CN101762762B - Detection method of packaging structure, detection plate and package detection component - Google Patents
Detection method of packaging structure, detection plate and package detection component Download PDFInfo
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- CN101762762B CN101762762B CN2008102075721A CN200810207572A CN101762762B CN 101762762 B CN101762762 B CN 101762762B CN 2008102075721 A CN2008102075721 A CN 2008102075721A CN 200810207572 A CN200810207572 A CN 200810207572A CN 101762762 B CN101762762 B CN 101762762B
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- parallel circuit
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Abstract
The invention provides a detection method of a packaging structure, a detection plate and a package detection component. The detection plate and the packaging structure can be assembled into the package detection component; the packaging structure is provided with a base plate and electro-conductive components; and the electro-conductive components are arranged one side face of the packaging base plate. The detection method comprises the steps of: connecting with the electro-conductive components to form into a plurality of electric loops; connecting with the electric loops to form into an equivalent parallel circuit; providing an electrical property comparison table; testing the practical electrical property of the equivalent parallel circuit; and comparing the electrical property comparison table with the practical electrical property to obtain the turnoff position of circuit nodes. The invention can fast reducing the detection range and the detection time to improve the detection efficiency.
Description
Technical field
The present invention relates to a kind of detection method, check-out console and package detection component, particularly relate to a kind of detection method, check-out console and package detection component of encapsulating structure.
Background technology
Along with the progress of science and technology, microelectronics Packaging (Packaging) technology also constantly promotes, and (Integrated Circuit, demand IC) also trend towards the kenel of high density, multi-functional, high transmission speed for integrated circuit.Therefore, encapsulation technology is also transferred to the mode of encapsulation such as the conductive component that uses tin ball for example gradually by metal pin (Lead) mode, to meet the demand of integrated circuit.
For example (Ball Grid Array, BGA), the application area that it can effectively increase IC also can meet the requirement that reduces cost to a kind of tin ball sealing dress method of widely using as the ball-shaped grid array encapsulation.Generally, after the bga component manufacturing is accomplished, must be through testing electrical property, to guarantee the quality of BGA assembly.Whether existing BGA electrical component property testing is to utilize lead to be connected in series the tin ball, and forms series loop, and via the resistance of surveying some contact or the mode of voltage difference, be connected on the base plate for packaging really to record the tin ball apace.
Yet the tin ball in detecting series loop has when connecting untrue situation, and can't learn it is that tin ball is uncertain for connecting at once, and tests soldered ball respectively in twos, can correctly find out problematic tin ball.
Summary of the invention
One of the object of the invention is to provide a kind of detection method, and in order to detect encapsulating structure, said encapsulating structure is provided with substrate and conductive component, and conductive component is a side that is arranged at said base plate for packaging, it is characterized in that said detection method comprises:
Connect said conductive component, to form several electrical loops;
Connect said electrical loop, to form the equivalent parallel circuit, wherein said equivalent parallel circuit has several circuit nodes;
Electrical property comparison table is provided, and wherein said electrical property comparison table has the electrical Value Data of said equivalent parallel circuit when each said circuit node opens circuit;
Bring in the actual electrically value that measures said equivalent parallel circuit by two of said equivalent parallel circuit; And
Compare said electrical property comparison table and said reality electrically is worth, to learn the off position of circuit node.
Two of the object of the invention is to provide a kind of check-out console, and in order to detect encapsulating structure, said encapsulating structure is provided with substrate and conductive component, and said conductive component is a side that is arranged at said base plate for packaging, it is characterized in that said check-out console comprises:
Some first wiring in order to connecting said conductive component, and form several electrical loops;
Some second wiring are in order to connect said electrical loop, to form the equivalent parallel circuit; And
Electrical measuring end is formed at the two ends of said equivalent parallel circuit respectively, in order to measure the electrical value of said equivalent parallel circuit.
Three of the object of the invention is to provide a kind of package detection component, it is characterized in that said package detection component comprises:
Encapsulating structure comprises substrate and conductive component, and wherein conductive component is to be arranged on the side of said base plate for packaging
Check-out console is electrically connected at said encapsulating structure, and in order to detect said encapsulating structure, wherein said check-out console comprises:
Some first wiring in order to connecting said conductive component, and form several electrical loops;
Some second wiring are in order to be connected in series said electrical loop, to form the equivalent parallel circuit; And
Electrical measuring end is formed at the two ends of said equivalent parallel circuit respectively, in order to measure the electrical value of said equivalent parallel circuit.
Detection method of the present invention and check-out console can reduce sensing range and time apace, with the lifting detection efficiency, and the effect of tool low complex degree and high detection efficient.
For letting the foregoing of the present invention can be more obviously understandable, hereinafter is special lifts preferred embodiment, and cooperates appended graphicly, elaborates as follows:
Description of drawings
Fig. 1 shows the diagrammatic cross-section according to the package detection component of one embodiment of the invention;
Fig. 2 A shows the front schematic view according to the check-out console of one embodiment of the invention;
Fig. 2 B shows the schematic bottom view according to the encapsulating structure of one embodiment of the invention;
Fig. 2 C shows the synoptic diagram that forms electric connection according to check-out console of one embodiment of the invention and encapsulating structure;
Fig. 3 shows the method flow diagram according to the detection method of one embodiment of the invention;
Fig. 4 A shows the synoptic diagram according to the equivalent parallel circuit of one embodiment of the invention;
Fig. 4 B shows the synoptic diagram according to the equivalent-simplification circuit of one embodiment of the invention; And
Fig. 5 A and Fig. 5 B show the synoptic diagram that forms electric connection according to check-out console of other embodiments of the invention and encapsulating structure.
Embodiment
Please with reference to Fig. 1, it shows the diagrammatic cross-section according to the package detection component of one embodiment of the invention.The detection method of present embodiment and check-out console 100 are that encapsulating structure 200 can be electrically connected at check-out console 100 in order to detection encapsulating structure 200, and form package detection component.
As shown in Figure 1, the encapsulating structure 200 of present embodiment can comprise substrate 210, conductive component 220, chip 230 and adhesive body 240.Substrate 210 for example is printed circuit board (PCB) (PCB), ceramic circuit board or the flexible PCB (FCB) of single or multiple lift, and it can be provided with circuit and connection pad (not illustrating), to electrically connect and carries chips 230.Conductive component 220 is to be arranged on the side of substrate 210; Conductive component 220 is preferably made with metal material; For example: tin, lead, silver, copper, nickel, bismuth, aluminium, indium, above-mentioned any alloy or other lead-free solder; Wherein conductive component 220 can be stitch shape (like needle-like grid array LGA), spherical (like the tin ball of ball-shaped grid array BGA) or tabular (like land grid array LGA), in order to electrically connect this encapsulating structure 200 in other assembly.Chip 230 is to be arranged on the another side of substrate 210, and (Flip Chip, mode FC) is electrically connected at substrate 210 for chip 230 bonding wires capable of using or chip bonding.Adhesive body 240 is to be formed on the another side of substrate 210, and coating chip 230, and forms the encapsulating structure of present embodiment.The material of adhesive body 400 can for example be epoxy resin, PMMA, polycarbonate (Polycarbonate), glass, silica gel, photo-hardening type resin (UV curable heat-resistantresin) or acryl.
A, Fig. 2 B and Fig. 2 C please see figures.1.and.2; Fig. 2 A shows the front schematic view according to the check-out console of one embodiment of the invention; Fig. 2 B shows the schematic bottom view according to the encapsulating structure of one embodiment of the invention, and Fig. 2 C shows the synoptic diagram that forms electric connection according to check-out console of one embodiment of the invention and encapsulating structure.Whether the conductive component 220 that the check-out console 100 of present embodiment can detect in the encapsulating structure 200 positively connects (for example welding) on substrate 210, and check-out console 100 comprises some first wiring 110, some second wiring 120 and two electrical measuring ends 130.First wiring 110 and second wiring 120 are to be arranged on the side surface of check-out console 100; And corresponding to the conductive component 220 of encapsulating structure 200; First wiring 110 is in order to connect 220 one-tenth several electrical loops 101 of conductive component; Second wiring 120 is in order to connect electrical loop 101, to form equivalent parallel circuit 102.Electrically measuring end 130 is the two ends that are formed at equivalent parallel circuit 102 respectively, in order to measure the electrical value of equivalent parallel circuit 102.In the present embodiment, substrate 210 is provided with some articles the 3rd wiring 211, and it connects 220 one-tenth electrical loops 101 of conductive component in order to cooperate first wiring 110 between conductive component 220.Shown in Fig. 2 A and Fig. 2 B; When check-out console 100 is not connected in encapsulating structure 200 as yet; First wiring 110, second wiring 120 and electrical measuring end 130 are to be formed at independently respectively on the side surface of check-out console 100; And the 3rd wiring 211 is to be connected in independently between the conductive component 220 respectively, thereby does not form electrical loop 101 as yet.In the present embodiment, shown in Fig. 2 C, when check-out console 100 is connected in encapsulating structure 200; Conductive component 220 can be contacted with first wiring 110; Form electrically connecting, thereby first wiring 110, conductive component 220 and the 3rd wiring 211 can be concatenated into electrical loop 101, and second wiring 120 can be connected between the electrical loop 101; Thereby formation equivalent parallel circuit 102; And can measure the electrical value of equivalent parallel circuit 102 through electrical measuring end 130, for example whether resistance value or magnitude of voltage with the electric connection that detects in the encapsulating structure 200 problem take place.First wiring 110, second wiring 120 and the 3rd wiring 211 of present embodiment can for example be plain conductor, like gold thread, silver-colored line, copper cash or aluminum steel, so are not limited thereto, and printed wiring mode also capable of using forms.
Please with reference to Fig. 1, Fig. 2 C, Fig. 3, Fig. 4 A and Fig. 4 B; Fig. 3 shows the method flow diagram according to the detection method of one embodiment of the invention; Fig. 4 A shows the synoptic diagram according to the equivalent parallel circuit of one embodiment of the invention, and Fig. 4 B shows the synoptic diagram according to the equivalent-simplification circuit of one embodiment of the invention.When carrying out the detection method of present embodiment, at first, connect the conductive component 220 of encapsulating structure 200, to form electrical loop 101 (step S301).At this moment, encapsulating structure 200 can be arranged on the check-out console 100, and conductive component 220 contraposition and be contacted with first wiring 110 discriminably, thereby first wiring 110, conductive component 220 and the 3rd wiring 211 can electrically connect into electrical loop 101.Then; Utilize second wiring 120 to connect electrical loop 101; To form equivalent parallel circuit 102 (step S302); Wherein equivalent parallel circuit 102 has several circuit nodes A, B, C, D, E, F, G and H (shown in Fig. 4 A), and these circuit nodes A～H can be in order to represent conductive component group a, b, c, d, e, f, g and h, and each conductive component group a～h forms (shown in Fig. 2 C) by 220 of a plurality of conductive components.In the present embodiment, per two conductive component group a～h form electrical loop 101.Shown in Fig. 4 B, this equivalent parallel circuit 102 can further be simplified to equivalent-simplification circuit 103, and wherein this equivalence simplification circuit 103 has several circuit nodes L, M, N and P, and circuit node L～P can be in order to represent each electrical loop 101.Therefore, the electrical value of circuit node L～P can calculate according to the electrical value of circuit node A～H, and the electrical value summation of the circuit node L～P desirable electrically value of equivalent parallel circuit 102 for this reason.With electrical value is that resistance value illustrates, and the resistance value of circuit node L～P can calculate according to following resistance value parallel connection formula (1)～(4):
L＝(A*B)/(A+B)...........(1)
M＝(C*D)/(C+D)...........(2)
N＝(E*F)/(E+F)...........(3)
P＝(G*H)/(G+H)...........(4)。
As shown in Figure 3, then, electrical property comparison table (step S303) is provided, wherein this electrical property comparison table has the electrical value data of equivalent parallel circuit 102 when each circuit node A～H opens circuit.For example, shown in following table one, it is the resistance value table of comparisons of equivalent parallel circuit 102:
Table one
Above-mentioned table one is that the situation when opening circuit according to each circuit node A～H is calculated, and arrangement forms, thereby has the resistance value data of equivalent parallel circuit 102 when each circuit node A～H opens circuit.Therefore, why can learn the desired electrical resistance of equivalent parallel circuit 102 when each circuit node A～H opens circuit by table one (the resistance value table of comparisons).
In the present embodiment, this electrical property comparison table can be calculated according to the electrical value of each circuit node A～H, and arrangement forms.So be not limited thereto; In one embodiment, each circuit node A～H is opened circuit, measure the electrical value of equivalent parallel circuit 102 again; Thereby can obtain the electrical value data of equivalent parallel circuit 102 when each circuit node A～H opens circuit, and can be organized into this electrical property comparison table.
Shown in Fig. 3 and Fig. 4 A, then, measure actual electrically value (step S304), the for example resistance value of this equivalent parallel circuit 102 by the electrical measuring end 130 at equivalent parallel circuit 102 two ends.Then; The actual therewith electrically value of comparison electrical property comparison table; With the off position (step S305) of learning circuit node A～H; Also can learn the circuit node that opens circuit why, and then can learn at that circuit node A～H (to have the untrue conductive component 220 of electric connection among that is the conductive component group a～h).Then, can decide the sensing range of conductive component 220, also can decide that conductive component group a～h is detected according to the off position of circuit node A～H according to the off position of circuit node A～H.
With above-mentioned table one is that example is explained, when equivalent records the resistance value of knowing this equivalent parallel circuit 102 and is 34 nurses difficult to understand, contrasts in table one (the resistance value table of comparisons), can learn at once that all circuit node A～H do not have the situation of opening circuit, that is encapsulating structure 200 is normal.When equivalent records the resistance value of knowing this equivalent parallel circuit 102 and is 74 nurses difficult to understand; Contrast in table one (the resistance value table of comparisons); Can learn at once that circuit node A is for opening circuit; That is have among the conductive component group a and connect untrue conductive component 220, and then can detect, and reduce the sensing range and the time of encapsulating structure 200 significantly to the conductive component 220 among the conductive component group a.
Therefore, the detection method of present embodiment and check-out console 100 can be learnt problematic conductive component apace in that scope, to reduce sensing range and time significantly, promote detection efficiency.And the structure of detection method and check-out console 100 is quite simple and easy, thereby the effect of tool low complex degree and high detection efficient.
Check-out console 100 that it should be noted that present embodiment can be not limited in one's power above-mentioned with encapsulating structure 200 formed equivalent parallel circuit 102.Please with reference to Fig. 5 A and Fig. 5 B, it shows the synoptic diagram that forms electric connection according to check-out console of other embodiments of the invention and encapsulating structure.In other embodiments, be familiar with the configuration that this art can at random change the first wiring 110a, the second wiring 120a and the 3rd wiring 211a, and reach identical detection effect.
Embodiment by the invention described above can know that detection method of the present invention and check-out console can reduce sensing range and time apace, promoting detection efficiency, and detection method and check-out console construct quite simple and easy, thereby the effect of tool low complex degree and high detection efficient.
In sum; Though the present invention discloses as above with preferred embodiment; But said preferred embodiment is not that the those of ordinary skill in said field is not breaking away from the spirit and scope of the present invention in order to restriction the present invention; All can do various changes and retouching, so protection scope of the present invention is as the criterion with the scope that claim defines.
Claims (9)
1. detection method, in order to detect encapsulating structure, said encapsulating structure is provided with substrate and conductive component, and said conductive component is a side that is arranged at said substrate, it is characterized in that said detection method comprises:
Connect said conductive component, to form several electrical loops;
Connect said electrical loop, to form the equivalent parallel circuit, wherein said equivalent parallel circuit has several circuit nodes;
Electrical property comparison table is provided; Wherein said electrical property comparison table has the electrical Value Data of said equivalent parallel circuit when each said circuit node opens circuit; Said electrical property comparison table is the resistance value table of comparisons, and it has the resistance value data of said equivalent parallel circuit when each said circuit node opens circuit;
Bring in the actual resistance that measures said equivalent parallel circuit by two of said equivalent parallel circuit; And
Compare the said resistance value table of comparisons and said actual resistance, to learn the off position of circuit node.
2. detection method according to claim 1 is characterized in that: the said step of electrical property comparison table that provides comprises:
Calculate the resistance value of said equivalent parallel circuit when each said circuit node opens circuit, to be organized into said electrical property comparison table.
3. detection method according to claim 1 is characterized in that: the said step of electrical property comparison table that provides comprises:
Measure the resistance value of said equivalent parallel circuit when each said circuit node opens circuit in advance, to be organized into said electrical property comparison table.
4. detection method according to claim 1 is characterized in that: said method more comprises:
Decide the sensing range of said conductive component according to the off position of circuit node.
5. check-out console, in order to detect encapsulating structure, said encapsulating structure is provided with substrate and conductive component, and said conductive component is a side that is arranged at said substrate, it is characterized in that said check-out console comprises:
Some first wiring in order to connecting said conductive component, and form several electrical loops;
Some second wiring are in order to connect said electrical loop, to form the equivalent parallel circuit; And
Electrical measuring end; Be formed at the two ends of said equivalent parallel circuit respectively; In order to measure the resistance value of said equivalent parallel circuit, said resistance value is to be used to be compared to electrical property comparison table, to learn the off position of circuit node; Said electrical property comparison table is the resistance value table of comparisons, and it has the resistance value data of said equivalent parallel circuit when each said circuit node opens circuit.
6. package detection component is characterized in that said package detection component comprises:
Encapsulating structure comprises substrate and conductive component, and wherein said conductive component is to be arranged on the side of said substrate
Check-out console is electrically connected at said encapsulating structure, and in order to detect said encapsulating structure, wherein said check-out console comprises:
Some first wiring in order to connecting said conductive component, and form several electrical loops;
Some second wiring are in order to connect said electrical loop, to form the equivalent parallel circuit; And
Electrical measuring end; Be formed at the two ends of said equivalent parallel circuit respectively; In order to measure the resistance value of said equivalent parallel circuit, said resistance value is to be used to be compared to electrical property comparison table, to learn the off position of circuit node; Said electrical property comparison table is the resistance value table of comparisons, and it has the resistance value data of said equivalent parallel circuit when each said circuit node opens circuit.
7. package detection component according to claim 6; It is characterized in that: said encapsulating structure more comprises chip and adhesive body; Said chip is arranged on the another side of said substrate, and said adhesive body is to be formed on the said another side of said substrate, and coats said chip.
8. package detection component according to claim 6 is characterized in that: said conductive component is a stitch shape, spherical or tabular.
9. package detection component according to claim 6 is characterized in that: said substrate is provided with some articles the 3rd wiring, and it becomes said electrical loop in order to be connected said conductive component with said first wiring between said conductive component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102075721A CN101762762B (en) | 2008-12-23 | 2008-12-23 | Detection method of packaging structure, detection plate and package detection component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102075721A CN101762762B (en) | 2008-12-23 | 2008-12-23 | Detection method of packaging structure, detection plate and package detection component |
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| CN101762762A CN101762762A (en) | 2010-06-30 |
| CN101762762B true CN101762762B (en) | 2012-11-07 |
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| CN103954877B (en) * | 2014-04-15 | 2017-03-08 | 京东方科技集团股份有限公司 | IC testing method and test device |
| CN107607858B (en) * | 2017-09-22 | 2020-08-28 | 信利光电股份有限公司 | Method, system and device for determining open circuit position of module and readable storage medium |
| CN114245633A (en) * | 2021-11-30 | 2022-03-25 | 中航光电科技股份有限公司 | Airtight packaging structure of multichannel digital optical module and ceramic circuit board |
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