CN1697165A - Transfer medium for seat body of load bearing wafer - Google Patents
Transfer medium for seat body of load bearing wafer Download PDFInfo
- Publication number
- CN1697165A CN1697165A CNA2004100442018A CN200410044201A CN1697165A CN 1697165 A CN1697165 A CN 1697165A CN A2004100442018 A CNA2004100442018 A CN A2004100442018A CN 200410044201 A CN200410044201 A CN 200410044201A CN 1697165 A CN1697165 A CN 1697165A
- Authority
- CN
- China
- Prior art keywords
- pliability
- machine plate
- crystal chip
- bearing pedestal
- chip bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The transfer medium includes a flexible plate with an insulative film and a circuit. Multiple contacts capable of connected to any kind of IC chip electrically are etched on up surface of the flexible plate. Multiple another contacts capable of connected to load supporting seat body electrically are etched on undersurface. The said circuit can connect contacts on up surface to contacts on undersurface electrically. While in use, the flexible plate is installed inside the supporting seat; and the plate is connected to the supporting seat electrically. Thus, being installed on up surface of the flexible plate, any kind of IC chip can be connected to the supporting seat electrically. Therefore, it is possible to change different chips at any moment.
Description
Technical field
The present invention relates to a kind of transfer medium of crystal chip bearing pedestal, particularly a kind of being used on the crystal chip bearing pedestal makes any kind of (or a kind of) wafer all can reach the transfer medium of electric connection with this crystal chip bearing pedestal at any time.
Background technology
Because general integrated circuit (IC) wafer is all very fragile, must be after its outside imposes suitable encapsulation, can guarantee not to be subject in use the pollution or the destruction of external force, and must be with electrically moderately being connected on a circuit board or a support plate or the lead frame of this wafer, can be effectively with it electrically by this circuit board or support plate or lead frame and conduct in the external world and use.
See also shown in Figure 1, the encapsulating structure of general integrated circuit (IC) wafer, it includes a wafer 11, the adhesive body 12 of this wafer 11 of sealing, a lead frame that electrically transmits outward, wherein, this lead frame is provided with a brilliant pad 16 and an a plurality of pin 14, this wafer 11 is cemented in crystalline substance pad 16 with viscoses such as elargol 13, and with a plurality of leads 15 inner electrically weld pad and pin 14 the inners in adhesive body 12 of connecting wafer 11, the outer end of these pins 14 is to extend outwardly out outside the adhesive body 12, as the end points that combines with printed circuit board surface.
Yet, this integrated circuit is done after the sealing, its wafer 11, pin 14, lead 15 promptly are fixed in the adhesive body 12 with certain form, can't change, and after this integrated circuit is connected in printed circuit board (PCB), also only can fixed wafer 11 on this printed circuit board (PCB), and use this wafer 11, so if this wafer 11 breaks down and wants to be replaced with another wafer, or the replacing wafer of upgrading, then destroy the surface of this printed circuit easily, cause the damage of this printed circuit.
Summary of the invention
After the objective of the invention is to solve above-mentioned wafer package, if the problem that breaks down and easily cause printed circuit to damage when being difficult for changing and changing, and a kind of transfer medium that overcomes the crystal chip bearing pedestal of above-mentioned shortcoming is provided.
The invention provides a kind of wafer of any kind of (or a kind of) that makes and all can reach the transfer medium of electric connection with the crystal chip bearing pedestal, this transfer medium is provided with a pliability machine plate, this pliability machine plate has an insulation film, has a circuit on this pliability machine plate, this pliability machine plate upper surface etching has a plurality of contacts that can electrically connect mutually with at least a wafer (integrated circuit (IC)), and this pliability machine plate lower surface etching has a plurality of another contacts that can electrically connect with the crystal chip bearing pedestal, circuit on this pliability machine plate is connected with the contact of this pliability machine plate upper surface and another contact of this pliability machine plate lower surface respectively, makes this circuit, these contacts and these another contacts are reached electric connection; During use, this pliability machine plate can be installed in the load bearing seat of crystal chip bearing pedestal, make this pliability machine plate and crystal chip bearing pedestal reach electric connection, so, the wafer (integrated circuit (IC)) of any kind of (or a kind of) can be installed at the upper surface of this pliability machine plate at any time, make any wafer all can reach electric connection by this pliability machine plate and crystal chip bearing pedestal, realization can be changed the purpose of different chips at any time.
Description of drawings
Fig. 1 is the floor map of the encapsulating structure of general integrated circuit (IC) wafer.
Fig. 2 is a schematic perspective view of the present invention.
Fig. 3 is a floor map of the present invention.
Fig. 4 is one of floor map of the present invention's wafer.
Fig. 5 is two of the floor map of the present invention's wafer.
Fig. 6 is three of the floor map of the present invention's wafer.
Fig. 7 is four of the floor map of the present invention's wafer.
Concrete enforcement side
See also Fig. 2, shown in Figure 3, the present invention's transfer medium is provided with a pliability machine plate 20, this pliability machine plate 20 has an insulation film and (is plastic film in the present embodiment, but, when the present invention implements in reality, be not limited to this), has a circuit 21 on this pliability machine plate 20, these pliability machine plate 20 upper surfaces 22 etchings have a plurality of contacts 23 that can electrically connect mutually with at least a wafer 40 (integrated circuit (IC)), and these pliability machine plate 20 lower surfaces 24 etchings have a plurality of another contacts 25 that can electrically connect with crystal chip bearing pedestal 30, circuit 21 on this pliability machine plate 20 is connected with the contact 23 of these pliability machine plate 20 upper surfaces 22 and another contact 25 of these pliability machine plate 20 lower surfaces 24 respectively, makes this circuit 21, these contacts 23 and these another contacts 25 are reached and are electrically connected.
Composition by above-mentioned member, see also Fig. 2 again, shown in Figure 3, when using this pliability machine plate 20, this pliability machine plate 20 can be installed in the load bearing seat 31 of crystal chip bearing pedestal 30, make this pliability machine plate 20 reach electric connection with crystal chip bearing pedestal 30, so, one or more wafer 40 (integrated circuit (IC)) can be installed at the upper surface 22 of this pliability machine plate 20 at any time, make any wafer 40 all can reach electric connection with crystal chip bearing pedestal 30, and then realize to change at any time the purpose and the effect of variety classes (or a kind of) wafer by this pliability machine plate 20.
See also shown in Figure 4 again, the contact 23 of these pliability machine plate 20 upper surfaces 22 can be according to the pin (not shown) of the different arrangement modes of different crystal 42, or the pin of different shape as expand outwardly type 41, the type that curves inwardly 51, tin ball-type 61 and design, as Fig. 5, Fig. 6, shown in Figure 7, can increase the scope of change crystal habit with order.
Seeing also Fig. 2, shown in Figure 3, in the present invention, crystal chip bearing pedestal 30 comprises open load bearing seat 31 and adhesive body 33, wherein, this load bearing seat 31 has certain open space, can hold multiple different chips 40, the surface of this load bearing seat 31 is provided with tie point 34 corresponding with another contact 25 and that quantity equates with another contact 25, when making this pliability machine plate 20 be installed in the load bearing seat 31, this pliability machine plate 20 will be reached electric connection with crystal chip bearing pedestal 30, and the inner of these pins 32 is sealed in the adhesive body 33, the outer end of these pins is then outwardly as the end points that combines with printed circuit board surface, crystal chip bearing pedestal 30 and printed circuit board (PCB) can be electrically connected.
In another embodiment of the present invention, when pliability machine plate 20 is installed in the load bearing seat 31, can be used for constituting several accommodation spaces with these pliability machine plate 20 bendings or with a plurality of pliability machine plates 20, make these accommodation spaces that one wafer can distinctly be installed, make these wafers all can reach electric connection by pliability machine plate 20 and crystal chip bearing pedestal 30.
The above only is the best specific embodiment of the present invention, still; structural feature of the present invention is not limited thereto; anyly be familiar with this operator, in field of the present invention, can think easily and variation or modification, all can be encompassed within the scope of the present invention.
Claims (6)
1, a kind of transfer medium of crystal chip bearing pedestal, it is characterized in that: it includes a pliability machine plate, this pliability machine plate has an insulation film, has a circuit on this pliability machine plate, this pliability machine plate upper surface etching has a plurality of contacts that can electrically connect mutually with at least a wafer, and this pliability machine plate lower surface etching has a plurality of another contacts that can electrically connect with the crystal chip bearing pedestal, circuit on this pliability machine plate is connected with the contact of this pliability machine plate upper surface and another contact of this pliability machine plate lower surface respectively, make this circuit, these contacts and these another contacts are reached electric connection, this pliability machine plate is installed in the load bearing seat of crystal chip bearing pedestal, and this pliability machine plate and crystal chip bearing pedestal are reached electric connection.
2, the transfer medium of a kind of crystal chip bearing pedestal according to claim 1 is characterized in that: described wafer is a crystal.
3, the transfer medium of a kind of crystal chip bearing pedestal according to claim 2 is characterized in that: the contact of described pliability machine plate upper surface can be according to the pin of the pin of the different arrangement modes of different crystal or different shape and is designed.
4, ask the transfer medium of 1 described a kind of crystal chip bearing pedestal according to right, it is characterized in that: described crystal chip bearing pedestal comprises open load bearing seat, a plurality of pins and adhesive body, wherein, this load bearing seat has certain open space, can hold multiple or a kind of different chips, the surface of this load bearing seat is provided with tie point corresponding with these another contacts and that another contact of quantity and this equates, these tie points and these contacts are electrically connected, when making this pliability machine plate be installed in the load bearing seat, this pliability machine plate will be reached electric connection with the crystal chip bearing pedestal.
5, ask the transfer medium of 1 described a kind of crystal chip bearing pedestal according to right, it is characterized in that: described insulation film is a plastic film.
6. ask the transfer medium of 1 described a kind of crystal chip bearing pedestal according to right, it is characterized in that: when described pliability machine plate is installed in the load bearing seat, can constitute several accommodation spaces with this pliability machine plate bending or with a plurality of pliability machine plates, make these accommodation spaces that one wafer can distinctly be installed, make these wafers all can reach electric connection by pliability machine plate and crystal chip bearing pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100442018A CN1697165A (en) | 2004-05-12 | 2004-05-12 | Transfer medium for seat body of load bearing wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100442018A CN1697165A (en) | 2004-05-12 | 2004-05-12 | Transfer medium for seat body of load bearing wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1697165A true CN1697165A (en) | 2005-11-16 |
Family
ID=35349786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004100442018A Pending CN1697165A (en) | 2004-05-12 | 2004-05-12 | Transfer medium for seat body of load bearing wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1697165A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808962A (en) * | 2021-11-15 | 2021-12-17 | 宁波中车时代传感技术有限公司 | Chip packaging process |
-
2004
- 2004-05-12 CN CNA2004100442018A patent/CN1697165A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808962A (en) * | 2021-11-15 | 2021-12-17 | 宁波中车时代传感技术有限公司 | Chip packaging process |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |