wherein are set, do not need in single drafting around gamut from starting point S1 to end point S1.Therefore, even only can moving also at the mobile range of relative narrower, dispenser nozzle (and/or mother substrate) can seal drafting.Under the situation that can obtain sufficient mobile range, certainly can begin sealing from for example starting point S1 and draw,, cross a S2 along the periphery sealant of the light shielding layer 22 of colour filtering chip basic board 20, turn back to starting point S1 then, form the coupling part at a S1 thus.In this case, only a coupling part forms at starting point S1.
In addition, according to the production method of the embodiment of the invention, needn't before moving to another colour filtering chip basic board, finish whole hermetic unit 32 in six colour filtering chip basic boards (A1 to A3 and B1 to B3).For example, can on each of colour filtering chip basic board A1 to A3, draw simultaneously, and after this and meanwhile, can on each of colour filtering chip basic board B1 to B3, draw simultaneously corresponding to the seal pattern of solid line corresponding to the seal pattern of solid line.Afterwards, can on each of colour filtering chip basic board A1 to A3, draw simultaneously, and after this or meanwhile, can on each of colour filtering chip basic board B1 to B3, draw simultaneously corresponding to the seal pattern of dotted line corresponding to the seal pattern of dotted line.
Although this example shows on the minor face that recess 22a is arranged on the substrate with rectangular shape, also recess can be arranged on the long limit of substrate.In addition, recess can also be arranged on minor face and the long limit, thereby form three or more junctions.The location of recess 22a (being the light transmission part) can be according to the mobile range of divider, and the size of mother substrate and the panel location in mother substrate is regulated.Be not limited to recess 22a, can adopt recess 22b or opening 22c as shown in Fig. 1 C or 1D, or their any mixing.Thus, about the shape of recess or opening without limits, as long as sealant can be used up abundant radiation.Yet as described below, in order to realize sufficient light shield with the light shielding layer that is arranged on the TFT substrate, optimal way is to optimize the shape and the location of recess or opening.
Although above-mentioned example shows the situation that CF mother substrate 20 is sealed drafting, also can draw seal pattern in the corresponding region of TFT mother substrate 10.In other words, can draw seal pattern, thereby the above-mentioned relation with respect to the light transmission part 22 in the light shielding layer 22 of colour filtering chip basic board (recess 22a) is satisfied in the position that will form hermetic unit 32 when colour filtering chip basic board 20 and TFT substrate 10 link together.
In the LCDs plate producing process of this embodiment, the coupling part of sealant is formed on the inboard of liquid crystal display panel, and announce among the No.2002-122870 differently with Japanese publication thus, there is not hermetic unit in the outside of liquid crystal display panel in the present invention.As a result, when cutting into piece corresponding to liquid crystal display panel, TFT mother substrate 10 and CF mother substrate 20 prevent the cutting failure.Even will be arranged in the signal wire terminal part under the situation on three or more limit of liquid crystal display panel, and also can prevent problem such as the fragment that can not remove colour filtering chip basic board.
Note, preferably not only be arranged on the coupling part but also be arranged on the bight such as the light transmission part of recess 22, as shown in Figure 3A and 3B.By bight recess 22d is set, can prevents that in the bight the sealant 32a ' of thickening overlaps with light shielding layer 22D, thereby sealant is fully solidified at light shielding layer 22D.
Although the coupling part can be formed on this bight, from the convenient viewpoint of checking the coupling part, optimal way is, forms any coupling part along the limit (not comprising the bight) of substrate.The coupling part that forms along the limit can be tested qualified degree by utilizing optical tech to detect the width of hermetic unit.In other words, if forming along the limit, the coupling part can easily detect such as imperfect (promptly the breaking) of coupling part or the inefficacy of crossing thin width.
Next, with reference to Fig. 4 to 13 structure according to the liquid crystal display panel of the embodiment of the invention is described in more detail.
Fig. 4 is a planimetric map of describing typical liquid crystal display panel.Liquid crystal display panel comprises: TFT substrate 10 '; Colour filtering chip basic board 20; And be used for TFT substrate 10 ' and colour filtering chip basic board 20 between realize bonding hermetic unit 32.TFT substrate 10 ' have two long limit LE1 and LE2, and two minor face SE1 and SE2.In an example shown, growing limit LE1 and minor face SE1 extends in the outside of colour filtering chip basic board 20; Source bus line terminal part SB 1 is arranged on the long limit LE1; And grid bus terminal part GB1 is arranged on the minor face SE1.Therefore, at these signal bus terminal part SB1 and GB1, the light shield part (not shown) of hermetic unit 32 and colour filtering chip basic board 20 and signal bus overlap.Thereby, (for example need have at the TFT substrate corresponding to the light transmission part in the light shielding layer that is arranged on colour filtering chip basic board 20, under the situation of light shielding layer recess), the preferred structure of this light shielding layer will change according to the position of line (for example, source bus line or grid bus).
Fig. 4 shows the example on two limits that the signal wire terminal part is arranged on substrate.As selection, the present invention also can be used for the signal wire terminal part and (for example is arranged on three structures on the limit, the grid bus terminal part is arranged on two minor faces), or the signal wire terminal part is arranged on four structures (be grid bus terminal part be arranged on two limits and source bus line terminal part be arranged on other two limits) on the limit.
At first, with reference to Fig. 5 A, 5B, 5C, 6A, 6B, 6C, 7A, 7B and 7C describe along on it not the limit (SE2 or LE2) of signalization line terminals part the exemplary configurations of the light shielding layer under the situation of light transmission part is set.Fig. 5 A to 5C be described in along on it not the limit of signalization line terminals part the synoptic diagram of the exemplary configurations of the light shielding layer under the situation of light transmission part is set.Fig. 5 A is a planimetric map; Fig. 5 B is the cut-open view along the line 5B-5B ' among Fig. 5 A; And Fig. 5 C is the cut-open view along the line 5C-5C ' among Fig. 5 A.Fig. 6 A to 6C is a synoptic diagram of describing another exemplary configurations.Fig. 6 A is a planimetric map; Fig. 6 B is the cut-open view along the line 6B-6B ' among Fig. 6 A; And Fig. 6 C is the cut-open view along the line 6C-6C ' among Fig. 6 A.Fig. 7 A to 7C is a synoptic diagram of describing another exemplary configurations.Fig. 7 A is a planimetric map; Fig. 7 B is the cut-open view along the line 7B-7B ' among Fig. 7 A; And Fig. 7 C is the cut-open view along the line 7C-7C ' among Fig. 7 A.
Fig. 5 A to 5C has described the situation that recess 22a is set in the position of part 32b that formation is tightly connected.Fig. 6 A to 6C has described the situation that a plurality of recess 22b are set in this position.Fig. 7 A to 7C has described the situation that a plurality of recess 22b ' and a plurality of opening 22c ' are set in this position.Under any situation, in zone, there are not grid bus terminal part or source bus line terminal part corresponding to the TFT substrate 10 of the light transmission part in the light shielding layer 22 of colour filtering chip basic board (22a, 22b, 22b ', 22c ').Therefore, light shielding layer 12a can be arranged on the zone of any needs.TFT substrate 10 comprises glass substrate 11; be formed on the grid bus (not shown) on the glass substrate 11; the grid insulating film 13 of overlies gate bus is formed on the source bus line (not shown) on the grid insulating film, and the insulation protection film 15 that covers source bus line.When making the conductive layer that constitutes grid bus form pattern, this pattern forms and can carry out in the remaining complete mode of light shielding layer 12a, thereby light shielding layer 12a is formed by the same process that forms grid bus.By adopting this structure, can on TFT substrate 10, form light shielding layer 12a, and not increase the quantity of production stage.
On minor face SE2, the main line of storage capacitance line is used to memory capacitance to supply with prearranged signals, and described memory capacitance is provided with for each pixel, and siding is used to revise the electrical connection of disconnected any signal wire.This main line or siding are thick relatively, can be used as light shielding layer thus.Usually, the main line of storage capacitance line and siding are made of the identical conduction layer that constitutes grid bus, and are formed by the same process that forms grid bus.Therefore, owing to have the high design freedom that is used to form light shielding layer at the minor face of liquid crystal display panel, so optimal way is to form any part that is tightly connected on minor face.
Particularly, can make the TFT substrate by following processes.
On glass substrate 11, produce the Ti/Al/TiN stacked film by utilizing sputter equipment.By etch process, form grid bus and gate electrode, and light shielding layer 12a forms simultaneously also such as photoetching process and dry ecthing.For example, will be under the situation of formation simultaneously such as grid bus in storage capacitance line, the main line of storage capacitance line can be arranged on minor face SE2, makes thus and can utilize the main line of storage capacitance line as light shielding layer 12a.
Secondly, on these layers, generate silicon nitride grid insulating films 13 such as (SiNx) by the plasma CVD technology.Afterwards, the active component of formation such as TFT.In addition, generate the Ti/Al/TiN stacked film by utilizing sputter equipment, and, form source bus line and drain electrode by etch process such as photoetching process and dry ecthing.
Then, form insulation protection film 15 by spin coating technique etc. such as transparent resin.In insulation protection film 15, make and to be used for thereon setting up the contact hole that contact between the pixel electrode that will form and the drain electrode, and manufacturing is used to form the through hole of memory capacitance.On insulation protection film 15, generate transparency electrode by sputter and (for example, ITO), and form pixel electrode by photoetching process and etch process.
For example, colour filtering chip basic board can followingly be made.
By dry type film technology, spin coating technique, ink-jet technology etc., light shielding layer be formed on corresponding to the glass substrate 21 of the color filter of RGB (red, green, blue) the zone and other necessary zone in, the color filter of RGB (red, green, blue) is corresponding with the pixel of TFT substrate.Because light shielding layer forms by utilizing the black photocurable resin, so light transmission part (recess and/or opening) can form by identical technology during forming pattern.
Secondly, be described in the exemplary configurations that the light shielding layer under the situation of light transmission part is set in the zone corresponding to grid bus terminal part GB1 along minor face SE1 with reference to Fig. 8 A, 8B, 8C, 8D, 9A, 9B, 9C, 9D, 10A, 10B, 10C.Fig. 8 A to 8C is described in the synoptic diagram that the exemplary configurations of the light shielding layer under the situation of light transmission part will be set in corresponding to the zone of grid bus terminal part GB1 along minor face SE1.Fig. 8 A is a planimetric map; Fig. 8 B is the cut-open view along the line 8B-8B ' among Fig. 8 A; Fig. 8 C is the cut-open view along the line 8C-8C ' among Fig. 8 A; And Fig. 8 D is the cut-open view along the line 8D-8D ' among Fig. 8 A.Fig. 9 A to 9C is a synoptic diagram of describing another exemplary configurations.Fig. 9 A is a planimetric map; Fig. 9 B is the cut-open view along the line 9B-9B ' among Fig. 9 A; Fig. 9 C is the cut-open view along the line 9C-9C ' among Fig. 9 A; And Fig. 9 D is the cut-open view along the line 9D-9D ' among Fig. 9 A.Figure 10 A to 10C is a synoptic diagram of describing another exemplary configurations.Figure 10 A is a planimetric map; Figure 10 B is the cut-open view along the line 10B-10B ' among Figure 10 A; Figure 10 C is the cut-open view along the line 10C-10C ' among Figure 10 A.
Grid bus 12b is formed on the glass substrate of TFT substrate 10.Grid bus 12b is as light shielding layer.Yet under the situation that forms the recess 22a shown in Fig. 8 A, light will pass between grid bus 12b.Therefore, shown in Fig. 8 D, and the conductive layer 14a of source bus line in same layer height is used to form the light shield part 14a that is used for guaranteeing the space light shield between grid bus 12b.Can be with the formal construction light shield part 14a of the single light shielding layer that overlaps with grid bus 12b and any therebetween space.Yet, under the situation that this light shielding layer overlaps by grid insulating film 13 and grid bus, may in some cases, between grid bus, may be short-circuited because the inadequate problem of insulation appears in foreign matter etc.Therefore, from the viewpoint of output, optimal way is to form the discrete light masked segment 14a corresponding to the space between the grid bus 12b, so do not overlap between light shielding layer that produces and grid bus 12b.
As shown in Fig. 9 A, a plurality of recess 22b can be set to relative with grid bus 12b.In this case, can realize sufficient light shield with grid bus 12b separately, the advantage of the structure of simplification is provided thus.
As shown in Figure 10 A, it is relative with grid bus 12b with a plurality of opening 22c ' and opening 22c ' that a plurality of recess 22b ' can be set, and light shielding layer 14a can be set to corresponding with recess 22b '.As a result, passing the light of light transmission part can conductively-closed.
Secondly, be described in the exemplary configurations that the light shielding layer under the situation of light transmission part will be set in corresponding to the zone of source bus line terminal part SB1 along long limit LE1 with reference to Figure 11 A, 11B, 11C, 11D, 12A, 12B, 12C, 12D, 13A, 13B, 13C.
Figure 11 A to 11C is described in the synoptic diagram that the exemplary configurations of the light shielding layer under the situation of light transmission part will be set in the zone corresponding to source bus line terminal part SB 1 along long limit LE1.Figure 11 A is a planimetric map; Figure 11 B is the cut-open view along the line 11B-11B ' among Figure 11 A; Figure 11 C is the cut-open view along the line 11C-11C ' among Figure 11 A; And Figure 11 D is the cut-open view along the line 11D-11D ' among Figure 11 A.Figure 12 A to 12C is a synoptic diagram of describing another exemplary configurations.Figure 12 A is a planimetric map; Figure 12 B is the cut-open view along the line 12B-12B ' among Figure 12 A; Figure 12 C is the cut-open view along the line 12C-12C ' among Figure 12 A; And Figure 12 D is the cut-open view along the line 12D-12D ' among Figure 12 A.Figure 13 A to 13C is a synoptic diagram of describing another exemplary configurations.Figure 13 A is a planimetric map; Figure 13 B is the cut-open view along the line 13B-13B ' among Figure 13 A; Figure 13 C is the cut-open view along the line 13C-13C ' among Figure 13 A.
Source bus line 14b is formed on the glass substrate 11 of TFT substrate 10.Source bus line 14b is as light shielding layer.Yet, shown in Figure 11 A, forming under the situation of recess 22a, light will pass between the source bus line 14b.Therefore, shown in Figure 11 D, and the conductive layer 12a of grid bus 12b in same layer height is used to form a plurality of light shield part 12a that are used for guaranteeing the space light shield between source bus line 14b.Can be with the formal construction light shield part 12a of the single light shielding layer that overlaps with source bus line 14b and any therebetween space.Yet for above-mentioned reasons, from the viewpoint of output, optimal way is to form the discrete light masked segment 12a corresponding to the space between the source bus line 14b.Although Figure 11 D shows light shield part 12a and forms under grid insulating film 13, and source bus line 14b is formed on the example on the grid insulating film, this is not only possible structure.For example, forming process according to TFT, can have following situation, source bus line in the active region (viewing area) was connected to gate metal (promptly constituting the conductive material of grid bus) before the source terminal part that is connected in frame area, thus by the line in the gate metal realization source electrode portion.In this case, although the stacked relation (being which line is on another) with respect to grid insulating film 13 will be opposite with the situation shown in Figure 11 D between line 14b and the light shield part 12a, will still can obtain above-mentioned effect.Any other embodiment also is like this.
Shown in Figure 12 A, a plurality of recess 22b can be set to relative with source bus line 14b.In this case, only just can realize sufficient light shield, therefore the advantage of the structure of simplification is provided with source bus line 14b.
As shown in Figure 13 A, it is relative with source bus line 14b with a plurality of opening 22c ' and opening 22c ' that a plurality of recess 22b ' can be set, and that light shielding layer 12a can be set to is corresponding with recess 22b '.As a result, passing the light of light transmission part can conductively-closed.
" under the situation of SXGA type liquid crystal display panel, for example, following structure can be preferred to produce 17 at the liquid crystal display panel that utilizes method produced according to the invention.
Figure 14 is described in 17 " hermetic unit 32 and comprise the synoptic diagram of the light shielding layer 22 of recess 22a in the SXGA type liquid crystal display panel.
As shown in Figure 14, in this example, adopted the structure of the recess 22a that has as shown in fig. 1.This liquid crystal display panel has identical structure with the liquid crystal display panel shown in Fig. 4, and recess 22a is arranged on the minor face SE2.The main line that is arranged on the memory capacitance on the TFT substrate is used to the interior light shield of recess 22a.
At the periphery of light shielding layer 22A and the gap Ws between the line of cut is 2.3mm.The depth D of recess 22a is 0.3mm, and length W is 10.0mm.The width of light shielding layer 22A (in the unexpected zone except recess 22a) is about 3mm.The reason that adopts this size is described below.
Once find, when the sealed width of setting 1.2mm on the specific divider that is using (i.e. the width of the main 32a of stretching, extension), will produce ± variation of 0.3mm.The bearing accuracy of the nozzle of divider is ± 0.15mm.Determine the marginal portion of about ± 0.2mm based on the cutting accuracy of mother substrate.Therefore, based on 1.2mm+0.3mm+ (0.15mm * 2)+0.2mm, the gap Ws from the periphery of light shielding layer 22A to line of cut must be 2mm or bigger.In this specific example, Ws is set at 2.3mm.
The width of the part that is tightly connected 32b has the maximal value of about 2.1mm.Wherein added bearing accuracy 0.15mm * 2 of nozzle, and considered cut edge part 0.2mm in addition, be set at 2.6mm to gap at the line of cut of recess 22a from the periphery of light shielding layer 22A.In other words, recess 22a " degree of depth " is set at 0.3mm.
In addition, because any bight can be than the main 32 thick 0.1mm to 0.15mm that stretch, light shielding layer is recessed into 0.15 " degree of depth " in each bight, and periphery and the minimum clearance between the line of cut that seal pattern is plotted as at light shielding layer equal 2.45mm (seeing Fig. 3 A).
In the structure of liquid crystal display panel, as reference Fig. 2 as described in, CF mother substrate 20 is carried out sealing draws.Then, by known method, liquid crystal material drops onto on the CF mother substrate 20 by the formula implantttion technique of dripping.After preposition is connected thereto, carry out the UV radiation from the colour filtering chip basic board side, at TFT mother substrate 110 with curing sealant.With several J/cm 2Carry out UV radiation also curing afterwards by carrying out one hour additional sealant of thermosetting at 120 ℃.
The liquid crystal display panel that produces cutting do not occur and lost efficacy during cutting, and does not observe the degeneration of stability, for example because the curing inefficacy of sealant or the reduction of the voltage retention that orientation deflection causes.In addition, do not observe because the display quality that causes by the leakage of recess light reduces.
Relate to by employing liquid crystal material is dropped onto on the CF mother substrate 20, the process that connects TFT mother substrate 10 and carry out optical radiation from following (promptly from CF mother substrate 20 sides), can carry out from sealing be plotted to optical radiation the institute in steps, keep the downside (and the surface of carrying color filter up) of CF mother substrate 20 simultaneously, make thus and can use simple device and process at display panel.
For the pattern shown in Fig. 1 C and the 1D, when the optical radiation that is used for curing sealant only when carry out one of substrate side, may prolong according to the area ratio of light transmission part and to realize fully solidifying needed radiated time (three times or higher once in a while).
On the other hand, the characteristics of said structure are arranged on a plurality of recesses or the opening in the light shielding layer of CF substrate, wherein source bus line and/or grid bus etc. are as the light shielding layer that optionally shields the TFT substrate of the light that passes recess or opening, can also carry out the optical radiation of sealant thus, because light is allowed to pass through the gap between source bus line and/or the grid bus from the TFT substrate-side.Therefore comprise corresponding between recess in the light shielding layer of CF substrate or the opening or by the light shielding layer of guaranteeing the TFT substrate-side, can carry out the optical radiation of sealant from the side of two substrates around the light transmission part of the periphery of recess or opening.As a result, can reduce and be used for the needed radiated time of sealant cures.
As the method that is used for carrying out optical radiation from the both sides of display panel, light source can be separately positioned on simply on the display panel and under.As selection, the mechanism that is used for the flip displays screen board can be provided for employed device; In this case, the optical radiation time will be in about twice of carrying out the required minimized radiation of the situation time of radiation from the both sides of display panel, but will be still than the required radiated time weak point of situation that only carries out radiation from a side of display panel.Some encapsulants can be from the edge of each opening towards light shield part photocuring on about tens microns distance, and optimal way is to utilize this material thus.
The pattern of recess or opening is not limited to band, and can be the mesh pattern as shown in Fig. 1 D.Although Fig. 1 D has described the mesh array of being made up of circular open, the shape of opening is not limited to circle, and can be rectangle for example.The part of pattern can form fillet or comprise bending.Particularly, light shield by situation about realizing at the signal wire on the TFT substrate under, the constraint that the shape of possible signal wire is related to.Thus, optimal way is to adopt patterns of openings as line pattern.
As the light irradiation apparatus that is used to seal close curing, have and adopt catoptron etc. so that not only in the normal direction of display panel but also the known devices that also can carry out optical radiation at vergence direction.By adopting this device that can also carry out optical radiation, even between the light shielding layer of the light shielding layer of CF substrate and TFT substrate, have the abundant curing that slightly overlapping also can obtain sealant from vergence direction.For example, and obtain experiment confirm, even have approximately the same big overlapping with the gap between substrate, the liquid crystal display panel of generation with the situation that not have overlapping under do not represent stable significant difference after by radiation under the identical radiation condition (radiation intensity and radiated time) yet.
Secondly, the problem that the transition portion part of the potential transfer of the electrode on the substrate electrode to another substrate of the terminal that comprises the connection that is used to be provided to the outside (promptly) may occur will be described.To partly describe example problem at shared transfer below, this is shared, and to shift part be the transfer part of type that is configured for the counter electrode on the CF substrate (being also referred to as " common electrode ") is connected to the path of the terminal on the TFT substrate.
Figure 15 A and 15B have schematically illustrated the TFT liquid crystal display panel of common employing and have arranged.Figure 15 B shows the equivalent electrical circuit of the single pixel of TFT liquid crystal display panel.
As shown in Figure 15 B, by usefulness grid bus 63 drive TFT 64, and source bus line 62 is connected to TFT64, and prearranged signal voltage is applied to pixel electrode 65.Pixel electrode 65 is relative with common electrode 66, and liquid crystal layer 40 places therebetween, constitutes liquid crystal capacitance (capacitor) thus.When signal voltage applies across liquid crystal layer 40 by TFT64, change the optical characteristics of liquid crystal layer 40, display panel is as display equipment thus.
Be formed on lip-deep common electrode 66 towards the CF of liquid crystal layer 40 substrate 20 and have it and transfer to the current potential of TFT substrate 10 ' side, be thus connected common electrode terminal 66a by shared transfer part 60.As shown in Figure 15 A, source bus line 62a and grid bus terminal 63a be arranged on TFT substrate 10 ' non-display area in.Usually, common electrode terminal 66a and source bus line 62a will be arranged on the same edge (i.e. a limit in four limits) of display panel.
As constituting the shared material for transfer that shifts part, use the material for transfer that comprises photocurable resin and conductive particle.For example, conductive particle can be that granularity is about 4 to 10 microns metallic particles or the graininess pearl that has metallic coating on it.As the photocurable resin that will be included in the material for transfer, use the photocurable resin that is similar to the resin that uses in the sealant.
The material for transfer that comprises photocurable resin in utilization forms shared the transfer under the situation partly, and frame area needs enough wide, to be provided for allowing the shared transmission region that shifts part with the light radiation.Thus, each shared transfer part can be fabricated to small part and hermetic unit overlapping.Yet even each shared transfer part will be formed in the hermetic unit, the width of hermetic unit also comprises shared transfer portion office at hermetic unit and becomes thicker, causes the problem than the big frame zone again.
With reference to Figure 16 A to 16D this problem is described below.Any composed component of appearance will be represented by identical label in above describing, and here with the descriptions thereof are omitted.
Shared transfer part 60 be arranged on hermetic unit 32 near, the counter electrode (not shown) on the CF substrate (not shown) is electrically connected to the shared pad 60a on the TFT substrate.As shown in Figure 16 D, if shared transfer part 60 is arranged on the position away from hermetic unit 32, non-display area (frame area) must have the width of broad.Therefore, as shown in Figure 16 A to 16C, common practice is to allow shared transfer part 60 to small part and hermetic unit 32 to overlap.Yet under any situation shown in Figure 16 A to 16C, sealant will be released by shared transfer part 60, cause the part 32c (also can be called " shared transfer hermetic unit ") of the width widen of seal pattern thus.Therefore, have following problems, promptly be similar to above-mentioned coupling part 32b, the width of shared transfer hermetic unit 32c is wideer than the width of main stretching, extension 32a (for example, seeing Fig. 1).
Therefore, according to this embodiment, light transmission part (recess or opening) is arranged in the light shield part of substrate, the optical radiation that execution is used to solidify shared transfer hermetic unit 32c from this substrate.
Figure 17 A and 17B are the shared synoptic diagram of describing according in the liquid crystal display panel of the embodiment of the invention that shifts the structure of part.Figure 17 A is a planimetric map; And Figure 17 B is the cut-open view of 17B-17B ' along the line among Figure 17 A.
Colour filtering chip basic board 20 is included in more end near the viewing area and is arranged on the first light shielding layer 22A in the non-display area.The first light shielding layer 22A comprises recess (light transmission part) 22a that is provided with near outer boundary.Allow the width of hermetic unit 32 to become wideer at the recess 22a of light shielding layer 22A.The recess 22a that supposes light shielding layer 22A has sufficient width and length, if shared transfer hermetic unit 32c is formed in the recess 22a, even work as the width that shared transfer hermetic unit 32c has increase, shared transfer hermetic unit 32c will not overlap with light shielding layer 22A yet.Therefore, as shown in Figure 17 B, even the UV radiation is carried out also fully curing sealant from the back side of colour filtering chip basic board 20.As long as sealant is subjected to sufficient optical radiation, the light transmission part is not limited to recess 22a.For example, as in the light shielding layer 22B as shown in Fig. 1 C, can provide the band that comprises a plurality of small recess 22b.As selection, as in the light shielding layer 22C as shown in Fig. 1 D, a plurality of minute openings (hole) 22c can be set, or, can adopt any other shape as in the above-described embodiments.
Secondly, with describe hermetic unit wherein width widen the embodiment that itself is suppressed.In the following embodiments, the broad gap zone, promptly the local zone that increases, the gap between CF substrate and the TFT substrate wherein is arranged in the non-display area of liquid crystal display panel.Any part that the width expection of seal pattern increases is formed in this broad gap zone, has suppressed widening of seal pattern thus.The broad gap zone is by producing in formation depression on the surface of the CF of liquid crystal layer substrate or TFT substrate.When material for transfer or sealant were coated to this depression, sealant was suppressed in the diffusion of viewing area, because depression has constituted the broad gap zone.
Have the various methods that are used on substrate surface, forming depression.For example, under resin film will be formed on situation on the TFT substrate, can in resin film, form depression or through hole at preposition.For example, this resin film can be used to form and will be arranged on the TFT that is formed on the TFT substrate or the interbed insulation film between signal wire and the pixel electrode.As selection, also can utilize the various resin beds (for example, color resin layer) that will be formed on the colour filtering chip basic board.
To describe below by utilizing the resin bed that is formed on the TFT substrate as the layer insulation film to produce the example in broad gap zone.Although above-mentioned shared transfer hermetic unit 32c will be described as the possible place that hermetic unit is widened, will understand the width that principle of uniformity can be widely used in seal pattern the be supposed to any part of hermetic unit of increase place, for example coupling part or bight.In addition, the broad gap zone can with any wherein as shown in above-mentioned embodiment light shielding layer comprise that the structure of light transmission part is used in combination.
Figure 18 A, 18B, 18C and 18D are that each all describes the synoptic diagram according to the structure of the shared transfer hermetic unit in the liquid crystal display panel of the embodiment of the invention.Figure 18 A, 18C and 18D are planimetric maps; And Figure 18 B is along the cut-open view of the 18B-18B ' among Figure 18 A.
As shown in Figure 18 A, resin bed 61 is arranged on the hermetic unit 32, and through hole 61a is formed on the part place that divides 60 corresponding resin beds 61 with shared transfer portion.Through hole 61a defines the broad gap zone.Although described the example that the size of through hole 61a is similar to shared pad 60a, present embodiment is not limited thereto.
Equal in the gap to be the mode of being scheduled to live width with hermetic unit 32 by any part of the definite gap width (being the thickness of liquid crystal layer) of the design of liquid crystal display panel, sealant, thus form hermetic unit.Because through hole 61a, the distance that forming the gap in the zone of shared transfer hermetic unit 32c increases equals the film thickness of resin bed 61.Owing to have constant area of section with the just coated sealant of wire, so the through hole 61a place of sealed width in resin bed 61 will become less relatively; For example, if not because shared transfer part 60, the live width of sealing will be shown in depression (through hole 61a) reduction as Figure 18 C.When the shared transfer of material of coating, sealant is owing to the volume domination of shared transfer of material is spread, owing to produce the structure shown in Figure 18 A.
For example, shared transfer hermetic unit 32c breadth extreme in the experimental example of carrying out with following conditions is 1100 microns: the film thickness of resin bed is 2.5 microns; The width of hermetic unit 32 is about 1000 microns; Hermetic unit is 5.5 microns in the gap that has the resin bed place; The width of through hole 61a in the resin bed is 1200 microns; And the aimed dia of shared transfer part 60 (under the theoretical case that does not have sealing) is 500 microns.
Optimal way is, the width of the through hole 61a in the resin bed 60 of present embodiment is greater than the maximal value of the width of the diameter of shared transfer part 60 or primary seal part (the main stretching, extension).Do not make in resin bed in the similar experiment of through hole, shared transfer hermetic unit is about 1400 microns breadth extreme.Thus, according to embodiments of the invention, the width that comprises the shared transfer hermetic unit 32c of shared transfer part 60 is compared with traditional situation and has been reduced by 300 microns.300 microns reduction of the width of the recess 22a of light shielding layer shows to compare with the foregoing description can make the frame area that further narrows down.
In addition, be set at the aimed dia (not existing under the theoretical case of hermetic unit) of shared transfer part 60 under 400 microns the situation, shared transfer hermetic unit 32c has about 1000 microns maximum line width.In this case, because maximum line width equals the width (1000 microns) of primary seal part 32, therefore can omit recess 22a among the light shielding layer 22A as the example among Figure 18 D.
Through hole 61a in the resin bed 61 needn't be so wide to surround the whole width of hermetic unit.This point is described with reference to Figure 19 A, 19B, 19C and 19D.
Figure 19 A, 19B, 19C and 19D are each synoptic diagram of describing the structure of the shared transfer hermetic unit in the liquid crystal display panel according to another embodiment of the present invention.Figure 19 A, 19C and 19D are planimetric maps; And Figure 19 B is along the cut-open view of the 19B-19B ' among Figure 19 A.
For example, even the width that only extends the part of sealing at the through hole 61a in the resin bed 61 shown in Figure 19 A also can obtain effect of sufficient.This structure is effective especially under less than the situation of the width of hermetic unit at the shared final diameter that shifts part.Reason is in this case, can ignore because shared transfer part 60 is released any width increase that sealant causes towards a side (or depression) 61a (promptly the viewing area from Figure 19 is towards opposite side) that resin bed 61 lacks through hole.
Be used for resin bed that another order forms conveniently as above-mentioned resin bed and must have under the situation of film thickness greatly, increase through hole 61a can cause the width of hermetic unit too thin.Yet the structure as shown in Figure 19 A can be eliminated this problem and obtain sufficient sealed width.Notice that Bao sealed width can cause and the inadequate problem of hermetic unit intensity excessively.
Figure 20 is the curve of describing the thickness (degree of depth of through hole 61a) of resin bed 61 and reducing the relation between the effect of width of hermetic unit 32.
As can be seen from Figure 20, when resin film thickness big (being the gap broad in broad gap zone) and primary seal width are big, obtain better effect.In simple simulation, live width reduces effect and can represent by following equation:
{ (gap of primary seal width * primary seal part)/(degree of depth of the depression in the gap+resin of primary seal part) }+shared transfer diameter-(shared transfer diameter+primary seal line width).
Be used in " shared transfer diameter " in the above-mentioned equation and be shared transfer of material not with situation that sealing contacts under the final diameter of shared transfer of material.Although above-mentioned simulation equation is not considered the shape of shared transfer of material and thus out of true is mated actual result, will obtain similar effects in fact.
For reality obtains above-mentioned effect, optimal way is, gap in the broad gap zone should be about at least 10% greater than the gap (i.e. the gap in any zone of the hermetic unit except the broad gap zone) of hermetic unit, because the variation of the live width that takes place at production period must be absorbed to a certain extent.Although above-mentioned example shows through hole 61a and is arranged on example in the resin bed 61, can replace through hole that depression (hole) is set.For example, depression can utilize photosensitive resin (photoresist) to form by half exposure technique.When depression will be utilized conformal photosensitive resin to pass through half exposure technique to form, before reaching the radiation that realizes whole photolysis, expose and develops, thereby form cave in (hole).On the other hand, utilizing under the situation of negative-type photosensitive, before reaching the radiated time of realizing complete photocuring, exposing and develops, to form cave in (hole).Forming depression by half exposure technique provides cup depth controllable advantage.Note, be arranged on the photosensitive resin layer and under conductive layer between the situation lower through-hole that can not allow of leakage mustn't in photosensitive resin layer, form; In this case, with through hole is opposite completely, forms hole (depression) and be fit to.
The layer that wherein forms through hole or depression (hole) is not limited to the interbed insulation film, and also can be resin bed or the protection resin bed that is used to form the black array.If the use photosensitive resin layer, through hole or depression can form by simple technology.As selection, can use inorganic material layer, although will making, this forms deep via or depression difficulty.When considering the shortcoming that becomes too thin such as sealed width, usually optimal way is, the degree of depth that is formed on any depression in the surface about 1 micron to about 3 microns scope.
Optimal way is that the size (being the size in broad gap zone) of through hole or depression is less than the maximal value of the final width of shared transport zone in the regulation resin bed.In the embodiment shown in Figure 19 A to 19D, the attenuate of the width of hermetic unit can also be controlled based on pattern and the layout of through hole 61a, thereby can select optimum structure from the scope of broad.For example, be positioned at the edge of through hole 61a under the situation of position of 300 microns of outsides at center of hermetic unit 32 of broad ways, under the situation identical, confirmed similar effects with above-mentioned situation.Optimal way is, the edge of through hole 61a is positioned at a certain position, even so that given processing variation hermetic unit has under the situation of minimum feature, the external margin of hermetic unit also falls into through hole 61a.
According to the present invention, a kind of method is provided, even part is formed in the liquid crystal display panel this method and also can produces effectively and have the liquid crystal display panel that does not reduce reliability, described part will cause thick seal pattern width (for example, be tightly connected part or shift part) under traditional production method.Particularly the present invention can be by the use formula implantttion technique production large-sized liquid crystal display effectively plate that drips.
Although described the present invention at preferred embodiment, clearly, disclosed invention can be made amendment in many ways and can be presented many embodiments for the described technician in this area, rather than top specifically described embodiment.Therefore, claim be intended to cover fall in true spirit of the present invention and the scope all to modification of the present invention.

Claims (33)

1, a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprise first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, said method comprising the steps of:
(A) provide first substrate or comprise first mother substrate of first substrate, with second substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer;
(B) utilize the sealant that comprises photocurable resin to draw seal pattern, described seal pattern is plotted in the first light shielding layer outside of first substrate, to center on the viewing area, draws seal pattern and comprises following substep:
(B1) begin the coating of sealant near the light transmission part of first substrate,
(B2) periphery along first light shielding layer of first substrate applies sealant;
(B3) form coupling part with the sealant that has applied near the light transmission part;
(C) in the viewing area that centers on by sealant, apply liquid crystal material;
(D) first substrate and second substrate are linked together, and liquid crystal material places between them; And
(E) in step (D) afterwards, carry out optical radiation from first substrate-side, with curing sealant.
2, LCDs plate producing process according to claim 1, wherein
First substrate has rectangular shape;
Described at least one light transmission part comprises at least the light transmission part that is provided with along the limit of rectangular shape; And
Described coupling part is formed on the office, transmittance section that is provided with along the described limit of rectangular shape.
3, LCDs plate producing process according to claim 2, wherein
Described at least one light transmission part comprises two or more light transmission parts that are provided with along the described limit of rectangular shape; And
Described coupling part is formed on along each place in two or more light transmission parts of the described limit setting of rectangular shape.
4, LCDs plate producing process according to claim 2, wherein said at least one light transmission part also comprises the light transmission part in the bight that is arranged on rectangular shape.
5, LCDs plate producing process according to claim 4, wherein first mother substrate comprises a plurality of first substrates, described method comprises:
First plot step: by coating near one in two or more light transmission parts of first substrate beginning sealant, periphery along first light shielding layer applies sealant, and finish the coating of sealant near in two or more light transmission parts another, and draw seal pattern in a plurality of first substrates one;
Second plot step: by coating near one in two or more light transmission parts of first substrate beginning sealant, periphery along first light shielding layer applies sealant, and finish the coating of sealant near in two or more light transmission parts another, and draw seal pattern in a plurality of first substrates another;
The 3rd plot step: after first plot step, coating by the beginning sealant is so that form coupling part with the sealant that has applied near a light transmission part or another light transmission part of first substrate, and draws seal pattern on described one first substrate; And
The 4th plot step: after second plot step, coating by the beginning sealant is so that form coupling part with the sealant that has applied near a light transmission part or another light transmission part of first substrate, and draws seal pattern on described another first substrate.
6, a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprise first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, said method comprising the steps of:
(A) provide first substrate or comprise first mother substrate of first substrate, with second substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer;
(B) utilize the sealant that comprises photocurable resin to draw seal pattern, to be arranged in the zone of the first light shielding layer outside of first substrate at second substrate when second substrate is connected to first substrate, draw described seal pattern, and seal pattern is plotted as around the viewing area, and described drafting seal pattern comprises following substep:
(B1) beginning the coating of sealant near position corresponding to the light transmission part of first substrate,
(B2) edge applies sealant corresponding to the zone of the periphery of first light shielding layer of first substrate;
(B3) form coupling part with the sealant that has applied near position corresponding to the light transmission part;
(C) in the viewing area that sealant centers on, apply liquid crystal material;
(D) first substrate and second substrate are linked together, and liquid crystal material places between them; And
(E) in step (D) afterwards, carry out optical radiation from first substrate-side, with curing sealant.
7, LCDs plate producing process according to claim 6, wherein
First substrate has rectangular shape;
Described at least one light transmission part comprises at least the light transmission part that is provided with along the limit of rectangular shape; And
Described coupling part is formed on the position of the light transmission part that is provided with corresponding to the described limit along rectangular shape.
8, LCDs plate producing process according to claim 7, wherein
Described at least one light transmission part comprises two or more light transmission parts that are provided with along the described limit of rectangular shape; And
Described coupling part is formed on each the position in two or more light transmission parts that form corresponding to the described limit along rectangular shape.
9, LCDs plate producing process according to claim 7, wherein said at least one light transmission part also comprises the light transmission part in the bight that is arranged on rectangular shape.
10, LCDs plate producing process according to claim 9, wherein second mother substrate comprises a plurality of second substrates, described method comprises:
First plot step: begin the coating of sealant corresponding to one position in two or more light transmission parts of first substrate by approaching, the edge applies sealant corresponding to the zone of the periphery of first light shielding layer, and near the coating that finishes sealant corresponding to another the position in two or more light transmission parts, and draw seal pattern in a plurality of second substrates one;
Second plot step: begin the coating of sealant corresponding to one position in two or more light transmission parts of first substrate by approaching, the edge applies sealant corresponding to the zone of the periphery of first light shielding layer, and near the coating that finishes sealant corresponding to another the position in two or more light transmission parts, and draw seal pattern in a plurality of second substrates another;
The 3rd plot step: after first plot step, coating by the beginning sealant, so that form with near the coupling part of the sealant that applies corresponding to the position of a light transmission part of first substrate or corresponding to the position of another light transmission part, thereby on described one second substrate, draw seal pattern; And
The 4th plot step: after second plot step, coating by the beginning sealant, forming with, and on described another second substrate, draw seal pattern near the coupling part of the sealant that applies corresponding to the position of a light transmission part of first substrate or corresponding to the position of another light transmission part.
11, LCDs plate producing process according to claim 1, wherein,
Liquid crystal display panel has the broad gap zone in non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, and described broad gap zone is included in the depression in the surface of first substrate or second substrate; And
Described at least one light transmission part comprises the light transmission part that is provided with near the broad gap zone.
12, LCDs plate producing process according to claim 11, comprise the steps: that also the material for transfer that will comprise photocurable resin is coated to first substrate or second substrate, be formed between first substrate and second substrate, setting up the transfer part that is electrically connected
Wherein material for transfer is coated in the depression.
13, LCDs plate producing process according to claim 11, comprise the steps: that also the material for transfer that will comprise photocurable resin is coated to first substrate or second substrate, be formed between first substrate and second substrate, setting up the transfer part that is electrically connected
Wherein material for transfer be coated on first substrate, near the position of at least one light transmission part, or near on second substrate, corresponding to the position of the light transmission part of first substrate.
14, LCDs plate producing process according to claim 12, wherein step (E) comprises the substep that solidifies material for transfer by optical radiation.
15, LCDs plate producing process according to claim 12, wherein the transfer portion branch forms at least partly and overlaps with seal pattern.
16, LCDs plate producing process according to claim 1, wherein second substrate is included at least one second light shielding layer in the non-display area, and described at least one second light shielding layer is arranged in the zone corresponding with described at least one light transmission part of first substrate.
17, LCDs plate producing process according to claim 16, wherein,
Second substrate comprises source bus line and grid bus; And
Described at least one second light shielding layer comprises the conductive layer identical with the conductive layer of source bus line or grid bus.
18, LCDs plate producing process according to claim 1, wherein said at least one light transmission part comprises a plurality of recesses or opening, described second light shielding layer also comprises corresponding to the gap between a plurality of recesses or the opening, or the light transmission part of the neighborhood of a plurality of recess or opening setting
Described method also comprises: in step (D) afterwards, carry out the step of optical radiation from second substrate-side.
19, a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprise first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area, non-display area around the viewing area, with the broad gap zone in non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, described broad gap zone is included in the depression in the surface of first substrate or second substrate, said method comprising the steps of:
(A) provide first substrate or comprise first mother substrate and second substrate of first substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area;
(B) utilize the sealant that comprises photocurable resin to draw seal pattern, described seal pattern is plotted in the first light shielding layer outside of first substrate with depression, or described seal pattern is plotted in the zone of second substrate of the first light shielding layer outside that will be positioned at first substrate when second substrate with depression is connected to first substrate, described seal pattern is plotted as around the viewing area, draws seal pattern and comprises following substep:
(B1) begin the coating of sealant in depression near first substrate or second substrate,
(B2) along the periphery of first light shielding layer of first substrate, or along applying sealant corresponding to the zone on second substrate of the periphery of first light shielding layer of first substrate; And
(B3) coupling part of the sealant of formation and approaching described depression coating;
(C) in the viewing area that centers on by sealant, apply liquid crystal material;
(D) first substrate and second substrate are linked together, and liquid crystal material places between them; And
(E) in step (D) afterwards, carry out optical radiation, with curing sealant.
20, a kind of method that is used to produce liquid crystal display panel, this liquid crystal display panel comprise first substrate, second substrate and place first substrate and second substrate between liquid crystal layer, described liquid crystal display panel has the viewing area, non-display area around the viewing area, with the broad gap zone in non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, described broad gap zone is included in the depression in the surface of first substrate or second substrate, said method comprising the steps of:
(A) provide first substrate or comprise first mother substrate and second substrate of first substrate or comprise second mother substrate of second substrate, wherein first substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area;
(B) utilize the sealant that comprises photocurable resin to draw seal pattern, described seal pattern is plotted in the first light shielding layer outside of first substrate with depression, or described seal pattern is plotted in the zone of second substrate of the first light shielding layer outside that will be positioned at first substrate when second substrate with depression is connected to first substrate, and described seal pattern is plotted as around the viewing area;
The material for transfer that (B ') will comprise photocurable resin is coated to first substrate or second substrate, is formed for setting up the transfer part that is electrically connected between first substrate and second substrate, and material for transfer is coated in the depression;
(C) in the viewing area that centers on by sealant, apply liquid crystal material;
(D) first substrate and second substrate are linked together, and liquid crystal material places between them; And
(E) in step (D) afterwards, carry out optical radiation, with curing sealant.
21, LCDs plate producing process according to claim 20, wherein step (B) comprises substep (B1): apply sealant since the depression of first substrate or second substrate.
22, LCDs plate producing process according to claim 20 also comprises the step that forms depression, and the step that wherein forms depression is included in the substep that forms through hole or hole in the photosensitive resin layer of eurymeric or minus.
23, LCDs plate producing process according to claim 22 also comprises the step that forms depression, and the step that wherein forms depression comprises by utilizing half exposure technique to form the substep in hole in photosensitive resin layer.
24, LCDs plate producing process according to claim 1, wherein first substrate is included in the color filter in the viewing area.
25, a kind of liquid crystal display panel, comprise first substrate, second substrate, place the liquid crystal layer between first substrate and second substrate, and the hermetic unit that centers on liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein
First substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer; And
Hermetic unit has the width of widening in described at least one office, transmittance section.
26, a kind of liquid crystal display panel, comprise first substrate, second substrate, place the liquid crystal layer between first substrate and second substrate, hermetic unit around liquid crystal layer, and the transfer part that is used between first substrate and second substrate, setting up electrical connection, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein
First substrate is included in more end near the viewing area and is arranged on first light shielding layer in the non-display area, first light shielding layer comprises that described at least one light transmission part comprises recess or opening near at least one light transmission part of the outer boundary setting of first light shielding layer;
At least a portion that shifts part is arranged in described at least one light transmission part.
27, liquid crystal display panel according to claim 25, wherein first substrate is included in the color filter in the viewing area.
28, liquid crystal display panel according to claim 25, wherein second substrate is included at least one second light shielding layer in the non-display area, and described at least one second light shielding layer is arranged in the zone corresponding at least one light transmission part of described first substrate.
29, liquid crystal display panel according to claim 28, wherein,
Second substrate comprises source bus line and grid bus; And
Described at least one second light shielding layer comprises the conductive layer identical with the conductive layer of source bus line or grid bus.
30, liquid crystal display panel according to claim 28, wherein,
Described at least one light transmission part comprises slit-shaped recess or opening; And
Described at least one second light shielding layer comprises a plurality of light shield parts, and described a plurality of light shield branches are set to relative with slit-shaped recess or opening.
31, a kind of liquid crystal display panel, comprise first substrate, second substrate, place the liquid crystal layer between first substrate and second substrate, hermetic unit around liquid crystal layer, and the transfer part that is used between first substrate and second substrate, setting up electrical connection, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein
Described liquid crystal display panel is included in the broad gap zone in the non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, and described broad gap zone is included in the depression in the surface of first substrate or second substrate;
The transfer portion branch is arranged in the depression.
32, a kind of liquid crystal display panel comprises first substrate, second substrate, places the liquid crystal layer between first substrate and second substrate, and the hermetic unit that centers on liquid crystal layer, described liquid crystal display panel has the viewing area and centers on the non-display area of viewing area, wherein
Described liquid crystal display panel is included in the broad gap zone in the non-display area, described broad gap zone is the local zone that increases, the gap between first substrate and second substrate wherein, and described broad gap zone is included in the depression in the surface of first substrate or second substrate; And
The part of hermetic unit is arranged in the depression.
33, liquid crystal display panel according to claim 31, wherein depression comprises through hole or the hole in the photosensitive resin layer that is formed on eurymeric or minus.
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